JP2014174607A - Manufacturing method of capacitance type touch panel sensor substrate, capacitance type touch panel sensor substrate and display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a capacitance type touch panel sensor substrate having excellent display quality, with an inexpensive electrode having lower resistance than that of a conventional transparent electrode.SOLUTION: A manufacturing method is for a sensor substrate including: a first electrode 23; a second electrode 24; a first connection part 25; a second connection part 21; an insulator layer 22; and drawing wiring 20. The first electrode 23 and the second electrode 24 each have an auxiliary fine line pattern 26. An insulator layer 22 is formed after one of a step of forming the first electrode 23, the second electrode 24 and the first connection part 25 or a step of forming the second connection part 21, and thereafter, the other of the step of forming the first electrode 23, the second electrode 24 and the first connection part 25 or the step of forming the second connection part 21 is performed. In the step of forming the second connection part 21, the auxiliary fine line pattern 26 is formed so as to be superposed on part of the first electrode 23 and the second electrode 24. A reflectance ratio of the second connection part 21, the auxiliary fine line pattern 26 and the drawing wiring 20 is 4-30%.

Description

  The present invention relates to a method for manufacturing a capacitive touch panel sensor substrate, a capacitive touch panel sensor substrate, and a display device.

  The touch panel is a component of an input device that can detect and input data by touching a transparent surface on the display screen with a finger or the like. In recent years, it has been widely used because it enables intuitive input. In particular, the touch panel is often combined with a display panel such as a liquid crystal to input and output information in an integrated manner.

  The touch panel detection method includes a resistance film type, a capacitance type, an ultrasonic type, an optical type, and the like. Until now, the resistance film type, which was relatively excellent in terms of manufacturing cost, has been the mainstream. However, a resistive touch panel having a structure in which an air layer is provided between two transparent conductive films has low optical characteristics (for example, transmittance), and it cannot be said that durability and operating temperature characteristics are sufficient. Improvements have been sought.

On the other hand, capacitive touch panels that do not have moving parts have high optical characteristics and are superior to resistance film types in terms of durability and operating temperature characteristics, so they are especially developed for high-reliability applications such as in-vehicle use. (For example, see Patent Documents 1 and 2).
The projected capacitive touch panel sensor substrate generally includes a first transparent electrode arranged in the x direction, a second transparent electrode arranged in the y direction, and a first transparent electrode on a transparent substrate. The first connection at the first connection part for joining the transparent electrodes, the second connection part for joining the second transparent electrodes, and the first connection part and the second connection part intersect with each other. And an insulating layer for electrically insulating the second connection portion. Further, on the transparent base material, an extraction wiring connecting these transparent electrodes and the control circuit is formed. Furthermore, in order to protect the transparent electrode, the connection portion, and the extraction wiring from corrosion or contact damage, a protective layer may be formed and used so as to cover almost the entire surface other than the connection portion of the extraction wiring connected to the control circuit. The number is increasing (see, for example, Patent Document 3).

  The projected capacitive touch panel has a film type that uses a resin film such as polyethylene terephthalate (PET) as a transparent substrate, and a glass type that uses non-alkali glass or soda lime glass. Therefore, it is properly used depending on the purpose. The film type is advantageous in that the manufacturing cost is low and it is difficult to break, and since it is flexible, it is easy to remove bubbles when it is bonded to another display device or a cover glass. On the other hand, the film type has disadvantages such that the transmittance of the film is lower than that of glass and the pattern position accuracy of the transparent electrode formed on the film is inferior to that of glass. For this reason, glass-types are often used for small items such as mobile terminals such as smartphones that require high definition and low power consumption. Medium and large sizes such as televisions that require productivity such as low cost and easy bonding. Many of the products are film type.

  For the transparent electrode, new conductive materials such as conductive polymers and silver nanowires have been introduced, but indium tin oxide (hereinafter referred to as ITO) is generally used because of its high transparency and excellent practicality. It is used for. However, ITO has a limit of several tens of ohms / square even if the resistance value is low. For this reason, there is no problem in a small product such as a portable terminal, but when the size is 15 inches or more, particularly 20 inches or more, the wiring resistance of the ITO electrode is increased and the detection sensitivity of the projected capacitive touch panel is deteriorated. was there. Furthermore, when the transparent base material is a film, it is up to about 200 ° C. even if the heat resistance of the film is high, so that the amorphous ITO formed by a film forming method such as sputtering is crystallized sufficiently at 200 ° C. or higher. It cannot be fired at a high temperature. For this reason, there existed a subject that resistance value is high and it is inferior to transparency.

  Furthermore, the formation of the transparent electrode, the connecting portion, the insulating layer, the lead-out wiring, and the protective layer requires a plurality of film formation and patterning steps, which requires a lot of manufacturing costs. In particular, in the manufacturing process of the lead-out wiring, molybdenum (Mo) / aluminum (Al) / molybdenum film is formed by a sputtering method from the viewpoint of high conductivity and easy microfabrication, and photolithography using a positive resist ( A method of performing etching and resist stripping after a step (hereinafter referred to as “photolitho”) is widely used. In addition, indium tin oxide (ITO), which has high transparency and excellent resistance, is generally used for the transparent electrode, but as with the lead-out wiring, a metal film is formed by sputtering on the substrate placed in the vacuum vessel. After that, it is necessary to perform protective film formation, etching, and protective film peeling, and not only there are many processes, but also the equipment cost is high.

On the other hand, as a transparent electrode, a method has been disclosed in which both a low resistance and a transparency are achieved by using an electrode having a mesh structure in which a highly conductive fine metal wire pattern is stretched in a lattice shape (for example, , See Patent Document 4).
However, with this method, even if a film-type touch panel sensor substrate having a thin line pattern is obtained, in addition to problems inherent to the film such as poor transmittance and poor pattern position accuracy, a thin film formed on the film Many problems remain in the film-type touch panel sensor substrate, such as interference unevenness and film thickness unevenness due to the influence of the film.

In addition, a method for reducing the manufacturing cost by simultaneously forming one of the lead-out wiring and the first or second connection portion is disclosed (for example, see Patent Document 5).
However, with this method, the touch panel sensor substrate can be manufactured at a low cost by shortening the manufacturing process, and the connection part in the display area formed using a metal material is solved visually under normal use conditions. Even if it was possible, the problem of the resistance value of the transparent electrode could not be solved.
In addition, the process flowchart of the manufacturing method of the electrostatic capacitance type touch panel sensor board | substrate which concerns on a prior art is shown in FIG.5 (b).

JP 63-174120 A JP 2006-23904 A JP 2007-279819 A JP 2012-53644 A JP 2011-86122 A

The present invention has been made in view of such a situation, and when manufacturing a capacitive touch panel sensor substrate having a medium size or larger, an electrode having a lower resistance than a conventional conductive transparent electrode is inexpensive, and It is an object of the present invention to provide a method for manufacturing a capacitive touch panel sensor substrate excellent in display quality without impairing visibility.
Another object of the present invention is to provide a capacitive touch panel sensor substrate that is manufactured by using the manufacturing method and that is inexpensive and excellent in display quality.

Furthermore, by forming a color filter on the surface of the transparent substrate on which the capacitive touch panel sensor is formed and the other surface, the on-cell capacitive type can be manufactured at a lower cost by reducing the number of components. Another object is to provide a touch panel sensor substrate.
Another object of the present invention is to provide a display device having the above-described capacitance type touch panel sensor substrate.

  One embodiment of the present invention includes (A) a first electrode, (B) a second electrode, (C) a first connection portion that connects the (A) first electrodes, and (D) (B) a second connecting part for connecting the second electrodes, and (E) the (C) first connecting part and the (D) second connecting part intersecting each other. An electrostatic capacitance formed on a transparent substrate, comprising: an insulating layer; and (F) the (A) first electrode and the (B) extraction wiring connected to the second electrode. A touch panel sensor substrate manufacturing method, wherein the (A) first electrode, the (B) second electrode, and the (C) first connection portion are formed using a transparent conductive material; (E) forming the insulating layer, and (D) the second connecting portion is formed by using the same photosensitive conductive material as the material of the (F) extraction wiring. Forming the wiring at the same time, and forming the first electrode, the second electrode, and the first connection part (D) or the second connection (D) After one step of forming the connecting portion, the step of forming the (E) insulating layer is performed, and after the step of forming the (E) insulating layer, the (A) first electrode, (B) performing the other step of the step of forming the second electrode and the (C) first connection portion or the step of (D) forming the second connection portion; In the step of forming the connecting portion, at the same time, (G) the auxiliary fine line pattern is formed so as to overlap a part on the (A) first electrode and the (B) second electrode, D) The reflectance of the second connecting portion, the (G) auxiliary fine line pattern, and the (F) extraction wiring is 4% or more and 30% or less. A capacitive touch panel sensor substrate manufacturing method which is a 囲内.

In the method for manufacturing a capacitive touch panel sensor substrate, the conductor widths of the (D) second connection portion and the (G) auxiliary fine line pattern are in the range of 0.5 μm to 10 μm. It is good.
In the method for manufacturing a capacitive touch panel sensor substrate, the photosensitive conductive material may be (H) black material, (I) metal particles, (J) photopolymerization initiator, (K) polymerizable polyfunctional. It is good also as a monomer, (L) resin, and (M) containing a solvent.

In the method for manufacturing a capacitive touch panel sensor substrate, the (H) black material is carbon, a black pigment, a pseudo black mixture of at least two or more kinds of pigments, at least one or more kinds of black dyes, a particle diameter. May be at least one selected from the group of black metal oxides in the range of 0.1 μm to 4 μm.
In the method for manufacturing a capacitive touch panel sensor substrate, the (I) metal particles may be gold (Au), silver (Ag), platinum (Pt), copper (Cu), palladium (Pd), iridium. One or more metals selected from (Ir), rhodium (Rh), and aluminum (Al) may be contained.

