WO2013038624A1

WO2013038624A1 - Method for producing capacitive touch panel sensor substrate, capacitive touch panel sensor substrate, and display device

Info

Publication number: WO2013038624A1
Application number: PCT/JP2012/005649
Authority: WO
Inventors: 宏希後藤; 松政　健司; 港　浩一; 保浩檜林; 元気原田; 由佳山内; 吉隆松原
Original assignee: 凸版印刷株式会社
Priority date: 2011-09-13
Filing date: 2012-09-06
Publication date: 2013-03-21
Also published as: JPWO2013038624A1; TW201333792A

Abstract

Provided is a production method whereby a touch panel sensor substrate of excellent display quality can be produced less expensively than with past production methods, and without diminished viewability despite the use of metal materials in connecting parts. The method is a method for producing a capacitive touch panel sensor substrate of a transparent substrate (10) onto which are formed a first transparent electrode (1), a second transparent electrode (2), a first connecting part (3), a second connecting part (4), an insulating layer (5), and takeoff wiring (20); characterized by including a step for forming the first connecting part (3), a step for forming the insulating layer (5), and a step for forming the second connecting part (4), the step for forming the insulating layer (5) being performed subsequent to either the step for forming the first connecting part (3) or the step for forming the second connecting part (4), the remaining step among the step for forming the first connecting part (3) and the step for forming the second connecting part (4) being performed subsequent to the step for forming the insulating layer (5), and the reflectivity of the second connecting part (4) and the takeoff wiring (20) being in a range of 0-30% inclusive.

Description

Capacitive touch panel sensor substrate manufacturing method, capacitive touch panel sensor substrate, and display device

The present invention relates to a method for manufacturing a capacitive touch panel sensor substrate, a capacitive touch panel sensor substrate, and a display device.

The touch panel is a touch panel that allows the operator to input data by touching a transparent surface on the display screen with a finger or the like and detecting the touched position. This touch panel has been used frequently in recent years because it enables direct and intuitive input rather than key input. In particular, this touch panel is often combined with a display panel such as a liquid crystal to input and output information in an integrated manner.

The touch panel detection method includes, for example, a resistance film type, a capacitance type, an ultrasonic type, and an optical type, and until now, the resistance film type, which was relatively superior in terms of manufacturing cost, has been the mainstream. . However, a resistive touch panel having a structure in which an air layer is provided between two transparent conductive films has low optical characteristics (for example, transmittance), and it cannot be said that durability and operating temperature characteristics are sufficient. Improvements have been sought.

On the other hand, capacitive touch panels that do not have moving parts have high optical characteristics and are superior to resistance film types in terms of durability and operating temperature characteristics, so they are especially developed for high-reliability applications such as in-vehicle use. (For example, see Patent Documents 1 and 2).
This type of capacitive touch panel can be broadly classified into a surface type and a projected type, and a surface type is used for a large product of 10 type (25.4 cm size) or more. In many cases, the projection type is used for small products of size 6 or less. A surface type with a simple electrode plate structure is likely to be large, but it is difficult to detect two or more contact points simultaneously. On the other hand, a projection type with a complicated electrode plate structure is disadvantageous for an increase in size, but two or more contact points can be detected simultaneously.

A sensor substrate for a projected capacitive touch panel generally includes a first transparent electrode arranged in the x direction, a second transparent electrode arranged in the y direction, and a first transparent electrode on a transparent substrate. The first connection part that connects the first transparent electrodes, the second connection part that connects the second transparent electrodes, and the part where the first connection part and the second connection part intersect, And an insulating layer for electrically insulating the second connecting portion. Further, on the transparent base material, an extraction wiring connecting these transparent electrodes and the control circuit is formed. In order to protect the transparent electrode, connection part, and lead-out wiring from corrosion and contact scratches, a protective layer is formed on the transparent base so that it covers almost the entire surface except the connection part of the lead-out wiring connected to the control circuit. (See, for example, Patent Document 3).

The projected capacitive touch panel includes a film type using a resin film such as polyethylene terephthalate (PET) and a glass type using non-alkali glass or soda lime glass as materials for the transparent substrate. The film type has the advantage that the manufacturing cost is low and it is difficult to break, but because the transparency is inferior and the resistance value of the transparent electrode on the film is high, the electrode part cannot be made small. It is often used for small products.

The formation of the above-mentioned transparent electrode, connecting portion, insulating layer, lead-out wiring and protective layer requires a plurality of film forming and patterning steps, which requires a lot of manufacturing costs. In particular, in the manufacturing process of the lead-out wiring, molybdenum (Mo) / aluminum (Al) / molybdenum film is formed by a sputtering method from the viewpoint of high conductivity and easy microfabrication, and photolithography using a positive resist ( Hereinafter, a method of performing etching / resist peeling after the step is also widely used. In addition, indium tin oxide (ITO), which has high transparency and excellent resistance, is generally used for the transparent electrode, but as with the lead-out wiring, a metal film is formed by sputtering on the substrate placed in the vacuum vessel. After that, it is necessary to perform protective film formation, etching, and protective film peeling, and not only there are many processes, but also the equipment cost is high.

On the other hand, a method of reducing the manufacturing cost by simultaneously forming one of the extraction wiring and the first or second connection portion is disclosed (see, for example, Patent Document 4). .
However, with this method, although the manufacturing process can be shortened and the touch panel sensor substrate can be manufactured at low cost, the connection portion in the display area formed using a metal material can be visually recognized under normal use conditions. For this reason, there is a problem of degrading display quality.
Further, as another method for manufacturing the lead-out wiring at a low cost, a photolithography method using a conductive paste in which conductive powder such as silver is dispersed in an organic binder and made photosensitive is known (for example, patent document). 5 and 6).

In this photolithography method, after applying a photosensitive conductive paste on a substrate, the exposed portion of the coating film is photocrosslinked by irradiating the substrate with ultraviolet light through a photomask corresponding to the desired extraction wiring. It is a method of forming a lead-out wiring part by curing after removing the unexposed portion of the coating film from the substrate using a developing solution. By using this photolithography method, it is possible to obtain a conductive portion that is less expensive than the vapor deposition method and has a higher definition than the printing method formed by screen printing or gravure offset printing. However, even with the techniques disclosed in these publications, the idea of manufacturing the extraction wiring at a low cost can be given, but the problem that occurs when the connection portion in the display area is simultaneously formed using a metal material, that is, Since the resolution is not sufficient, the problem that the connection part formed under normal use conditions can be visually recognized cannot be solved.

JP 63-174120 A JP 2006-23904 A JP 2007-279819 A JP 2011-86122 A Japanese Patent No. 4374653 Japanese Patent No. 3329723

The object of the present invention is to produce a capacitive touch panel sensor substrate, rather than a conventional manufacturing method in which a transparent electrode, a connecting portion, an insulating layer, a lead-out wiring, and a protective layer are individually formed and patterned. It is an object of the present invention to provide a method for manufacturing a touch panel sensor substrate excellent in display quality, which can be manufactured at a low cost and does not impair visibility even when a metal material is used for a connection portion.

Another object of the present invention is to provide a touch panel sensor substrate that is inexpensively manufactured using the manufacturing method and has excellent display quality.
Furthermore, it is to provide a cover glass-integrated touch panel sensor substrate that can be manufactured at a lower cost by reducing the number of components by using a cover glass for the transparent base material.
Moreover, it is providing the display apparatus which has the above-mentioned electrostatic capacitance type touch panel sensor board | substrate.

According to one aspect of the present invention, (A) the first transparent electrode, (B) the second transparent electrode, and (C) the first connection portion that connects the (A) first transparent electrodes to each other. And (D) the second connection part that connects the (B) second transparent electrodes, and (E) the intersection of the (C) first connection part and the (D) second connection part. A transparent base material comprising: an insulating layer formed on a portion to be removed; and (F) an extraction wiring connected to the (A) first transparent electrode and the (B) second transparent electrode. It is a manufacturing method of the electrostatic capacitance type touch panel sensor substrate formed on, Comprising: Said (C) 1st connection part of said (A) 1st transparent electrode and said (B) 2nd transparent electrode Using the same transparent conductive material as the material, (A) the step of forming the first transparent electrode and the (B) second transparent electrode at the same time, and (E Forming the insulating layer; and (D) forming the second connection portion simultaneously with the (F) lead-out wiring using a conductive material, and (C) the first connection portion. The step of forming the (E) insulating layer after performing one step of the step of forming or the step of forming the (D) second connecting portion, and the step of forming the (E) insulating layer. After performing, the other step of the step (C) forming the first connection portion or the step (D) forming the second connection portion is performed, and the (D) second connection portion and the (( F) A method for manufacturing a capacitive touch panel sensor substrate is provided, wherein the reflectance of the lead-out wiring is in the range of 0% to 30%.

The conductor width of the (D) second connection portion may be in the range of 3 μm to 20 μm.
The conductive material may be a photosensitive conductive material.
The photosensitive conductive material may contain (G) a black material, (H) metal particles, (I) a photopolymerization initiator, (J) a polymerizable polyfunctional monomer, and (K) a resin.
The (G) black material may be any one of a black pigment, a pseudo black mixture of two or more pigments, a black dye, and a metal compound.
The black material may be carbon black having an average particle diameter in the range of 10 nm to 500 nm.

The (H) metal particles are selected from gold (Au), silver (Ag), platinum (Pt), copper (Cu), palladium (Pd), iridium (Ir), rhodium (Rh), and aluminum (Al). One or more metals may be included.
The particle diameter of the (H) metal particles may be in the range of 0.1 μm to 4 μm.
The (I) photopolymerization initiator may contain one or more O-acyloxime compounds.
The carbon black content may be in the range of 1 wt% to 100 wt% with respect to the weight of the (H) metal particles.
The conductive material for the (D) second connection portion and the (F) extraction wiring may be formed by a printing method and finely patterned by a photolithography method.

According to another aspect of the present invention, there is provided a capacitive touch panel sensor substrate manufactured by the above-described method for manufacturing a capacitive touch panel sensor substrate.
According to still another aspect of the present invention, (A) a first transparent electrode, (B) a second transparent electrode, and (C) the first (A) first transparent electrode connected to each other. A connection part, (D) the (B) second connection part for connecting the second transparent electrodes, (E) the (C) first connection part, and (D) the second connection part, A transparent layer comprising: an insulating layer formed at an intersecting portion of the substrate; and (F) an extraction wiring connected to the (A) first transparent electrode and the (B) second transparent electrode. A capacitive touch panel sensor substrate formed on a substrate, wherein the (C) first connection portion is made of the material of the (A) first transparent electrode and the (B) second transparent electrode. The (D) second connection portion is formed of the same material as the (F) lead-out wiring using a conductive material. Wherein (D) the reflectivity of the second connecting portion and the (F) extracting wiring capacitive touch panel sensor substrate, characterized in that in the range of 30% or more 0% is provided.

The conductor width of the (D) second connection portion may be in the range of 3 μm to 20 μm.
The conductive material may be a photosensitive conductive material.
The photosensitive conductive material may contain (G) a black material, (H) metal particles, (I) a photopolymerization initiator, (J) a polymerizable polyfunctional monomer, and (K) a resin.
The (G) black material may be any one of a black pigment, a pseudo black mixture of two or more pigments, a black dye, and a metal compound.

The (G) black material may be carbon black having an average particle diameter in the range of 10 nm to 500 nm.
The (H) metal particles are selected from gold (Au), silver (Ag), platinum (Pt), copper (Cu), palladium (Pd), iridium (Ir), rhodium (Rh), and aluminum (Al). One or more metals may be included.

The particle diameter of the (H) metal particles may be in the range of 0.1 μm to 4 μm.
The (I) photopolymerization initiator may contain one or more O-acyloxime compounds.
The carbon black content may be in the range of 1 wt% to 100 wt% with respect to the weight of the (H) metal particles.
The transparent substrate may be the same as the cover glass.
According to still another aspect of the present invention, a display device including the above-described capacitive touch panel sensor substrate is provided.

According to the present invention, when a capacitive touch panel sensor substrate is manufactured, the conventional transparent electrode, connecting portion, insulating layer, lead-out wiring, and protective layer are each formed more independently than a manufacturing method for patterning. It is possible to provide a method for manufacturing a touch panel sensor substrate excellent in display quality that can be manufactured at low cost and does not impair visibility even when a metal material is used for a connection portion.

In addition, it is possible to provide a touch panel sensor substrate that is inexpensively manufactured using the manufacturing method and has excellent display quality.
Furthermore, by using a cover glass for the transparent base material, it is possible to provide a cover glass integrated touch panel sensor substrate that can be manufactured at a lower cost by reducing the number of components.
In addition, it is possible to provide a display device having the above-described capacitive touch panel sensor substrate.

According to the first embodiment of the present invention, after the first transparent electrode, the second transparent electrode, and the first connection portion connecting the first transparent electrode are formed, the second transparent electrode is interposed through the insulating layer. The plane schematic diagram which shows an example of a capacitive touch panel sensor board | substrate with which the connection part and the extraction wiring were formed simultaneously. According to the first embodiment of the present invention, after the second connection portion and the lead-out wiring are formed at the same time, the first transparent electrode is inserted through the first transparent electrode, the second transparent electrode, and the insulating layer. The plane schematic diagram which shows an example of the capacitive touch panel sensor board | substrate with which the 1st connection part to connect was formed. The projection schematic diagram which shows an example of the electrostatic capacitance type touch panel which concerns on 1st embodiment of this invention. The projection schematic diagram which shows an example of the cover glass integrated capacitance type touch panel sensor board | substrate which concerns on 1st embodiment of this invention. FIG. 2 is a cross-sectional view taken along line AA ′ in FIG. 1. Sectional drawing in the BB 'line of FIG. The figure which shows the relationship between the reflectance in a capacitive touch panel sensor board | substrate, and a conductor width. The schematic diagram which shows the flat type display apparatus provided with the electronic input device which has a touch-panel function in a prior art example in a cross section. The schematic diagram which shows the electronic input device which has a touch-panel function which concerns on 3rd embodiment of this invention in a cross section. The schematic diagram which shows the decorating transparent protection board integrated touch panel which concerns on 3rd embodiment of this invention with a plane. The schematic diagram which shows the cross section in the CC 'line | wire in the decorative transparent protective substrate integrated touch panel shown in FIG. The schematic diagram which shows the cross section in CC 'line in another structural example of the decorative transparent protective substrate integrated touch panel shown in FIG. The schematic diagram which shows the cross section in CC 'line in another structural example of the decorative transparent protective substrate integrated touch panel which concerns on 3rd embodiment of this invention. The schematic diagram which shows the cross section in CC 'line in another structural example of the decorative transparent protective substrate integrated touch panel which concerns on 3rd embodiment of this invention.

DETAILED DESCRIPTION OF THE INVENTION A method for manufacturing a projected capacitive touch panel sensor substrate according to the present invention and a projected capacitive touch panel sensor substrate manufactured using the same will be described in detail based on the embodiments thereof. In addition, the touch panel sensor board | substrate of this invention is not limited to the following structures, unless the summary is exceeded.

≪First embodiment≫
<Projection capacitive touch panel sensor substrate>
1 and 2 are plan views of the touch panel sensor substrate according to the first embodiment of the present invention, seen through the protective film 6. Here, FIG. 1 and FIG. 2 are examples in which the positional relationship among the first connection portion 3, the second connection portion 4, and the insulating layer 5 is different. 4A shows a cross-sectional view taken along line AA ′ in FIG. 1, and FIG. 4B shows a cross-sectional view taken along line BB ′ in FIG.

As shown in FIG. 1, the projected capacitive touch panel sensor substrate according to the first embodiment includes a first transparent electrode 1, a second transparent electrode 2, and a first connection portion on a transparent substrate 10. 3, the second connection portion 4, the insulating layer 5, and the extraction wiring 20. The insulating layer 5 is disposed in order to prevent and insulate the second connecting portion 4 orthogonal to the first connecting portion 3. Further, the projected capacitive touch panel sensor substrate according to the first embodiment can further include a protective film 6.

