JP2014085771A - Capacitance type touch panel sensor substrate and method for manufacturing the same and display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a capacitance type touch panel sensor substrate which is excellent in display fidelity and a method for manufacturing the capacitance type touch panel sensor substrate capable of more inexpensively manufacturing an electrode having a mesh structure whose resistance is lower than that of an ITO transparent electrode, a connection part, an insulating layer, extraction wiring and a protection layer than a conventional manufacturing method of independently carrying out film deposition and patterning in the case of manufacturing an intermediate or more largely-sized capacitance type touch panel sensor substrate, and preventing visibility from being damaged even by using metallic materials to the electrode having the mesh structure.SOLUTION: A first connection part 25 of a capacitance type touch panel sensor substrate is simultaneously formed with a first electrode 23, a second electrode 24 and extraction wiring 20 by using the same photosensitive conductive materials as materials forming the first electrode 23, the second electrode 24 and the extraction wiring 20, and the second connection part 21 is formed by using transparent conductive materials, and the reflection rates of the first connection part 25, the first electrode 23, the second electrode 24 and the extraction wiring 20 are set so as to be 0% or more and 30% or less.

Description

  The present invention relates to a capacitive touch panel sensor substrate, a manufacturing method thereof, and a display device.

  The touch panel is a component of an input device that allows the operator to touch a transparent surface on the display screen with a finger or a pen to detect a touched position and input data. In recent years, it has become widely used because it enables efficient and intuitive input. In particular, the touch panel is often combined with a display panel such as a liquid crystal to input and output information in an integrated manner.

The touch panel detection method includes a resistance film type, a capacitance type, an ultrasonic type, an optical type, and the like. Until now, the resistance film type, which was relatively excellent in terms of manufacturing cost, has been the mainstream. However, a resistance film type touch panel having a structure in which an air layer is provided between two transparent conductive films has low optical characteristics (for example, transmittance), and it cannot be said that durability and operating temperature characteristics are sufficient. Improvements have been sought.
On the other hand, capacitive touch panels that do not have moving parts have high optical characteristics (for example, transmittance) and are superior to resistive film types in durability and operating temperature characteristics. The development is proceeding toward (see Patent Document 1 and Patent Document 2, for example).

  The projected capacitive touch panel sensor substrate generally includes a first transparent electrode arranged in the x direction, a second transparent electrode arranged in the y direction, and a first transparent electrode on a transparent substrate. A first connecting part for connecting the transparent electrodes to each other, and a second connecting part for connecting the second transparent electrodes to each other. An insulating layer is provided to electrically insulate the one connection portion from the second connection portion. Further, on the transparent base material, an extraction wiring connecting these transparent electrodes and the control circuit is formed. And, in order to protect the transparent electrode, the connection part, and the lead-out wiring from corrosion and scratches due to contact, a protective layer is formed and used so as to cover almost the entire surface other than the connection part of the lead-out wiring connected to the control circuit. (See, for example, Patent Document 3).

  The projected capacitive touch panel has a film type that uses a resin film such as polyethylene terephthalate (PET) as a transparent substrate, and a glass type that uses non-alkali glass or soda lime glass. Because there is, it is properly used depending on the purpose. The film type has the advantage that it is easy to remove bubbles when bonding with other display devices and cover glass because the manufacturing cost is low and difficult to break, and it is easy to bond, but the transmittance of the film is the glass Compared to glass, etc. due to its lowness compared to the pattern position accuracy of transparent electrodes formed on the film, glass is used for small items such as mobile terminals such as smartphones that require high definition and low power consumption. Many types are used, and film types are often used for medium-sized and large-sized products such as televisions that require productivity such as low cost and easy bonding.

New conductive materials such as conductive polymers and silver nanowires have been introduced for the aforementioned transparent electrodes, but indium tin oxide (ITO) is generally used because of its high transparency and excellent practicality. It has been. However, since ITO has a low resistance value of several tens of ohms / cm ^2, there is no problem with a small product such as a portable terminal, but when the size is 15 inches or more, particularly 20 inches or more, the wiring of the ITO electrode Since the resistance increases, there is a problem that the detection sensitivity of the projected capacitive touch panel is deteriorated.
Furthermore, when the transparent substrate is a film, the heat resistance of the film is up to about 250 ° C., so that the amorphous ITO formed by a film formation method such as sputtering is crystallized at 250 ° C. or higher. Since it could not be fired at a high temperature, there was a problem that the resistance value was high and the transparency was poor.

Further, the formation of the transparent electrode, the connection portion, the insulating layer, the lead-out wiring, and the protective layer requires a plurality of film formation and patterning steps, which requires a lot of manufacturing costs. In particular, in the manufacturing process of the lead-out wiring, molybdenum (Mo) / aluminum (Al) / molybdenum film is formed by a sputtering method from the viewpoint of high conductivity and easy microfabrication, and photolithography using a positive resist ( A method of performing etching and resist stripping after a step (hereinafter referred to as “photolitho”) is widely used.
In addition, indium tin oxide (ITO), which is highly transparent and excellent in resistance value, is generally used for the transparent electrode, but a metal film is sputter-formed on the substrate placed in the vacuum vessel, as with the extraction wiring. After film formation, it is necessary to form a protective film, etch, and peel off the protective film, which is problematic not only in many steps but also in high equipment costs.

  On the other hand, a method has been disclosed that uses both a transparent electrode and a mesh-structured electrode in which fine conductive metal fine-line patterns are arranged in a lattice pattern to achieve both low resistance and transparency (for example, , See Patent Document 4). However, with this method, even if a film-type touch panel sensor substrate having a thin line pattern is obtained, in addition to problems inherent to the film such as poor transmittance and poor pattern position accuracy, a thin film formed on the film Many problems remain in the film-type touch panel sensor substrate, such as interference unevenness and film thickness unevenness due to the influence of the film.

  In addition, a method for reducing the manufacturing cost by simultaneously forming the extraction wiring and one of the first and second connection portions is disclosed (for example, see Patent Document 5). However, in this method, although the manufacturing process can be shortened and the touch panel sensor substrate can be manufactured at low cost, the connection portion in the display area formed using a metal material is visually observed under normal use conditions. In addition, the problem of the resistance value of the transparent electrode could not be solved.

JP 63-174120 A JP 2006-23904 A JP 2007-279819 A JP 2012-53644 A JP 2011-86122 A

  An object of the present invention is to provide an electrode having a mesh structure, a connecting portion, an insulating layer, a lead-out wiring, and a protective layer having a resistance lower than that of the ITO transparent electrode when manufacturing a capacitive touch panel sensor substrate having a medium size or larger. In addition, it can be manufactured at a lower cost than the conventional manufacturing method in which each film is formed and patterned independently, and even if a metal material is used for the mesh structure electrode, the visibility is not impaired, and the display quality is excellent. It is to provide a method for manufacturing a capacitive touch panel sensor substrate.

Another object of the present invention is to provide a capacitive touch panel sensor substrate that is manufactured by using the manufacturing method and that is inexpensive and excellent in display quality.
It is another object of the present invention to provide a display device that is inexpensive and excellent in display quality, including the capacitive touch panel sensor substrate.

  In order to achieve the above object, an aspect of the present invention has the following configuration. That is, in the method for manufacturing a capacitive touch panel sensor substrate according to one aspect of the present invention, a plurality of first electrodes are arranged in a straight line in the x direction, and each is connected by a first connection portion to form a first electrode array. A plurality of the first electrode rows are arranged in parallel, and a plurality of second electrodes are arranged in a straight line in the y direction orthogonal to the x direction, and each is connected by a second connection portion to form a second electrode row. A plurality of the second electrode rows are arranged in parallel, and the first electrode row and the second electrode row are crossed so that the first connection portion and the second connection portion overlap each other. The first electrode and the second electrode are arranged in a lattice pattern on the transparent substrate, and an insulating layer is interposed between the first connection portion and the second connection portion. And an electrostatic capacitance formed on the transparent base material with extraction wirings connected to the first electrode row and the second electrode row, respectively. A method of manufacturing a touch panel sensor substrate, wherein the first electrode and the second electrode are formed in a mesh structure in a thin line pattern, and the first connection portion is connected to the first electrode and the second electrode. Using the same photosensitive conductive material as the material for forming the electrode and the extraction wiring, the first electrode, the second electrode, and the extraction wiring are formed at the same time, and the second connection portion is formed. It is formed using a transparent conductive material, and the reflectance of the first connection portion, the first electrode, the second electrode, and the lead-out wiring is 0% to 30%.

In this method of manufacturing a capacitive touch panel sensor substrate, the conductor width of the fine line pattern of the first electrode and the second electrode may be in the range of 0.5 μm or more and 10 μm or less.
The photosensitive conductive material may contain a black material, metal particles, a photopolymerization initiator, a polymerizable polyfunctional monomer, and a resin.

Furthermore, the black material may be one or more selected from the group consisting of carbon, black pigment, titanium black, a pseudo black mixture of two or more pigments, a black dye, and a black metal oxide.
Furthermore, the metal particles may contain one or more metals selected from the group consisting of gold, silver, platinum, copper, palladium, iridium, rhodium, and aluminum.
Furthermore, the particle diameter of the metal particles may be in the range of 0.1 μm to 4 μm.
Furthermore, the photopolymerization initiator may contain one or more O-acyloxime compounds.

Furthermore, it is preferable that content of the said black material in the said photosensitive conductive material exists in the range of 1 to 100 mass% of the mass of the said metal particle contained in the said photosensitive conductive material.
Furthermore, the transparent conductive material may be indium tin oxide.
Furthermore, the capacitive touch panel sensor substrate according to another aspect of the present invention is manufactured by the method for manufacturing a capacitive touch panel sensor substrate.