In the method for manufacturing a capacitive touch panel sensor substrate, the particle diameter of the metal particles (I) may be in the range of 0.1 μm to 4 μm.
In the method for producing a capacitive touch panel sensor substrate, the (J) photopolymerization initiator may contain one or more O-acyloxime compounds.
In the method for manufacturing a capacitive touch panel sensor substrate, the content of the (H) black material is in the range of 1 wt% to 100 wt% with respect to the weight of the (I) metal particles. It may be there.

In the method for manufacturing the capacitive touch panel sensor substrate, the transparent conductive material may be indium tin oxide (ITO).
Another aspect of the present invention is a capacitive touch panel sensor substrate manufactured by the above-described method for manufacturing a capacitive touch panel sensor substrate.
Further, in the above-described capacitive touch panel sensor substrate, a color filter may be formed on a surface of the transparent base material opposite to the surface on which the capacitive touch panel sensor is formed.

Another embodiment of the present invention is a display device including the above-described capacitance-type touch panel sensor substrate.
In another aspect of the present invention, (A) a first electrode, (B) a second electrode, and (C) a first connection portion that connects the (A) first electrodes; (D) The (B) second connecting portion for connecting the second electrodes, (E) the portion where the (C) first connecting portion and the (D) second connecting portion intersect. An insulating layer to be formed, and (F) the (A) first electrode and the (B) extraction wiring connected to the second electrode are formed on a transparent substrate. It is an electrostatic capacitance type touch panel sensor board | substrate, Comprising: Said (A) 1st electrode and said (B) 2nd electrode are on said (A) 1st electrode and said (B) 2nd electrode. (G) Auxiliary fine line pattern is provided so as to overlap with a part, and (D) the second connection portion is made of (G) auxiliary fine line pattern and (F) extraction wiring material. The reflectance of the (D) second connection portion, (G) auxiliary fine line pattern and (F) lead-out wiring is 4% or more and 30% or less. It is an electrostatic capacitance type touch panel sensor board | substrate characterized by being in the range.

In the capacitance touch panel sensor substrate, the conductor widths of the (D) second connection portion and the (G) auxiliary fine line pattern may be in the range of 0.5 μm or more and 10 μm or less. .
In the above capacitive touch panel sensor substrate, the photosensitive conductive material includes (H) black material, (I) metal particles, (J) photopolymerization initiator, (K) polymerizable polyfunctional monomer, ( L) A resin and (M) a solvent may be contained.

In the capacitance touch panel sensor substrate, the (H) black material may be carbon, a black pigment, a pseudo black mixture of at least two or more pigments, at least one or more black dyes, and a particle size of 0.1. It is good also as being 1 or more types chosen from the group of the black metal oxide which exists in the range of 1 micrometer or more and 4 micrometers or less.
In the above capacitive touch panel sensor substrate, the (I) metal particles are gold (Au), silver (Ag), platinum (Pt), copper (Cu), palladium (Pd), iridium (Ir). One or more metals selected from rhodium (Rh) and aluminum (Al) may be contained.

Moreover, in the above-described capacitance-type touch panel sensor substrate, the particle diameter of the (I) metal particles may be in the range of 0.1 μm to 4 μm.
Moreover, said electrostatic capacitance type touch-panel sensor board | substrate WHEREIN: The said (J) photoinitiator is good also as containing 1 or more types of O-acyl oxime type compounds.
Moreover, in said electrostatic capacitance type touch panel sensor board | substrate, content of the said (H) black material shall be in the range of 1 weight% or more and 100 weight% or less with respect to the weight of the said (I) metal particle. Also good.

Further, in the above capacitive touch panel sensor substrate, the transparent conductive material may be indium tin oxide (ITO).
In the capacitance touch panel sensor substrate, a color filter may be provided on a surface of the transparent base opposite to a surface on which the capacitance touch panel sensor is formed.
Another embodiment of the present invention is a display device including the above-described capacitance-type touch panel sensor substrate.

According to the present invention, when manufacturing a capacitive touch panel sensor substrate of a medium size or larger, an electrode having a lower resistance than a conventional ITO transparent electrode can be manufactured at a lower cost, and an auxiliary fine line pattern used for the electrode Alternatively, it is possible to provide a method for manufacturing a touch panel sensor substrate that does not impair the display quality of the connection portion.
Further, it is possible to provide an inexpensive capacitive touch panel sensor substrate manufactured using the manufacturing method and having excellent display quality.
Furthermore, by forming a color filter on the surface of the transparent substrate on which the capacitive touch panel sensor is formed and the other surface, the on-cell capacitive type can be manufactured at a lower cost by reducing the number of components. A touch panel sensor substrate can be provided.
Further, it is possible to provide a display device having the above-described capacitance type touch panel sensor substrate that is inexpensive and excellent in display quality.

It is a plane schematic diagram which shows the manufacturing method of the electrostatic capacitance type touch panel sensor board | substrate which concerns on embodiment of this invention, Comprising: On a transparent base material, (A) 1st electrode, (B) 2nd electrode, and (C FIG. 3 is a schematic plan view showing a state in which a first connection portion is formed. It is a plane schematic diagram which shows the manufacturing method of the electrostatic capacitance type touch panel sensor board | substrate which concerns on embodiment of this invention, Comprising: On a transparent base material, (A) 1st electrode, (B) 2nd electrode, and (C FIG. 4 is a schematic plan view showing a state where (E) an insulating layer is formed after the first connection portion is formed. It is a plane schematic diagram which shows the manufacturing method of the electrostatic capacitance type touch panel sensor board | substrate which concerns on embodiment of this invention, Comprising: On a transparent base material, (A) 1st electrode, (B) 2nd electrode, (C ) After the first connection portion and (E) insulating layer are formed, (G) auxiliary thin line pattern, (D) second connection portion and (F) a schematic plan view showing a state in which the extraction wiring is formed at the same time It is. a) (A) When forming the first electrode in the x-axis direction of the capacitive touch panel sensor substrate according to the embodiment of the present invention, (A) the first electrode and (B) the second electrode It is the plane schematic diagram which expanded the intersection position. b) (A) When forming the first electrode in the y-axis direction of the capacitive touch panel sensor substrate according to the embodiment of the present invention, (A) the first electrode and (B) the second electrode It is the plane schematic diagram which expanded the intersection position. a) It is a process flow figure of the manufacturing method of the capacitive touch panel sensor board | substrate which concerns on embodiment of this invention. b) It is a process flow figure of the manufacturing method of the electrostatic capacitance type touch panel sensor board | substrate which concerns on a prior art.

  A method for manufacturing a projected capacitive touch panel sensor substrate according to the present invention and a touch panel sensor substrate manufactured using the same will be described in detail based on the embodiments thereof. In addition, the touch panel sensor board | substrate of this invention is not limited to the following structures, unless the summary is exceeded.

<Projection capacitive touch panel sensor substrate>
FIG. 3 is a plan view of the projected capacitive touch panel sensor substrate according to the present embodiment as seen through a protective layer (not shown). FIG. 4A) is a schematic plan view in which the crossing position of (A) the first electrode and (B) the second electrode in FIG. 3 is enlarged. Note that the projected capacitive touch panel sensor substrate according to the present embodiment can be configured such that the positional relationship between the x direction and the y direction is different, as shown in FIG.
(A) First electrode 23 and (B) second electrode 24 are formed by combining a transparent electrode pattern and (G) auxiliary fine line pattern 26. The transparent electrode pattern is obtained through a step of forming a transparent conductive material by sputtering or the like, a step of forming an etching protective layer, a step of forming a pattern by etching, and a step of peeling off the etching protective layer. Further, (G) the auxiliary fine line pattern 26 is formed through a step of forming a pattern only on a necessary portion by a printing method such as screen printing using a photosensitive conductive material described later, and a photomask provided with a desired fine pattern. It is obtained through a photolithography process in which exposure and development are performed by irradiation with ultraviolet rays. By combining the transparent electrode pattern and the (G) auxiliary fine line pattern 26, it is possible to achieve both low resistance and transparency that can cope with a medium size or larger size.

  (G) The auxiliary fine line pattern 26 is preferably formed so as to follow the transparent electrode pattern from the viewpoint of capacitance, that is, so as to surround the outer peripheral portions of the first electrode 23 and the second electrode 24. However, in order to eliminate moire, the wavy line pattern and the adjacent thin line patterns may not be in a parallel relationship, the shape of the lattice pattern may be deviated from the square, or a bias of a certain angle may be applied as a whole.

  Although it does not specifically limit as the transparent base material 10, For example, glass plates, such as a soda lime glass, a low alkali borosilicate glass, an alkali free alumino borosilicate glass, or a polyethylene terephthalate (PET), a triacetyl cellulose ( A plastic plate or plastic film made of TAC), polymethyl methacrylate (PMMA), polycarbonate (PC), or the like is used.

  When a cover glass is used for the transparent base material 10, it can be set as a projection type capacitive touch panel sensor substrate integrated with a cover glass. The transparent substrate 10 is chemically strengthened with aluminosilicate glass (for example, “Gollila (Corning)”, “IOX-FS (Corning)”, “Dragonrail (Asahi Glass)”) A special glass plate such as soda lime glass can be used. When a cover glass is used for the transparent base material 10, the number of parts per transparent base material can be reduced in order to provide both a frame layer (bezel) and a touch panel sensor on a large glass substrate that is a base material. The touch panel can be manufactured at a low cost. Since a normal cover glass is chemically strengthened after dividing a large glass substrate into individual pieces, sufficient strength is easily obtained, whereas when a cover glass is used for the transparent substrate 10, After a plurality of frame layers (bezels) and touch panel sensors are formed together on a single large glass substrate, a tempered glass is formed on each piece by methods such as chemical etching and mechanical cutting. There is a problem that the strength becomes weak when the reinforced large substrate is divided into individual pieces. In recent years, means for solving these problems are being disclosed, and a tempered glass such as a cover glass is often employed for the transparent substrate 10.