FIG. 1 shows a structure in which a first connection portion 3 is formed in the lowermost layer, an insulating layer 5 is provided thereon, and a second connection portion 4 is formed on the insulating layer 5. As shown in FIG. 2, the second connection portion 4 may be formed in the lowermost layer, the insulating layer 5 may be provided on the second connection portion 4, and the first connection portion 3 may be formed on the insulating layer 5. . In addition, the first connection portion 3 and the second connection portion 4 may be in either the x direction or the y direction with respect to the transparent substrate 10.

Although it does not specifically limit as the transparent base material 10, For example, glass plates, such as a soda lime glass, a low alkali borosilicate glass, an alkali free alumino borosilicate glass, or a polyethylene terephthalate (PET), a triacetyl cellulose ( A plastic plate or plastic film made of TAC), polymethyl methacrylate (PMMA), polycarbonate (PC), or the like may be used.

FIG. 3A is a projected view of a touch panel formed on the transparent base material 10 and including the touch panel sensor substrate according to the first embodiment and the cover glass 30. Note that a frame layer (bezel) is formed in a rectangular frame shape on the surface of the cover glass 30 on the touch panel sensor substrate side (that is, the surface of the cover glass 30 facing the transparent base material 10) (not shown). ). This frame layer is formed so as to overlap, for example, the extraction wiring 20 when the touch panel sensor substrate according to the first embodiment formed on the transparent base material 10 and the cover glass 30 are overlapped.

FIG. 3B is a diagram showing the structure of a cover glass integrated projection type capacitive touch panel sensor substrate using a cover glass for the transparent base material 10. The transparent base material 10 includes, for example, an aluminosilicate glass (for example, , "Gollila (Corning)", "IOX-FS (Corning)", "Dragonrail (Asahi Glass)") or chemically strengthened special glass plates such as soda lime glass Can do. When a cover glass is used for the transparent base material 10, a single transparent base material component is provided to provide both a frame layer (bezel) (not shown) and the touch panel sensor 40 on a large glass substrate that is a base material. The number of points can be reduced, and a touch panel can be manufactured at low cost. Since a normal cover glass is chemically strengthened after dividing a large glass substrate into individual pieces, sufficient strength is easily obtained. On the other hand, when a cover glass is used for the transparent substrate 10, after a plurality of frame layers (bezels) and the touch panel sensor 40 are collectively formed on a single large glass substrate. The process of dividing the tempered glass into individual pieces by a method such as chemical etching or mechanical cutting is necessary, and there is a problem that the strength is weakened by dividing the reinforced large substrate into individual pieces. there were. In recent years, since means for solving these problems are being disclosed, tempered glass such as cover glass is often used for the transparent substrate 10.

The first transparent electrode 1 and the second transparent electrode 2 are not particularly limited as long as the first transparent electrode 1 and the second transparent electrode 2 can be disposed on the surface of the transparent substrate 10. For example, ITO, zinc oxide (ZnO) Inorganic conductive materials such as polyethylene dioxythiophene / polystyrene sulfonic acid (PEDOT / PSS), polyaniline, polypyrrole, and other organic conductive materials can be used. These materials may be used alone or in combination of two or more. Among these, it is preferable to use ITO in terms of transparency and resistance value.

In the case of the structure shown in FIG. 1, that is, in the case of a connection part for connecting adjacent first transparent electrodes 1 arranged in the x direction with respect to the transparent substrate 10, the first connection part 3 is formed simultaneously with the first transparent electrode 1 using the same transparent conductive material as the material of the first transparent electrode 1. In other words, when the first transparent electrode 1 is formed, the first connection portion 3 is also formed at the same time, which means that a continuous transparent electrode pattern is formed without interruption in the x direction.

Furthermore, the second transparent electrode 2 arranged in the y direction with respect to the transparent substrate 10 is also formed simultaneously with the first transparent electrode 1 and the first connection portion 3. However, since the second transparent electrode 2 is not formed at the same time as the second connection portion 4, the second transparent electrode 2 is not yet connected in the y direction at this point.

The second connection portion 4 is formed simultaneously with the extraction wiring 20 using the same conductive material as that of the extraction wiring 20 through the insulating layer 5. Moreover, in the example shown in FIG. 1 and FIG. 2, the connection part of the x direction with respect to the transparent base material 10 is the first connection part 3, and the connection part of the y direction is the second connection part 4. As described above, the x direction and the y direction may be reversed. That is, a structure in which the connection portion in the x direction is used as the second connection portion 3 and formed simultaneously with the extraction wiring 20 using the same conductive material as the material of the extraction wiring 20 may be used.

Examples of the conductive material of the second connection portion 4 and the extraction wiring 20 include gold (Au), silver (Ag), platinum (Pt), copper (Cu), palladium (Pd), iridium (Ir), rhodium ( A photosensitive conductive material such as a conductive paste in which conductive powders such as Rh) and aluminum (Al) are dispersed in an organic binder to impart photosensitivity can be preferably used. Select the particle size of conductive powder such as gold (Au), silver (Ag), platinum (Pt), copper (Cu), palladium (Pd), iridium (Ir), rhodium (Rh), aluminum (Al) as appropriate The reflectance of the second connection part 4 and the extraction wiring 20 can be easily achieved by absorbing, scattering, and diffracting light from a metal film such as Mo, Al, Ag, Cu, Pd obtained by sputtering. And can be controlled within a range of 0% to 30%. Thereby, since the problem of pattern appearance can be easily avoided and the manufacturing cost can be suppressed, these conductive materials are preferably used. Furthermore, other known techniques for reducing the reflectance may be applied. If the reflectivity exceeds 30%, the degree of reflection of external light under normal use conditions increases, so that the pattern can be seen with the naked eye and display quality is degraded.

The “reflectance” in the first embodiment refers to the reflectance at 550 nm when the glass substrate surface side is measured using an ultraviolet-visible spectrophotometer. Here, “reflectance” refers to the substantial reflectance of the second connecting portion 4 itself and the extraction wiring 20 itself. That is, “reflectance is 0%” means a state in which incident light is not reflected by the second connection portion 4 itself and the extraction wiring 20 itself. In the present embodiment, the reflectance is measured as a value including specular reflection as described later. The value of light reflection (so-called specular reflection) by the glass substrate itself is about 4%.

Conventionally, a Mo / Al / Mo three-layer structure (hereinafter also referred to as “MAM”) is formed by sputtering at a thickness of about 350 mm / 2000 mm / 350 mm, respectively, and after a photolithography process using a positive resist. Etching / resist stripping methods have been frequently used. However, since this metal material has a high reflectance, even if the second connection portion 4 in the display area is finely formed to have a conductor width of 8 μm × conductor length of about 200 μm, it is visually visible under normal use conditions. As a result, there is a problem of degrading display quality. If the reflectance of the second connection portion 4 is low, the reflected light of the second connection portion 4 in the display area will not reach the eyes, and it will be difficult to see the connection portion. That is, the blackening of the second connection portion 4 and the extraction wiring 20 serves to make the second connection portion 4 inconspicuous.

The conductor width of the second connection portion 4 is preferably in the range of 3 μm to 20 μm. If the conductor width of the second connection portion 4 is less than 3 μm, a malfunction (hereinafter also referred to as “electrostatic breakdown”) is likely to occur when a transient voltage such as static electricity is generated. On the other hand, when the conductor width of the second connection portion 4 is larger than 20 μm, not only the pattern is easily seen with the naked eye, but also the problem that the transmittance of the display area is lowered occurs.

The conductor thickness of the second connection portion 4 is preferably in the range of 1 μm or more and 5 μm or less. If the conductor thickness of the second connection portion 4 is less than 1 μm, sufficient conductivity cannot be obtained, and conduction failure may occur. On the other hand, if the conductor thickness of the second connection portion 4 is thicker than 5 μm, ultraviolet light does not reach the bottom during exposure in the photolithography process, and pattern formation becomes difficult.
The “conductor width” is the line width of the second connection portion 4, and the “conductor thickness” is the film thickness of the second connection portion 4.

The insulating layer 5 and the protective film 6 can be formed using known materials conventionally used for insulating layers and protective films. For example, inorganic films such as SiO ₂ and SiN _x and organic materials such as transparent resins are used. Can be mentioned. Since inorganic films are formed of SiO ₂ or SiN _x by a CVD method, a sputtering method, or the like, there is a problem that the manufacturing cost becomes high, such as an increase in energy consumption and the number of processes. Preferably, an organic material may be used. As the organic material, for example, a UV curable coating composition containing a polymerizable group-containing oligomer, monomer, photopolymerization initiator and other additives can be used.

<Method for manufacturing capacitive touch panel sensor substrate>
As the first transparent electrode 1, the second transparent electrode 2, and the first connection part 3, ITO that is generally used in many cases is suitable, but is not limited. Depending on the specific specifications of the capacitive touch panel function, the characteristics of ITO or the characteristics as a transparent electrode pattern may be selected. For example, as an ITO film, a film having a film thickness of 30 nm and a sheet resistance value of about 100Ω / □ is formed by a thin film forming unit of a sputtering apparatus. Next, a resist pattern is formed by a photolithographic method including a series of steps of resist coating, exposure, and development using an etching-resistant photosensitive resin. Thereafter, a pattern is formed through ITO etching and a resist peeling process. For example, as the first connection portion 3, a large number of patterns having a conductor width of 50 μm to 100 μm and a conductor length of 200 μm to 500 μm are formed.

For the second connection portion 4 and the lead-out wiring 20, a photosensitive conductive material such as a conductive paste whose reflectance is controlled within a range of 0% to 30% is formed by a printing method such as screen printing, and a photolithographic method. Can be obtained by fine patterning. In the photolithographic method, after applying a photosensitive conductive material on a substrate, the exposed portion of the coating is cured by photocrosslinking by irradiating the substrate with ultraviolet light through a photomask corresponding to the desired extraction wiring. In this method, the unexposed portion of the coating film is removed from the base material using a developer and then baked to form a lead-out wiring pattern. By using this photolithographic method, it is possible to obtain a conductive pattern that is cheaper than the vapor deposition method and more precise than the printing method formed by screen printing or gravure offset printing.

When the second connecting portion 4 and the lead-out wiring 20 are patterned on the transparent substrate 10 at an early stage, it has a sufficient light shielding property against transmitted light, so that it is easy to optically detect and recognize the pattern. It is. Therefore, the metal electrode pattern itself can be used as an index of alignment with respect to a layer on which a subsequent pattern is formed. In addition to the electrode pattern, an alignment mark can be provided independently in the same layer as the second connection portion 4 and the extraction wiring 20. Independently providing a mark for alignment can generally achieve higher accuracy in the alignment process in which a position correction amount is determined from pattern recognition and a movement for position correction is output.

The insulating layer 5 is formed so as to cover a range including the effective area of the first connection portion 3 or the second connection portion 4. As a method for manufacturing the insulating layer 5, an insulating function can be obtained by forming a SiO ₂ film with a thickness of 100 nm or more. Alternatively, as an easier manufacturing method, the organic insulating film can be formed by a photolithography method. For example, a photosensitive organic insulating film material having a refractive index of 1.53 and a volume resistivity of 2 × 10 ¹⁵ Ω · cm is applied to a dry film by a coating method such as spray coating, spin coating, slit die coating, roll coating, or bar coating. The coating is applied so that the thickness is 0.2 to 10 μm, more preferably 0.5 to 5 μm. If necessary, the dried film is exposed through a mask having a predetermined pattern provided in contact or non-contact with the film. The kind of light beam at the time of exposure is not particularly limited, and examples thereof include visible light, ultraviolet rays, far infrared rays, electron beams, X-rays, etc. Among them, ultraviolet rays are preferable. The illuminance of the light beam is not particularly limited, but is preferably 5 to 150 mW / cm ² at 365 nm, and particularly preferably 15 to 35 mW / cm ² .

Then, if necessary, immerse the substrate in an aqueous alkaline developer such as sodium carbonate or sodium hydroxide, or spray the developer onto the substrate by spraying etc. to remove the uncured part and form the desired pattern To do. Furthermore, in order to accelerate the polymerization of the photosensitive composition to form a film, heating (so-called post-baking) is performed as necessary. By forming a pattern through these steps, a patterned insulating layer 5 having a transmittance exceeding 97% can be obtained.

If necessary, the protective film 6 is provided with an effective area of the first transparent electrode 1, the second transparent electrode 2, the first connection part 3, the second connection part 4, the insulating layer 5, and the extraction wiring 20. It is formed over the range to include. The protective film 6 can be formed using the materials and methods described in the description of the insulating layer 5 so that the dry film thickness is 0.5 to 20 μm, more preferably 1.0 to 10 μm. In addition, since the protective film 6 forms the outermost layer of the capacitive touch panel sensor substrate, it is desirable that the protective film 6 be disposed as widely as possible to serve as a planarization layer. Further, the protective film 6 may have a structure overlapping with a part of the metal layer 6b to be the formed terminal electrode.

<Photosensitive conductive material>
The photosensitive conductive material used in the first embodiment has at least (G) black material, (H) metal particles, and (I) photopolymerization in order to control the reflectance within the range of 0% to 30%. A photosensitive conductive material containing an initiator, (J) a polymerizable polyfunctional monomer, and (K) resin can be used.

(G) The black material is selected from the group consisting of (L) one or more black pigments, (M) a pseudo black mixture of two or more pigments, (N) one or more black dyes, and (O) a metal oxide. At least one or more types of blackening components can be used as essential components. Moreover, the (P) solvent can also be contained in the photosensitive electrically-conductive material, and another additive can be included as needed.
The second connection part 4 and the lead-out wiring 20 constituting the capacitive touch panel sensor substrate according to the first embodiment are referred to as exposure, development, and thermosetting after the photosensitive conductive material is applied on the transparent substrate 10. It may be formed through a so-called photolithography process.

(L) As the black pigment, for example, aniline black or perylene black pigment can be used. I. Black pigments such as

Pigment Black

1, 6, 7, 12, 20, 31, 32 can be used. The average particle size of the black pigment is preferably in the range of 10 nm to 500 nm, more preferably in the range of 10 nm to 300 nm.

(M) The pseudo black mixture is, for example, a pigment used when forming a colored transparent layer of a color filter.

I. Pigment Red

1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 41, 48: 1, 48: 2, 48: 3, 48: 4, 57: 1, 81, 81: 1, 81: 2, 81: 3, 81: 4, 97, 122, 123, 146, 149, 166, 168, 169, 176, 177, 178, 179, 180, 184, 185, 187, 192,200,202,208,210,215,216,217,220,223,224,226,227,228,240,242,246,254,255,264,270,272,273,274,276, Red (RED) pigments typified by 277, 278, 279, 280, 281, 282, 283, 284, 285, 286, 287, and the like; I. At least a blue (BLUE) pigment typified by CI Pigment Blue 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 6, 16, 22, 60, 64, 80, etc. Therefore, a pseudo black color can be used.

Further, as a pseudo black mixture of pigments used in the first embodiment, a yellow (YELLOW) pigment may be added in addition to a red pigment and a blue pigment. It is known that yellow pigments absorb light in the low wavelength region of visible light, that is, light having a wavelength of 500 nm or less (for example, “Shoji Shiji (1965)“ Printing Ink Class ”(Nihon Printing Shimbun) P170. 173). By adding a yellow pigment to a red pigment and a blue pigment, the yellow pigment absorbs low-wavelength visible light and can be made closer to black.

Examples of yellow (YELLOW) pigments include C.I. I.

Pigment Yellow

1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35: 1, 36, 36: 1, 37, 37: 1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 144, 146, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 17 , It includes the 175,176,177,179,180,181,182,185,187,188,193,194,198,199,213,214,218,219,220,221.

In the pseudo black mixture of pigments used in the first embodiment, a violet pigment may be further added.
Examples of violet pigments include C.I. I.