  Furthermore, in the capacitive touch panel sensor substrate according to another aspect of the present invention, a plurality of first electrodes are arranged in a straight line in the x direction, and each is connected by a first connection portion to form a first electrode row, A plurality of the first electrode rows are arranged in parallel, and a plurality of second electrodes are linearly arranged in the y direction orthogonal to the x direction, and each is connected by a second connection portion to form a second electrode row, A plurality of the second electrode rows are arranged in parallel, and the first electrode row and the second electrode row are arranged so as to intersect so that the first connection portion and the second connection portion overlap each other. The first electrode and the second electrode are arranged in a lattice pattern on a transparent substrate, and an insulating layer is interposed between the first connection portion and the second connection portion, A capacitive touch panel in which extraction wirings connected to the first electrode array and the second electrode array are formed on the transparent substrate. The first electrode and the second electrode have a mesh structure formed in a thin line pattern, and the first connection portion includes the first electrode and the second electrode. The electrode and the conductive conductive material are the same as the material for forming the lead-out wiring, and the second connection portion is formed of a transparent conductive material. The reflectance of the electrode, the second electrode, and the extraction wiring is 0% or more and 30% or less.

In this capacitive touch panel sensor substrate, the conductor width of the fine line pattern of the first electrode and the second electrode may be in the range of 0.5 μm to 10 μm.
The photosensitive conductive material may contain a black material, metal particles, a photopolymerization initiator, a polymerizable polyfunctional monomer, and a resin.

Furthermore, the black material may be one or more selected from the group consisting of carbon, black pigment, titanium black, a pseudo black mixture of two or more pigments, a black dye, and a black metal oxide.
Furthermore, the metal particles may contain one or more metals selected from the group consisting of gold, silver, platinum, copper, palladium, iridium, rhodium, and aluminum.

Furthermore, the particle diameter of the metal particles may be in the range of 0.1 μm to 4 μm.
Furthermore, the photopolymerization initiator may contain one or more O-acyloxime compounds.
Furthermore, it is preferable that content of the said black material in the said photosensitive conductive material exists in the range of 1 to 100 mass% of the mass of the said metal particle contained in the said photosensitive conductive material.

Furthermore, the transparent conductive material may be indium tin oxide.
Furthermore, in this capacitive touch panel sensor substrate, the plate on which the first electrode row, the second electrode row, and the extraction wiring are formed among both plate surfaces of the plate-like transparent base material. A color filter may be formed on the plate surface opposite to the surface.
Furthermore, a display device according to another aspect of the present invention includes the capacitive touch panel sensor substrate.

The manufacturing method of the capacitive touch panel sensor substrate according to the present invention includes a mesh structure electrode having a resistance lower than that of the ITO transparent electrode, a connecting portion, when manufacturing a capacitive touch panel sensor substrate having a medium size or larger. The insulating layer, the lead-out wiring, and the protective layer can be manufactured at a lower cost than the conventional manufacturing method in which the film is formed and patterned independently, and the visibility is improved even if a metal material is used for the mesh structure electrode. A capacitive touch panel sensor substrate with excellent display quality that is not damaged can be manufactured.
Further, the capacitive touch panel sensor substrate and the display device according to the present invention are inexpensive and excellent in display quality.

1 is a schematic plan view illustrating an embodiment of a capacitive touch panel sensor substrate according to the present invention. It is a schematic plan view explaining another embodiment of the capacitive touch panel sensor substrate according to the present invention. It is a typical enlarged plan view which shows the cross | intersection part and its peripheral part of the 1st electrode row | line | column and 2nd electrode row | line | column in the touch-panel sensor board | substrate of FIG. It is a typical enlarged plan view which shows the cross | intersection part and its peripheral part of the 1st electrode row | line | column and 2nd electrode row | line | column in the touch-panel sensor board | substrate of FIG. It is a typical expanded sectional view which shows the cross | intersection part of the 1st electrode row | line | column and the 2nd electrode row | line | column in the touch-panel sensor board | substrate of FIG. It is a schematic plan view which shows the example of the mesh structure which an electrode has. It is a typical three-dimensional perspective view showing an example of an on-cell type capacitive touch panel sensor substrate including a color filter. It is a figure which shows an example of the manufacturing process flow of an electrostatic capacitance type touch panel sensor board | substrate. It is a figure explaining one Embodiment of the manufacturing method of the electrostatic capacitance type touch panel sensor board | substrate which concerns on this invention, Comprising: It is a schematic plan view of the transparent base material in which the 2nd connection part was formed. It is a figure explaining one Embodiment of the manufacturing method of the electrostatic capacitance type touch panel sensor board | substrate which concerns on this invention, Comprising: The typical plane of the transparent base material in which the insulating layer was further formed after the 2nd connection part was formed FIG.

Embodiments of a capacitive touch panel sensor substrate, a method for manufacturing the same, and a display device according to the present invention will be described in detail with reference to the drawings.
<Projection capacitive touch panel sensor substrate>
In FIG. 1, after forming the second connection portion 21 and the insulating layer 22 on the transparent substrate 10, the first electrode 23, the second electrode 24, the first connection portion 25, and the extraction wiring 20 are arranged. It is a schematic plan view of a capacitive touch panel sensor substrate manufactured by forming simultaneously. 2 is different from FIG. 1 in the relationship between the first electrode 23, the second electrode 24, the insulating layer 22, the first connection portion 25, and the second connection portion 21 in the x and y directions. It is a typical top view. 1 and 2 are seen through a protective film (not shown).

As shown in FIG. 1, the projected capacitive touch panel sensor substrate of the present embodiment has a first electrode 23, a second electrode 24, a first connection portion 25, and a second connection on a transparent substrate 10. It has the connection part 21, the insulating layer 22, and the extraction wiring 20.
More specifically, a plurality (four in FIG. 1) of first electrodes 23 are arranged in a straight line in the x direction (lateral direction in FIG. 1), and each of them is connected by a first connection portion 25. An electrode array is formed. A plurality (5 in FIG. 1) of the first electrode rows are arranged in parallel on the transparent substrate 10.

Further, a plurality (five in FIG. 1) of second electrodes 24 are linearly arranged in the y direction (vertical direction in FIG. 1) orthogonal to the x direction, and each is connected by the second connection portion 21. A second electrode array is formed. A plurality (5 in FIG. 1) of the second electrode rows are arranged in parallel on the transparent substrate 10.
Furthermore, since the first electrode row and the second electrode row are arranged so that the first connection portion 25 and the second connection portion 21 overlap with each other, The second electrodes 24 are arranged on the transparent substrate 10 in a lattice pattern.

Furthermore, since the first connection portion 25 and the second connection portion 21 overlap, the first connection portion 25 and the second connection portion 21 are overlapped with each other in order to prevent and insulate the second connection portion 21 orthogonal to the first connection portion 25. An insulating layer 22 is interposed between the connection portion 25 and the second connection portion 21.
Furthermore, an extraction wiring 20 connected to each of the first electrode array and the second electrode array is formed on the transparent substrate 10, and these electrodes 23 and 24 and a control circuit (not shown) are connected by the extraction wiring 20. It is connected.

  FIG. 3 is a schematic enlarged plan view showing a crossing portion between the first electrode row and the second electrode row in the touch panel sensor substrate of FIG. 1 and its peripheral portion. FIG. 4 is a schematic enlarged plan view showing a crossing portion between the first electrode row and the second electrode row in the touch panel sensor substrate of FIG. 2 and its peripheral portion. FIG. 5 is a schematic enlarged cross-sectional view showing a crossing portion of the first electrode row and the second electrode row in the touch panel sensor substrate of FIGS.

  In the projected capacitive touch panel sensor substrate of the present embodiment, the particle diameter is 0.1 μm or more as the material of the first electrode 23, the second electrode 24, the first connection portion 25, and the extraction wiring 20. Since a photosensitive conductive material including metal particles of 4.0 μm or less is used, as shown in FIG. 5, the second connection portion 21 formed of a transparent conductive material is formed in the lowermost layer, and the first electrode 23, By forming the second electrode 24, the first connection portion 25, and the extraction wiring 20 in the upper layer, disconnection of the connection portion between the second connection portion 21, the second electrode 24, and the extraction wiring 20 is prevented. It becomes possible.

  Furthermore, the projected capacitive touch panel sensor substrate of the present embodiment can further have a protective film. That is, in order to protect both the electrodes 23 and 24, both the connecting portions 21 and 25, and the lead-out wiring 20 from corrosion and contact damage, almost the entire surface of the transparent substrate 10 on which the electrodes 23 and 24 are formed. You may coat | cover a protective layer so that it may cover. However, it is preferable not to cover the protective layer on the connection portion of the lead-out wiring 20 with the control circuit.

  For the first electrode 23 and the second electrode 24, a photoconductive mask provided with a desired fine pattern and a step of forming a pattern only in a necessary portion by a printing method such as screen printing using a photosensitive conductive material described later. It is an electrode having a mesh structure formed by a fine line pattern obtained through a photolithographic process of exposing and developing by irradiating with ultraviolet rays. By adopting a mesh structure formed by a fine line pattern, both low resistance and transparency are achieved.

  The pitch of the fine line pattern is preferably 100 μm or more and 2000 μm or less, and more preferably 300 μm or more and 1500 μm or less from the viewpoint of visibility and conductivity. When the pitch is smaller than 100 μm, the aperture ratio becomes small, the luminance of the display unit is lowered, and there is a possibility that a projected capacitive touch panel with poor display quality may be obtained. On the other hand, when the pitch is larger than 2000 μm, the wiring resistance becomes high, and there is a possibility that the projected capacitive touch panel has poor detection accuracy.