  (C) The first connection portion 25 is formed simultaneously with the transparent electrode pattern of (A) the first electrode 23 and (B) the second electrode 24. The materials used for (A) the first electrode 23, (B) the second electrode 24, and (C) the first connection portion 25 are particularly those that can be disposed on the surface of the transparent substrate 10. Although not limited, inorganic conductive materials such as ITO and zinc oxide (ZnO) are preferable. These materials may be used alone or in combination of two or more. Among these, it is preferable to use ITO in terms of transparency, reliability, and practical use. As the thickness of the transparent electrode (that is, (A) first electrode 23, (B) second electrode 24, and (C) first connection portion 25) in the present embodiment (hereinafter referred to as conductor thickness), It is preferably 0.02 μm or more and 0.1 μm or less. If the conductor thickness is less than 0.02 μm, sufficient electrical characteristics cannot be obtained, and if it exceeds 0.1 μm, the visibility of the touch panel is affected.

(E) The insulating layer 22 and the protective layer (not shown) can be formed using known materials conventionally used for the insulating layer and the protective layer. (E) Examples of the material for the insulating layer 22 or the protective layer include inorganic films such as SiO ₂ and SiN _x and organic materials such as transparent resins. The inorganic film is a film formed by a CVD method, a sputtering method, or the like. For this reason, the formation of the inorganic film has a problem that the manufacturing cost becomes high, for example, the energy consumption increases or the number of steps increases. For this reason, formation by a photolithography method using an organic material is preferably used. As the organic material, a UV curable coating composition containing a polymerizable group-containing oligomer, monomer, photopolymerization initiator and other additives can be used.

  (D) The second connection portion 21 is formed by using the same photosensitive conductive material as (G) the auxiliary fine line pattern 26 and (F) the extraction wiring 20 via (E) the insulating layer 22 (G It is formed simultaneously with the auxiliary thin line pattern 26 and (F) the extraction wiring 20. In FIG. 3, the connection part in the x direction with respect to the transparent substrate 10 is (C) the first connection part 25, and the connection part in the y direction is (D) the second connection part 21. As described above, the x direction and the y direction may be reversed. That is, as shown in FIG. 4B), the structure may be such that the connection portion in the x direction is (D) the second connection portion 21 and the connection portion in the y direction is (C) the first connection portion 25.

  (G) Auxiliary fine line pattern 26, (D) second connection portion 21 and (F) lead-out wiring 20 have a step of forming a pattern only in a necessary portion by a printing method such as the above-described screen printing, and a desired fine pattern. It is simultaneously formed through a photolithographic process in which exposure and development are performed by irradiating with ultraviolet rays through a photomask provided with. The projected capacitive touch panel sensor substrate according to the present embodiment is preferable in that it can be formed at a lower cost than when these are formed individually.

Photosensitive conductive materials used for forming the (G) auxiliary fine line pattern 26, (D) the second connection portion 21 and (F) the extraction wiring 20 include gold (Au), silver (Ag), platinum (Pt), Photosensitive conductive material such as conductive paste in which conductive powder such as copper (Cu), palladium (Pd), iridium (Ir), rhodium (Rh), and aluminum (Al) is dispersed in an organic binder to provide photosensitivity. Can be preferably used. Select the particle size of conductive powder such as gold (Au), silver (Ag), platinum (Pt), copper (Cu), palladium (Pd), iridium (Ir), rhodium (Rh), aluminum (Al) as appropriate By doing so, the reflectance of (G) auxiliary fine line pattern 26, (D) second connection portion 21 and (F) extraction wiring 20 can be easily controlled to 4% or more and 30% or less. For this reason, if it is the electroconductive powder which selected the particle diameter suitably, the problem of a pattern appearance can be avoided easily and manufacturing cost can be held down. If the reflectivity exceeds 30%, the degree of reflection of external light under normal use conditions increases, so that the pattern can be seen with the naked eye and display quality is degraded.
The “reflectance” used in this embodiment refers to the reflectance at 550 nm when the glass substrate surface side is measured using an ultraviolet-visible spectrophotometer. Moreover, you may apply the other well-known technique which reduces a reflectance.

  Conventionally, a three-layer structure of Mo / Al / Mo is formed by sputtering at a thickness of about 350 mm / 2000 mm / 350 mm respectively, followed by a photolithography process using a positive resist, followed by etching / resist peeling (hereinafter referred to as “resisting”). (Referred to as “MAM”), but since this metal material has high reflectivity, the (D) second connecting portion 21 in the display area is finely formed to have a width of 8 μm and a length of about 200 μm. However, since it can be visually recognized under normal use conditions, there is a problem of deteriorating display characteristics.

  (D) As conductor width of the 2nd connection part 21 and (G) auxiliary fine line pattern 26, 0.5 micrometer or more and 10 micrometers or less are preferred. (D) When the conductor width of the second connection portion 21 and (G) auxiliary fine line pattern 26 is less than 0.5 μm, a fault occurs when a transient voltage such as static electricity is generated (hereinafter referred to as “electrostatic breakdown”). It is easy to occur. On the other hand, when the conductor width of (D) the second connection portion 21 and (G) the auxiliary fine line pattern 26 exceeds 10 μm, not only the pattern is easily seen with the eyes, but also the transmittance of the display area is reduced. To do.

Further, the conductor thickness of (D) the second connection portion 21 and (G) the auxiliary fine wire pattern 26 is preferably 0.5 μm or more and 5 μm or less. If the conductor thickness of the (D) second connection portion 21 and (G) the auxiliary fine line pattern 26 is less than 0.5 μm, sufficient conductivity cannot be obtained, and conduction failure may occur. On the other hand, if the conductor thickness of (D) the second connection portion 21 and (G) the auxiliary fine line pattern 26 exceeds 5 μm, the ultraviolet light does not reach the bottom during exposure in the photolithography process, and pattern formation becomes difficult.
The “conductor width” means (D) the second connection portion 21 or (G) the line width of the auxiliary thin line pattern 26, and “conductor thickness” means (D) the second connection portion 21 or ( G) The thickness of the auxiliary fine line pattern 26.

  (C) The 1st connection part 25 is a connection part for connecting the (A) 1st electrode 23 which adjoins, and, in the case of the structure shown in FIG. Are connected to each other. (C) The first connection portion 25 is formed simultaneously with the transparent electrode pattern of the first electrode 23 by using the same transparent conductive material as that of the transparent electrode pattern of the first electrode 23 (A). Is done. In other words, (A) when the transparent electrode pattern of the first electrode 23 is formed, (C) the first connection portion 25 is also formed at the same time, so that a continuous electrode pattern is formed without interruption in the x direction. Means that.

  Furthermore, the transparent electrode pattern of the (B) second electrode 24 arranged in the y direction with respect to the transparent substrate 10 is also formed simultaneously with (A) the first electrode 23 and (C) the first connecting portion 25. The Note that (B) the transparent electrode pattern of the second electrode 24 is not formed at the same time as (D) the second connection portion 21, so at this point, it is not yet connected in the y direction.

<Method of manufacturing capacitive touch panel substrate>
The manufacturing process of the projected capacitive touch panel sensor according to this embodiment is shown in FIGS. 1 to 3 and the manufacturing flow is shown in FIG.
First, as shown in FIG. 1, the transparent electrode pattern of (A) the first electrode 23 and (B) the second electrode 24 and (C) the first connection portion 25 are formed on the transparent substrate 10. To do.
As a material of the transparent electrode pattern of (A) the first electrode 23 and (B) the second electrode 24 and (C) the first connecting portion 25, ITO which is generally used is suitable. It is not limited to this. Depending on the specific specifications of the capacitive touch panel function, the characteristics of ITO and the characteristics as a transparent electrode pattern are selected. For example, as an ITO film, a film having a film thickness of 30 nm and a sheet resistance value of about 100Ω / □ is formed by a thin film forming unit of a sputtering apparatus. Next, a resist pattern is formed by a photolithographic method including a series of steps of resist coating, exposure, and development using an etching-resistant photosensitive resin. Thereafter, a pattern is formed through ITO etching and a resist peeling process. For example, (C) As the first connection portion 25, a large number of patterns having a width of 50 μm to 100 μm and a length of 200 μm to 500 μm are formed.

As shown in FIG. 2, the transparent electrode pattern of (A) the first electrode 23 and (B) the second electrode 24 and (C) the first connection portion 25 were formed on the transparent substrate 10. Thereafter, (E) an insulating layer 22 is formed. Specifically, (E) the insulating layer 22 is formed so as to cover a range including the effective area of (C) the first connection portion 25 or (D) the second connection portion 21. (E) As a manufacturing method of the insulating layer 22, an insulating function can be obtained by forming a SiO ₂ film with a thickness of 100 nm or more. However, as an easier manufacturing method, an organic insulating film can be formed by a photolithography method. it can. For example, a photosensitive organic insulating film material having a refractive index of 1.53 and a volume resistivity of 2 × 10 ¹⁵ Ω · cm is applied by a coating method such as spray coating, spin coating, slit die coating, roll coating, or bar coating. The film is applied so that the dry film thickness is 0.2 to 10 μm, more preferably 0.5 to 5 μm. If necessary, the dried film is exposed through a mask having a predetermined pattern provided in contact with or not in contact with the film. The kind of the light beam at the time of exposure is not particularly limited, and examples thereof include visible light, ultraviolet rays, far infrared rays, electron beams, X-rays, etc. Among them, ultraviolet rays are preferable. Is not particularly limited illuminance of the light beam is preferably 5~150mW / cm ² at 365 nm, and particularly preferably 15~35mW / cm ^2.