Pigment violet

1, 19, 23, 27, 29, 30, 32, 37, 40, 42, 50.
Further, a pigment such as an orange pigment or a green pigment may be added. Examples of the orange pigment include C.I. I. Pigment orange 36, 43, 51, 55, 59, 61, 71, 73, and the like. Examples of the green pigment include C.I. I. And green pigments such as CI Pigment Green 7, 10, 36, 37, and 58.
Further, in the pseudo black mixture of pigments used in the first embodiment, an organic black pigment can be used as an auxiliary agent for reducing the reflectance.

I. PBK

1, 30, 31, etc. are listed.

Examples of the chemical structure of the (N) black dye include triphenylmethane, anthraquinone, benzylidene, oxonol, cyanine, phenothiazine, pyrrolopyrazole azomethine, xanthene, phthalocyanine, benzopyran, and indigo. Can be mentioned. Of these, pyrazole azo dyes, anilinoazo dyes, pyrazolotriazole azo dyes, pyridone azo dyes, anthraquinone dyes, and anthrapyridone dyes are preferable.

As the colorant, known dyes can be used as long as they are soluble in an organic solvent. Examples thereof include oil-soluble dyes, acid dyes or derivatives thereof, direct dyes, and modern dyes.
Examples of the pigment used for the black dye include C.I. I. Acid Black 1, 24, 26, 31, 48, 50, 52, 52: 1, 58, 60, 63: 2, 64, 107, 109, 110, 112, 113, 118, 140, 155, 170, 172, 177 187, 188, 194, 207, 222, C.I. I. Direct Black 17, 19, 22, 51, 62, 91, 112, 117, 118, 122, 132, 146, 154, 159, 169, 173, C.I. I.

Solvent Black

3, 4, 5, 27, 28, 29, 34, 45.

The black dye used in the first embodiment may be a pseudo black mixture of two or more dyes, or a pseudo black mixture having a light shielding property. For example, C.I. I. Acid Red1, 6, 9, 14, 18, 35, 37, 42, 50, 52, 57, 73, 87, 88, 89, 92, 97, 106, 111, 114, 118, 128, 134, 138, 143 143: 1,145,158,183,186,211,214,215,217,219,225,226,249,254,256,257,259,260,261,263,266,274,276,278 289, 299, 301, 303, 307, 315, 316, 317, 336, 337, 341, 355, 357, 359, 362, 366, 383, 399, 405, 407, 414, 416, 426, C.I. I. Direct Red2, 23, 24, 31, 39, 54, 79, 83: 1, 89, 224, 225, 226, 227, 242, 243, C.I. I. A dye composed of a red (RED) pigment represented by Reactive Red 5, 8, 43, and the like;

I. Acid Blue

7, 9, 15, 22, 23, 25, 40, 45, 47, 59, 61: 1, 62, 78, 80, 83, 90, 104, 109, 112, 127, 127: 1, 129, Blue (BLUE) typified by 138, 140, 203, 204, 207, 227, 228, 232, 247, 260, 264, 277, 278, 280, 283, 290, 333, 343,

Direct Blue

106, 108, etc. A pseudo black color is obtained by mixing at least a dye composed of a system pigment.

Examples of pigments used for yellow (YELLOW) dyes include I.I. Acid Yellow 3, 17, 38, 40: 1, 42, 44: 1, 49, 61, 65, 67, 72, 79, 110, 114, 116, 117, 119, 121, 127, 129, 135, 141, 143, 155, 158, 161, 194, 204, 207, 220, 232, 235, 241, C.I. I. Direct Yellow 12, 86, 87, 130, 142, C.I. I. Reactive Yellow 84, 102 and the like.

In the pseudo black mixture of dyes used in the first embodiment, a violet dye may be further added.
Examples of pigments used in violet dyes include C.I. I. Acid Violet 21, 42, 43, 47, 48, 49, 54, 97, 102 etc. are mentioned.

In addition to the above-mentioned dyes, dyes such as orange dyes and green dyes may be added. Examples of the pigment used for the orange dye include C.I. I.

Orange

10, 19, 33, 50, 56, 67, 80, 108, 122, 142, 166, 130, C.I. I. Direct Orange 26, 39, C.I. I.

Reactive Orange

1, 4 etc. are mentioned. Examples of the pigment used as the green dye include C.I. I. Acid Green3, 5, 22, 25, 27, 28, 41 etc. are mentioned.

Examples of (O) metal compounds include silver oxide, iron oxide, zinc oxide, triiron tetroxide, cobalt oxide, titanium oxide, tin oxide, indium oxide, magnesium oxide, copper chromite, copper chromate, and cobalt-iron. Composite oxide, cobalt-iron-chromium composite oxide, nickel-iron-chromium composite oxide, copper-iron-manganese composite oxide, cobalt-nickel composite oxide, titanium-vanadium-antimony composite oxide, tin-antimony Metal oxides such as composite oxide molybdenum disulfide can be used. Further, for example, metal sulfides such as copper sulfide, iron sulfide, palladium sulfide, molybdenum disulfide and zinc sulfide, and metal nitrides such as titanium nitride, copper nitride and lithium nitride can be used. The metal particles contained in the photosensitive conductive material are oxidized after pattern formation using an oxidizing agent such as sodium chlorite, sodium hypochlorite, and sodium nitrite and an alkaline aqueous solution of sodium hydroxide and sodium phosphate. You may form as a thing. In addition, it is preferable that the particle diameter of (O) metal compound exists in the range of 0.1 micrometer or more and 4 micrometers or less.

In addition, the blackened layer may be formed by depositing tellurium chloride by using metallic tellurium, tellurium dioxide and hydrochloric acid.
The content of the above blackening component (hereinafter also simply referred to as “black material”) is within the range of 1 wt% or more and 100 wt% or less based on the solid content of (H) metal particles. Preferably, it is in the range of 1 wt% or more and 70 wt% or less. When the content of the black material is less than 1% by weight, the reflectance is high, so that a thin wiring must be formed. On the other hand, when it exceeds 100% by weight, the sensitivity is lowered and it is difficult to obtain a thin wiring.
In addition, carbon black can also be used as the black material in the photosensitive conductive material used in the first embodiment in order to control the reflectance within a range of 0% to 30%.

Carbon black may be a black pigment having a light shielding property. Examples of commercially available carbon black that can be used include # 260, # 25, # 30, # 32, # 33, # 40, # 44, # 45, # 45L, # 47, # 50, # 52, MA7, MA8. MA11, MA100, MA100R, MA100S, MA230 (Mitsubishi Chemical Corporation), Printex L, Printex P, Printex 30, Printex 35, Printex 40, Printex 45, Printex 55, Printex 60, 350 PrintP, 300 In addition to carbon black alone such as Black 4, Special Black 350, Special Black 550 (and above, manufactured by DEGUSSA), MHI Black # 201, # 220, # 2 3 (or more, Mikuni Color Ltd.) can be used carbon black dispersion such. Carbon black may be used individually by 1 type, or 2 or more types may be mixed and used for it. The average primary particle diameter of carbon black of the photosensitive conductive material used in the first embodiment is preferably in the range of 10 nm to 500 nm, more preferably in the range of 100 nm to 500 nm, and still more preferably in the range of 100 nm to 300 nm. Within the following range.

When the average primary particle diameter of carbon black is smaller than 10 nm, it is difficult to disperse at a high concentration, and it is difficult to obtain a photosensitive black composition having good temporal stability. On the other hand, when carbon black having an average primary particle size larger than 500 nm is used, the blackness is lowered. Therefore, in order to provide sufficient blackness, the ratio of carbon black in the photosensitive conductive material must be increased. Adversely affects pattern processability. When the average primary particle size of carbon black is 100 nm or more, better dispersibility can be obtained. The content of carbon black in the photosensitive conductive material is preferably in the range of 1 to 100% by weight, more preferably in the range of 1 to 3% by weight, based on the solid content of the metal particles. Is within. When the content of carbon black is less than 1% by weight, a sufficient reflectance reduction effect cannot be obtained, and when it is more than 100% by weight, it is difficult to obtain conductivity, and the second connecting portion 4 and the extraction wiring 20 Formation can be difficult.

The average particle diameter of the (H) metal particles of the photosensitive conductive material used in the first embodiment is preferably in the range of 0.1 μm to 4 μm.
When the average particle diameter is smaller than 0.1 μm, the concealing property becomes high, so that ultraviolet light does not reach the bottom during exposure, and pattern formation becomes difficult. On the other hand, when the average particle diameter is larger than 4 μm, the linearity and resolution in the fine pattern are not preferable. Most preferably, when the (H) metal particles are Ag particles, the average particle diameter is in the range of 0.5 μm to 4 μm.

Further, regarding the shape of (H) metal particles, for example, there are flakes, needles, spheres, etc., but spherical silver powder is desirable from the viewpoint of screen printability and light scattering during exposure. (H) The amount of metal particles used is preferably in the range of 40% by weight to 90% by weight, more preferably in the range of 50% by weight to 90% by weight, based on the total solid content of the photosensitive conductive material. More preferably, it is in the range of 65 wt% or more and 90 wt% or less. (H) If the added amount of metal particles is less than 40% by weight, sufficient resistivity cannot be obtained as a wiring, and if it exceeds 90% by weight, ultraviolet light does not reach the bottom during exposure, making pattern formation difficult. .

Examples of the (I) photopolymerization initiator of the photosensitive conductive material used in the first embodiment include 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)]. It is necessary to use at least one O-acyloxime compound such as O- (acetyl) -N- (1-phenyl-2-oxo-2- (4′-methoxy-naphthyl) ethylidene) hydroxylamine. The O-acyloxime compound has excellent curing characteristics even in a highly concealable photosensitive conductive material because it generates methyl radicals and phenyl radicals with high mobility with high efficiency. These photopolymerization initiators can be used alone or in combination. Examples of the photopolymerization initiator that can be used by mixing with an O-acyloxime compound include 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, 1- (4-isopropylphenyl) -2 Acetophenone compounds such as -hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, benzoin Benzoin compounds such as benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldimethyl ketal, benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxyben Benzophenone compounds such as phenone, acrylated benzophenone, 4-benzoyl-4′-methyldiphenyl sulfide, 3,3 ′, 4,4′-tetra (t-butylperoxycarbonyl) benzophenone, thioxanthone, 2-chlorothioxanthone, Thioxanthone compounds such as 2-methylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, 2,4-diethylthioxanthone, 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis (trichloro Methyl) -s-triazine, 2- (p-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) -s- Triazine, 2-piphenyl-4,6-bis ( Lichloromethyl) -s-triazine, 2-piperonyl-4,6-bis (trichloromethyl) -s-triazine, 2,4-bis (trichloromethyl) -6-styryl-s-triazine, 2- (naphth-1- Yl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxy-naphth-1-yl) -4,6-bis (trichloromethyl) -s-triazine, 2,4-trichloro Triazine compounds such as methyl- (piperonyl) -6-triazine, 2,4-trichloromethyl (4′-methoxystyryl) -6-triazine, 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)], O- (acetyl) -N- (1-phenyl-2-oxo-2- (4′-methoxy-naphthyl) ethylidene) hydro Oxime ester compounds such as xylamine, phosphine compounds such as bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 9,10-phenanthrenequinone, camphor Quinone compounds such as quinone and ethyl anthraquinone, borate compounds, carbazole compounds, imidazole compounds, titanocene compounds and the like are used. (I) The amount of photopolymerization initiator used is preferably in the range of 0.1 wt% to 50 wt%, more preferably 0.2 wt% to 20 wt%, based on the total solid content of the photosensitive conductive material. % Or less.

Further, (I) As a sensitizer for a photopolymerization initiator, for example, α-acyloxy ester, acylphosphine oxide, methylphenylglyoxylate, benzyl, 9,10-phenanthrenequinone, camphorquinone, ethylanthraquinone , 4,4'-diethylisophthalophenone, 3,3 ', 4,4'-tetra (t-butylperoxycarbonyl) benzophenone, triethanolamine, methyldiethanolamine, triisopropanolamine, 4-dimethylamino Methyl benzoate, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, 2-ethylhexyl 4-dimethylaminobenzoate, N, N-dimethylparatoluidine, 4,4 ′ -Bis (dimethyl Mino) benzophenone, 4,4'-bis (diethylamino) benzophenone, can be used in combination of 4,4'-bis (ethylmethylamino) amine compounds such as benzophenone. These sensitizers can be used alone or in combination. The amount of the sensitizer used is preferably in the range of 0.5% by weight to 50% by weight, more preferably 1% by weight to 30% by weight, based on the total amount of the photopolymerization initiator and the sensitizer. Within range.

Examples of the (J) polymerizable polyfunctional monomer and oligomer of the photosensitive conductive material used in the first embodiment include methyl (meth) acrylate, ethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2- Hydroxypropyl (meth) acrylate, cyclohexyl (meth) acrylate, β-carboxyethyl (meth) acrylate, diethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, triethylene glycol di (meth) acrylate, Tripropylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, polyethylene glycol di (meth) acrylate, pentaerythritol tri (meth) acrylate, 1,6-hexanedi Diglycidyl ether di (meth) acrylate, bisphenol A diglycidyl ether di (meth) acrylate, neopentyl glycol diglycidyl ether di (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tricyclodecanyl (meth) acrylate , Various acrylates and methacrylates such as ester acrylate and melamine (meth) acrylate, (meth) acrylates of methylolated melamine, various acrylates and methacrylates such as epoxy (meth) acrylate and urethane acrylate, (Meth) acrylic acid, styrene, vinyl acetate, hydroxyethyl vinyl ether, ethylene glycol divinyl ether, pentaerythritol trivinyl ether Ter, (meth) acrylamide, N-hydroxymethyl (meth) acrylamide, N-vinylformamide, acrylonitrile and the like. Moreover, it is preferable to use the polyfunctional urethane acrylate which has the (meth) acryloyl group obtained by making polyfunctional isocyanate react with the (meth) acrylate which has a hydroxyl group. The combination of the (meth) acrylate having a hydroxyl group and the polyfunctional isocyanate is arbitrary and is not particularly limited. Moreover, one type of polyfunctional urethane acrylate may be used alone, or two or more types may be used in combination. These can be used alone or in admixture of two or more.

The (K) resin of the photosensitive conductive material used in the first embodiment is a linear polymer having a carboxyl group. For example, a (meth) acrylic copolymer resin or an epoxy resin and (meth) acrylic acid or Examples thereof include an epoxy-modified acrylate resin obtained by further reacting the anhydride reaction product with a polybasic carboxylic acid or an anhydride thereof.

Here, the above-mentioned (K) resin is preferably an alkali-soluble type. This is because, in order to pattern the photosensitive conductive material in the photolithography process, it is common to impart alkali solubility to the resin and enable development with an aqueous alkali solution. Although development can be performed with an alkaline aqueous solution without using an alkali-soluble resin, unexposed portions of details are removed by development in order to obtain a conductor width of 20 μm or less, particularly 10 μm or less. There is a need. In order to obtain a pattern having good linearity, it is necessary to increase the alkali-soluble contrast between the unexposed portion and the exposed portion. For these purposes, it is preferable to increase developability by giving the resin alkalinity.

The (meth) acrylic copolymer resin of the photosensitive conductive material used in the first embodiment is a copolymer resin containing at least a (meth) acrylic monomer in its constituent components, for example, as a (meth) acrylic monomer (Meth) acrylic acid, methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, allyl acrylate, benzyl acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, glycidyl acrylate, aminoethyl Acrylate, methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, Butyl methacrylate, allyl methacrylate, benzyl methacrylate, cyclohexyl methacrylate, dicyclopentanyl methacrylate, dicyclopentenyl acrylate, glycidyl methacrylate, aminoethyl methacrylate, and the like. As a constituent component other than the (meth) acrylic monomer, a compound having an unsaturated bond such as styrene or cyclohexylmaleimide can be used.

Examples of the epoxy resin used for the epoxy-modified acrylate resin include phenol novolac, cresol novolac, and those having a bisphenol A or bisphenol F skeleton.
Examples of the (P) organic solvent of the photosensitive conductive material used in the first embodiment include cyclohexanone, ethyl cellosolve acetate, butyl cellosolve acetate, ethyl carbitol acetate, 1-methoxy-2-propyl acetate, diethylene glycol dimethyl ether, ethylbenzene, Examples include ethylene glycol diethyl ether, xylene, ethyl cellosolve, methyl-n amyl ketone, propylene glycol monomethyl ether, petroleum solvent, and the like. These can be used alone or in combination. (P) The addition amount of the organic solvent is preferably within a range of 5% by weight or more and 20% by weight or less based on the total amount of the photosensitive conductive material.