  As the shape of the mesh structure, a linear pattern as shown in FIGS. 6A and 6C or a wavy pattern as shown in FIG. 6B is used. A pattern is more preferably used. These patterns are not limited to square lattice patterns as shown in FIGS. 6A, 6B, and 6C. May be out of parallel relationship, the shape of the lattice pattern may deviate from the square, or may be biased at a certain angle as a whole, due to the deviation from the square or the effect of tilt due to the bias at a certain angle, It is preferably used in that light interference due to these lattice patterns and the lattice pattern of the pixel formation portion of the display portion and unevenness such as moire can be eliminated.

  Furthermore, an on-cell capacitive touch panel sensor substrate can be configured by forming a color filter on one plate surface of a plate-like transparent substrate. FIG. 7 shows an arrangement in which a fine line pattern 6 serving as an electrode having a mesh structure is superimposed on the black matrix 2 of the color filter 1 on the surface of the transparent substrate (not shown) opposite to the surface on which the color filter 1 is formed. FIG. 3 is a schematic three-dimensional perspective view showing an on-cell capacitive touch panel sensor substrate.

  In the on-cell projection capacitive touch panel sensor substrate in which the color filter 1 is formed on the back surface of the transparent substrate, as shown in FIG. 7, a square lattice is formed so as to be superimposed on the back surface of the black matrix 2 of the color filter 1. A thin line pattern 6 can be formed. By using this shape, it is possible not only to obtain a bright display device that does not impair the luminance of the display unit, but also to locate the moire pattern on the back surface of the black matrix 2 in the lattice pattern of the pixel forming unit of the display unit. Thus, a display device with excellent display quality that does not cause unevenness can be obtained. Furthermore, since the number of parts can be reduced, an on-cell type projected capacitive touch panel sensor substrate can be manufactured at low cost.

  The transparent substrate 10 is not particularly limited. For example, a glass plate made of soda lime glass, low alkali borosilicate glass, non-alkali aluminoborosilicate glass, polyethylene terephthalate (PET), triacetyl, or the like. Plastic plates and plastic films made of cellulose (TAC), polymethyl methacrylate (PMMA), polycarbonate (PC), etc. are used.

  When a cover glass is used for the transparent base material 10, it can be set as a projection type capacitive touch panel sensor substrate integrated with a cover glass. The transparent substrate 10 may be aluminosilicate glass (for example, “Gollira (Corning)”, “IOX-FS (Corning)”, “Dragonrail (Asahi Glass))” or chemically strengthened. Special glass plates such as soda lime glass can be used. When a cover glass is used for the transparent base material 10, the number of parts per transparent base material can be reduced in order to provide both a frame layer (bezel) and a touch panel sensor on a large glass substrate that is a base material. The touch panel can be manufactured at a low cost.

  Since a normal cover glass is chemically strengthened after dividing a large glass substrate into individual pieces, sufficient strength is easily obtained, whereas when a cover glass is used for the transparent substrate 10, After a plurality of frame layers (bezels) and touch panel sensors are formed together on a single large glass substrate, a tempered glass is formed on each piece by methods such as chemical etching and mechanical cutting. There is a problem that the strength becomes weak when the reinforced large substrate is divided into individual pieces. In recent years, means for solving these problems are being disclosed, and a tempered glass such as a cover glass is often employed for the transparent substrate 10.

  The second connection portion 21 is not particularly limited as long as it can be disposed on the surface of the transparent substrate 10, but is not limited to inorganic conductive materials such as ITO and zinc oxide (ZnO), and polyethylene. Organic conductive materials such as dioxythiophene / polystyrene sulfonic acid (PEDOT / PSS), polyaniline, and polypyrrole can be used. These materials may be used alone or in combination of two or more. Among these, it is preferable to use ITO in terms of transparency, reliability, and practical use. The thickness of the transparent electrode in the present invention (hereinafter referred to as conductor thickness) is preferably 0.02 μm or more and 0.1 μm or less. When the conductor thickness is less than 0.02 μm, sufficient electrical characteristics cannot be obtained, and when it exceeds 0.1 μm, the visibility of the touch panel is affected.

The insulating layer 22 and the protective film (not shown) can be formed using known materials conventionally used for the insulating layer and the protective film. For example, inorganic films such as SiO ₂ and SiN _x , transparent resins, etc. Organic materials. Since inorganic films are formed of SiO ₂ or SiN _x by a CVD method or a sputtering method, there is a problem that the manufacturing cost becomes high, such as an increase in energy consumption and an increase in the number of processes. Formation by photolithography using an organic material is preferably used. As the organic material, a UV curable coating composition containing a polymerizable group-containing oligomer, monomer, photopolymerization initiator and other additives can be used.

  The first connection portion 25 uses the same photosensitive conductive material as the material of the first electrode 23, the second electrode 24, and the extraction wiring 20 through the insulating layer 22, and the first electrode 23, The second electrode 24 and the extraction wiring 20 are formed at the same time. Moreover, in the example shown in FIG. 1, although the connection part of the x direction is the 1st connection part 25 and the connection part of the y direction is the 2nd connection part 21 with respect to the transparent base material 10, as above-mentioned, x The direction and the y direction may be reversed. That is, as shown in FIG. 2, the structure may be such that the connection portion in the x direction is the second connection portion 21 and the connection portion in the y direction is the first connection portion 25.

  The first electrode 23, the second electrode 24, the first connection portion 25, and the extraction wiring 20 have a process of forming a pattern only at a necessary portion by a printing method such as screen printing described above, and a desired fine pattern. It is simultaneously formed through a photolithographic process of exposing and developing by irradiating with ultraviolet rays through a provided photomask. The projected capacitive touch panel sensor substrate of the present embodiment is preferable in that it can be formed at a lower cost than when these are obtained individually.

  Photosensitive conductive materials for the first electrode 23, the second electrode 24, the second connection portion 25, and the lead-out wiring 20 include gold (Au), silver (Ag), platinum (Pt), and copper (Cu). It is preferable to use a photosensitive metal material such as a conductive paste in which conductive powder such as palladium (Pd), iridium (Ir), rhodium (Rh), and aluminum (Al) is dispersed in an organic binder to give photosensitivity. Can do.

  Select the particle size of conductive powder such as gold (Au), silver (Ag), platinum (Pt), copper (Cu), palladium (Pd), iridium (Ir), rhodium (Rh), aluminum (Al) as appropriate Then, the first electrode 23, the second electrode 24, and the second connection portion 25 are obtained by absorbing, scattering, and diffracting light from a metal film such as Mo, Al, Ag, Cu, and Pd obtained by sputtering. In addition, since the reflectance of the extraction wiring 20 can be easily controlled to 0% or more and 30% or less, the problem of pattern appearance can be easily avoided and the manufacturing cost can be reduced. Preferably used.

  Furthermore, other known techniques for reducing the reflectance may be applied. If the reflectivity exceeds 30%, the degree of reflection of external light under normal use conditions increases, so that the pattern can be seen with the naked eye and display quality is degraded. The “reflectance” in the present invention refers to a reflectance at a wavelength of 550 nm when measurement is performed on the glass substrate surface side using an ultraviolet-visible spectrophotometer.

  Conventionally, a three-layer structure of Mo / Al / Mo is formed by sputtering at a thickness of about 350 mm / 2000 mm / 350 mm respectively, followed by a photolithography process using a positive resist, followed by etching / resist peeling (hereinafter referred to as “resisting”). However, since this metal material has a high reflectivity, even if the second connection portion in the display area is finely formed to have a width of 8 μm × a length of about 200 μm. In addition, since it can be visually recognized under normal use conditions, there is a problem of deteriorating display characteristics.

  The conductor width of the first electrode 23 and the second electrode 24 is preferably 0.5 μm or more and 10 μm or less. When the conductor width of the first electrode 23 and the second electrode 24 is 0.5 μm or less, a malfunction (hereinafter referred to as “electrostatic breakdown”) occurs when a transient voltage such as static electricity occurs. It becomes easy to do. On the other hand, if the conductor widths of the first electrode 23 and the second electrode 24 are 10 μm or more, not only the pattern is easily seen with the eyes, but also the transmittance of the display area is lowered.

  The conductor thickness of the first electrode 23 and the second electrode 24 is preferably 0.5 μm or more and 5 μm or less. If the conductor thickness of the first electrode 23 and the second electrode 24 is 0.5 μm or less, sufficient conductivity cannot be obtained, and conduction failure may occur. On the other hand, when the conductor thickness of the first electrode 23 and the second electrode 24 is 5 μm or more, the ultraviolet light does not reach the bottom during exposure in the photolithography process, and pattern formation becomes difficult. The “conductor width” is the line width of the thin line pattern of the first electrode 23 and the second electrode 24, and the “conductor thickness” is the thin line pattern of the first electrode 23 and the second electrode 24. This is the thickness of the film.

  In the case of the structure shown in FIG. 1, that is, when the first connection portion 25 is a connection portion for connecting the adjacent first electrodes 23 arranged in the x direction with respect to the transparent substrate 10. Is formed simultaneously with the first electrode 23 using the same photosensitive conductive material as the material of the first electrode 23. In other words, when the first electrode 23 is formed, the first connection portion 25 is also formed at the same time, which means that a continuous electrode pattern is formed without interruption in the x direction.

<Method for manufacturing capacitive touch panel sensor substrate>
FIG. 8 shows a manufacturing process flow of the projected capacitive touch panel sensor substrate of the present embodiment. FIG. 9 is a schematic plan view of a transparent substrate on which a second connection portion is formed, and FIG. 10 is a transparent substrate on which an insulating layer is further formed after the second connection portion is formed. FIG.