  Then, if necessary, the film is immersed in an aqueous alkaline developer such as sodium carbonate or sodium hydroxide, or sprayed with a developer or the like to remove uncured portions and form a desired pattern. Furthermore, in order to accelerate the polymerization of the photosensitive composition to form a film, heating (post-baking) is performed as necessary. A pattern is formed through these steps, and a patterned (E) insulating layer 22 having a transmittance exceeding 97% can be obtained.

  The (G) auxiliary thin line pattern 26, (D) second connection portion 21 and (F) take-out wiring 20 shown in FIG. 3 are photosensitive conductive materials such as a conductive paste whose reflectivity is controlled to 4% to 30%. The material can be obtained by forming a film by a printing method such as screen printing and forming a fine pattern by a photolithography method. In the photolithographic method, after applying a photosensitive conductive paste on the transparent substrate 10, the exposed portion of the coating film is cured by photocrosslinking by irradiating with ultraviolet light through a photomask corresponding to a desired extraction wiring, This is a method of forming a lead-out wiring pattern by baking after removing an unexposed portion of a coating film using a developer. By using this photolithography method, it is possible to obtain a conductive pattern that is cheaper than the vapor deposition method and has a higher definition than the printing method formed by screen printing or gravure offset printing.

  Further, if necessary, a protective film (not shown) may be provided with (A) the first transparent electrode 23, (B) the second transparent electrode 24, (C) the first connection portion 25, and (D) the second connection portion 21. (E) The insulating layer 22, (F) the extraction wiring 20, and (G) the auxiliary fine line pattern 26 are formed so as to cover a range including the effective region. More specifically, the protective layer is formed so as to have a dry film thickness of 0.5 to 20 μm, more preferably 1.0 to 10 μm, using the materials and methods described in the description of (E) insulating layer 22. . In addition, since the protective layer forms the outermost layer of the capacitive touch panel substrate, it is desirable that the protective layer be disposed as wide as possible to serve as a planarization layer.

Further, the capacitive touch panel sensor (that is, (A) the first transparent electrode 23, (B) the second transparent electrode 24, (C) the first connection portion 25, (D) The color filter is formed on the surface opposite to the surface on which the second connection portion 21, (E) insulating layer 22, (F) extraction wiring 20 and (G) auxiliary thin line pattern 26) is formed. May be. This color filter may be created before or after the formation of the capacitive touch panel sensor.
In addition, various types of display devices can be manufactured using the capacitive touch panel sensor substrate according to the present embodiment.

<Photosensitive conductive material>
The photosensitive conductive material used in this embodiment is at least (H) black material, (I) metal particles, (J) photopolymerization initiator, (K) polymerizable polyfunctional monomer, (L) resin, (M) A photosensitive conductive paste containing a solvent can be used, and other additives can be included as required.
The (G) auxiliary thin line pattern 26, (D) the second connection portion 21 and (F) the extraction wiring 20 constituting the capacitance type touch panel substrate according to the present embodiment are made of the above-described photosensitive conductive paste using the transparent substrate 10. It is formed by applying a so-called photolithographic process such as exposure, development, and heat curing after coating.
The photosensitive conductive material used in the present embodiment has carbon, black pigment, a pseudo black mixture of at least two or more types of pigments, at least one or more types of black dyes, and a particle size in order to control the reflectance to 30% or less. One or more (H) black materials selected from the group of black metal oxides in the range of 0.1 μm or more and 4 μm or less can be used in combination.

  The carbon black used in the present embodiment is a black pigment having a light shielding property. Examples of commercially available carbon blacks include # 260, # 25, # 30, # 32, # 33, # 40, # 44, # 44, and # 44. 45, # 45L, # 47, # 50, # 52, MA7, MA8, MA11, MA100, MA100R, MA100S, MA230 (manufactured by Mitsubishi Chemical Corporation), Printex L, Printex P, Printex 30, Printex 35, Printex 40 , Printex 45, Printex 55, Printex 60, Printex 300, Printex 350, Special Black 4, Special Black 350, Special Black 550 (manufactured by DEGUSSA) Another click alone, MHI Black # 201, # 220, # 273 (or, Mikuni Color Ltd.) can be used carbon black dispersion such. Carbon black may be used individually by 1 type, or 2 or more types may be mixed and used for it. The average primary particle diameter of the carbon black used in the present embodiment is preferably 10 nm or more and 500 nm or less, more preferably 10 nm or more and 300 nm or less.

  If the average primary particle size of the carbon black is smaller than 10 nm, it is difficult to disperse at a high concentration, so that it is difficult to obtain a photosensitive black composition having good temporal stability. Further, when the average primary particle diameter of carbon black is larger than 500 nm, the blackness is lowered. For this reason, in order to give sufficient blackness, the ratio of carbon black in the photosensitive conductive material increases, which adversely affects pattern processability. The content of carbon black in the photosensitive conductive material is preferably (I) 100% by weight or less and more preferably 1% by weight or more and 3% by weight or less based on the solid content of the metal particles (I). . When the carbon black content is less than 1% by weight, a sufficient reflectance reduction effect cannot be obtained. Further, when the carbon black content is more than 100% by weight, it is difficult to obtain photosensitivity, and (G) the auxiliary fine line pattern 26, (D) the second connection portion 21 and (F) the extraction wiring 20 are formed. It can be difficult.

As the black pigment, for example, aniline black or perylene black pigment can be used. I. Black pigments such as Pigment Black 1, 6, 7, 12, 20, 31, 32 can be used.
The pseudo black pigment mixture of at least two or more types of pigments used in the present embodiment is a pseudo black mixture having a light shielding property. Examples of the pseudo black mixture include pigments used for forming a colored transparent layer of a color filter, and C.I. I. Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 41, 48: 1, 48: 2, 48: 3, 48: 4, 57: 1, 81, 81: 1, 81: 2, 81: 3, 81: 4, 97, 122, 123, 146, 149, 166, 168, 169, 176, 177, 178, 179, 180, 184, 185, 187, 192,200,202,208,210,215,216,217,220,223,224,226,227,228,240,242,246,254,255,264,270,272,273,274,276, Red (RED) pigments typified by 277, 278, 279, 280, 281, 282, 283, 284, 285, 286, 287, and the like; I. At least a blue (BLUE) pigment typified by CI Pigment Blue 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 6, 16, 22, 60, 64, 80, etc. Therefore, a pseudo black color can be used.

  In addition to the red pigment and the blue pigment, a yellow (YELLOW) pigment may be added as the pseudo black mixture of pigments used in the present embodiment. It is known that yellow pigments absorb light in the low wavelength region of visible light, that is, light having a wavelength of 500 nm or less (for example, “Shoji Shio (1965)“ Printing Ink Class ”(Nihon Printing Shimbun) P170-173). By adding a yellow pigment to a red pigment and a blue pigment, the yellow pigment absorbs low-wavelength visible light and can be made closer to black.

  Examples of yellow (YELLOW) pigments include C.I. I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35: 1, 36, 36: 1, 37, 37: 1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 144, 146, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 17 , It includes the 175,176,177,179,180,181,182,185,187,188,193,194,198,199,213,214,218,219,220,221.

In the pseudo black mixture of pigments used in this embodiment, a violet pigment may be further added. By adding a violet pigment, it is easy to absorb light in the vicinity of a wavelength of 550 nm as compared with the case where it is not added, and a black having a higher optical density (OD value) can be obtained.
Examples of purple pigments used in this embodiment include C.I. I. Pigment violet 1, 19, 23, 27, 29, 30, 32, 37, 40, 42, 50.

Further, a pigment such as an orange pigment or a green pigment may be added. Examples of the orange pigment include C.I. I. Pigment orange 36, 43, 51, 55, 59, 61, 71, 73, and the like. Examples of the green pigment include C.I. I. And green pigments such as CI Pigment Green 7, 10, 36, 37, and 58.
Furthermore, in the pseudo black material of the pigment used in the present embodiment, an organic black pigment can be used as an auxiliary agent for reducing the reflectance. I. PBK 1, 30, 31 etc. are mentioned.

In the present embodiment, at least one kind of black dye can be used.
Examples of the chemical structure of the dye include triphenylmethane, anthraquinone, benzylidene, oxonol, cyanine, phenothiazine, pyrrolopyrazole azomethine, xanthene, phthalocyanine, benzopyran, and indigo. Of these, pyrazole azo dyes, anilinoazo dyes, pyrazolotriazole azo dyes, pyridone azo dyes, anthraquinone dyes, and anthrapyridone dyes are preferable.

As the colorant, known dyes can be used as long as they are soluble in an organic solvent. Examples thereof include oil-soluble dyes, acid dyes or derivatives thereof, direct dyes, and modern dyes.
Examples of the pigment used for the black dye include C.I. I. Acid Black 1, 24, 26, 31, 48, 50, 52, 52: 1, 58, 60, 63: 2, 64, 107, 109, 110, 112, 113, 118, 140, 155, 170, 172, 177, 187, 188, 194, 207, 222, C.I. I. Direct Black 17, 19, 22, 51, 62, 91, 112, 117, 118, 122, 132, 146, 154, 159, 169, 173 may be mentioned.