In addition to the components described above, a radical scavenger may be included as the photosensitive conductive material used in the first embodiment. The radical scavenger has a function of deactivating active radicals, and by adding it to the photosensitive conductive material, it becomes possible to suppress the curing reaction in the unexposed part caused by light scattering by (H) metal particles. The dimensional accuracy of the conductor pattern can be improved. Examples of the radical scavenger include hydroquinone derivatives such as hydroquinone, methylhydroquinone, methoquinone, kinopower MNT (manufactured by Kawasaki Kasei Co., Ltd.), non-flex alba, non-flex CBP, non-flex EBP (above, manufactured by Seiko Chemical Co., Ltd.) and the like. , 4-benzoquinone, 2,6-dichloroquinone, p-xyloquinone, quinone derivatives such as naphthoquinone, Irganox 245, Irganox 259, Irganox 1010, Irganox 1035, Irganox 1076, Irganox 1098 (manufactured by BASF), Adeka Stab AO30-A tab 30 (Holded phenols such as ADEKA), TINUVIN123, TINUVIN144, TINUVIN152, TINUVI 765, TINUVIN770DF (above, manufactured by BASF), hindered amines such as ADK STAB LA-77, ADK STAB LA-57, ADK STAB LA-67, ADK STAB LA-87 (above, manufactured by ADEKA), etc. More than one type can be used. As the addition amount of the radical scavenger, it can be added within a range of 0.01 wt% or more and 0.1 wt% or less based on the total solid content of the photosensitive conductive material. If the added amount of the radical scavenger is less than 0.01% by weight, the effect of improving the dimensional accuracy of the conductor pattern cannot be obtained. appear.

In order to stabilize the time-dependent viscosity of the photosensitive conductive material used in the first embodiment, a storage stabilizer can be contained. Examples of the storage stabilizer include quaternary ammonium chlorides such as benzyltrimethyl chloride and diethylhydroxyamine, organic acids such as lactic acid and oxalic acid, and organic acids such as methyl ether, t-butylpyrocatechol, triethylphosphine, and triphenylphosphine. Examples thereof include phosphine and phosphite. The storage stabilizer can be contained in an amount in the range of 0.1 wt% to 10 wt% based on the total amount of the photosensitive conductive material.

Further, the photosensitive conductive material used in the first embodiment can contain a surfactant. Examples of surfactants include polyoxyethylene alkyl ether sulfate, sodium dodecylbenzenesulfonate, alkali salt of styrene-acrylic acid copolymer, sodium alkylnaphthalenesulfonate, sodium alkyldiphenyletherdisulfonate, lauryl sulfate monoethanolamine, lauryl Anionic surfactants such as triethanolamine sulfate, ammonium lauryl sulfate, monoethanolamine stearate, sodium stearate, sodium lauryl sulfate, monoethanolamine of styrene-acrylic acid copolymer, polyoxyethylene alkyl ether phosphate ester; Polyoxyethylene oleyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene Nonionic surfactants such as alkyl ether phosphates, polyoxyethylene sorbitan monostearate and polyethylene glycol monolaurate; chaotic surfactants such as alkyl quaternary ammonium salts and their ethylene oxide adducts; Examples include amphoteric surfactants such as alkylbetaines such as aminoacetic acid betaine and alkylimidazolines, and these can be used alone or in admixture of two or more.

A silane coupling agent can be included in the photosensitive conductive material used in the first embodiment in order to improve adhesion to the substrate. Examples of silane coupling agents include KBM-303, KBM-402, KBM-403, KBE-402, KBE-403, KBM-502, KBM-503, KBE-502, KBE-503, KBM-5103, KBM-802. , KBM-803, KBE-9007 (above, manufactured by Shin-Etsu Silicone), Z-6011, Z-6020, Z-6030, Z-6040, Z-6043, Z-6094, Z-6519 (above, Toray Dow Corning) Etc.). The silane coupling agent can be contained in an amount in the range of 0.1 wt% or more and 1 wt% or less based on the total amount of the photosensitive conductive material.

The photosensitive conductive material used in the first embodiment includes (L) at least one black pigment, (M) a pseudo black pigment mixture of at least two pigments, and (N) at least one black pigment. (H) metal particles, (I) photopolymerization initiator, (J) polymerizable polyfunctional monomer, comprising as essential components at least one blackening component selected from the group consisting of black dyes and (O) metal compounds , (K) resin, (P) solvent, surfactant and the like are blended in a predetermined composition, stirred with a stirrer, and then kneaded with a three-roll mill.

Further, another photosensitive conductive material used in the first embodiment is carbon black, (H) metal particles, (I) a photopolymerization initiator, (J) a polymerizable polyfunctional monomer, and (K) an alkali-soluble resin. (P) It can obtain by mix | blending components, such as a solvent and surfactant, with a predetermined composition, kneading with a stirrer, and knead | mixing with a 3 roll mill.

<The manufacturing method of the 2nd connection part 4 and the extraction wiring 20 using a photosensitive electrically-conductive material>
The manufacturing method of the 2nd connection part 4 and the extraction wiring 20 using the photosensitive electrically-conductive material in 1st embodiment is demonstrated below.
Examples of the method for applying the photosensitive conductive material to the transparent substrate 10 include screen printing, gravure offset printing, reverse offset printing, relief printing, die coating, and bar coating, and screen printing is generally used. After application to the transparent substrate 10, pre-baking is performed as necessary to evaporate the organic solvent. For example, a hot air circulation oven, a hot plate, or an IR oven can be used for pre-baking.

After applying the photosensitive conductive material to the transparent base material 10, pattern exposure is performed through a photomask corresponding to the desired second connection portion 4 and extraction wiring 20. A normal high-pressure mercury lamp may be used as the exposure light source. The exposure amount is preferably about 10 to 200 mJ / cm ² from the viewpoint of tact time.
Development is performed following exposure. An alkaline aqueous solution is used as the developer. As an example of the alkaline aqueous solution, a tetramethylammonium hydroxide aqueous solution or a potassium hydroxide aqueous solution is preferably used, but a sodium carbonate aqueous solution, a sodium hydrogen carbonate aqueous solution, a mixed aqueous solution of both, or a surfactant suitable for them. You may use what added.

After the development, an arbitrary extraction wiring 20 is obtained by performing a heat treatment. The heat treatment is performed at 130 to 250 ° C. for 10 to 60 minutes using a heat drying oven. Due to the curing shrinkage of the resin due to the heat treatment, the silver powder of the extracted wiring pattern comes into contact with each other and has sufficient conductivity and also improves the resistance to chemicals and the like.
In addition, in 1st embodiment, after forming the 1st transparent electrode 1, the 2nd transparent electrode 2, and the 1st connection part 3, the case where the 2nd connection part 4 and the extraction wiring 20 are formed is demonstrated. However, the present invention is not limited to this. For example, after forming the 2nd connection part 4 and the extraction wiring 20, you may form the 1st transparent electrode 1, the 2nd transparent electrode 2, and the 1st connection part 3. FIG.

<Display device>
A display device according to the first embodiment is a display device having the above-described projected capacitive touch panel sensor substrate. Since this display device has the above-described projected capacitive touch panel sensor substrate, it is possible to provide a display device that can be manufactured at low cost and has excellent display quality.

<< Example 1.1 >>
Hereinafter, the first embodiment will be specifically described by way of examples. However, the present invention is not limited to the examples without departing from the gist of the present invention.
In addition, the notation “1.1” in the 1.1st example means “the 1st example in the first embodiment”.

[Synthesis of alkali-soluble resin A]
A reaction vessel was charged with 800 parts of 1-methoxy-2-propyl acetate, heated while injecting nitrogen gas into the vessel, and a mixture of the following monomer and thermal polymerization initiator was added dropwise to carry out a polymerization reaction.
Styrene 40 parts Methacrylic acid 60 parts Methyl methacrylate 55 parts Benzyl methacrylate 45 parts Azobisisobutyronitrile 10 parts 1,4-dimethylmercaptobenzene 3 parts

After dripping, the mixture was heated sufficiently, and then 2 parts of azobisisobutyronitrile dissolved in 50 parts of 1-methoxy-2-propylacetate was added, and the reaction was continued to obtain an acrylic resin solution.
An acrylic resin solution was prepared by adding 1-methoxy-2-propylacetate to the resin solution so that the solid content was 30% by weight.
The weight average molecular weight of the alkali-soluble resin A was about 20,000.

[Preparation of pseudo black pigment mixture B]
The pseudo black pigment mixture B is obtained by dispersing a red pigment and a blue pigment in an alkali-soluble resin dissolved in a solvent. Examples of red pigments and blue pigments include C.I. I. Pigment red 254 and C.I. I. A mixture of CI Pigment Blue 15: 3 at a ratio of 1: 1 was used.
Red pigment: C.I. I. Pigment Red 254
("ILGER FOR RED B-CF" manufactured by BASF) 30 parts Blue pigment: C.I. I. Pigment Blue 15: 3
(BASF, IRGALITE Blue GBP) 30 parts

[Preparation of photosensitive conductive material 1.1.1]
A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and filtered through a 5 μm filter to prepare photosensitive conductive material 1.1.1. In addition, the notation “photosensitive conductive material 1.1. ◯” described below means “photosensitive conductive material ○ in the first example of the first embodiment”. That is, “photosensitive conductive material 1.1.1” means “photosensitive conductive material 1 in the first example of the first embodiment”.
C. I. Pigment Black 32 7.2 parts silver powder (average particle size d50 1.5 μm) 65 parts photopolymerization initiator Irgacure OXE02 (manufactured by BASF) 0.2 parts polymerizable polyfunctional monomer R-684 (manufactured by Nippon Kayaku Co., Ltd.) 6 Part alkali-soluble resin A 17.28 parts radical scavenger methyl hydroquinone 0.02 part organic solvent 1-methoxy-2-propyl acetate 4 parts surfactant Adecanate B-940 (manufactured by ADEKA) 0.1 part silane coupling agent KBM-502 (manufactured by Shin-Etsu Silicone) 0.2 parts

[Preparation of photosensitive conductive material 1.1.2 to 1.1.9]
Photosensitive conductive materials 1.1.2 to 1.1.9 were obtained in the same manner as photosensitive conductive material 1.1.1 except that the composition was changed to the materials shown in Table 1.

[Preparation of photosensitive conductive material 1.1.10.]
A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and then filtered through a 5 μm filter to prepare photosensitive conductive material 1.1.10.
Pseudo black pigment mixture B 7.2 parts silver powder (average particle size d50 1.5 μm) 65 parts photopolymerization initiator Irgacure OXE02 (manufactured by BASF) 0.2 parts polymerizable polyfunctional monomer R-684 (manufactured by Nippon Kayaku Co., Ltd.) ) 6 parts alkali-soluble resin A 17.28 parts radical scavenger methyl hydroquinone 0.02 parts organic solvent 1-methoxy-2-propyl acetate 4 parts surfactant Adecanate B-940 (manufactured by ADEKA) 0.1 part silane cup Ring agent KBM-502 (manufactured by Shin-Etsu Silicone) 0.2 parts

[Preparation of photosensitive conductive material 1.1.11 to 1.1.17]
Photosensitive conductive materials 1.1.1.11 to 1.1.17 were obtained in the same manner as photosensitive conductive material 1.1.10, except that the composition was changed to the materials shown in Table 1.

[Preparation of photosensitive conductive material 1.1.18]
A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and then filtered through a 5 μm filter to prepare photosensitive conductive material 1.1.18.
Black dye: C.I. I. Acid Black 24 7.2 parts silver powder (average particle diameter d50 1.5 μm) 65 parts photopolymerization initiator Irgacure OXE02 (manufactured by BASF) 0.2 parts polymerizable polyfunctional monomer R-684 (manufactured by Nippon Kayaku Co., Ltd.) 6 Part alkali-soluble resin A 17.28 parts radical scavenger methyl hydroquinone 0.02 part organic solvent 1-methoxy-2-propyl acetate 4 parts surfactant Adecanate B-940 (manufactured by ADEKA) 0.1 part silane coupling agent KBM-502 (manufactured by Shin-Etsu Silicone) 0.2 parts

[Preparation of photosensitive conductive material 1.1.19 to 1.1.25]
Photosensitive conductive materials 1.1.19 to 1.1.25 were obtained in the same manner as photosensitive conductive material 1.1.18, except that the composition was changed to the materials shown in Table 1.

[Preparation of photosensitive conductive material 1.1.26]
A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and filtered through a 5 μm filter to prepare photosensitive conductive material 1.1.26.
Black metal oxide: triiron tetroxide (average particle diameter d50 1.0 μm) 7.2 parts silver powder (average particle diameter d50 2.0 μm) 65 parts photopolymerization initiator Irgacure OXE02 (manufactured by BASF) 0.2 parts polymerization Polyfunctional monomer R-684 (manufactured by Nippon Kayaku Co., Ltd.) 6 parts alkali-soluble resin A 17.28 parts radical scavenger methyl hydroquinone 0.02 parts organic solvent 1-methoxy-2-propyl acetate 4 parts surfactant Adecanate B -940 (manufactured by ADEKA) 0.1 part silane coupling agent KBM-502 (manufactured by Shin-Etsu Silicone) 0.2 part

[Preparation of photosensitive conductive material 1.1.27 to 1.1.33]
Photosensitive conductive materials 1.1.27 to 1.1.33 were obtained in the same manner as photosensitive conductive material 1.1.26, except that the composition was changed to the materials shown in Table 1.

[Preparation of photosensitive conductive material 1.1.34]
A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and then filtered through a 5 μm filter to prepare photosensitive conductive material 1.1.34.
Black metal oxide: triiron tetroxide (average particle diameter d50 5.0 μm) 7.2 parts silver powder (average particle diameter d50 2.0 μm) 65 parts photopolymerization initiator Irgacure OXE02 (manufactured by BASF) 0.2 parts polymerization Polyfunctional monomer R-684 (manufactured by Nippon Kayaku Co., Ltd.) 6 parts alkali-soluble resin A 17.28 parts radical scavenger methyl hydroquinone 0.02 parts organic solvent 1-methoxy-2-propyl acetate 4 parts surfactant Adecanate B -940 (manufactured by ADEKA) 0.1 part silane coupling agent KBM-502 (manufactured by Shin-Etsu Silicone) 0.2 part

(Example 1.1.1)
In addition, the notation “Example 1.1. ○” described below means “Example ○ in the first example of the first embodiment”. Further, the notation “Comparative Example 1.1. ◯” means “Comparative Example ○ in the first example of the first embodiment”. That is, “Example 1.1.1” means “Example 1 in the first example of the first embodiment”. Similarly, “comparative example 1.1.1” means “comparative example 1 in the first example of the first embodiment”.

<Production of capacitive touch panel sensor substrate>
On the aluminosilicate glass, the photosensitive conductive material 1.1.1 was applied by screen printing using a screen printing plate (material: stainless steel, manufactured by Tokyo Process Service Co., Ltd.) of mesh 500, and 90 ° C. on a hot plate. The film was dried for 5 minutes to dry the coating film. Thereafter, exposure is performed through a photomask having a desired opening at 50 to 200 mJ / cm ² using a high-pressure mercury lamp as a light source, and then for 30 to 60 seconds with a 0.2 wt% aqueous sodium bicarbonate solution. Shower development was performed. After washing with water, heat treatment was performed at 230 ° C. for 30 minutes in a hot-air circulating oven to produce the second connection portion 4 and the extraction wiring 20. By changing the opening of the photomask, the exposure amount, and the development time, the second connecting portion 4 having a conductor width of 6 to 20 μm × conductor length of 200 μm was obtained. The sheet resistance of the photosensitive conductive material layer was 0.2Ω / □, and the conductor thickness was 3.0 μm.