First, as shown in FIG. 9, the second connection portion 21 is formed on the transparent substrate 10. As the second connection portion 21, ITO that is generally used in many cases is suitable, but is not particularly limited. Depending on the specific specifications of the capacitive touch panel function, the characteristics of ITO and the characteristics as a transparent electrode pattern are selected. For example, as an ITO film, a film having a film thickness of 30 nm and a sheet resistance value of about 100 Ω / cm ^{2 is} formed by a thin film forming unit of a sputtering apparatus. Next, a resist pattern is formed by a photolithographic method including a series of steps of resist coating, exposure, and development using an etching-resistant photosensitive resin. Thereafter, a pattern is formed through ITO etching and a resist peeling process. For example, as the second connection portion 21, a large number of patterns having a width of 50 μm to 100 μm and a length of 200 μm to 500 μm are formed.

  As a specific forming process of the second connection portion 21 shown in FIG. 9, an ITO film forming process in which ITO sputtering is performed while heating at 170 ° C. by a DC magnetron sputtering method, which is generally used for an etching protective film. After spin-coating a positive resist (for example, novolak), pre-baking is performed on a hot plate, and then proximity exposure is performed using a photomask with the desired pattern reversed, and development is performed with an alkaline developer. Then, a positive resist patterning step for patterning the positive resist, an ITO etching step for etching the ITO film-formed transparent base material patterned with the positive resist with an etching solution containing oxalic acid as a main component, and finally alkaline peeling There is a stripping process in which positive resist stripping is performed with a liquid. The 2nd connection part 21 is obtained by passing through these processes.

As shown in FIG. 10, after the second connection portion 21 is formed on the transparent substrate 01, the insulating layer 22 is formed. The insulating layer 22 is formed so as to cover a range including the effective area of the first connection portion 25 or the second connection portion 21. As a manufacturing method of the insulating layer 22, an insulating function can be obtained by forming a SiO ₂ film with a thickness of 100 nm or more. However, as an easier manufacturing method, an organic insulating film can also be formed by a photolithography method. For example, a photosensitive organic insulating film material having a refractive index of 1.53 and a volume resistivity of 2 × 10 ¹⁵ Ω · cm is applied to a dry film by a coating method such as spray coating, spin coating, slit die coating, roll coating, or bar coating. It is applied so that the thickness is 0.2 to 10 μm, more preferably 0.5 to 5 μm.

If necessary, the dried film is exposed through a mask having a predetermined pattern provided in contact with or not in contact with the film. The type of light beam at the time of exposure is not particularly limited, and examples thereof include visible light, ultraviolet rays, far infrared rays, electron beams, X-rays, etc. Among them, ultraviolet rays are preferable. Is not particularly limited illuminance of the light beam is preferably 5~150mW / cm ² at 365 nm, and particularly preferably 15~35mW / cm ^2.

Then, if necessary, it is immersed in an aqueous alkali developer such as sodium carbonate or sodium hydroxide, or sprayed with a developer or the like to remove uncured portions and form a desired pattern. Furthermore, in order to accelerate | stimulate superposition | polymerization of the photosensitive composition and to harden | cure, it heats (post-bake) as needed, respectively. A pattern is formed through these steps, and the patterned insulating layer 22 having a transmittance exceeding 97% can be obtained.
A transparent resin composition (for example, an acrylic material) used for the insulating layer 22 was applied by spin coating, and prebaked on a hot plate. Thereafter, proximity exposure was performed using a photomask corresponding to the desired pattern, and development was performed with an alkaline developer. Then, it used as the insulating layer 22 by implementing a post-baking.

  The first electrode 23, the second electrode 24, the first connection portion 25, and the lead-out wiring 20 shown in FIG. 1 are made of a photosensitive metal material such as a conductive paste whose reflectance is controlled to be 0% to 30%. It is obtained by forming a film by a printing method such as screen printing and forming a fine pattern by a photolithographic method. The photolithographic method is a method in which a photosensitive conductive paste is applied onto a substrate, and then the exposed portion of the coating film is cured by photocrosslinking by irradiating ultraviolet light through a photomask corresponding to a desired extraction wiring. This is a method for forming a lead-out wiring pattern by baking after removing the unexposed portion of the coating film. By using this photolithography method, it is possible to obtain a conductive pattern that is less expensive than the vapor deposition method and has a higher definition than the printing method formed by screen printing or gravure offset printing.

  When the first electrode 23, the second electrode 24, the first connection portion 25, and the extraction wiring 20 are patterned on the transparent substrate 10 at an early stage, the light-shielding property is sufficient for transmitted light. Therefore, it is easy to optically detect and recognize a pattern. Therefore, the metal electrode pattern itself can be used as an index of alignment with respect to a layer on which a subsequent pattern is formed. In addition to the electrode pattern, an alignment mark can be provided independently in the same layer as the second connection portion 21 and the extraction wiring 20. Independently providing a mark for alignment can generally achieve higher accuracy in the alignment process in which a position correction amount is determined from pattern recognition and a movement for position correction is output.

  Further, if necessary, a protective film (not shown) can be used for the first transparent electrode 23, the second transparent electrode 24, the first connection portion 25, the second connection portion 21, the insulating layer 22, and the extraction wiring 20. It is formed over the range including the region. The protective film can be formed using the materials and methods described in the description of the insulating layer 22 so that the dry film thickness is 0.5 to 20 μm, more preferably 1.0 to 10 μm. In addition, since the protective film forms the outermost layer of the capacitive touch panel sensor substrate, it is desirable that the protective film be disposed as wide as possible to serve as a planarization layer.

<Photosensitive conductive material>
As the photosensitive metal material used in the present invention, a photosensitive conductive paste containing a black material, metal particles, a photopolymerization initiator, a polymerizable polyfunctional monomer, and a resin can be used. Other additives can be included. ,
The lead wiring constituting the capacitive touch panel substrate of the present invention is formed by applying the photosensitive conductive paste on a transparent substrate, and then performing so-called photolithographic processes such as exposure, development, and thermosetting.

  The photosensitive metal material used in the present invention includes carbon, black pigment, titanium black, a pseudo black mixture of two or more pigments, a black dye, and a black metal oxide in order to control the reflectance to 30% or less. One or more black materials selected from the group can be used in combination.

  The carbon black used in the present invention is a black pigment having a light shielding property. Examples of commercially available carbon black include # 260, # 25, # 30, # 32, # 33, # 40 manufactured by Mitsubishi Chemical Corporation. , # 44, # 45, # 45L, # 47, # 50, # 52, MA7, MA8, MA11, MA100, MA100R, MA100S, MA230, Printex L, Printex P, Printex 30, Printex 35, manufactured by DEGUSSA Carbon black alone such as Printex 40, Printex 45, Printex 55, Printex 60, Printex 300, Printex 350, Special Black 4, Special Black 350, Special Black 550, etc. I can get lost. Further, carbon black dispersions such as MHI black # 201, # 220, and # 273 manufactured by Gokoku Color Co., Ltd. can be used. Carbon black may be used individually by 1 type, or 2 or more types may be mixed and used for it. The average primary particle size of the carbon black used in the present invention is preferably 10 nm or more and 500 nm or less, more preferably 10 nm or more and 300 nm or less.

If the average primary particle size of the carbon black is smaller than 10 nm, it is difficult to disperse at a high concentration, so that it is difficult to obtain a photosensitive black composition having good stability over time. On the other hand, when carbon black larger than 500 nm is used, the blackness is lowered, and in order to obtain sufficient blackness, the ratio of carbon black in the photosensitive conductive material is increased, which adversely affects pattern processability. The content of carbon black in the photosensitive conductive material is preferably 1% by mass or more and 100% by mass or less based on the solid content of the metal particles. When the content of carbon black is less than 1% by mass, a sufficient effect of reducing the reflectance cannot be obtained, and when it is more than 100% by mass, it is difficult to obtain conductivity, and it becomes difficult to form connection parts and lead-out wirings. there is a possibility.
As the black pigment, for example, aniline black or perylene black pigment can be used. I. Black pigments such as Pigment Black 1, 6, 7, 12, 20, 31, 32 can be used.

  The pseudo black pigment mixture of two or more kinds of pigments used in the present invention is a pseudo black mixture having light shielding properties. Examples of the pseudo black mixture include pigments used for forming a colored transparent layer of a color filter, and C.I. I. Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 41, 48: 1, 48: 2, 48: 3, 48: 4, 57: 1, 81, 81: 1, 81: 2, 81: 3, 81: 4, 97, 122, 123, 146, 149, 166, 168, 169, 176, 177, 178, 179, 180, 184, 185, 187, 192,200,202,208,210,215,216,217,220,223,224,226,227,228,240,242,246,254,255,264,270,272,273,274,276, Red (RED) pigments typified by 277, 278, 279, 280, 281, 282, 283, 284, 285, 286, 287, and the like; I. At least a blue (BLUE) pigment typified by CI Pigment Blue 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 6, 16, 22, 60, 64, 80, etc. Therefore, a pseudo black color can be obtained.

  Moreover, as a pseudo black mixture of pigments used in the present invention, a yellow (YELLOW) pigment may be added in addition to a red pigment and a blue pigment. It is known that yellow pigments absorb light in the low wavelength region of visible light, that is, light having a wavelength of 500 nm or less (for example, “Shoji Shiji (1965)“ Printing Ink Class ”(Nihon Printing Shimbun) P170. 173). By adding a yellow pigment to a red pigment and a blue pigment, the yellow pigment absorbs low-wavelength visible light and can be made closer to black.

  Examples of yellow (YELLOW) pigments include C.I. I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35: 1, 36, 36: 1, 37, 37: 1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 144, 146, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 17 , 175,176,177,179,180,181,182,185,187,188,193,194,198,199,213,214,218,219,220,221 and the like.