  The (H) black material used in the present embodiment may be a pseudo black mixture of two or more dyes having light shielding properties. For example, C.I. I. Acid Red 1, 6, 9, 14, 18, 35, 37, 42, 50, 52, 57, 73, 87, 88, 89, 92, 97, 106, 111, 114, 118, 128, 134, 138, 143, 143: 1, 145, 158, 183, 186, 211, 214, 215, 217, 219, 225, 226, 249, 254, 256, 257, 259, 260, 261, 263, 266, 274, 276, 278, 289, 299, 301, 303, 307, 315, 316, 317, 336, 337, 341, 355, 357, 359, 362, 366, 383, 399, 405, 407, 414, 416, 426, C.I. I. Direct Red 2, 23, 24, 31, 39, 54, 79, 83: 1, 89, 224, 225, 226, 227, 242, 243, C.I. I. A dye comprising a red (RED) pigment represented by Reactive Red 5, 8, 43, and the like; I. Acid Blue 7, 9, 15, 22, 23, 25, 40, 45, 47, 59, 61: 1, 62, 78, 80, 83, 90, 104, 109, 112, 127, 127: 1, 129, Blue (BLUE) represented by 138, 140, 203, 204, 207, 227, 228, 232, 247, 260, 264, 277, 278, 280, 283, 290, 333, 343, Direct Blue 106, 108, etc. A pseudo black color is obtained by mixing at least a dye composed of a system pigment.

  Examples of pigments used in yellow (YELLOW) dyes include I.I. Acid Yellow 3, 17, 38, 40: 1, 42, 44: 1, 49, 61, 65, 67, 72, 79, 110, 114, 116, 117, 119, 121, 127, 129, 135, 141, 143, 155, 158, 161, 194, 204, 207, 220, 232, 235, 241, C.I. I. Direct Yellow 12, 86, 87, 130, 142, C.I. I. And Reactive Yellow 84 and 102.

In the pseudo black mixture of dyes used in the present embodiment, a violet dye may be further added. By adding a violet dye, it is easy to absorb light in the vicinity of a wavelength of 550 nm as compared with the case where it is not added, and it is possible to make black with a higher optical density (OD value).
Examples of the pigment used for the violet dye used in the present embodiment include C.I. I. Acid Violet 21, 42, 43, 47, 48, 49, 54, 97, 102 etc. are mentioned.

  In addition to the above dyes, dyes such as orange dyes and green dyes may be added as the dyes used in the present embodiment. Examples of the pigment used for the orange dye include C.I. I. Orange 10, 19, 33, 50, 56, 67, 80, 108, 122, 142, 166, 130, C.I. I. Direct Orange 26, 39, C.I. I. Reactive Orange 1, 4 etc. are mentioned. Examples of pigments used as green dyes include C.I. I. Acid Green 3, 5, 22, 25, 27, 28, 41 etc. are mentioned.

Examples of the black metal oxide used in the present embodiment include titanium oxide, titanium oxynitride, silver oxide, iron oxide, zinc oxide, triiron tetroxide, cobalt oxide, tin oxide, indium oxide, magnesium oxide, and chromium. Copper oxide, copper chromate, cobalt-iron composite oxide, cobalt-iron-chromium composite oxide, nickel-iron-chromium composite oxide, copper-iron-manganese composite oxide, cobalt-nickel composite oxide, titanium- Vanadium-antimony composite oxide, tin-antimony composite oxide molybdenum disulfide, zinc sulfide, or the like can be used. The metal particles contained in the photosensitive conductive material are formed after pattern formation using an oxidizing agent such as sodium chlorite, sodium hypochlorite, and sodium nitrite, and an alkaline aqueous solution of sodium hydroxide and sodium phosphate. You may form as.
In addition, the blackened layer may be formed by depositing tellurium chloride by using metallic tellurium, tellurium dioxide and hydrochloric acid.

  In addition, it is preferable that content of the above-mentioned (H) black material exists in the range of 1 to 100 weight% with respect to the weight of (I) metal particle mentioned later. As in the case of the carbon black described above, when the content of the (H) black material is less than 1% by weight, a sufficient reflectance reduction effect cannot be obtained. Further, when the content of (H) the black material is more than 100% by weight, it is difficult to obtain photosensitivity, (G) auxiliary fine line pattern 26, (D) second connection portion 21 and (F) extraction wiring 20 May be difficult to form.

As the (I) metal particles of the photosensitive conductive material used in the present embodiment, gold (Au), silver (Ag), platinum (Pt), copper (Cu), palladium (Pd), iridium (Ir), rhodium And particles containing one or more metals selected from (Rh) and aluminum (Al).
Moreover, it is preferable that the average particle diameter of the (I) metal particle of the photosensitive electrically-conductive material used by this embodiment is 0.1 micrometer or more and 4 micrometers or less.

  When the average particle diameter is less than 0.1 μm, the concealing property becomes high, so that ultraviolet light does not reach the bottom during exposure, and pattern formation becomes difficult. On the other hand, when the average particle diameter exceeds 4 μm, the linearity and resolution in the fine pattern are not preferable. Moreover, (I) Although there exist flake shape, needle shape, spherical shape etc. regarding the shape of a metal particle, spherical silver powder is desirable from a viewpoint of screen printing property or light scattering at the time of exposure. (I) The amount of metal particles used is preferably 65% by weight or more and 90% by weight or less based on the total solid content of the photosensitive conductive material. (I) If the added amount of the metal particles is less than 65% by weight, a sufficient resistivity as a wiring cannot be obtained, and if it exceeds 90% by weight, the ultraviolet light does not reach the bottom during exposure and pattern formation becomes difficult.

  As the photopolymerization initiator (J) of the photosensitive conductive material used in this embodiment, 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)], O— It is necessary to use at least one O-acyloxime compound such as (acetyl) -N- (1-phenyl-2-oxo-2- (4′-methoxy-naphthyl) ethylidene) hydroxylamine. The O-acyloxime compound has excellent curing characteristics even in a highly concealable photosensitive conductive material because it generates methyl radicals and phenyl radicals with high mobility with high efficiency. These (J) photopolymerization initiators can be used alone or in combination. As a photopolymerization initiator that can be used by mixing with an O-acyloxime compound, 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, 1- (4-isopropylphenyl) -2- Acetophenone compounds such as hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, benzoin, Benzoin compounds such as benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzyl dimethyl ketal, benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophene Benzophenone compounds such as benzophenone, acrylated benzophenone, 4-benzoyl-4′-methyldiphenyl sulfide, 3,3 ′, 4,4′-tetra (t-butylperoxycarbonyl) benzophenone, thioxanthone, 2-chlorothioxanthone, Thioxanthone compounds such as 2-methylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, 2,4-diethylthioxanthone, 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis (trichloro Methyl) -s-triazine, 2- (p-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) -s- Triazine, 2-piphenyl-4,6-bis (trick (Romethyl) -s-triazine, 2-piperonyl-4,6-bis (trichloromethyl) -s-triazine, 2,4-bis (trichloromethyl) -6-styryl-s-triazine, 2- (naphth-1-) Yl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxy-naphth-1-yl) -4,6-bis (trichloromethyl) -s-triazine, 2,4-trichloro Triazine compounds such as methyl- (piperonyl) -6-triazine, 2,4-trichloromethyl (4′-methoxystyryl) -6-triazine, bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, 2, Phosphine compounds such as 4,6-trimethylbenzoyldiphenylphosphine oxide, 9,10-phenanthrenequinone, camphor Quinone compounds such as quinone and ethyl anthraquinone, borate compounds, carbazole compounds, imidazole compounds, titanocene compounds and the like are used. (J) The amount of the photopolymerization initiator used is preferably 0.1% by weight to 50% by weight, more preferably 0.2% by weight to 20% by weight, based on the total solid content of the photosensitive conductive material. .

  Furthermore, as a sensitizer for (J) photopolymerization initiator, α-acyloxy ester, acylphosphine oxide, methylphenylglyoxylate, benzyl, 9,10-phenanthrenequinone, camphorquinone, ethylanthraquinone, Compounds such as 4,4′-diethylisophthalophenone, 3,3 ′, 4,4′-tetra (t-butylperoxycarbonyl) benzophenone, triethanolamine, methyldiethanolamine, triisopropanolamine, 4-dimethylaminobenzoic acid Acid methyl, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, 2-ethylhexyl 4-dimethylaminobenzoate, N, N-dimethylparatoluidine, 4,4′- Bis (dimethylamino) Benzophenone, 4,4'-bis (diethylamino) benzophenone, can be used in combination of 4,4'-bis (ethylmethylamino) amine compounds such as benzophenone. These sensitizers can be used alone or in combination. The amount of the sensitizer used is preferably 0.5 to 50% by weight, more preferably 1 to 30% by weight, based on the total amount of (J) the photopolymerization initiator and the sensitizer.

  As the (K) polymerizable polyfunctional monomer and oligomer of the photosensitive conductive material used in the present embodiment, methyl (meth) acrylate, ethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl ( (Meth) acrylate, cyclohexyl (meth) acrylate, β-carboxyethyl (meth) acrylate, diethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, triethylene glycol di (meth) acrylate, tripropylene glycol Di (meth) acrylate, trimethylolpropane tri (meth) acrylate, polyethylene glycol di (meth) acrylate, pentaerythritol tri (meth) acrylate, 1,6-hexanediol diglycy Ruether di (meth) acrylate, bisphenol A diglycidyl ether di (meth) acrylate, neopentyl glycol diglycidyl ether di (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tricyclodecanyl (meth) acrylate, ester acrylate, Various acrylic esters and methacrylic esters such as melamine (meth) acrylate, (meth) acrylic esters of methylolated melamine, various acrylic esters and methacrylates such as epoxy (meth) acrylate, urethane acrylate, (meth) acrylic Acid, styrene, vinyl acetate, hydroxyethyl vinyl ether, ethylene glycol divinyl ether, pentaerythritol trivinyl ether, (meth) acrylic acid Examples include rylamide, N-hydroxymethyl (meth) acrylamide, N-vinylformamide, acrylonitrile and the like. Moreover, it is preferable to use the polyfunctional urethane acrylate which has the (meth) acryloyl group obtained by making polyfunctional isocyanate react with the (meth) acrylate which has a hydroxyl group. The combination of the (meth) acrylate having a hydroxyl group and the polyfunctional isocyanate is arbitrary and is not particularly limited. Moreover, one type of polyfunctional urethane acrylate may be used alone, or two or more types may be used in combination. These may be used alone or in combination of two or more.