Next, an acrylic negative resist was spin-coated and dried on a hot plate to dry the coating film. Then, after exposing through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the sodium hydrogencarbonate aqueous solution. After washing with water, heat treatment was performed in an oven to form the insulating layer 5. The insulating layer 5 has a width of 60 μm × length of 120 μm so as to cover only the effective portion of the second connection portion 4.

Subsequently, an ITO film having a film thickness of 30 nm was formed by a sputtering apparatus, a novolac positive resist was spin-coated, dried on a hot plate, and the coating film was dried. Then, after exposing through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the tetramethylammonium hydroxide aqueous solution. After washing with water, wet etching is performed using an etching solution containing oxalic acid as a main component, and the resist is removed using a potassium hydroxide resist stripping solution. Then, the first transparent electrode 1 is subjected to heat treatment in an oven. The 2nd transparent electrode 2 and the 1st connection part 3 were formed. The sheet resistance of the ITO film was 100Ω / □.

Furthermore, an acrylic negative resist was applied by spin coating and dried on a hot plate to dry the coating film. Then, after exposing through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the sodium hydrogencarbonate aqueous solution. After washing with water, heat treatment was performed in an oven to form the protective layer 6 to obtain a capacitive touch panel sensor substrate. The protective layer 6 was formed so as to cover the entire region excluding the connection portion connected to the extraction wiring 20 and the control circuit of the touch panel sensor substrate.

(Examples 1.1.2 to 1.1.29, Comparative Examples 1.1.1 to 1.1.5)
<Production of capacitive touch panel sensor substrate>
The same procedure as in Example 1.1.1 was performed except that the photosensitive conductive material 1.1.2 to 1.1.34 was used instead of the photosensitive conductive material 1.1.1.

(Example 1.1.30)
<Production of capacitive touch panel sensor substrate>
In the same manner as in Comparative Example 1.1.1, the second connection portion 4 and the lead-out wiring 20 were prepared, and the mixture was 40 ° C. in a sulfuric acid (10 wt%) / sodium persulfate (0.5 wt%) mixture. The substrate was immersed for 2 minutes. Next, as an oxidation treatment, sodium hydroxide (6% by weight) / sodium chlorite (10% by weight) / sodium hypochlorite (10% by weight) / sodium nitrite (10% by weight) in a mixed solution of 50 The substrate was immersed for 2 minutes at 0 ° C. to oxidize the silver powder. Thereafter, a touch panel sensor substrate was produced in the same manner as in Comparative Example 1.1.1.

(Comparative Example 1.1.6)
<Production of capacitive touch panel sensor substrate>
On the aluminosilicate glass, films of Mo, Al, and Mo are formed in a thickness of 350 mm / 2000 mm / 350 mm by sputtering, a novolac positive resist is spin-coated, dried on a hot plate, and a coating film is formed. Dried. Then, after exposing through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the tetramethylammonium hydroxide aqueous solution. After washing with water, wet etching is performed using an etching solution mainly composed of phosphoric acid, nitric acid, and acetic acid. After removing the resist using a potassium hydroxide resist stripping solution, heat treatment is performed in an oven. The connection part 4 and the lead-out wiring 20 were prepared. By changing the opening of the photomask, the exposure amount, and the development time, the second connecting portion 4 having a conductor width of 6 to 20 μm × conductor length of 200 μm was obtained. The sheet resistance of the Mo / Al / Mo film was 0.2Ω / □. Other than that was carried out similarly to Example 1.1.1, and obtained the capacitive touch-panel sensor board | substrate.

[Evaluation method of connection part]
<Measurement of reflectance>
On an alkali-free glass substrate, Mo, Al, and Mo were formed in the order of 350 Å / 2000 Å / 350 それぞれ respectively by sputtering, and subjected to heat treatment at 230 ° C. for 30 minutes in a hot air circulating oven for evaluation substrate Was made. In addition, a photosensitive conductive material is applied on a non-alkali glass substrate by screen printing using a screen printing plate of mesh 500 (material: stainless steel, manufactured by Tokyo Process Service Co., Ltd.), and 5 ° C. at 100 ° C. on a hot plate. Drying was performed for a minute, and the coating film was dried. Thereafter, the entire surface was exposed at 100 mJ / cm ² using a high-pressure mercury lamp as a light source, and then shower development was performed with a 0.2 wt% sodium hydrogen carbonate aqueous solution for 30 seconds. After washing with water, heat treatment was performed at 230 ° C. for 30 minutes in a hot air circulation oven to prepare an evaluation substrate. The reflectance was measured using an ultraviolet-visible spectrophotometer (U-4100, manufactured by Hitachi High-Tech), and diffuse reflection measurement including specular reflection was performed from the surface of an anhydrous alkali glass substrate using an integrating sphere.

<Evaluation of connection pattern appearance>
The electrostatic capacitance type touch panel sensor substrate obtained in Examples 1.1.1 to 1.1.30 and Comparative Examples 1.1.1 to 1.1.6 was used so that the light from above and outside the fluorescent light box When placed on a light-shielded blackboard and reflected by changing the angle under a fluorescent lamp as external light, it was evaluated whether the second connecting portion 4 could be visually observed. The evaluation criteria are shown below.
○… The second connection 4 is not visible either on the fluorescent light box or on the blackboard △… The second connection 4 is slightly visible on either the fluorescent light box or on the blackboard ×… Fluorescent light The second connecting part 4 is clearly visible either on the box or on the blackboard-... the pattern cannot be formed because the pattern is not peeled off or cannot be resolved Note that ◯ and Δ are usable levels.

<Sensitivity evaluation>
On the aluminosilicate glass substrate, a photosensitive conductive material is applied by screen printing using a screen printing plate of mesh 500 (material: stainless steel, manufactured by Tokyo Process Service Co., Ltd.) and dried on a hot plate at 90 ° C. for 5 minutes. And the coating film was dried. Thereafter, exposure is performed through a photomask having a desired opening at 50 to 200 mJ / cm ² using a high-pressure mercury lamp as a light source, and then shower development is performed with a 0.2 wt% sodium bicarbonate aqueous solution for 60 seconds. Carried out. As a criterion for sensitivity, as an exposure amount necessary for forming the second connection portion 4 having a conductor width of 10 μm × conductor length of 200 μm, a sensitivity of less than 150 mJ / cm ² is good, 150 mJ / cm ² or more A value of less than 200 mJ / cm ² can be used, and a value of 200 mJ / cm ² or more is marked as x because of insufficient sensitivity.

<Electrostatic breakdown evaluation>
The electrostatic capacity type touch panel sensor substrate obtained in Examples 1.1.1 to 1.1.30 and Comparative Examples 1.1.1 to 1.1.6 was used as an electrostatic discharge simulator (KES4021 manufactured by Kikusui Electronics Corporation). ) Was used to evaluate electrostatic breakdown. As evaluation criteria, a case where no disconnection occurred at an applied voltage of 10 kV was indicated as “◯”, and a case where a disconnection occurred was indicated as “x”.
The composition of the photosensitive conductive material is shown in Table 1, and the evaluation results are shown in Table 2.

From the comparison between the above Examples 1.1.1 to 1.1.30 and Comparative Examples 1.1.1 to 1.1.6, the second is obtained when the reflectance is in the range of 0% to 30%. It can be seen that it is possible to manufacture a capacitive touch panel sensor with excellent display quality without the pattern of the connecting portion 4 being visible.
Considering sensitivity and process margin, the average particle size of (H) metal particles is better within the range of 0.1 μm to 4 μm, and the black material content is within the range of 1 wt% to 100 wt%. It is good to be in.

<< Example 1.2 >>
Hereinafter, the first embodiment will be specifically described by way of examples. However, the present invention is not limited to the examples without departing from the gist of the present invention. The 1.2th example is an example when carbon black is used as the black material. In addition, the notation “1.2” in the above 1.2 example means “the 2nd example in the first embodiment”.

[Synthesis of alkali-soluble resin A]
The method for synthesizing the alkali-soluble resin A in Example 1.2 is the same as the method for [Synthesis of alkali-soluble resin A] described in Example 1.1 above. Therefore, the description is omitted here.

[Adjustment of photosensitive conductive material 1.2.1]
A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and filtered through a 5 μm filter to prepare photosensitive conductive material 1.2.1. Note that the notation “photosensitive conductive material 1.2. ◯” shown below means “photosensitive conductive material ○ in the second example of the first embodiment”. That is, “photosensitive conductive material 1.2.1” means “photosensitive conductive material 1 in the second example of the first embodiment”.

Carbon Black MHI Black # 220 (manufactured by Mikuni Dye Co., Ltd.) 3.6 parts Carbon black content 33%, solid content 40%, average particle size 125 nm
Silver powder (average particle size d50 1.5 μm) 65 parts photopolymerization initiator Irgacure OXE02 (manufactured by BASF) 0.2 parts polymerizable polyfunctional monomer R-684 (manufactured by Nippon Kayaku Co., Ltd.) 6 parts alkali-soluble resin A 20. 88 parts radical scavenger methylhydroquinone 0.02 parts organic solvent 1-methoxy-2-propyl acetate 4 parts silane coupling agent KBM-502 (manufactured by Shin-Etsu Silicone) 0.2 parts surfactant Adecanate B-940 (ADEKA) 0.1 parts)

[Adjustment of photosensitive conductive material 1.2.2 to 1.2.14]
Photosensitive conductive materials 1.2.2 to 1.2.14 were obtained in the same manner as photosensitive conductive material 1.2.1 except that the composition was changed to a mixture of materials described in Table 3 described later. It was.

(Example 1.2.1)
Note that the notation “Example 1.2. ◯” shown below means “Example ○ in the second example of the first embodiment”. In addition, the notation “Comparative Example 1.2. ◯” means “Comparative Example ○ in the second example of the first embodiment”. That is, “Example 1.2.1” means “Example 1 in the second example of the first embodiment”. Similarly, “Comparative example 1.2.1” means “Comparative example 1 in the second example of the first embodiment”.

<Production of capacitive touch panel sensor substrate>
On the aluminosilicate glass, the photosensitive conductive material 1.2.1 is applied by screen printing using a screen printing plate (material: stainless steel, manufactured by Tokyo Process Service Co., Ltd.) of mesh 500, and is heated at 90 ° C. on a hot plate. The film was dried for 5 minutes to dry the coating film. Thereafter, exposure is performed through a photomask having a desired opening at 50 to 200 mJ / cm ² using a high-pressure mercury lamp as a light source, and then for 30 to 60 seconds with a 0.2 wt% aqueous sodium bicarbonate solution. Shower development was performed. After washing with water, heat treatment was performed at 230 ° C. for 30 minutes in a hot-air circulating oven to produce the second connection portion 4 and the extraction wiring 20. By changing the opening of the photomask, the exposure amount, and the development time, a second connection portion 4 having a conductor width of 6 to 22 μm × conductor length of 200 μm was obtained. The sheet resistance of the photosensitive conductive material layer was 0.2Ω / □, and the conductor thickness was 3.0 μm.

(Examples 1.2.2 to 1.2.12, Comparative Examples 1.2.1 and 1.2.2)
<Production of capacitive touch panel sensor substrate>
The same procedure as in Example 1.2.1 was performed, except that the photosensitive conductive material 1.2.2 to 1.2.14 was used instead of the photosensitive conductive material 1.2.1.

(Comparative Example 1.2.3)
<Production of capacitive touch panel sensor substrate>
On the aluminosilicate glass, films of Mo, Al, and Mo are formed in a thickness of 350 mm / 2000 mm / 350 mm by sputtering, a novolac positive resist is spin-coated, dried on a hot plate, and a coating film is formed. Dried. Then, after exposing through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the tetramethylammonium hydroxide aqueous solution. After washing with water, wet etching is performed using an etching solution mainly composed of phosphoric acid, nitric acid, and acetic acid. After removing the resist using a potassium hydroxide resist stripping solution, heat treatment is performed in an oven. The connection part 4 and the lead-out wiring 20 were prepared. By changing the opening of the photomask, the exposure amount, and the development time, a second connection portion 4 having a conductor width of 6 to 22 μm × conductor length of 200 μm was obtained. The sheet resistance of the Mo / Al / Mo film was 0.2Ω / □. Other than that was carried out similarly to Example 1.2.1, and obtained the capacitive touch-panel sensor board | substrate.

[Evaluation method of connection part]
<Measurement of reflectance>
Capacitive touch panel sensor substrates obtained in Examples 1.2.1 to 1.2.12 and Comparative Examples 1.2.1 to 1.2.3 are described in Example 1.1 above. The measurement was performed using the same method as described above. Therefore, the description is omitted here.

<Evaluation of connection pattern appearance>
Capacitive touch panel sensor substrates obtained in Examples 1.2.1 to 1.2.12 and Comparative Examples 1.2.1 to 1.2.3 are described in Example 1.1 above. Evaluation was performed using the same method. The evaluation criteria are also the same as the evaluation criteria described in the above-mentioned first embodiment. Therefore, the description is omitted here.

<Sensitivity evaluation>
Capacitive touch panel sensor substrates obtained in Examples 1.2.1 to 1.2.12 and Comparative Examples 1.2.1 to 1.2.3 are described in Example 1.1 above. Evaluation was performed using the same method. The evaluation criteria are also the same as the evaluation criteria described in the above-mentioned first embodiment. Therefore, the description is omitted here.

<Electrostatic breakdown evaluation>
Capacitive touch panel sensor substrates obtained in Examples 1.2.1 to 1.2.12 and Comparative Examples 1.2.1 to 1.2.3 are described in Example 1.1 above. Evaluation was performed using the same method. The evaluation criteria are also the same as the evaluation criteria described in the above-mentioned first embodiment. Therefore, the description is omitted here.
Table 3 shows the composition of the photosensitive conductive material, and Table 4 shows the evaluation results.

From the comparison between the above Examples 1.2.1 to 1.2.12 and Comparative Examples 1.2.1 to 1.2.3, the second is obtained when the reflectance is in the range of 0% to 30%. It can be seen that it is possible to manufacture a capacitive touch panel sensor with excellent display quality without the pattern of the connecting portion 4 being visible.
In consideration of sensitivity and process margin, (H) the average particle diameter of metal particles is better within the range of 0.1 μm to 4 μm, and the inclusion of carbon black whose average particle diameter is within the range of 10 nm to 500 nm More preferably, the amount is in the range of 1% to 100% by weight. In addition, in Example 1.2.9 (the average particle diameter of (H) metal particles is 4.2 μm) that is out of the above numerical range, the sensitivity and the process margin are good, but the linearity is slightly good. It wasn't.

Here, among the examples of the 1.1th example and the 1.2th example, the pattern appearance evaluation is “O” or “O” in the examples evaluated in the sensitivity evaluation and the electrostatic breakdown evaluation. FIG. 5 shows the relationship between the widest conductor width marked “Δ” and the reflectance.
It can be seen from the data shown in FIG. 5 that there is a certain correlation between reflectivity and conductor width. Specifically, the following relational expression (1) is established.
“Conductor width” = − 0.5167 × “reflectance” +22.115 (Expression 1)
This relational expression (1) is a relational expression calculated by the least square method using the points shown in FIG.
In other words, the lower the reflectivity, the better the pattern appearance even when the conductor width is larger. When the reflectivity is higher, the conductor width needs to be reduced in order to improve the pattern appearance.

<< Second Embodiment >>
<Projection capacitive touch panel sensor substrate>
The structure of the projected capacitive touch panel sensor substrate according to the second embodiment is substantially the same as the structure of the projected capacitive touch panel sensor substrate described in the first embodiment. That is, the projected capacitive touch panel sensor substrate according to the second embodiment includes the first transparent electrode 1, the second transparent electrode 2, the first connection portion 3, and the second connection on the transparent base material 10. It has the connection part 4, the insulating layer 5, and the extraction wiring 20. The insulating layer 5 is disposed in order to prevent and insulate the second connecting portion 4 orthogonal to the first connecting portion 3. Further, the projected capacitive touch panel sensor substrate according to the second embodiment can further have a protective film 6. Thus, hereinafter, a projected capacitive touch panel sensor substrate according to a second embodiment will be described with reference to FIGS. 1 and 2.