In the pseudo black mixture of pigments used in the present invention, a violet pigment may be further added. By adding a violet pigment, it is easy to absorb light in the vicinity of a wavelength of 550 nm as compared with the case where it is not added, and a black having a higher optical density (OD value) can be obtained.
Examples of violet pigments used in the present invention include C.I. I. Pigment violet 1, 19, 23, 27, 29, 30, 32, 37, 40, 42, 50.

Further, a pigment such as an orange pigment or a green pigment may be added. Examples of the orange pigment include C.I. I. Pigment orange 36, 43, 51, 55, 59, 61, 71, 73 and the like. Examples of the green pigment include C.I. I. And green pigments such as CI Pigment Green 7, 10, 36, 37, and 58.
Furthermore, in the pseudo black material of the pigment used in the present invention, an organic black pigment can be used as an auxiliary agent for reducing the reflectance. I. PBK 1, 30, 31, etc. are mentioned.

  In the present invention, one or more black dyes can be used. Examples of the chemical structure of the dye include triphenylmethane, anthraquinone, benzylidene, oxonol, cyanine, phenothiazine, pyrrolopyrazole azomethine, xanthene, phthalocyanine, benzopyran, and indigo. Of these, pyrazole azo dyes, anilinoazo dyes, pyrazolotriazole azo dyes, pyridone azo dyes, anthraquinone dyes, and anthrapyridone dyes are preferable.

As the colorant, known dyes can be used as long as they are soluble in an organic solvent. Examples thereof include oil-soluble dyes, acid dyes or derivatives thereof, direct dyes, and modern dyes.
Examples of the pigment used in the black dye include C. I. Acid Black 1, 24, 26, 31, 48, 50, 52, 52: 1, 58, 60, 63: 2, 64, 107, 109, 110, 112, 113, 118, 140, 155, 170, 172, 177, 187, 188, 194, 207, 222, C.I.Direct Black 17, 19, 22, 51, 62, 91, 112, 117, 118, 122, 132, 146, 154, 159, 169, and 173.

  The black material used in the present invention may be a pseudo black mixture of two or more dyes having light shielding properties. For example, C. I. Acid Red 1, 6, 9, 14, 18, 35, 37, 42, 50, 52, 57, 73, 87, 88, 89, 92, 97, 106, 111, 114, 118, 128 , 134, 138, 143, 143: 1, 145, 158, 183, 186, 211, 214, 215, 217, 219, 225, 226, 249, 254, 256, 257, 259, 260, 261, 263, 266 274, 276, 278, 289, 299, 301, 303, 307, 315, 316, 317, 336, 337, 341, 355, 357, 359, 362, 366, 383, 399, 405, 407, 414, 416 426, C.I. Direct Red 2, 23, 24, 31, 39, 54, 79, 83: 1, 89, 224, 225 226, 227, 242, 243, C. I. Reactive Red 5, 8, 43, and the like, a dye composed of a red (RED) pigment, and C. I. Acid Blue 7, 9, 15, 22 23, 25, 40, 45, 47, 59, 61: 1, 62, 78, 80, 83, 90, 104, 109, 112, 127, 127: 1, 129, 138, 140, 203, 204, 207 227, 228, 232, 247, 260, 264, 277, 278, 280, 283, 290, 333, 343, and a dye composed of a blue (BLUE) pigment represented by Direct Blue 106, 108, etc. As a result, a pseudo black color can be obtained.

  Examples of pigments used for yellow (YELLOW) dyes include: I. Acid Yellow 3, 17, 38, 40: 1, 42, 44: 1, 49, 61, 65, 67, 72, 79, 110, 114, 116, 117, 119, 121, 127, 129, 135, 141, 143, 155, 158, 161, 194, 204, 207, 220, 232, 235, 241, C.I. Direct Yellow 12, 86, 87, 130, 142, C. I. Reactive Yellow 84, 102, and the like.

  In the pseudo black mixture of dyes used in the present invention, a violet dye may be further added. By adding a violet dye, it is easy to absorb light in the vicinity of a wavelength of 550 nm as compared with the case where it is not added, and it is possible to make black with a higher optical density (OD value). Examples of the pigment used for the violet dye used in the present invention include CI Acid Violet 21, 42, 43, 47, 48, 49, 54, 97, 102 and the like.

  In addition to the dyes described above, dyes such as orange dyes and green dyes may be added as the dyes used in the present invention. Examples of the pigment used for the orange dye include C. I. Orange 10, 19, 33, 50, 56, 67, 80, 108, 122, 142, 166, 130, C. I. Direct Orange 26, 39, C. I. Reactive Orange 1, 4 and the like. Examples of the pigment used as the green dye include CI Acid Green 3, 5, 22, 25, 27, 28, 41, and the like.

Examples of the black metal oxide include silver oxide, iron oxide, zinc oxide, triiron tetroxide, cobalt oxide, tin oxide, indium oxide, magnesium oxide, copper chromite, copper chromate, and cobalt-iron composite oxide. , Cobalt-iron-chromium composite oxide, nickel-iron-chromium composite oxide, copper-iron-manganese composite oxide, cobalt-nickel composite oxide, titanium-vanadium-antimony composite oxide, tin-antimony composite oxide Molybdenum disulfide, zinc sulfide, etc. can be used. The metal particles contained in the photosensitive conductive material are oxidized after pattern formation using an oxidizing agent such as sodium chlorite, sodium hypochlorite, and sodium nitrite and an alkaline aqueous solution of sodium hydroxide and sodium phosphate. You may form as a thing. The particle diameter of the black metal oxide is preferably 0.1 μm or more and 4 μm or less.
In addition, the blackening layer may be formed by depositing tellurium chloride by using metal tellurium, tellurium dioxide and hydrochloric acid.

  The average particle diameter of the metal particles of the photosensitive conductive material used in the present invention is preferably 0.1 μm or more and 4 μm or less. When the average particle diameter is 0.1 μm or less, the concealing property is high, so that ultraviolet light does not reach the bottom during exposure, and pattern formation becomes difficult. On the other hand, an average particle diameter of 4 μm or more is not preferable because linearity and resolution in a fine pattern are deteriorated.

  Moreover, regarding the shape of the metal particles, there are flakes, needles, spheres, etc., but spherical silver powder is desirable from the viewpoint of screen printability and light scattering during exposure. The amount of the metal particles used is preferably 65 to 90% by mass based on the total solid content of the photosensitive conductive material. If the added amount of the metal particles is less than 65% by mass, a sufficient resistivity cannot be obtained as a wiring, and if it exceeds 90% by mass, the ultraviolet light does not reach the bottom during exposure and pattern formation becomes difficult.

  As a photopolymerization initiator of the photosensitive conductive material used in the present invention, 1- [4- (phenylthio) phenyl] -1,2-octanedione-2- (O-benzoyloxime), O- (acetyl)- N- (1-phenyl-2-oxo-2- (4′-methoxy-naphthyl) ethylidene) hydroxylamine, ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3- It is necessary to use at least one O-acyloxime compound such as yl-1- (O-acetyloxime). The O-acyloxime compound has excellent curing characteristics even in a highly concealable photosensitive conductive material in order to generate methyl radicals and phenyl radicals with high mobility with high efficiency. These photopolymerization initiators can be used alone or in combination.

  As a photopolymerization initiator that can be used by mixing with an O-acyloxime compound, 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, 1- (4-isopropylphenyl) -2- Acetophenone compounds such as hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, benzoin, Benzoin compounds such as benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzyl dimethyl ketal, benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophene Benzophenone compounds such as benzophenone, acrylated benzophenone, 4-benzoyl-4′-methyldiphenyl sulfide, 3,3 ′, 4,4′-tetra (t-butylperoxycarbonyl) benzophenone, thioxanthone, 2-chlorothioxanthone, Thioxanthone compounds such as 2-methylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, 2,4-diethylthioxanthone, 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis (trichloro Methyl) -s-triazine, 2- (p-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) -s- Triazine, 2-piphenyl-4,6-bis (trick (Romethyl) -s-triazine, 2-piperonyl-4,6-bis (trichloromethyl) -s-triazine, 2,4-bis (trichloromethyl) -6-styryl-s-triazine, 2- (naphth-1-) Yl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxy-naphth-1-yl) -4,6-bis (trichloromethyl) -s-triazine, 2,4-trichloro Triazine compounds such as methyl- (piperonyl) -6-triazine, 2,4-trichloromethyl (4′-methoxystyryl) -6-triazine, 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)], O- (acetyl) -N- (1-phenyl-2-oxo-2- (4′-methoxy-naphthyl) ethylidene) hydroxyl Oxime ester compounds such as amines, phosphine compounds such as bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 9,10-phenanthrenequinone, camphor Quinone compounds such as quinone and ethyl anthraquinone, borate compounds, carbazole compounds, imidazole compounds, titanocene compounds and the like are used. The amount of the photopolymerization initiator used is preferably 0.1% by mass or more and 50% by mass or less, more preferably 0.2% by mass or more and 20% by mass based on the total solid content of the photosensitive conductive material.

  Further, as a sensitizer for the photopolymerization initiator, α-acyloxy ester, acylphosphine oxide, methylphenylglyoxylate, benzyl, 9,10-phenanthrenequinone, camphorquinone, ethylanthraquinone, 4,4 Compounds such as '-diethylisophthalophenone, 3,3', 4,4'-tetra (t-butylperoxycarbonyl) benzophenone, triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, Ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, 2-ethylhexyl 4-dimethylaminobenzoate, N, N-dimethylparatoluidine, 4,4′-bis (dimethyl) Amino) benzo Enon, 4,4'-bis (diethylamino) benzophenone, can be used in combination of 4,4'-bis (ethylmethylamino) amine compounds such as benzophenone. These sensitizers can be used alone or in combination. The amount of the sensitizer used is preferably 0.5 to 50 mass%, more preferably 1 to 30 mass%, based on the total amount of the photopolymerization initiator and the sensitizer.