The (L) resin of the photosensitive conductive material used in this embodiment is a linear polymer having a carboxyl group, and is a (meth) acrylic copolymer resin or epoxy resin and (meth) acrylic acid or its anhydride. Examples thereof include an epoxy-modified acrylate resin obtained by further reacting the reaction product with a polybasic carboxylic acid or an anhydride thereof.
The (meth) acrylic copolymer resin of the photosensitive conductive material used in the present embodiment is a copolymer resin containing at least a (meth) acrylic monomer as a constituent component, and the (meth) acrylic monomer is a (meth) acrylic monomer. ) Acrylic acid, methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, allyl acrylate, benzyl acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, glycidyl acrylate, aminoethyl acrylate, methyl methacrylate , Ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate Rate, allyl methacrylate, benzyl methacrylate, cyclohexyl methacrylate, dicyclopentanyl methacrylate, dicyclopentenyl acrylate, glycidyl methacrylate, aminoethyl methacrylate, and the like. As a constituent component other than the (meth) acrylic monomer, a compound having an unsaturated bond such as styrene or cyclohexylmaleimide can be used.
Examples of the epoxy resin used for the epoxy-modified acrylate resin include phenol novolac, cresol novolac, and those having bisphenol A or bisphenol F skeleton.

  As the (M) solvent of the photosensitive conductive material used in the present embodiment, cyclohexanone, ethyl cellosolve acetate, butyl cellosolve acetate, ethyl carbitol acetate, 1-methoxy-2-propyl acetate, diethylene glycol dimethyl ether, ethylbenzene, ethylene glycol diethyl ether , Xylene, ethyl cellosolve, methyl-n amyl ketone, propylene glycol monomethyl ether, petroleum solvent and the like, and these can be used alone or in combination. (M) The solvent is preferably added in an amount of 5 to 20% by weight based on the total amount of the photosensitive conductive paste.

  In addition to the above components, the photosensitive conductive material used in this embodiment may include a radical scavenger. The radical scavenger has an action of deactivating active radicals, and by adding it to the photosensitive conductive paste, (I) it is possible to suppress the curing reaction in the unexposed part caused by light scattering by the metal particles. Thus, the dimensional accuracy of the conductor pattern can be improved. Examples of the radical scavenger include hydroquinone derivatives such as hydroquinone, methylhydroquinone, methoquinone, quinopower MNT (manufactured by Kawasaki Kasei Co., Ltd.), non-flex alba, non-flex CBP, non-flex EBP (manufactured by Seiko Chemical Co., Ltd.), and the like. Quinone derivatives such as 4-benzoquinone, 2,6-dichloroquinone, p-xyloquinone, naphthoquinone, Irganox 245, Irganox 259, Irganox 1010, Irganox 1035, Irganox 1076, Irganox 1098 (above, manufactured by BASF), Adekastab AO-30A Tab 30 Hindered phenols such as ADEKA), TINUVIN123, TINUVIN144, TINUVIN152, TINUVIN76 And hindered amines such as TINUVIN770DF (above, manufactured by BASF), ADK STAB LA-77, ADK STAB LA-57, ADK STAB LA-67, ADK STAB LA-87 (above, manufactured by ADEKA), etc. More than one type can be used. As the addition amount of the radical scavenger, it can be added in the range of 0.01 wt% or more and 0.1 wt% or less based on the total solid content of the photosensitive conductive paste. If the added amount of the radical scavenger is less than 0.01% by weight, the effect of improving the dimensional accuracy of the conductor pattern cannot be obtained, and if it exceeds 0.1% by weight, pattern peeling due to insufficient crosslinking density or discoloration during heat curing. Occurs.

  In order to stabilize the time-dependent viscosity of the photosensitive conductive material used in the present embodiment, a storage stabilizer can be contained. Examples of the storage stabilizer include quaternary ammonium chlorides such as benzyltrimethyl chloride and diethylhydroxyamine, organic acids such as lactic acid and oxalic acid, and organic acids such as methyl ether, t-butylpyrocatechol, triethylphosphine, and triphenylphosphine. Examples thereof include phosphine and phosphite. The storage stabilizer can be contained in an amount of 0.1 wt% or more and 10 wt% or less based on the total amount of the photosensitive conductive material.

  Further, the photosensitive conductive material used in this embodiment can contain a surfactant. As surfactant, polyoxyethylene alkyl ether sulfate, sodium dodecylbenzenesulfonate, alkali salt of styrene-acrylic acid copolymer, sodium alkylnaphthalene sulfonate, sodium alkyldiphenyl ether disulfonate, lauryl sulfate monoethanolamine, lauryl sulfate Anionic surfactants such as triethanolamine, ammonium lauryl sulfate, monoethanolamine stearate, sodium stearate, sodium lauryl sulfate, monoethanolamine of styrene-acrylic acid copolymer, polyoxyethylene alkyl ether phosphate ester, etc. Oxyethylene oleyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene ether Nonionic surfactants such as kill ether phosphates, polyoxyethylene sorbitan monostearate, polyethylene glycol monolaurate; chaotic surfactants such as alkyl quaternary ammonium salts and their ethylene oxide adducts; alkyldimethylamino Examples include amphoteric surfactants such as alkylbetaines such as betaine acetate and alkylimidazolines, and these can be used alone or in admixture of two or more.

  The photosensitive conductive material used in the present embodiment can contain a silane coupling agent in order to improve the adhesion to the substrate. As silane coupling agents, KBM-303, KBM-402, KBM-403, KBE-402, KBE-403, KBM-502, KBM-503, KBE-502, KBE-503, KBM-5103, KBM-802, KBM-803, KBE-9007 (above, manufactured by Shin-Etsu Silicone), Z-6011, Z-6020, Z-6030, Z-6040, Z-6043, Z-6094, Z-6519 (above, Toray Dow Corning Manufactured) and the like. The silane coupling agent can be contained in an amount of 0.1 wt% or more and 1 wt% or less based on the total amount of the photosensitive conductive material.

  The photosensitive conductive material used in the present embodiment is the above-described carbon, black pigment, a pseudo black mixture of at least two or more types of pigments, at least one or more types of black dyes, and the particle diameter is in the range of 0.1 μm to 4 μm. One or more (H) black materials selected from the group of black metal oxides, (I) metal particles, (J) photopolymerization initiators, (K) polymerizable polyfunctional monomers, (L) resins, (M) It obtained by mix | blending components, such as a solvent and surfactant, with a predetermined composition, kneading with a stirrer, and knead | mixing with a 3 roll mill.

<(G) Auxiliary Fine Wire Pattern 26 Using Photosensitive Conductive Material, (D) Second Connecting Portion 21 and (F) Manufacturing Method of Extraction Wiring 20>
A method for manufacturing the (G) auxiliary fine line pattern 26, (D) the second connection portion 21 and (F) the extraction wiring 20 using the photosensitive conductive material in the present embodiment will be described below.
Examples of the method for applying the photosensitive conductive material to the transparent substrate 10 include screen printing, gravure offset printing, reverse offset printing, relief printing, die coating, and bar coating, and screen printing is generally used. After application to the transparent substrate 10, pre-baking is performed as necessary to evaporate the organic solvent. For pre-baking, a hot air circulation oven, a hot plate, or an IR oven can be used.

After the photosensitive conductive material is applied to the transparent substrate 10, pattern exposure is performed through a photomask corresponding to the desired (G) auxiliary fine line pattern 26, (D) second connection portion 21, and (F) extraction wiring 20. I do. A normal high-pressure mercury lamp can be used as the exposure light source. The exposure amount is preferably about 10 to 200 mJ / cm ² from the viewpoint of tact time.
Development is performed following exposure. An alkaline aqueous solution is used as the developer. As an example of the alkaline aqueous solution, a tetramethylammonium hydroxide aqueous solution or a potassium hydroxide aqueous solution is preferably used, but a sodium carbonate aqueous solution, a sodium hydrogen carbonate aqueous solution, a mixed aqueous solution of both, or a surfactant suitable for them. You may use what added.

  After the development, an arbitrary (G) auxiliary fine line pattern 26, (D) the second connection portion 21 and (F) the extraction wiring 20 are obtained by performing a heat treatment. The heat treatment is performed at 130 to 250 ° C. for 10 to 60 minutes using a heat drying oven. Due to the curing shrinkage of the resin due to the heat treatment, the silver powder of the pattern of the (F) extraction wiring 20 comes into contact with each other and has sufficient conductivity and also improves the resistance to chemicals and the like.

Hereinafter, the present invention will be specifically described by way of examples. However, the present invention is not limited thereto without departing from the spirit of the present invention.
[Synthesis of Resin A]
800 parts of 1-methoxy-2-propyl acetate was placed in a reaction vessel, heated while injecting nitrogen gas into the vessel, and a mixture of the following monomers and a thermal polymerization initiator was added dropwise to carry out a polymerization reaction.
Styrene 40 parts Methacrylic acid 60 parts Methyl methacrylate 55 parts Benzyl methacrylate 45 parts 1,4-Dimethylmercaptobenzene 3 parts After dripping and heating sufficiently, 2 parts of azobisisobutyronitrile are mixed with 1-methoxy-2-propyl acetate 50 What was dissolved in part was added, and the reaction was further continued to obtain an acrylic resin solution.
An acrylic resin solution was prepared by adding 1-methoxy-2-propylacetate to the resin solution so that the solid content was 30% by weight.
The weight average molecular weight of Resin A was about 20000.