In the projected capacitive touch panel sensor substrate according to the second embodiment and the projected capacitive touch panel sensor substrate according to the first embodiment, the second connection portion 4 and the extraction wiring 20 are different. The other parts (that is, the first transparent electrode 1, the second transparent electrode 2, the first connection part 3, the insulating layer 5, and the protective film 6) are the same. Therefore, only this different part is demonstrated here and description is abbreviate | omitted about another part.

In the projected capacitive touch panel sensor substrate according to the second embodiment, the second connection portion 4 and the extraction wiring 20 are made of a metal material having a reflectance in the range of 0% to 10%. Metals such as Mo (molybdenum), Al (aluminum), Ag (silver), Cu (copper), Pd (palladium) are preferably used, and in order to achieve both conductivity and reflectivity, for example, with Mo oxide It is more preferable to use Al together.

Conventionally, a Mo / Al / Mo three-layer structure (hereinafter also referred to as “MAM”) is formed by sputtering at a thickness of about 350 mm / 2000 mm / 350 mm, respectively, and after a photolithography process using a positive resist. Etching / resist stripping methods have been frequently used. However, since this metal material has a high reflectivity, even if the second connection portion 4 in the display area is finely formed to have a width of about 8 μm and a length of about 200 μm, it can be visually recognized under normal use conditions. For this reason, there is a problem of degrading display quality. If the reflectance of the second connection portion 4 is low, the reflected light of the second connection portion 4 in the display area will not reach the eyes, and it will be difficult to see the connection portion. That is, the blackening of the second connection portion 4 and the extraction wiring 20 serves to make the second connection portion 4 inconspicuous.

As a result of intensive investigations, the present inventors have made it possible to reduce the visual appearance of the pattern by improving the reflectivity of the metal material within the range of 0% to 10%, thereby improving the display quality. I found out that I can do it. The reflectance is preferably 8% or less, and more preferably 5% or less.

Specifically, a three-layer structure of oxidized Mo / Al / Mo having a thickness of about 350 mm / 2000 mm / 350 mm is formed on the transparent base material 10 through the photolithography process and the etching / resist stripping process in the same manner as MAM. A pattern is formed in the order of oxidized Mo / Al / Mo from the lower layer. Thereby, when viewed from the back surface of the transparent substrate, the oxidized Mo surface having a reflectance of 10% or less can come to the forefront. As a result, the reflectance is low, and the visual observation under normal use conditions is possible. The problem of pattern appearance can be solved.

<Method for manufacturing capacitive touch panel sensor substrate>
The method for manufacturing the projected capacitive touch panel sensor substrate according to the second embodiment is substantially the same as the method for manufacturing the projected capacitive touch panel sensor substrate described in the first embodiment. The manufacturing processes of the second connection portion 4 and the extraction wiring 20 are different. For this reason, in the second embodiment, only the manufacturing process different from the above-described first embodiment will be described, and the other manufacturing processes (that is, the first transparent electrode 1, the second transparent electrode 2, the first The description of the manufacturing process of the connecting portion 3, the insulating layer 5, and the protective film 6) is omitted.

As the second connection portion 4 and the lead-out wiring 20, the above-described three-layered laminated film of oxidized Mo / Al / Mo is formed by a thin film forming means such as a sputtering apparatus, and a resist pattern is formed by the above-described photolithography method. . Thereafter, a pattern is formed through a metal etching and resist stripping process. The thickness of each layer can be, for example, 350 mm / 2000 mm / 350 mm in order from the lower layer, and pattern etching of these layers can be performed by wet etching using an etching solution containing phosphoric acid, nitric acid, and acetic acid.

The second connection portion 4 and the lead-out wiring 20 may be formed by patterning a metal thin film other than the above, such as Al-based, Ag-based, etc., by a photolithography / etching process, etc. It can be appropriately selected depending on the pattern accuracy, conductivity, size, etc. of the electrode plate.

Specifically, for the conductive material of the second connection portion 4 and the lead-out wiring 20, for example, a conductive powder such as a conductive paste in which conductive powder such as silver, copper, or carbon is dispersed in an organic binder to provide photosensitivity. A conductive conductive material can be preferably used. When the conductive material of the second connection portion 4 and the lead-out wiring 20 is a photosensitive conductive material, the reflectance of the second connection portion 4 and the lead-out wiring 20 can be easily controlled to 10% or less. It is preferably used because the problem can be easily avoided and the manufacturing cost can be suppressed. Because it is easier to absorb, scatter, and diffract light than metal films such as Mo, Al, Ag, Cu, and Pd obtained by sputtering by appropriately selecting the particle size of conductive powder such as silver, copper, and carbon. It is easy to control the reflectance to 10% or less. Furthermore, other known techniques for reducing the reflectance may be applied.

A photosensitive conductive material such as a conductive paste whose reflectance is controlled to 10% or less is formed by a printing method such as screen printing, and is finely patterned by a photolithographic method. When a connection part is formed simultaneously, the problem that the connection part formed under normal use conditions can be visually recognized can be solved. In the photolithographic method, after applying a photosensitive conductive material on a substrate, the exposed portion of the coating film is cured by photocrosslinking by irradiating ultraviolet light through a photomask corresponding to a desired extraction wiring, and a developer solution. This is a method for forming a lead-out wiring pattern by baking after removing the unexposed portion of the coating film. By using this photolithography method, it is possible to obtain a conductive pattern that is less expensive than the vapor deposition method and has a higher definition than the printing method formed by screen printing or gravure offset printing.

When the second connecting portion 4 and the lead-out wiring 20 are patterned on the transparent substrate 10 at an early stage, it has a sufficient light shielding property against transmitted light, so that it is easy to optically detect and recognize the pattern. It is. Therefore, the metal electrode pattern itself can be used as an index of alignment with respect to a layer on which a subsequent pattern is formed. In addition to the electrode pattern, an alignment mark can be provided independently in the same layer as the second connection portion 4 and the extraction wiring 20. Independently providing a mark for alignment can generally obtain higher accuracy in the alignment process of determining a position correction amount from pattern recognition and outputting a movement for position correction.

<Photosensitive conductive material>
As the photosensitive conductive material used in the second embodiment, a known material can be used as long as it can form the lead wiring 20 and the

connection portions

3 and 4, and is not particularly limited. For example, as the photosensitive conductive material described above, (R) silver powder, (I) a photopolymerization initiator, (J) a polymerizable polyfunctional monomer, (K) an alkali-soluble resin, and (Q) a radical scavenger (P) A photosensitive conductive material containing a solvent can be used, and other additives can be included as necessary.

The lead-out wiring 20 constituting the capacitive touch panel sensor substrate according to the second embodiment is subjected to a so-called photolithography process of exposure, development, and thermosetting after applying the photosensitive conductive material described above onto the transparent substrate 10. Formed by.
The average particle size of the (R) silver powder of the photosensitive conductive material used in the second embodiment is preferably 3 μm or less. Further, regarding the shape of (R) silver powder, there are, for example, flakes, needles, and spheres, but spherical silver powder is desirable from the viewpoint of screen printability and light scattering during exposure. The amount of (R) silver powder used is preferably 65 to 85% by weight, more preferably 70 to 80% by weight, based on the total solid content of the photosensitive conductive material.

Examples of the (I) photopolymerization initiator of the photosensitive conductive material used in the second embodiment include 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, 1- (4-isopropylphenyl). ) Acetophenones such as 2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one Compounds, benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldimethyl ketal, benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxyben Benzophenone compounds such as phenone, acrylated benzophenone, 4-benzoyl-4′-methyldiphenyl sulfide, 3,3 ′, 4,4′-tetra (t-butylperoxycarbonyl) benzophenone, thioxanthone, 2-chlorothioxanthone, Thioxanthone compounds such as 2-methylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, 2,4-diethylthioxanthone, 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis (trichloro Methyl) -s-triazine, 2- (p-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) -s- Triazine, 2-piphenyl-4,6-bis ( Lichloromethyl) -s-triazine, 2-piperonyl-4,6-bis (trichloromethyl) -s-triazine, 2,4-bis (trichloromethyl) -6-styryl-s-triazine, 2- (naphth-1- Yl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxy-naphth-1-yl) -4,6-bis (trichloromethyl) -s-triazine, 2,4-trichloro Triazine compounds such as methyl- (piperonyl) -6-triazine, 2,4-trichloromethyl (4′-methoxystyryl) -6-triazine, 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)], O- (acetyl) -N- (1-phenyl-2-oxo-2- (4′-methoxy-naphthyl) ethylidene) hydro Oxime ester compounds such as xylamine, phosphine compounds such as bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 9,10-phenanthrenequinone, camphor Quinone compounds such as quinone and ethyl anthraquinone, borate compounds, carbazole compounds, imidazole compounds, titanocene compounds and the like are used. These photopolymerization initiators can be used alone or in combination. (I) The amount of the photopolymerization initiator used is preferably 0.5 to 50% by weight, more preferably 1 to 20% by weight, based on the total solid content of the photosensitive conductive material.

Furthermore, as the sensitizer for (I) the photopolymerization initiator, the sensitizer described in the first embodiment can be used. Therefore, the description is omitted here.
As the (J) polymerizable polyfunctional monomer and oligomer of the photosensitive conductive material used in the second embodiment, it is possible to use the (J) polymerizable polyfunctional monomer and oligomer described in the first embodiment. it can. Therefore, the description is omitted here.

The (K) alkali-soluble resin of the photosensitive conductive material used in the second embodiment is the (K) alkali-soluble resin described in the first embodiment. Therefore, the description is omitted here.
As the (meth) acrylic copolymer resin of the photosensitive conductive material used in the second embodiment, the (meth) acrylic copolymer resin described in the first embodiment can be used. Therefore, the description is omitted here. As in the case of the first embodiment described above, compounds having an unsaturated bond such as styrene or cyclohexylmaleimide can be used as components other than the (meth) acrylic monomer.

As the epoxy resin used for the epoxy-modified acrylate resin, for example, a phenol novolak, a cresol novolak, or a resin having a bisphenol A or bisphenol F skeleton is used as in the case of the first embodiment.
The (Q) radical scavenger of the photosensitive conductive material used in the second embodiment has a function of deactivating active radicals. By adding to the photosensitive conductive material, (R) light from silver powder It becomes possible to suppress the curing reaction in the unexposed part caused by scattering, and the dimensional accuracy of the conductor pattern can be improved. (Q) As a kind of radical scavenger, (Q) radical scavenger demonstrated by the above-mentioned 1st embodiment can be used. Therefore, the description is omitted here.

As the (L) solvent of the photosensitive conductive material used in the second embodiment, the (L) solvent described in the first embodiment can be used. Therefore, the description is omitted here.
The photosensitive conductive material used in the second embodiment may contain carbon black in order to control the reflectance to 0% or more and 10% or less.

Carbon black may be a black pigment having a light shielding property. Examples of commercially available carbon black that can be used include # 260, # 25, # 30, # 32, # 33, # 40, # 44, # 45, # 45L, # 47, # 50 manufactured by Mitsubishi Chemical Corporation. , # 52, MA7, MA8, MA11, MA100, MA100R, MA100S, MA230, manufactured by DEGUSSA Printex L, Printex P, Printex 30, Printex 35, Printex 40, Printex 45, Printex 55, Printex 350, PrintPr , Special Black 4, Special Black 350, Special Black 550, and the like. Carbon black may be used individually by 1 type, or 2 or more types may be mixed and used for it.

Carbon black having a specific surface area of 50 to 200 m ² / g is used from the viewpoint of pattern shape. When carbon black with a specific surface area of less than 50 m ² / g is used, the pattern shape is deteriorated. When carbon black with a specific surface area of more than 200 m ² / g is used, the dispersant used in combination with carbon black is excessively adsorbed. Therefore, in order to express various physical properties, it is necessary to add a large amount of dispersant.

Carbon black preferably has a dibutyl phthalate (hereinafter referred to as “DBP”) oil absorption of 120 cc / 100 g or less from the viewpoint of sensitivity.
Further, the average primary particle diameter of carbon black is preferably 20 to 50 nm. The content of carbon black in the photosensitive conductive material is preferably 3 to 100% by weight, more preferably 5 to 50% by weight, based on the solid content of the conductive powder. When the content of carbon black is more than 100% by weight, it is difficult to obtain conductivity, and it may be difficult to form a connection part and a lead-out wiring.

In addition to the above-described components, a storage stabilizer can be contained in order to stabilize the viscosity with time of the photosensitive conductive material used in the second embodiment. As the storage stabilizer, the storage stabilizer described in the first embodiment can be used. Therefore, the description is omitted here.
The photosensitive conductive material used in the second embodiment can contain a surfactant. As the surfactant, the surfactant described in the first embodiment can be used. Therefore, the description is omitted here.

The photosensitive conductive material used in the second embodiment includes (R) silver powder, (I) a photopolymerization initiator, (J) a polymerizable polyfunctional monomer, (K) an alkali-soluble resin, and (Q). It can be obtained by blending a radical scavenger, (P) a solvent, a surfactant and the like with a predetermined composition, stirring with a stirrer, and kneading with a three-roll mill.

<The manufacturing method of the 2nd connection part 4 and the extraction wiring 20 using a photosensitive electrically-conductive material>
The manufacturing method of the 2nd connection part 4 and the extraction wiring 20 using the photosensitive electrically-conductive material in 2nd embodiment is the same as the manufacturing method demonstrated in the above-mentioned 1st embodiment. Therefore, the description is omitted here.

<Display device>
A display device according to the second embodiment is a display device having the above-described projected capacitive touch panel sensor substrate (not shown). Since this display device has the above-described projected capacitive touch panel sensor substrate, it is possible to provide a display device that can be manufactured at low cost and has excellent display quality.

<< Example 2.1 >>
Hereinafter, the second embodiment will be specifically described by way of examples. However, the present invention is not limited to the examples without departing from the spirit of the present invention.
Note that the notation “2.1” in the 2.1 example above means “the 1st example in the second embodiment”.

[Synthesis of alkali-soluble resin]
The method for synthesizing the alkali-soluble resin in the second embodiment is the same as the method of [Synthesis of alkali-soluble resin A] described in the first embodiment. Therefore, the description is omitted here.

[Preparation of carbon black dispersion]
Carbon black (Mitsubishi Chemical Co., Ltd. # 260, average particle size is 40 nm) and 0.5 part of the pigment derivative of the following formula 1 are uniformly mixed with 24 parts of the acrylic resin solution and 40 parts of cyclohexanone to obtain a diameter. A carbon black dispersion was prepared by dispersing for 5 hours in a sand mill using 1 mm glass beads. The carbon black dispersion obtained had a DBP oil absorption of 74 cc / 100 g and a specific surface area of 79 m ² / g.

[Adjustment of photosensitive conductive material 2.1.1]
A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and filtered through a 5 μm filter to prepare photosensitive conductive material 2.1.1. Note that the notation “photosensitive conductive material 2.1. ◯” described below means “photosensitive conductive material ○ in the first example of the second embodiment”. That is, “photosensitive conductive material 2.1.1” means “photosensitive conductive material 1 in the first example of the second embodiment”.

Silver powder (average particle size D50 1.5 μm) 130 parts carbon black dispersion 20 parts photopolymerization initiator Irgacure 379 (manufactured by BASF) 3 parts sensitizer DETX-S (manufactured by Nippon Kayaku Co., Ltd.) 2 parts polymerizable polyfunctional Monomer R-684 (manufactured by Nippon Kayaku Co., Ltd.) 16 parts alkali-soluble resin 38.78 parts radical scavenger methyl hydroquinone 0.02 parts organic solvent 1-methoxy-2-propyl acetate 8 parts surfactant Adecanate B-940 (ADEKA) 0.2 parts At this time, the ratio of the silver powder to the total solid content was 77.6% by weight, and the ratio of the radical scavenger to the total solid content was 0.012% by weight.