  As the polymerizable polyfunctional monomer and oligomer of the photosensitive conductive material used in the present invention, methyl (meth) acrylate, ethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, Cyclohexyl (meth) acrylate, β-carboxyethyl (meth) acrylate, diethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, triethylene glycol di (meth) acrylate, tripropylene glycol di (meth) Acrylate, trimethylolpropane tri (meth) acrylate, polyethylene glycol di (meth) acrylate, pentaerythritol tri (meth) acrylate, 1,6-hexanediol diglycidyl ether Di (meth) acrylate, bisphenol A diglycidyl ether di (meth) acrylate, neopentyl glycol diglycidyl ether di (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tricyclodecanyl (meth) acrylate, ester acrylate, Various acrylic esters and methacrylic esters such as melamine (meth) acrylate, (meth) acrylic esters of methylolated melamine, various acrylic esters and methacrylates such as epoxy (meth) acrylate, urethane acrylate, (meth) acrylic Acid, styrene, vinyl acetate, hydroxyethyl vinyl ether, ethylene glycol divinyl ether, pentaerythritol trivinyl ether, (meth) acrylamide N-hydroxymethyl (meth) acrylamide, N-vinylformamide, acrylonitrile and the like. Moreover, it is preferable to use the polyfunctional urethane acrylate which has the (meth) acryloyl group obtained by making polyfunctional isocyanate react with the (meth) acrylate which has a hydroxyl group. The combination of the (meth) acrylate having a hydroxyl group and the polyfunctional isocyanate is arbitrary and is not particularly limited. Moreover, one type of polyfunctional urethane acrylate may be used alone, or two or more types may be used in combination. These can be used alone or in admixture of two or more.

  The photosensitive conductive material resin used in the present invention is a linear polymer having a carboxyl group, and examples thereof include (meth) acrylic copolymer resins and epoxy resins and (meth) acrylic acid or anhydrides thereof. An epoxy-modified acrylate resin obtained by further reacting the reaction product with a polybasic carboxylic acid or its anhydride.

  The (meth) acrylic copolymer resin of the photosensitive conductive material used in the present invention is a copolymer resin containing at least a (meth) acrylic monomer in its constituent components, and the (meth) acrylic monomer is (meth) Acrylic acid, methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, allyl acrylate, benzyl acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, glycidyl acrylate, aminoethyl acrylate, methyl methacrylate, Ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate DOO, allyl methacrylate, benzyl methacrylate, cyclohexyl methacrylate, dicyclopentanyl methacrylate, dicyclopentenyl acrylate, glycidyl methacrylate, aminoethyl methacrylate, and the like. As a constituent component other than the (meth) acrylic monomer, a compound having an unsaturated bond such as styrene or cyclohexylmaleimide can be used.

As the epoxy resin used for the epoxy-modified acrylate resin, phenol novolak, cresol novolak, those having bisphenol A or bisphenol F skeleton and the like are used.
As the solvent for the photosensitive conductive material used in the present invention, cyclohexanone, ethyl cellosolve acetate, butyl cellosolve acetate, ethyl carbitol acetate, 1-methoxy-2-propyl acetate, diethylene glycol dimethyl ether, ethylbenzene, ethylene glycol diethyl ether, xylene, ethyl Cellosolve, methyl-n amyl ketone, propylene glycol monomethyl ether, petroleum solvent and the like can be mentioned, and these can be used alone or in combination. The addition amount of the solvent is preferably 5 to 20% by mass based on the total amount of the photosensitive conductive paste.

  In addition to the above components, a radical scavenger may be included as the photosensitive conductive material used in the present invention. The radical scavenger has the effect of deactivating active radicals, and by adding it to the photosensitive conductive paste, it becomes possible to suppress the curing reaction in the unexposed part caused by light scattering by the metal particles, and the conductor The dimensional accuracy of the pattern can be improved.

  Examples of the radical scavenger include hydroquinone derivatives such as hydroquinone, methylhydroquinone, methoquinone, quinopower MNT (manufactured by Kawasaki Kasei Co., Ltd.), non-flex alba, non-flex CBP, non-flex EBP (above, manufactured by Seiko Chemical Co., Ltd.), and the like. , 4-benzoquinone, 2,6-dichloroquinone, p-xyloquinone, quinone derivatives such as naphthoquinone, Irganox 245, Irganox 259, Irganox 1010, Irganox 1035, Irganox 1076, Irganox 1098 (manufactured by BASF), Adekas Tab A-Tab A30-A tab 30 (Holded phenols such as ADEKA), TINUVIN123, TINUVIN144, TINUVIN152, TINUVIN76 5, hindered amines such as TINUVIN 770DF (above, manufactured by BASF), ADK STAB LA-77, ADK STAB LA-57, ADK STAB LA-67, ADK STAB LA-87 (above, manufactured by ADEKA), etc. More than one type can be used.

  As the addition amount of the radical scavenger, it can be added in the range of 0.01 to 0.1% by mass based on the total solid content of the photosensitive conductive paste. If the added amount of the radical scavenger is 0.01% by mass or less, the effect of improving the dimensional accuracy of the conductor pattern cannot be obtained, and if it is 0.1% by mass or more, pattern peeling due to insufficient crosslinking density or discoloration during thermosetting occurs. To do.

  In order to stabilize the time-dependent viscosity of the photosensitive conductive material used in the present invention, a storage stabilizer can be contained. Examples of the storage stabilizer include quaternary ammonium chlorides such as benzyltrimethyl chloride and diethylhydroxyamine, organic acids such as lactic acid and oxalic acid, and methyl ethers thereof, t-butylpyrocatechol, triethylphosphine, and triphenylphosphine. Organic phosphines, phosphites and the like can be mentioned. The storage stabilizer can be contained in an amount of 0.1% by mass or more and 10% by mass or less based on the total amount of the photosensitive conductive material.

  Further, the photosensitive conductive material used in the present invention can contain a surfactant. As surfactant, polyoxyethylene alkyl ether sulfate, sodium dodecylbenzenesulfonate, alkali salt of styrene-acrylic acid copolymer, sodium alkylnaphthalene sulfonate, sodium alkyldiphenyl ether disulfonate, lauryl sulfate monoethanolamine, lauryl sulfate Anionic surfactants such as triethanolamine, ammonium lauryl sulfate, monoethanolamine stearate, sodium stearate, sodium lauryl sulfate, monoethanolamine of styrene-acrylic acid copolymer, polyoxyethylene alkyl ether phosphate ester, etc. Oxyethylene oleyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene ether Nonionic surfactants such as kill ether phosphates, polyoxyethylene sorbitan monostearate, polyethylene glycol monolaurate; chaotic surfactants such as alkyl quaternary ammonium salts and their ethylene oxide adducts; alkyldimethylamino Examples include amphoteric surfactants such as alkylbetaines such as betaine acetate and alkylimidazolines, and these can be used alone or in admixture of two or more.

  The photosensitive conductive material used in the present invention can contain a silane coupling agent in order to improve adhesion to the transparent substrate. As silane coupling agents, KBM-303, KBM-402, KBM-403, KBE-402, KBE-403, KBM-502, KBM-503, KBE-502, KBE-503, KBM-5103, KBM-802, KBM-803, KBE-9007 (above, manufactured by Shin-Etsu Silicone), Z-6011, Z-6020, Z-6030, Z-6040, Z-6043, Z-6094, Z-6519 (above, Toray Dow Corning Manufactured). The silane coupling agent can be contained in an amount of 0.1% by mass or more and 1% by mass or less based on the total amount of the photosensitive conductive material.

  The photosensitive conductive material used in the present invention includes carbon, black pigment, titanium black, a pseudo black mixture of at least two or more pigments, at least one or more black dyes, and a particle diameter in the range of 0.1 μm to 4 μm. One or more kinds of black materials selected from the group consisting of black metal oxides, metal particles, photopolymerization initiators, polymerizable polyfunctional monomers, resins, solvents, surfactants and the like with a predetermined composition After mixing and stirring with a stirrer, it was obtained by kneading with a three-roll mill.

<The manufacturing method of the 1st electrode 23, the 2nd electrode 24, the 1st connection part 25, and the extraction wiring 20 which used the photosensitive electrically-conductive material>
The manufacturing method of the 1st electrode 23, the 2nd electrode 24, the 1st connection part 25, and the extraction wiring 20 which used the photosensitive metal material in this invention is demonstrated below.

  Examples of the method for applying the photosensitive conductive material to the transparent substrate include screen printing, gravure offset printing, reverse offset printing, relief printing, die coating, and bar coating, and screen printing is generally used. In order to evaporate the organic solvent after application to the transparent substrate, pre-baking is performed as necessary. For pre-baking, a hot air circulation oven, a hot plate, or an IR oven can be used.

After applying the photosensitive metal material to the transparent substrate, pattern exposure is performed through a photomask corresponding to the desired first electrode 23, second electrode 24, first connection portion 25, and extraction wiring 20. . A normal high-pressure mercury lamp may be used as the exposure light source. The exposure amount is preferably about 10 to 200 mJ / cm ² from the viewpoint of tact time.
Development is performed following exposure. An alkaline aqueous solution is used as the developer. As an example of the alkaline aqueous solution, a tetramethylammonium hydroxide aqueous solution or a potassium hydroxide aqueous solution is preferably used, but a sodium carbonate aqueous solution, a sodium hydrogen carbonate aqueous solution, a mixed aqueous solution of both, or a surfactant suitable for them. You may use what added.