[Preparation of photosensitive conductive material 1]
A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and then filtered through a 5 μm filter to prepare photosensitive conductive material 1.
Carbon Black MHI Black # 220 (manufactured by Mikuni Dye Co., Ltd.) 3.6 parts Carbon black content 33%, solid content 40%, average particle size 125 nm
Silver powder (average particle size d50 1.5 μm) 65 parts photopolymerization initiator Irgacure OXE02 (manufactured by BASF) 0.2 parts polymerizable polyfunctional monomer R-684 (manufactured by Nippon Kayaku Co., Ltd.) 6 parts alkali-soluble resin A 20. 88 parts radical scavenger methyl hydroquinone 0.02 parts organic solvent 1-methoxy-2-propyl acetate 4 parts surfactant Adecanate B-940 (manufactured by ADEKA) 0.1 part silane coupling agent KBM-502 (Shin-Etsu Silicone) 0.2 parts [Preparation of photosensitive conductive material 2-14]
Photosensitive conductive materials 2 to 14 were obtained in the same manner as the photosensitive conductive material 1 except that the composition was changed to the mixture of materials shown in Table 1.

Example 1
<Production of capacitive touch panel sensor substrate>
On the aluminosilicate glass, an ITO film having a film thickness of 30 nm was formed by a sputtering apparatus, a positive resist was spin-coated, dried on a hot plate, and the coating film was dried. Then, after exposing through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the tetramethylammonium hydroxide aqueous solution. After washing with water, wet etching is performed using an etching solution containing oxalic acid as a main component, and after removing the resist using a potassium hydroxide resist stripping solution, heat treatment is performed in an oven (A) The transparent electrode pattern of the electrode 23 and (B) the second electrode 24 and the (C) first connection portion 25 having a conductor width of 80 μm and a conductor length of 500 μm were formed. The sheet resistance of the ITO film was 60Ω / □.

  Next, an acrylic negative resist was spin-coated, dried on a hot plate, and the coating film was dried. Then, after exposing through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the sodium hydrogencarbonate aqueous solution. After washing with water, heat treatment was performed in an oven to form (E) the insulating layer 22. (E) The insulating layer 22 is (D) 100 μm wide and 120 μm long so as to cover only the effective portion of the second connecting portion 21.

Subsequently, the photosensitive conductive material 1 is applied by screen printing using a screen printing plate (material: stainless steel, manufactured by Tokyo Process Service Co., Ltd.) having a desired opening of the mesh 500, and at 90 ° C. on a hot plate. The coating was dried for 5 minutes. Thereafter, exposure is performed through a photomask having a desired opening at 50 to 200 mJ / cm ² using a high-pressure mercury lamp as a light source, and then for 30 to 60 seconds with a 0.2 wt% sodium bicarbonate aqueous solution. Shower development was performed. After washing with water, heat treatment is performed at 230 ° C. for 30 minutes in a hot air circulating oven, and (G) auxiliary fine line pattern 26, (D) second connection portion 21 and (F) take-out wiring 20 as shown in FIG. Was made. The (G) auxiliary fine line pattern 26 having a conductor width of 3 to 12 μm was obtained by changing the opening of the photomask, the exposure amount, and the development time. The sheet resistance of the photosensitive conductive material layer was 0.2Ω / □, and the conductor thickness was 3.0 μm.

  Subsequently, an acrylic negative resist was spin-coated and dried on a hot plate to dry the coating film. Then, after exposing through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the sodium hydrogencarbonate aqueous solution. After washing with water, heat treatment was performed in an oven to form a protective layer, and a capacitive touch panel sensor substrate was obtained. The protective layer was formed so as to cover the entire area of the touch panel sensor substrate 2 mm inside from the glass edge, excluding the connection site connecting the (F) extraction wiring 20 and the control circuit.

(Examples 2-12, Comparative Examples 1-2)
<Production of capacitive touch panel sensor substrate>
It carried out like Example 1 except having changed into the photosensitive conductive material 1 and using the photosensitive conductive materials 2-14.
(Comparative Example 3)
<Production of capacitive touch panel sensor substrate>
Similarly to Example 1, (C) the first connection part 25 is formed on the aluminosilicate glass with an ITO film, and (E) the insulating layer 22 is formed using an acrylic negative resist. Then, Mo, Al , Mo were formed in a thickness of 350 mm / 2000 mm / 350 mm respectively by a sputtering method, a positive resist was spin-coated, dried on a hot plate, and the coating film was dried. Then, after exposing through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the tetramethylammonium hydroxide aqueous solution. After washing with water, wet etching is performed using an etching solution mainly composed of phosphoric acid, nitric acid, and acetic acid. After removing the resist using a resist stripping solution of potassium hydroxide, heat treatment is performed in an oven (G ) Auxiliary fine line pattern 26, (D) second connection portion 21 and (F) extraction wiring 20 were produced. By changing the opening of the photomask, the exposure amount, and the development time, (G) the auxiliary fine line pattern 26 was obtained. The sheet resistance of the Mo / Al / Mo film was 0.2Ω / □. Thereafter, in the same manner as in Example 1, a capacitive touch panel sensor substrate was obtained. (Comparative Example 4)

<Production of capacitive touch panel sensor substrate>
On the aluminosilicate glass, Mo, Al, and Mo were formed in the order of 350 mm / 2000 mm / 350 mm in thickness by a sputtering method, a positive resist was spin-coated, and dried on a hot plate to dry the coating film. It was. Then, after exposing through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the tetramethylammonium hydroxide aqueous solution. After washing with water, wet etching is performed using an etching solution mainly composed of phosphoric acid, nitric acid, and acetic acid. After removing the resist using a resist remover of potassium hydroxide, heat treatment is performed in an oven (F ) Extraction wiring 20 was produced. (F) After the extraction wiring 20 is formed, (D) the second connection portion 21 is formed with an ITO film, (E) the insulating layer 22 is formed using an acrylic negative resist, and then the film thickness is 30 nm by a sputtering apparatus. An ITO film was formed, a positive resist was spin coated, dried on a hot plate, and the coating film was dried. Then, after exposing through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the tetramethylammonium hydroxide aqueous solution. After washing with water, wet etching is performed using an etching solution containing oxalic acid as a main component, and after removing the resist using a potassium hydroxide resist stripping solution, heat treatment is performed in an oven (A) Electrode 23 and (B) second electrode 24 and (C) first connection portion 25 were produced. The sheet resistance of the ITO film was 60Ω / □. Thereafter, in the same manner as in Example 1, a capacitive touch panel sensor substrate was obtained.

[Evaluation method]
<Reflectance evaluation>
On an alkali-free glass substrate, Mo, Al, and Mo were formed in the order of 350 Å / 2000 Å / 350 そ れ ぞ れ respectively by sputtering, and subjected to heat treatment at 230 ° C. for 30 minutes in a hot air circulating oven for evaluation substrate Was made. In addition, a photosensitive conductive material is applied on a non-alkali glass substrate by screen printing using a screen printing plate of mesh 500 (material: stainless steel, manufactured by Tokyo Process Service Co., Ltd.), and 5 ° C. at 100 ° C. on a hot plate. Drying was performed for a minute, and the coating film was dried. Thereafter, the entire surface was exposed at 100 mJ / cm ² using a high-pressure mercury lamp as a light source, and then shower development was performed with a 0.2 wt% sodium hydrogen carbonate aqueous solution for 30 seconds. After washing with water, heat treatment was performed at 230 ° C. for 30 minutes in a hot air circulation oven to prepare an evaluation substrate. The reflectance was measured by using a UV-visible spectrophotometer (U-4100 manufactured by Hitachi High-Tech) and measuring diffuse reflected light including specular reflection from an alkali-free glass substrate surface using an integrating sphere.

<Visibility evaluation>
The capacitive touch panel sensor substrates obtained in Examples 1 to 12 and Comparative Examples 1 to 4 were placed on a fluorescent light box and on a blackboard where external light was shielded, and under fluorescent light as external light. It was evaluated whether each can be observed visually when reflected at different angles. The evaluation criteria are shown below.
... (A) the first electrode 23, (B) the second electrode 24, and (D) the second connection portion 21 are not visible either on the fluorescent light box or on the blackboard. (A) The first electrode 23, (B) the second electrode 24, and (D) the second connection portion 21 are slightly visible on the lamp light box and on the blackboard. And (A) the first electrode 23, (B) the second electrode 24, and (D) the second connection portion 21 are clearly visible on any of the blackboards-the pattern is not peeled off or cannot be resolved What cannot be formed In addition, (circle) and (triangle | delta) are usable levels.

<Appearance evaluation>
The capacitive touch panel sensor substrates obtained in Examples 1 to 12 and Comparative Examples 1 to 4 were placed on a fluorescent light box and on a blackboard where external light was shielded, and under fluorescent light as external light. It was evaluated whether or not unevenness could be visually observed when the image was reflected at different angles. The evaluation criteria are shown below.
○ ... Unevenness is not visible either on the fluorescent light box or on the blackboard △ ... Unevenness is slightly visible on either the fluorescent light box or on the blackboard × ... On the fluorescent light box or on the blackboard Unevenness can be clearly seen in any of the above --- patterns cannot be peeled off or cannot be patterned, and ◯ and Δ are usable levels.