[Adjustment of photosensitive conductive material 2.1.2]
A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and filtered through a 5 μm filter to prepare photosensitive conductive material 2.1.2.
Silver powder (average particle size D50 1.5 μm) 130 parts carbon black dispersion 75 parts photopolymerization initiator Irgacure 379 (manufactured by BASF) 3 parts sensitizer DETX-S (manufactured by Nippon Kayaku Co., Ltd.) 2 parts polymerizable polyfunctional Monomer R-684 (manufactured by Nippon Kayaku Co., Ltd.) 16 parts alkali-soluble resin 38.78 parts radical scavenger TINUVIN 123 (manufactured by BASF) 0.02 parts organic solvent 1-methoxy-2-propyl acetate 8 parts surfactant Adecanate B -940 (manufactured by ADEKA) 0.2 parts At this time, the ratio of the silver powder to the total solid content was 72.0% by weight, and the ratio of the radical scavenger to the total solid content was 0.011% by weight.

[Adjustment of photosensitive conductive material 2.1.3]
A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and then filtered through a 5 μm filter to prepare photosensitive conductive material 2.1.3.
Silver powder (average particle size D50 1.5 μm) 130 parts photopolymerization initiator Irgacure 379 (manufactured by BASF) 3 parts sensitizer DETX-S (manufactured by Nippon Kayaku Co., Ltd.) 2 parts polymerizable polyfunctional monomer R-684 (Japan) 16 parts alkali-soluble resin (D-1) 38.8 parts organic solvent 1-methoxy-2-propyl acetate 8 parts Surfactant Adecanate B-940 (manufactured by ADEKA) 0.2 part At this time The ratio of the silver powder to the total solid content was 79.8% by weight.

<Production of capacitive touch panel sensor substrate>
(Example 2.1.1)
In addition, the notation “Example 2.1. ○” described below means “Example ○ in the first example of the second embodiment”. In addition, the notation “Comparative Example 2.1. ◯” means “Comparative Example ○ in the first example of the second embodiment”. That is, “Example 2.1.1” means “Example 1 in the first example of the second embodiment”. Similarly, “comparative example 2.1.1” means “comparative example 1 in the first example of the second embodiment”.

On the aluminosilicate glass, a film of Mo, Al, and Mo was formed by sputtering at a thickness of 350 mm / 2000 mm / 350 mm respectively, a novolac positive resist was spin-coated, dried on a hot plate, and coated Was dried. Then, after exposing through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the tetramethylammonium hydroxide aqueous solution. After washing with water, wet etching is performed using an etching solution mainly composed of phosphoric acid, nitric acid, and acetic acid. After removing the resist using a potassium hydroxide resist stripping solution, heat treatment is performed in an oven. The connection part 4 and the lead-out wiring 20 were prepared. The obtained second connection portion 4 was 8 μm wide × 200 μm long. The sheet resistance of the oxidized Mo / Al / Mo film was 0.2Ω / □.

Further, an acrylic negative resist was applied by spin coating, dried on a hot plate, and the coating film was dried. Then, after exposing through the photomask which has a desired opening using a high pressure mercury lamp as a light source, it developed with the sodium hydrogencarbonate aqueous solution. After washing with water, heat treatment was performed in an oven to form the protective layer 6 to obtain a capacitive touch panel sensor substrate. The protective layer 6 was formed so as to cover the entire region excluding the connection portion connected to the extraction wiring 20 and the control circuit of the touch panel sensor substrate.

(Example 2.1.2)
A capacitive touch panel sensor substrate was obtained in the same manner as in Example 2.1.1 except that the size of the second connection portion 4 was changed to 10 μm wide × 200 μm long.
(Example 2.1.3)
A capacitive touch panel sensor substrate was obtained in the same manner as in Example 2.1.1 except that the size of the second connection portion 4 was set to 15 μm wide × 200 μm long.

(Example 2.1.4)
On the aluminosilicate glass, the photosensitive conductive material 2.1.1 was applied by screen printing using a screen printing plate (material: stainless steel, manufactured by Tokyo Process Service Co., Ltd.) of mesh 500, and 100 ° C. on a hot plate. The film was dried for 5 minutes to dry the coating film. After that, exposure was performed through a photomask having a desired opening at 100 mJ / cm ² using a high-pressure mercury lamp as a light source, and then shower development was performed for 30 seconds with a 0.2 wt% aqueous sodium bicarbonate solution. did. After washing with water, heat treatment was performed at 230 ° C. for 30 minutes in a hot-air circulating oven to produce the second connection portion 4 and the extraction wiring 20. The obtained second connection portion 4 was 8 μm wide × 200 μm long. Other than that was carried out similarly to Example 2.1.1, and obtained the capacitive touch-panel sensor board | substrate. The sheet resistance of the photosensitive conductive material layer was 0.2Ω / □.

(Example 2.1.5)
A capacitive touch panel sensor substrate was obtained in the same manner as in Example 2.1.4 except that the size of the second connection portion 4 was set to 15 μm wide × 200 μm long.
(Example 2.1.6)
Example 2 except that photosensitive conductive material 2.1.2 was used instead of photosensitive conductive material 2.1.1, and the size of the second connecting portion 4 was 15 μm wide × 200 μm long. In the same manner as in 1.4, a capacitive touch panel sensor substrate was obtained.
(Comparative Example 2.1.1)
A capacitive touch panel sensor substrate was obtained in the same manner as in Example 2.1.4 except that Mo was used instead of oxidized Mo.

[Evaluation method of connection part]
<Measurement of reflectance>
The capacitive touch panel sensor substrate obtained in Examples 2.1.1 to 2.1.6 and Comparative Example 2.1.1 is the same method as the measurement method described in the first embodiment. Was used to evaluate. Therefore, the description is omitted here. The reflectance was measured using an ultraviolet-visible spectrophotometer (U-4100 manufactured by Hitachi High-Tech), and diffuse reflection measurement including specular reflection was performed from the surface of an anhydrous alkali glass substrate using an integrating sphere.

<Evaluation of connection pattern appearance>
The capacitive touch panel sensor substrate obtained in Examples 2.1.1 to 2.1.6 and Comparative Example 2.1.1 is the same method as the evaluation method described in the first embodiment. Was used to evaluate. Also, the evaluation criteria are the same as the evaluation criteria described in the first embodiment. Therefore, the description is omitted here.

<Sensitivity evaluation>
The capacitive touch panel sensor substrate obtained in Examples 2.1.1 to 2.1.6 and Comparative Example 2.1.1 is the same method as the evaluation method described in the first embodiment. Was used to evaluate. Also, the evaluation criteria are the same as the evaluation criteria described in the first embodiment. Therefore, the description is omitted here.
Table 5 shows the composition of the photosensitive conductive material, and Table 6 shows the evaluation results.

From the comparison between the above-described Examples 2.1.1, 2.1.2, and 2.1.3 and Comparative Example 2.1.1, the pattern appears on the capacitive touch panel having a reflectance of 10% or less. Is found to be good.
Moreover, although the above-mentioned Examples 2.1.4, 2.1.5, and 2.1.6 have usable sensitivity, the sensitivity is equal to or higher than that of the first embodiment. It is as follows. This is considered that the sensitivity was lowered because the carbon black content in the second embodiment was larger than the carbon black content in the first embodiment.

<< Third embodiment >>
The capacitive touch panel sensor substrate according to the third embodiment includes a transparent protective substrate and a transparent protective substrate among the capacitive touch panel sensor substrates described in the first embodiment and the second embodiment. A transparent protective substrate integrated capacitive touch panel sensor substrate using a cover glass. This transparent protective substrate integrated capacitive touch panel sensor substrate has a structure in which both a frame layer for decoration and a touch panel sensor are formed on a transparent protective substrate.

The decorative transparent protective substrate integrated touch panel sensor substrate according to the third embodiment (that is, the above-mentioned transparent protective substrate integrated electrostatic capacitance type touch panel sensor substrate) will be described in detail below based on one embodiment.
6A and 6B are schematic views showing a cross-sectional structure of a flat display device provided with an electronic input device having a touch panel function, and FIG. 6A is a combination of a transparent protective substrate and a touch panel formed separately in a later process. FIG. 6B shows an example in which the sensor layer of the touch panel is directly formed on the transparent protective substrate as an embodiment of the decorative transparent protective substrate integrated touch panel according to the third embodiment.

Generally, a touch panel type flat display device includes a display panel, a panel driving unit, a touch position detection unit, and the like. FIGS. 6A and 6B show examples of an active matrix type color liquid crystal display device as a display panel. An array substrate 130 in which active elements (thin film transistors, TFTs) are formed for each pixel on a glass substrate, and a color filter substrate 120 in which a color filter and a uniform transparent electrode are formed on a glass substrate as a counter substrate, The liquid crystal 150 is disposed so as to face each other. The decorative transparent protective substrate integrated touch panel according to the third embodiment is configured integrally with a transparent protective substrate arranged on the viewing side of the flat display device as shown in FIG. A sensor layer having a plurality of pixel portions and a signal line for sensing a touch position is provided on one surface facing the type display device.

FIG. 7 is a schematic view showing an embodiment of the decorative transparent protective substrate integrated touch panel according to the third embodiment in plan view. 8A and 8B are schematic views showing in cross section the configuration of one embodiment and another embodiment of the decorative transparent protective substrate integrated touch panel shown in FIG.

The decorative transparent protective substrate integrated touch panel 100 according to the third embodiment includes a frame portion 103 that divides a display area of a predetermined shape on one surface side of the transparent protective substrate 102. If necessary, a planarizing film 104 is provided on the transparent protective substrate 102 on which the frame portion 103 is formed. In the display area, a plurality of first translucent electrodes 105 arranged intermittently in the X-axis direction and the Y-axis direction orthogonal to the X-axis direction and the X-axis direction and the Y-axis direction, respectively, A plurality of transparent conductive film patterns arranged two-dimensionally are provided as a plurality of second light transmissive electrodes 106 disposed between rows and columns of the first light transmissive electrodes 105. Further, a jumper portion 107 for electrically connecting the transparent conductive film patterns of the sensor layer and an insulating film 108 for preventing an electrical short circuit between the transparent conductive film pattern layers in the jumper portion 107 are provided. Here, each of the first translucent electrodes 105 aligned in the X-axis direction passes through a through hole (not shown) of the insulating film 108 at the intersection of the first translucent electrode 105 and the second translucent electrode 106. The plurality of jumpers 107 made of conductive films arranged in the X-axis direction and the Y-axis direction are electrically connected to each other. In addition, a wiring portion 109 that leads the wiring from the end portion of the sensor layer onto the frame portion 103 and reaches the terminal portion 110 is provided. The wiring portion 109 detects an electric signal through the terminal portion 110 to detect an electric signal. Further, a protective film 111 that covers the frame portion 103 and the display area is provided on the entire upper surface of the display device. In particular, the jumper part 107 and the wiring part 109 are made of the same conductive film formed using a photosensitive resin composition containing metal particles.

In addition, the transparent protective substrate 102 of 3rd embodiment is corresponded when the cover glass is used in the transparent base material 10 of 1st, 2nd embodiment mentioned above. The first translucent electrode 105 corresponds to the first transparent electrode 1 of the first and second embodiments described above. The second translucent electrode 106 corresponds to the second transparent electrode 2 of the first and second embodiments described above. Further, the jumper portion 107 corresponds to the second connection portion 4 of the first and second embodiments described above. The insulating film 108 corresponds to the insulating layer 5 of the first and second embodiments described above. The wiring portion 109 corresponds to the extraction wiring 20 of the first and second embodiments described above.

The formation of the jumper portion 107 that electrically connects the transparent conductive film patterns of the sensor layer described above, and the formation of the wiring portion 109 that leads the wiring from the end portion of the sensor layer onto the frame portion 103 and reaches the terminal portion 110. The photosensitive resin composition containing metal particles is applied to the entire surface of the frame portion and the display area, and then exposed to ultraviolet rays through a photomask having the jumper portion 107 and the wiring portion as openings, and then developed. Thus, the jumper portion 107 and the wiring portion are collectively formed at a predetermined position at the same stage.

Below, the decorative transparent protection board integrated touch panel 100 which concerns on 3rd embodiment is demonstrated in detail along the manufacturing process in the one embodiment.
First, a frame portion 103 that divides a display area having a predetermined shape is formed on one surface side of a cover glass to be a transparent protective substrate 102.
The transparent protective substrate 102 is a transparent front plate that is the outermost surface of the touch panel sensor, and is a member that is touched by the user. As the transparent protective substrate 102, a substrate having a transmittance of 80% or more with respect to visible light can be used, and a substrate having a transmittance of 95% or more can be preferably used. The transparent protective substrate 102 may be generally used for a liquid crystal display device. For example, an inorganic transparent substrate such as glass or a transparent resin substrate such as polycarbonate, polymethyl methacrylate, polyethylene terephthalate, and cyclic olefin copolymer can be used. . A capacitive type is recommended for the touch panel function of the decorative transparent protective substrate integrated touch panel 100 according to the third embodiment. There is no risk of distortion due to external force unlike the conventional touch screen system, and the material and thickness of the transparent protective substrate 102 can be appropriately selected according to the specifications of the display panel to be applied. However, considering the heat resistance in the process, the glass substrate is optimal. It is. The cover glass is usually produced by strengthening soda lime glass, and it is recommended to use glass having a strengthening depth of 10 μm to 50 μm, preferably 20 μm to 30 μm.

The frame portion 103 is a rectangular annular light-shielding layer formed on the peripheral edge on one surface side of the cover glass using a light-shielding material, and partitions a display area of a predetermined shape such as a rectangle in the central window portion. And it plays the role which hides the wiring part 109 provided in the peripheral part of a touch panel sensor. The frame portion 103 is formed using a negative photosensitive colored resin composition or ink and is generally black.

The photosensitive colored resin composition applied to the frame portion 103 is, for example, a colorant is dispersed in a resin binder using a dispersant, and a monomer, a photopolymerization initiator, a sensitizer, a solvent, or the like is added to the dispersion. Prepared. The colorant is for coloring the frame portion 103 into a desired color. Although pigments and dyes can be used, it is desirable to use pigments because of their excellent durability. The pigment may be either an organic pigment or an inorganic pigment, and the amount of the pigment is not particularly limited. The frame portion 103 can be formed from a cured product of the photosensitive colored resin composition in a predetermined pattern using a photosensitive colored resin composition by a known photolithography method. First, for example, a photosensitive colored resin composition is applied and dried on a transparent protective substrate 102 using a coater, and pre-baked to form a photosensitive colored resin layer. Next, using a mask having a predetermined pattern, the photosensitive colored resin layer is subjected to proximity exposure using an ultra-high pressure mercury lamp lamp or the like to transfer the mask pattern. Next, the frame portion 103 may be formed by developing with a developing solution such as an aqueous sodium carbonate solution, thoroughly washing with water after development, and further drying and heating to cure. The frame portion 103 may be formed on the transparent protective substrate 102 by screen printing using ink as a light shielding material.

Next, if necessary, a planarization film 104 is formed on the transparent protective substrate 102 on which the frame portion 103 has been formed as described above. The planarizing film 104 planarizes the frame portion 103 and the display area, and improves the electrical insulation of the frame portion 103 where the wiring portion 109 is formed. In particular, when the frame portion 103 is printed with ink, there is an effect of preventing the wiring from being damaged by the surface unevenness of the frame portion 103. Further, the planarization film 104 has a role of sealing out-gassing from the colored resin layer of the frame portion 103 in the sensor layer forming process described later.

The flattened film 104 has, for example, smoothness and toughness, transparency, high heat resistance and light resistance, no deterioration such as yellowing and whitening over a long period of time, water resistance, solvent resistance It is required to have excellent properties, acid resistance and alkali resistance. Examples of the material of the planarizing film 104 include thermosetting or radiation curable acrylate resins, methacrylate resins, epoxy resins, urethane resins, and polyimide resins. These resin compositions are applied on the transparent protective substrate 102 on which the frame portion 103 has been formed to a thickness of 2 to 20 μm, preferably 5 to 10 μm, and then cured by baking or ultraviolet irradiation. A planarizing film 104 is formed.