  By performing heat treatment after development, an arbitrary first electrode 23, second electrode 24, first connection portion 25, and extraction wiring 20 are obtained. The heat treatment is performed at 130 to 250 ° C. for 10 to 60 minutes using a heat drying oven. Due to the curing shrinkage of the resin due to the heat treatment, the silver powder of the extracted wiring pattern comes into contact with each other and has sufficient conductivity, and the resistance to chemicals and the like is improved.

Hereinafter, the present invention will be specifically described by way of examples. However, the present invention is not limited thereto without departing from the spirit of the present invention.
[Synthesis of alkali-soluble resin A]
The reaction vessel was charged with 800 parts of 1-methoxy-2-propyl acetate, heated while injecting nitrogen gas into the reaction vessel, and a mixture of the following monomer and thermal polymerization initiator was added dropwise to conduct a polymerization reaction.
Styrene 40 parts Methacrylic acid 60 parts Methyl methacrylate 55 parts Benzyl methacrylate 45 parts Azobisisobutyronitrile 10 parts 1,4-dimethylmercaptobenzene 3 parts

After dripping, after heating sufficiently, what melt | dissolved 2 parts of azobisisobutyronitrile with 50 parts of 1-methoxy-2-propyl acetate was added, and reaction was further continued, and the solution of the acrylic resin was obtained.
To this resin solution, 1-methoxy-2-propyl acetate was added so that the solid content was 30% by mass to prepare an acrylic resin solution.
The weight average molecular weight of the alkali-soluble resin A was about 20,000.

[Preparation of photosensitive conductive material 1]
A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and then filtered through a 5 μm filter to prepare photosensitive conductive material 1.
Carbon black MHI black # 220 (manufactured by Gokoku Dye) 3.6 parts Silver powder (average particle size d50 1.5 μm) 65 parts Photopolymerization initiator Irgacure OXE02 (manufactured by BASF) 0.2 part Polymerizable polyfunctional monomer R- 684 (Nippon Kayaku Co., Ltd.) 6 parts Alkali-soluble resin A 20.88 parts Radical scavenger Methyl hydroquinone 0.02 parts Organic solvent 1-methoxy-2-propyl acetate 4 parts Surfactant Adecanate B-940 (manufactured by ADEKA) ) 0.1 part Silane coupling agent KBM-502 (manufactured by Shin-Etsu Silicone) 0.2 part Carbon black content in carbon black MHI black # 220 is 33% by mass, solid content is 40% by mass, average particle The diameter is 125 nm.

[Preparation of photosensitive conductive materials 2-14]
Photosensitive conductive materials 2 to 14 were obtained in the same manner as the photosensitive conductive material 1 except that the composition was changed to the mixture of materials shown in Tables 1 and 2.

Example 1
<Production of capacitive touch panel sensor substrate>
An ITO film with a film thickness of 30 nm was formed on an aluminosilicate glass by a sputtering apparatus, a novolac positive resist was spin-coated, dried on a hot plate, and the coating film was dried. Then, after performing exposure through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the alkaline developing solution. After washing with water, wet etching is performed using an etching solution mainly composed of oxalic acid, and the resist is removed using an alkaline resist stripping solution. Then, heat treatment is performed at 230 ° C. for 30 minutes in an oven, and the conductor width is 80 μm. X A second connection portion having a conductor length of 500 µm was formed. The sheet resistance of the ITO film was 60 Ω / cm ² .

  Next, an acrylic negative resist was spin-coated, dried on a hot plate, and the coating film was dried. Then, after performing exposure through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the alkaline developing solution. After washing with water, heat treatment was performed in an oven to form an insulating layer. The insulating layer was 100 μm wide × 120 μm long so as to cover only the effective portion of the second connecting portion.

Subsequently, the photosensitive conductive material 1 was applied by screen printing using a screen printing plate (material: stainless steel, manufactured by Tokyo Process Service Co., Ltd.) having a desired opening of the mesh 500, and 90 ° C. on a hot plate. The film was dried for 5 minutes to dry the coating film. Thereafter, exposure is performed through a photomask having a desired opening at 50 to 200 mJ / cm ² using a high-pressure mercury lamp as a light source, and then for 30 to 60 seconds with a 0.2% by mass aqueous sodium hydrogen carbonate solution. Shower development was performed. After washing with water, heat treatment was performed at 230 ° C. for 30 minutes in a hot-air circulating oven to produce a first electrode, a second electrode, a first connection portion, and an extraction wiring.

By changing the opening of the photomask, the exposure amount, and the development time, a first electrode and a second electrode having a mesh structure with a conductor width of 3 to 12 μm of the fine line pattern were obtained. The sheet resistance of the photosensitive conductive material layer was 0.2Ω / cm ² and the conductor thickness was 3.0 μm. The pitch between the fine line patterns of the mesh structure was 1000 μm, and the shape of the mesh structure was a wavy diagonal lattice shown in FIG.

  Subsequently, an acrylic negative resist was spin-coated and dried on a hot plate to dry the coating film. Then, after performing exposure through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the alkaline developing solution. After washing with water, heat treatment was performed in an oven to form a protective layer, and a capacitive touch panel sensor substrate was obtained. The insulating layer was formed so as to cover the entire region excluding the connection part connected to the extraction wiring of the touch panel sensor substrate and the control circuit.

(Examples 2-12, Comparative Examples 1-2)
<Production of capacitive touch panel sensor substrate>
It carried out like Example 1 except having changed into the photosensitive conductive material 1 and using the photosensitive conductive materials 2-14, respectively.

(Comparative Example 3)
<Production of capacitive touch panel sensor substrate>
In the same manner as in Example 1, after forming a second connection portion with an ITO film on an aluminosilicate glass and forming an insulating layer using a negative resist, each of Mo, Al, and Mo in this order was 350 mm / 2000 mm / 350 mm. A positive resist was spin-coated, dried on a hot plate, and the coating film was dried. Then, after performing exposure through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the alkaline developing solution. After washing with water, wet etching is performed using an etching solution mainly composed of phosphoric acid, nitric acid, and acetic acid. After removing the resist using an alkaline resist stripping solution, heat treatment is performed at 230 ° C. for 30 minutes in an oven. The 1st electrode, the 2nd electrode, the 1st connection part, and the extraction wiring were produced.

By changing the opening of the photomask, the exposure amount, and the development time, a first electrode and a second electrode having a mesh structure with a conductor width of 3 to 12 μm of the fine line pattern were obtained. The sheet resistance of the Mo / Al / Mo film was 0.2Ω / cm ² . The pitch between the fine line patterns of the mesh structure was 1000 μm, and the shape of the mesh structure was a wavy diagonal lattice shown in FIG. Thereafter, in the same manner as in Example 1, a capacitive touch panel sensor substrate was obtained.

(Comparative Example 4)
<Production of capacitive touch panel sensor substrate>
As in Comparative Example 3, after forming a second connection portion with an ITO film on an aluminosilicate glass and forming an insulating layer using a negative resist, an ITO film with a film thickness of 30 nm was formed by a sputtering apparatus. The positive resist was spin-coated and dried on a hot plate to dry the coating film. Then, after performing exposure through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the alkaline developing solution. After washing with water, wet etching is performed using an etching solution containing oxalic acid as a main component, and after removing the resist using an alkaline resist stripping solution, heat treatment is performed in an oven at 230 ° C. for 30 minutes to form a first electrode. The second electrode, the first connection portion, and the lead-out wiring were produced.

By changing the opening of the photomask, the exposure amount, and the development time, a first electrode and a second electrode having a mesh structure with a conductor width of 3 to 12 μm of the fine line pattern were obtained. The sheet resistance of the ITO film was 60 Ω / cm ² . The pitch between the fine line patterns of the mesh structure was 1000 μm, and the shape of the mesh structure was a wavy diagonal lattice shown in FIG. Thereafter, in the same manner as in Example 1, a capacitive touch panel sensor substrate was obtained.

[Evaluation method of first electrode, second electrode, and first connection portion]
<Reflectance evaluation>
On an alkali-free glass substrate, Mo, Al, and Mo were formed in the order of 350 Å / 2000 Å / 350 そ れ ぞ れ respectively by sputtering, and subjected to heat treatment at 230 ° C. for 30 minutes in a hot air circulating oven for evaluation substrate Was made. In addition, a photosensitive conductive material is applied on a non-alkali glass substrate by screen printing using a screen printing plate of mesh 500 (material: stainless steel, manufactured by Tokyo Process Service Co., Ltd.), and 5 ° C. at 100 ° C. on a hot plate. Drying was performed for a minute, and the coating film was dried.

Thereafter, the entire surface was exposed at 100 mJ / cm ² using a high-pressure mercury lamp as a light source, and then shower development was performed for 30 seconds with a 0.2% by mass aqueous sodium hydrogen carbonate solution. After washing with water, heat treatment was performed at 230 ° C. for 30 minutes in a hot air circulation oven to prepare an evaluation substrate. The reflectance was measured by using a UV-visible spectrophotometer (U-4100 manufactured by Hitachi High-Tech) and measuring diffuse reflected light including specular reflection from an alkali-free glass substrate surface using an integrating sphere.

<Evaluation of first electrode, second electrode, and first connection pattern appearance>
When the obtained capacitive touch panel sensor substrate is placed on the fluorescent lamp light box and on the blackboard where the external light is shielded, and reflected by changing the angle under the fluorescent lamp as external light, It was evaluated whether the second connection portion could be observed visually. The evaluation criteria are shown below.
○: The first electrode, the second electrode, and the first connection portion are not visible on either the fluorescent light box or the blackboard. The first electrode, the second electrode, and the first connection portion are slightly visible. X: The first electrode, the second electrode, and the first connection either on the fluorescent light box or on the blackboard Part is clearly visible-Pattern cannot be formed because pattern peeling or resolution is impossible. Note that ○ and Δ are usable levels.