<Sensitivity evaluation>
On the aluminosilicate glass substrate, a photosensitive conductive material is applied by screen printing using a screen printing plate of mesh 500 (material: stainless steel, manufactured by Tokyo Process Service Co., Ltd.) and dried on a hot plate at 90 ° C. for 5 minutes. And the coating film was dried. Thereafter, exposure is performed through a photomask having a desired opening at 50 to 200 mJ / cm ² using a high-pressure mercury lamp as a light source, and then shower development is performed with a 0.2 wt% sodium hydrogen carbonate aqueous solution for 60 seconds. Carried out. As a criterion for sensitivity, the exposure amount necessary for forming a conductor width 5μm of (G) an auxiliary fine line pattern 26, ○ less than 150 mJ / cm ² as a sensitivity good, less than 150 mJ / cm ² or more 400 mJ / cm ² As Δ, 400 mJ / cm ² or more was evaluated as x because sensitivity was insufficient.

<Evaluation of wiring resistance>
A probe using a continuity tester (FPμ-3600 manufactured by Miyachi Systems Co., Ltd.) at the terminal portion of the (F) lead-out wiring 20 of the capacitive touch panel sensor substrate obtained in Examples 1-12 and Comparative Examples 1-4 And the wiring resistance was measured. The evaluation criteria are shown below.

○ ... 50 kΩ or less × ... 50 kΩ or more-... Patterns that cannot be formed due to pattern peeling or inability to resolve

<Electrostatic breakdown evaluation>
The electrostatic capacitance type touch panel sensor substrate obtained in Examples 1 to 12 and Comparative Examples 1 to 4 was subjected to electrostatic breakdown evaluation using an electrostatic discharge simulator (KES 4021 manufactured by Kikusui Electronics Corporation). As evaluation criteria, a case where no disconnection occurred at an applied voltage of 10 kV was indicated as “◯”, and a case where a disconnection occurred was indicated as “x”.
The compositions of the photosensitive conductive materials 1 to 14 are shown in Table 1, and the evaluation results are shown in Table 2.

  From the comparison between Examples 1-12 and Comparative Examples 1 and 2 in this embodiment, if the reflectance is 30% or less, (A) the first electrode 23, (B) the second electrode 24, and (D). It can be seen that a capacitive touch panel with excellent display quality can be manufactured without the second connecting portion 21 being visible in a pattern.

Further, in the example in which the metal film of Comparative Example 3 is used for (G) the auxiliary fine line pattern 26 and (D) the second connection portion 21, there is no problem with the wiring resistance, but the pattern is visible, so the display quality is poor. Capacitive touch panel. Further, (G) Comparative Example 4 in which the auxiliary fine line pattern 26 is not formed is a capacitive touch panel with poor wiring resistance and poor detection sensitivity. By using the manufacturing method according to the present embodiment, (A) the first electrode 23 and (B) the second electrode 24 take into account a printing margin rather than forming a mesh electrode using a photosensitive material. It is possible to reduce the amount of extra conductive photosensitive material used. For this reason, if it is the manufacturing method which concerns on this embodiment, cost reduction can be anticipated.
From the above, the superiority of the present invention was shown.

DESCRIPTION OF SYMBOLS 10 ... Transparent base material 20 ... Extraction wiring 21 ... 2nd connection part 22 ... Insulating layer 23 ... 1st electrode 24 ... 2nd electrode 25 ... 1st connection part 26 ... Auxiliary fine wire pattern

Claims (23)

(A) 1st electrode, (B) 2nd electrode, (C) 1st connection part which connects said (A) 1st electrodes, (D) Said (B) 2nd A second connecting portion for connecting the electrodes; (E) an insulating layer formed at a portion where the (C) first connecting portion and the (D) second connecting portion intersect; and (F) A manufacturing method of a capacitive touch panel sensor substrate formed on a transparent substrate, comprising: (A) a first electrode; and (B) a lead-out wiring connected to the second electrode. Because
Forming the (A) first electrode, the (B) second electrode, and the (C) first connection portion using a transparent conductive material;
(E) forming an insulating layer;
(D) forming the second connection portion simultaneously with the (F) extraction wiring using the same photosensitive conductive material as the material of the (F) extraction wiring, and
One of the steps (A) forming the first electrode, (B) the second electrode, and (C) forming the first connection portion or (D) forming the second connection portion. Later, the step (E) of forming an insulating layer is performed,
After the step (E) of forming the insulating layer, the step (A) of forming the first electrode, the step (B) of the second electrode and the step (C) of forming the first connection portion or the step (D) of Performing the other step of the step of forming the second connecting portion,
In the step (D) of forming the second connecting portion, at the same time, the (G) auxiliary fine line pattern is overlapped with the part on the (A) first electrode and the part on the (B) second electrode. Formed,
Capacitance type touch panel characterized in that the reflectance of the (D) second connecting portion, the (G) auxiliary fine line pattern and the (F) extraction wiring is in the range of 4% to 30%. A method for manufacturing a sensor substrate.   2. The capacitive touch panel sensor according to claim 1, wherein a conductor width of the (D) second connection portion and the (G) auxiliary fine line pattern is in a range of 0.5 μm to 10 μm. A method for manufacturing a substrate.   The photosensitive conductive material contains (H) black material, (I) metal particles, (J) photopolymerization initiator, (K) polymerizable polyfunctional monomer, (L) resin, and (M) solvent. The method for manufacturing a capacitive touch panel sensor substrate according to claim 1 or 2, wherein the capacitive touch panel sensor substrate is the same.   The (H) black material is carbon, a black pigment, a pseudo black mixture of at least two or more types of pigments, at least one or more types of black dyes, and a black metal oxide having a particle size in the range of 0.1 to 4 μm. The method for producing a capacitive touch panel sensor substrate according to claim 3, wherein the method is one or more selected from the group consisting of:   The (I) metal particles are selected from gold (Au), silver (Ag), platinum (Pt), copper (Cu), palladium (Pd), iridium (Ir), rhodium (Rh), and aluminum (Al). 5. The method for manufacturing a capacitive touch panel sensor substrate according to claim 3, comprising at least one metal.   6. The capacitance type touch panel sensor substrate according to claim 3, wherein a particle diameter of the metal particles is in a range of 0.1 μm to 4 μm. Production method.   The capacitive touch panel sensor substrate according to any one of claims 3 to 6, wherein the (J) photopolymerization initiator contains one or more O-acyloxime compounds. Production method.   The content of the (H) black material is in the range of 1 wt% to 100 wt% with respect to the weight of the (I) metal particles. A method for producing the capacitive touch panel sensor substrate according to Item 1.   The method for manufacturing a capacitive touch panel sensor substrate according to any one of claims 1 to 8, wherein the transparent conductive material is indium tin oxide (ITO).   A capacitive touch panel sensor substrate manufactured by the method for manufacturing a capacitive touch panel sensor substrate according to any one of claims 1 to 9.   The capacitive touch panel sensor substrate according to claim 10, wherein a color filter is formed on a surface of the transparent substrate opposite to a surface on which the capacitive touch panel sensor is formed.   A display device comprising the capacitive touch panel sensor substrate according to claim 10. (A) 1st electrode, (B) 2nd electrode, (C) 1st connection part which connects said (A) 1st electrodes, (D) Said (B) 2nd A second connecting portion for connecting the electrodes; (E) an insulating layer formed at a portion where the (C) first connecting portion and the (D) second connecting portion intersect; and (F) A capacitive touch panel sensor substrate formed on a transparent substrate, comprising: (A) a first electrode; and (B) a lead-out wiring connected to the second electrode. ,
The (A) first electrode and the (B) second electrode overlap the (A) first electrode and a part on the (B) second electrode. Each has its own pattern
The (D) second connection part is formed using the same photosensitive conductive material as the material of the (G) auxiliary fine line pattern and the (F) extraction wiring,
Capacitance type touch panel characterized in that the reflectance of the (D) second connecting portion, the (G) auxiliary fine line pattern and the (F) extraction wiring is in the range of 4% to 30%. Sensor board.   14. The capacitive touch panel sensor according to claim 13, wherein a conductor width of the (D) second connection portion and the (G) auxiliary fine line pattern is in a range of 0.5 μm to 10 μm. substrate.   The photosensitive conductive material contains (H) black material, (I) metal particles, (J) photopolymerization initiator, (K) polymerizable polyfunctional monomer, (L) resin, and (M) solvent. 15. The capacitive touch panel sensor substrate according to claim 13 or 14, wherein the capacitive touch panel sensor substrate is characterized in that:   The (H) black material is carbon, a black pigment, a pseudo black mixture of at least two or more types of pigments, at least one or more types of black dyes, and a black metal oxide having a particle size in the range of 0.1 to 4 μm. The capacitive touch panel sensor substrate according to claim 15, wherein the capacitive touch panel sensor substrate is one or more selected from the group of   The (I) metal particles are selected from gold (Au), silver (Ag), platinum (Pt), copper (Cu), palladium (Pd), iridium (Ir), rhodium (Rh), and aluminum (Al). The electrostatic capacitance type touch panel sensor substrate according to claim 15 or 16, comprising at least one metal.   18. The capacitive touch panel sensor substrate according to claim 15, wherein a particle diameter of the metal particles is in a range of 0.1 μm to 4 μm.   The capacitive touch panel sensor substrate according to any one of claims 15 to 18, wherein the (J) photopolymerization initiator contains one or more O-acyloxime compounds.   20. The content of the (H) black material is in the range of 1 wt% or more and 100 wt% or less with respect to the weight of the (I) metal particles. The capacitive touch panel sensor substrate according to Item 1.   21. The capacitive touch panel sensor substrate according to any one of claims 13 to 20, wherein the transparent conductive material is indium tin oxide (ITO).   The color filter is provided in the surface on the opposite side to the surface in which the electrostatic capacitance type touch panel sensor was formed of the said transparent base material, The any one of Claims 13-21 characterized by the above-mentioned. Capacitive touch panel sensor board.   23. A display device comprising the capacitive touch panel sensor substrate according to any one of claims 13 to 22.