Hereinafter, a case where the frame portion 103 and the planarizing film 104 are formed on the transparent protective substrate 102 will be described.
After the frame portion 103 and the planarization film 104 are formed on the transparent protective substrate 102, a capacitive touch panel sensor layer is formed on the transparent protective substrate 102. The basic configuration of the sensor layer may be a sensor electrode (for example, the first translucent electrode 105 and the second translucent electrode 106) + insulating film 108 + jumper 107 + protective film 111 from the transparent protective substrate 102 side ( 8A and B), or jumper portion 107 + insulating film 108 + sensor electrode (for example, first light transmitting electrode 105 and second light transmitting electrode 106) + protective film 111 (see FIGS. 9A and 9B). The sensor layer according to the third embodiment can be applied to any of the configurations described above. Here, the jumper portion 107 and the wiring portion 109 will be described with a processing method in which the same photosensitive resin composition containing metal particles is used to form the jumper portion 107 and the wiring portion 109 in the known photolithography method.

As described above, in the third embodiment, the jumper portion 107 that electrically connects the transparent conductive film patterns of the sensor layer is formed, and the wiring is led from the end portion of the sensor electrode to the frame portion 103 to be a terminal. The formation of the conductive film of the wiring part 109 reaching the part means that a photosensitive resin composition containing metal particles is applied to the entire surface of the frame part 103 and the display area, and then the jumper part 107 and the wiring part are used as openings. It is performed at the same stage as patterning and forming the jumper portion 107 and the wiring portion 109 at a predetermined position by exposing with ultraviolet rays through a mask and then developing.

Here, the jumper units 107 are arranged in a matrix in the X-axis direction and the Y-axis direction in the display area. Each of the jumper portions 107 is for connecting the first translucent electrodes 105 aligned in the X-axis direction in the X-axis direction, and a pair of second transparent electrodes whose both ends are adjacent in the X-axis direction. It is formed at a predetermined position with a position and size so as to overlap each of the photoelectrodes 106. Usually, the position of the jumper unit 107 is often designed to overlap with the BM (black matrix) of the liquid crystal display panel to be finally integrated. Further, the wiring part 109 is arranged and formed at a position on the frame part 103 that is not visually recognized.

The photosensitive resin composition containing metal particles is prepared by dispersing metal particles in a resin binder and adding, for example, a monomer, a photopolymerization initiator, a sensitizer, and a solvent to the dispersion. The metal particles used are selected from, for example, gold (Au), silver (Ag), platinum (Pt), iridium (Ir), rhodium (Rh), copper (Cu), nickel (Ni), aluminum (Al), and carbon. It is preferable that the particle size is 1 μm or more and 4 μm or less. In consideration of resolvable patterning accuracy using a photosensitive resin composition containing metal particles, the minimum line width of metal wiring used in a normal mobile display device or the like is about 15 μm. It is preferable that it is 4 micrometers or less. In addition, the resolution of patterning is improved by making the particle size of the metal particles fine, but if the particle size is too fine, physical contact between the metal particles becomes difficult and the conductivity decreases, so the particle size of the metal particles must be 1 μm or more. It is.

The reflectivity of the conductive film formed using the photosensitive resin composition containing metal particles as the jumper part 107 and the wiring part 109 is preferably 20% or less, and the photosensitive resin containing metal particles The conductive film formed using the composition preferably has a surface resistance value of 1Ω / □ or less. In order to realize the above characteristics, the content of the metal particles in the photosensitive resin composition is preferably 20 to 60% by mass, and the film thickness of the cured conductive film is preferably in the range of 3 to 5 μm. As the photosensitive resin composition containing metal particles, a commercially available product can be used.

Next, patterning may be performed by a known photolithography method so that the insulating film 108 has a predetermined pattern on the jumper portion 107 and the wiring portion 109. A photosensitive resin suitable for use in forming the insulating film 108 is a transparent resin having a transmittance of preferably 80% or more, more preferably 95% or more in the entire wavelength region of 400 to 700 nm in the visible light region. This transparent resin includes a thermoplastic resin, a thermosetting resin, and a photosensitive resin. If necessary, the transparent resin can be used alone or in admixture of two or more monomers or oligomers that are precursors thereof that are cured by irradiation with radiation to produce a transparent resin. As the photosensitive resin composition for forming the insulating film 108, a commercially available product can be used, and a preferable film thickness range is 1.3 to 2.0 μm.

The insulating film 108 is formed by laminating a light-transmitting insulating material so as to cover the jumper portion 107 formed on the planarizing film 104 and the wiring portion 109 on the frame. In addition, when the first translucent electrode 105 and the second translucent electrode 106 are collectively formed, only the first translucent electrode 105 is jumpered through a through hole or the like provided in the insulating film 108. The second translucent electrode 106 is patterned so as not to come into contact with the jumper portion 107 with the insulating film 108 interposed therebetween. Further, patterning is performed so that the first light-transmissive electrode 105 and the second light-transmissive electrode 106 are in contact with the previously formed wiring portion 109 even in a portion where the wiring is drawn from the sensor layer at the panel end.

The capacitive touch panel includes a plurality of first translucent electrodes 105 arranged intermittently in the same layer in the X-axis direction and the Y-axis direction orthogonal thereto, and the X-axis direction and the Y-axis direction. And a plurality of second translucent electrodes 106 arranged between the rows and the columns of the first translucent electrodes 105. First, using a light-transmitting conductive material of a composite oxide of metal oxides such as indium, tin, gallium, and zinc such as ITO, in the same process using a vacuum film formation method such as vapor deposition, ion plating, and sputtering. A transparent conductive film is formed on the entire upper surface of the transparent protective substrate 102 formed up to the insulating film 108. Thereafter, the transparent conductive film is patterned by a known method to form a first translucent electrode 105 and a second translucent electrode 106 having a predetermined shape. At this time, as described above, the panel end portions of the first light-transmissive electrode 105 and the second light-transmissive electrode 106 are connected to the detector for detecting the electrical signal that has been previously created. It will be in contact with the connected wiring.

The surface of the sensor layer produced as described above is provided with a protective film 111 formed of a photosensitive resin. As the protective film 111, the same material as that of the insulating film 108 described above can be used. As a method for forming the protective film 111 formed of the above-described photosensitive resin on the surface of the sensor layer of the touch panel, a slit and spin method or the like is usually used, but it is uniform on the transparent protective substrate 102 on which the sensor layer is formed. The method is not limited to these as long as it is a method capable of coating with a small film thickness. Exposure is performed on the substrate on which the photosensitive composition is applied to form a transparent resin layer. A normal high-pressure mercury lamp or the like may be used as the light source. Moreover, you may post-bake as needed.

As described above, the decorative transparent protective substrate integrated touch panel 100 according to the third embodiment shown in FIGS. 9A and 9B is obtained. As a modification, the first light-transmitting electrode 105 and the second light-transmitting electrode 106 can be formed first, and the step of forming the jumper portion 107 and the wiring portion 109 can be performed later. In other words, after forming the frame portion 103 (the planarization film 104 if necessary) on the transparent protective substrate 102, first, the first light-transmissive electrode 105 and the second light-transmissive electrode 106 are formed. . Thereafter, an insulating film 108 is formed. Then, after the insulating film 108 is formed, the jumper portion 107 and the wiring portion 109 can be formed. If it is this modification, the decorative transparent protective substrate integrated touch panel shown in FIGS. 8A and 8B can be obtained. In any case, since the jumper portion 107 and the wiring portion 109 can be manufactured using the same material and in the same process step, not a vacuum process, the jumper portion 107 and the wiring portion 109 can be manufactured in a short process with an inexpensive manufacturing facility. There is a configuration that leads to reduction of defects in the process and enables cost reduction.

The decorative transparent protective substrate integrated touch panel 100 according to the third embodiment is arranged on the viewing side of the flat display device, and is on one surface side of the transparent protective substrate (front plate) 102 facing the flat display device. It is applied with a sensor electrode. As the flat display device, for example, a color liquid crystal display device can be cited, and the counter substrate is uniform with a plurality of colored pixels such as red (R), green (G), and blue (B) defined by a black matrix. As a display panel is assembled by sandwiching the liquid crystal between the color filter substrate on which a transparent electrode is formed and the necessary alignment treatment is performed and the array substrate on which the TFT is formed, and a polarizing plate, a drive electrode, and a backlight Combine with etc.

An array substrate of a liquid crystal display device, which is a flat display device provided with a decorative transparent protective substrate integrated touch panel 100, has a gate line and a gate electrode made of metal such as molybdenum, tungsten, or an alloy thereof on a transparent substrate. A gate insulating film made of silicon oxide, silicon nitride or the like is disposed so as to cover them. A semiconductor layer such as amorphous silicon is disposed on the gate insulating film, and further, a source line, a source electrode, and a drain electrode made of molybdenum or aluminum are disposed to form a switching element. A protective layer made of silicon oxide, silicon nitride, or the like is disposed on the switching element. The switching element is wired so that it can be driven by an operation of the decorative transparent protective substrate integrated touch panel 100 disposed on the front surface side (viewing side).

As described above, a display panel that has a pixel area in which a plurality of pixels are arranged in a matrix and forms an image in the above-described pixel area based on an input signal, and is attached so as to cover the pixel area A flat display device including the decorative transparent protective substrate integrated touch panel 100 is obtained.

DESCRIPTION OF SYMBOLS 1 ... 1st transparent electrode 2 ... 2nd transparent electrode 3 ... 1st connection part 4 ... 2nd connection part 5 ... Insulating layer 6 ... Protective film 10 ... Transparent base material 20 ... Extraction wiring 30 ... Cover glass 40 ... Touch panel sensor 100 ... Decorative transparent protective substrate integrated touch panel 102 ... Transparent protective substrate 103 ... Frame portion 104 ... Flattening film 105 ... First translucent electrode 106 ... Second translucent electrode 107 ... Jumper portion 108 ... Insulating film 109 ... Wiring part 110 ... Terminal part 111 ... Protective film 112 ... Cover glass (front plate)
120 ... Color filter substrate 130 ... Array substrate 140 ... Polarizing plate 150 ... Liquid crystal

Claims

(A) 1st transparent electrode, (B) 2nd transparent electrode, (C) 1st connection part which connects said (A) 1st transparent electrodes, (D) Said (B) A second connecting portion for connecting the second transparent electrodes; and (E) an insulating layer formed at a portion where the (C) first connecting portion and the (D) second connecting portion intersect. (F) Capacitance type formed on a transparent substrate comprising (A) the first transparent electrode and (B) a lead-out wiring connected to the second transparent electrode. A method of manufacturing a touch panel sensor substrate,
The (C) first connection portion is formed by using the same transparent conductive material as that of the (A) first transparent electrode and the (B) second transparent electrode, Forming the electrode and the (B) second transparent electrode at the same time;
(E) forming an insulating layer;
(D) forming the second connection part simultaneously with the (F) extraction wiring using a conductive material,
After performing one step of the step of forming the (C) first connection portion or the step of forming the (D) second connection portion, the step of forming the (E) insulating layer is performed,
After the step of forming the (E) insulating layer, the other step of the step of forming the (C) first connection portion or the step of forming the (D) second connection portion is performed,
The method of manufacturing a capacitive touch panel sensor substrate, wherein the reflectance of the (D) second connection portion and the (F) extraction wiring is in the range of 0% to 30%.
2. The method of manufacturing a capacitive touch panel sensor substrate according to claim 1, wherein the conductor width of the (D) second connection portion is in a range of 3 μm to 20 μm.
3. The method of manufacturing a capacitive touch panel sensor substrate according to claim 1, wherein the conductive material is a photosensitive conductive material.
The photosensitive conductive material contains (G) a black material, (H) metal particles, (I) a photopolymerization initiator, (J) a polymerizable polyfunctional monomer, and (K) a resin. 4. A method for producing a capacitive touch panel sensor substrate according to 3.
5. The capacitive touch panel sensor substrate according to claim 4, wherein the (G) black material is any one of a black pigment, a pseudo black mixture of two or more pigments, a black dye, and a metal compound. Production method.
The method for manufacturing a capacitive touch panel sensor substrate according to claim 4, wherein the (G) black material is carbon black having an average particle diameter in a range of 10 nm to 500 nm.
The (H) metal particles are selected from gold (Au), silver (Ag), platinum (Pt), copper (Cu), palladium (Pd), iridium (Ir), rhodium (Rh), and aluminum (Al). One or more types of metals are contained, The manufacturing method of the capacitive touch-panel sensor board | substrate as described in any one of Claims 4-6 characterized by the above-mentioned.
8. The capacitance type touch panel sensor substrate according to claim 4, wherein a particle diameter of the (H) metal particles is in a range of 0.1 μm to 4 μm. 9. Production method.
The capacitive touch panel sensor substrate according to any one of claims 4 to 8, wherein the (I) photopolymerization initiator contains one or more O-acyloxime compounds. Production method.
7. The capacitive touch panel sensor substrate according to claim 6, wherein a content of the carbon black is in a range of 1 wt% to 100 wt% with respect to a weight of the (H) metal particles. Manufacturing method.
11. The conductive material of the (D) second connection portion and the (F) lead-out wiring is formed by a printing method and finely patterned by a photolithographic method. The manufacturing method of the capacitive touch-panel sensor board | substrate as described in any one.
A capacitive touch panel sensor substrate manufactured by the method for manufacturing a capacitive touch panel sensor substrate according to any one of claims 1 to 11.
(A) 1st transparent electrode, (B) 2nd transparent electrode, (C) 1st connection part which connects said (A) 1st transparent electrodes, (D) Said (B) A second connecting portion for connecting the second transparent electrodes; and (E) an insulating layer formed at a portion where the (C) first connecting portion and the (D) second connecting portion intersect. (F) Capacitance type formed on a transparent substrate comprising (A) the first transparent electrode and (B) a lead-out wiring connected to the second transparent electrode. A touch panel sensor substrate,
The (C) first connection part is formed using the same transparent conductive material as the material of the (A) first transparent electrode and the (B) second transparent electrode,
The (D) second connection portion is formed of the same material as the extraction wiring (F) using a conductive material,
The capacitance type touch panel sensor substrate, wherein the reflectance of the (D) second connection portion and the (F) extraction wiring is in the range of 0% to 30%.
14. The capacitive touch panel sensor substrate according to claim 13, wherein the conductor width of the (D) second connection portion is in a range of 3 μm to 20 μm.
The capacitive touch panel sensor substrate according to claim 13 or 14, wherein the conductive material is a photosensitive conductive material.
The photosensitive conductive material contains (G) black material, (H) metal particles, (I) a photopolymerization initiator, (J) a polymerizable polyfunctional monomer, and (K) a resin. 15. The capacitive touch panel sensor substrate according to 15.
The capacitive touch panel sensor substrate according to claim 16, wherein the (G) black material is one of a black pigment, a pseudo black mixture of two or more pigments, a black dye, and a metal compound.
The capacitive touch panel sensor substrate according to claim 16, wherein the (G) black material is carbon black having an average particle diameter in a range of 10 nm to 500 nm.
The (H) metal particles are selected from gold (Au), silver (Ag), platinum (Pt), copper (Cu), palladium (Pd), iridium (Ir), rhodium (Rh), and aluminum (Al). The capacitive touch panel sensor substrate according to any one of claims 16 to 18, comprising at least one metal.
The capacitance type touch panel sensor substrate according to any one of claims 16 to 19, wherein a particle diameter of the (H) metal particles is in a range of 0.1 µm to 4 µm.
21. The capacitive touch panel sensor substrate according to any one of claims 16 to 20, wherein the (I) photopolymerization initiator contains one or more O-acyloxime compounds.
19. The capacitive touch panel sensor substrate according to claim 18, wherein a content of the carbon black is in a range of 1 wt% to 100 wt% with respect to a weight of the (H) metal particles. .
The capacitive touch panel sensor substrate according to any one of claims 12 to 22, wherein the transparent substrate is the same as a cover glass.
A display device comprising the capacitive touch panel sensor substrate according to any one of claims 12 to 23.