<Appearance evaluation of first electrode, second electrode, and first connection portion>
When the obtained capacitive touch panel sensor substrate is placed on the fluorescent lamp light box and on the blackboard where the external light is shielded, and reflected by changing the angle under the fluorescent lamp as external light, It was evaluated whether or not unevenness could be observed visually. The evaluation criteria are shown below.
○ ・ ・ ・ Non-uniformity is visible on both the fluorescent light box and the blackboard △ ・ ・ ・ Non-uniformity is slightly visible on both the fluorescent light box and the blackboard × ・ ・ ・ On the fluorescent light box and the blackboard Unevenness can be clearly seen in any of the above-Pattern cannot be formed because pattern peeling or resolution is impossible. Note that ◯ and Δ are usable levels.

<Sensitivity evaluation>
On the aluminosilicate glass substrate, a photosensitive conductive material is applied by screen printing using a screen printing plate of mesh 500 (material: stainless steel, manufactured by Tokyo Process Service Co., Ltd.) and dried on a hot plate at 90 ° C. for 5 minutes. And the coating film was dried. Thereafter, exposure is performed through a photomask having a desired opening at 50 to 200 mJ / cm ² using a high-pressure mercury lamp as a light source, followed by shower development for 60 seconds with a 0.2% by mass aqueous sodium bicarbonate solution. Carried out. As a criterion for determining the sensitivity, the exposure amount necessary for forming the first electrode and the second electrode having a mesh structure with a conductor width of 5 μm in a thin line pattern is assumed to be less than 150 mJ / cm ² with good sensitivity, and 150 mJ / cm ^{A value of 2} or more and less than 400 mJ / cm ² can be used, and a value of 400 mJ / cm ² or more is marked as insufficient sensitivity.

<Evaluation of wiring resistance>
A probe was applied to the terminal portion of the extraction wiring of the obtained capacitive touch panel sensor substrate using a continuity tester (FPμ-3600, manufactured by Miyachi Systems), and the wiring resistance was measured. The evaluation criteria are shown below.
○ ... 50 kΩ or less × ... 50 kΩ or more-... Pattern cannot be formed due to pattern peeling or resolution not possible.

<Electrostatic breakdown evaluation>
The obtained electrostatic capacitance type touch panel sensor substrate was subjected to electrostatic breakdown evaluation using an electrostatic discharge simulator (KES 4021 manufactured by Kikusui Electronics Corporation). As evaluation criteria, the case where no disconnection occurred at an applied voltage of 10 kV was rated as ◯, and the case where a disconnection occurred was rated as x.
The compositions of the photosensitive conductive materials 1 to 14 are shown in Tables 1 and 2, and the evaluation results are shown in Table 3.

From the comparison between Examples 1 to 12 and Comparative Examples 1 and 2, if the reflectance is 30% or less, the first electrode, the second electrode, and the first connection portion are displayed without a pattern visible. It can be seen that it is possible to manufacture a capacitive touch panel with excellent quality.
Further, in the example in which the metal film of Comparative Example 3 is used for the first electrode, the second electrode, and the first connection portion, there is no problem with the wiring resistance, but the pattern is visible, so that the display quality is poor. It becomes a capacitive touch panel. In Comparative Example 4 in which the ITO film is used for the first electrode, the second electrode, and the first connection portion, a capacitive touch panel with poor wiring resistance and poor detection sensitivity is obtained.
From the above, the superiority of the present invention was shown.

DESCRIPTION OF SYMBOLS 1 Color filter 6 Fine line pattern 10 Transparent base material 20 Extraction wiring 21 2nd connection part 22 Insulating layer 23 1st electrode 24 2nd electrode 25 1st connection part

Claims (21)

A plurality of first electrodes are arranged in a straight line in the x direction, and each of them is connected by a first connecting portion to form a first electrode row, a plurality of first electrode rows are arranged in parallel, and a second electrode is A plurality of lines arranged in a straight line in the y direction perpendicular to the x direction are connected to each other by a second connection portion to form a second electrode row, a plurality of the second electrode rows are arranged in parallel, and the first connection portion and The first electrode row and the second electrode row are arranged so as to intersect with each other so that the second connection portion overlaps, and the first electrode and the second electrode are arranged on a transparent substrate. Are arranged in a grid pattern, with an insulating layer interposed between the first connection portion and the second connection portion, and connected to the first electrode row and the second electrode row, respectively. A capacitive touch panel sensor substrate formed on the transparent substrate, wherein the first electrode and the second electrode The electrode is formed in a mesh structure with a fine line pattern,
The first electrode and the second electrode are formed using the same photosensitive conductive material as the material for forming the first electrode, the second electrode, and the extraction wiring. And forming the second connection portion using a transparent conductive material, and forming the first connection portion, the first electrode, the second electrode, and the extraction wire. The method of manufacturing a capacitive touch panel sensor substrate, wherein the reflectance of the capacitive touch panel sensor substrate is 0% or more and 30% or less.   2. The method of manufacturing a capacitive touch panel sensor substrate according to claim 1, wherein the conductor width of the thin line pattern of the first electrode and the second electrode is in a range of 0.5 μm to 10 μm. .   3. The capacitive touch panel sensor according to claim 1, wherein the photosensitive conductive material includes a black material, metal particles, a photopolymerization initiator, a polymerizable polyfunctional monomer, and a resin. A method for manufacturing a substrate.   The black material is at least one selected from the group consisting of carbon, black pigment, titanium black, a pseudo black mixture of two or more pigments, a black dye, and a black metal oxide. The manufacturing method of the electrostatic capacitance type touch-panel sensor board | substrate of description.   The said metal particle contains 1 or more types of metals chosen from the group which consists of gold, silver, platinum, copper, palladium, iridium, rhodium, and aluminum, The Claim 3 or Claim 4 characterized by the above-mentioned. A method for manufacturing a capacitive touch panel sensor substrate.   6. The method of manufacturing a capacitive touch panel sensor substrate according to claim 3, wherein a particle diameter of the metal particles is in a range of 0.1 μm to 4 μm.   The said photoinitiator contains 1 or more types of O-acyl oxime type compound, The manufacturing method of the electrostatic capacitance type touch-panel sensor board | substrate as described in any one of Claims 3-6 characterized by the above-mentioned.   The content of the black material in the photosensitive conductive material is in the range of 1% by mass to 100% by mass of the mass of the metal particles contained in the photosensitive conductive material. The manufacturing method of the capacitive touch-panel sensor board | substrate as described in any one of 3-7.   The method for producing a capacitive touch panel sensor substrate according to any one of claims 1 to 8, wherein the transparent conductive material is indium tin oxide.   A capacitive touch panel sensor substrate manufactured by the method for manufacturing a capacitive touch panel sensor substrate according to claim 1. A plurality of first electrodes are arranged in a straight line in the x direction, and each of them is connected by a first connecting portion to form a first electrode row, a plurality of first electrode rows are arranged in parallel, and a second electrode is A plurality of lines arranged in a straight line in the y direction perpendicular to the x direction are connected to each other by a second connection portion to form a second electrode row, a plurality of the second electrode rows are arranged in parallel, and the first connection portion and The first electrode row and the second electrode row are arranged so as to intersect with each other so that the second connection portion overlaps, and the first electrode and the second electrode are arranged on a transparent substrate. Are arranged in a grid pattern, with an insulating layer interposed between the first connection portion and the second connection portion, and connected to the first electrode row and the second electrode row, respectively. A capacitive touch panel sensor substrate formed on the transparent substrate,
The first electrode and the second electrode have a mesh structure formed in a fine line pattern,
The first connection portion is formed of the same photosensitive conductive material as the material forming the first electrode, the second electrode, and the extraction wiring, and the second connection portion is transparent. It is formed of a conductive material, and the reflectivity of the first connection portion, the first electrode, the second electrode, and the extraction wiring is 0% or more and 30% or less. Capacitive touch panel sensor board.   The capacitive touch panel sensor substrate according to claim 11, wherein the conductor width of the thin line pattern of the first electrode and the second electrode is in the range of 0.5 μm to 10 μm.   The capacitive touch panel sensor according to claim 11 or 12, wherein the photosensitive conductive material contains a black material, metal particles, a photopolymerization initiator, a polymerizable polyfunctional monomer, and a resin. substrate.   The black material is at least one selected from the group consisting of carbon, black pigment, titanium black, a pseudo black mixture of two or more pigments, a black dye, and a black metal oxide. Capacitive touch panel sensor substrate as described in 1.   The said metal particle contains 1 or more types of metals chosen from the group which consists of gold, silver, platinum, copper, palladium, iridium, rhodium, and aluminum, The Claim 13 or Claim 14 characterized by the above-mentioned. Capacitive touch panel sensor board.   The capacitive touch panel sensor substrate according to any one of claims 13 to 15, wherein a particle diameter of the metal particles is in a range of 0.1 µm to 4 µm.   The capacitive touch panel sensor substrate according to any one of claims 13 to 16, wherein the photopolymerization initiator contains one or more O-acyloxime compounds.   The content of the black material in the photosensitive conductive material is in the range of 1% by mass to 100% by mass of the mass of the metal particles contained in the photosensitive conductive material. The capacitive touch panel sensor substrate according to any one of 13 to 17.   The capacitive touch panel sensor substrate according to any one of claims 11 to 18, wherein the transparent conductive material is indium tin oxide.   A color filter is formed on the plate surface opposite to the plate surface on which the first electrode row, the second electrode row, and the extraction wiring are formed, out of both plate surfaces of the plate-like transparent substrate. The capacitive touch panel sensor substrate according to any one of claims 11 to 19, wherein   A display device comprising the capacitive touch panel sensor substrate according to any one of claims 11 to 20.

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