TW201543977A - Method of forming silver-containing conductive pattern - Google Patents
Method of forming silver-containing conductive pattern Download PDFInfo
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- TW201543977A TW201543977A TW103116259A TW103116259A TW201543977A TW 201543977 A TW201543977 A TW 201543977A TW 103116259 A TW103116259 A TW 103116259A TW 103116259 A TW103116259 A TW 103116259A TW 201543977 A TW201543977 A TW 201543977A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
- C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
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Abstract
Description
本發明是有關於一種形成導線的方法,且特別是有關於一種形成含銀之導電圖案層的方法。 This invention relates to a method of forming a wire, and more particularly to a method of forming a silver-containing conductive pattern layer.
觸控面板(touch screen)是一種允許使用者藉由觸碰螢幕而對元件施予控制的裝置;由於它提供了有效、自然、活潑的人機互動界面,目前已在許多電子產品中獲得廣泛應用。 A touch screen is a device that allows a user to control a component by touching the screen; since it provides an effective, natural, and lively human-computer interaction interface, it has been widely used in many electronic products. application.
圖1是一種習知的觸控面板的上視圖。參考圖1,觸控面板10包括基底110,其可區分為顯示區112和周邊區114。多個感應電極E配置在顯示區112中,且相鄰的感應電極E之間透過縱向或橫向的橋接線C電性連接。配置在周邊區114的走線130把各個由感應電極E和橋接線C構成的串列連接到連接部130a,以和外部電路(未繪示)電性連接。其中,橋接線C可以由微細金屬導線製成;感應電極E的材料在一些案例中可能是銦錫氧化物(ITO),或者,如圖1的局部放大圖所示,也可以由微細金屬導線M(例如銅導線或銀導線)構成。 FIG. 1 is a top view of a conventional touch panel. Referring to FIG. 1, the touch panel 10 includes a substrate 110 that can be divided into a display area 112 and a peripheral area 114. A plurality of sensing electrodes E are disposed in the display region 112, and adjacent sensing electrodes E are electrically connected through the longitudinal or lateral bridge wires C. The traces 130 disposed in the peripheral region 114 connect the series of the sensing electrodes E and the bridge wires C to the connecting portion 130a to be electrically connected to an external circuit (not shown). Wherein, the bridge wire C may be made of a fine metal wire; the material of the sensing electrode E may be indium tin oxide (ITO) in some cases, or, as shown in a partial enlarged view of FIG. 1, or may be made of a fine metal wire. M (for example, a copper wire or a silver wire).
使用微細金屬導線需克服的問題在於,由於金屬材料本身的高反射性質,即使金屬導線的寬度下降到數十微米等級,仍可能被使用者察 覺。因此,已有研究者對降低金屬導線可視度的方法進行研究。例如,參照圖2和圖3,這些圖式繪示了已知的兩種降低金屬導線可視度的技術。圖2所示的技術是先在基底400上形成金屬導線402,再在金屬導線402的表面形成低反射層404;圖3所示的技術則是先在覆蓋板500上形成低反射層504,再在低反射層504上形成金屬導線502,兩者的精神均在於在金屬導線和觀察者的位置之間置入一層低反射層,使金屬導線比較難以察覺。然而,這些技術有步驟繁瑣、膜層的尺寸控制不易等問題。 The problem to be overcome with the use of fine metal wires is that, due to the highly reflective nature of the metal material itself, even if the width of the metal wire drops to the tens of microns, it may be observed by the user. feel. Therefore, researchers have studied methods for reducing the visibility of metal wires. For example, referring to Figures 2 and 3, these figures illustrate two known techniques for reducing the visibility of metal wires. The technique shown in FIG. 2 is to first form a metal wire 402 on the substrate 400, and then form a low-reflection layer 404 on the surface of the metal wire 402. The technique shown in FIG. 3 first forms a low-reflection layer 504 on the cover plate 500. A metal wire 502 is then formed on the low reflective layer 504, both of which are characterized by the placement of a low reflective layer between the metal wire and the observer's position, making the metal wire less noticeable. However, these techniques have problems such as cumbersome steps and difficulty in controlling the size of the film layer.
本發明提供一種形成含銀之導電圖案層的方法,可以降低含銀之導電圖案層的可視度。 The present invention provides a method of forming a silver-containing conductive pattern layer, which can reduce the visibility of a silver-containing conductive pattern layer.
本發明的形成含銀之導電圖案層的方法包括以下步驟。將感光性組合物塗布在基底上。使該基底上的該感光性組合物進行UV光硬化,以形成含銀之導電圖案層。其中,該感光性組合物包括溶劑、光起始劑、含氟有機銀絡合物、低反射率材料和光可聚合單體及/或其寡聚物。 The method of forming a silver-containing conductive pattern layer of the present invention comprises the following steps. The photosensitive composition is coated on a substrate. The photosensitive composition on the substrate is subjected to UV light curing to form a silver-containing conductive pattern layer. Among them, the photosensitive composition includes a solvent, a photoinitiator, a fluorine-containing organic silver complex, a low reflectance material, and a photopolymerizable monomer and/or an oligomer thereof.
在一種實施方式中,以該感光性組合物的總固含量計,該含氟有機銀絡合物佔50~90重量%。 In one embodiment, the fluorine-containing organic silver complex accounts for 50 to 90% by weight based on the total solid content of the photosensitive composition.
在一種實施方式中,該含氟有機銀絡合物是三氟乙酸銀、1,1,1-三氟-2,4-戊二酮銀或其組合。 In one embodiment, the fluorine-containing organic silver complex is silver trifluoroacetate, silver 1,1,1-trifluoro-2,4-pentanedione, or a combination thereof.
在一種實施方式中,該低反射率材料為對可見光的反射率在80%以下的材料。 In one embodiment, the low reflectivity material is a material having a reflectance to visible light of less than 80%.
在一種實施方式中,該低反射率材料包括碳黑;鉻、鈦或鋯的 單氮化物或單氧化物;或前述材料的組合。 In one embodiment, the low reflectivity material comprises carbon black; chromium, titanium or zirconium Mononitride or monooxide; or a combination of the foregoing.
在一種實施方式中,該低反射率材料包括偶氮染料、蒽醌染料、酞菁染料、醌亞胺染料、喹啉染料、硝基染料、羰基染料、次甲基染料或其組合。 In one embodiment, the low reflectivity material comprises an azo dye, an anthraquinone dye, a phthalocyanine dye, a quinone imine dye, a quinoline dye, a nitro dye, a carbonyl dye, a methine dye, or a combination thereof.
在一種實施方式中,將該感光性組合物塗布在基底上的方法為噴墨印刷、膠印、轉印或網版印刷。 In one embodiment, the method of applying the photosensitive composition to a substrate is inkjet printing, offset printing, transfer printing or screen printing.
在一種實施方式中,該基底上的該感光性組合物的厚度介於0.1到5μm之間,線寬介於0.5到50μm之間。 In one embodiment, the photosensitive composition on the substrate has a thickness of between 0.1 and 5 [mu]m and a line width of between 0.5 and 50 [mu]m.
本發明的觸控顯示裝置的製造方法包括以前述方法形成含銀之導電圖案層。 A method of manufacturing a touch display device of the present invention includes forming a silver-containing conductive pattern layer by the aforementioned method.
本發明的觸控顯示裝置由前述觸控顯示裝置的製造方法製成。 The touch display device of the present invention is fabricated by the method of manufacturing the touch display device.
基於上述,本發明的技術方案可以透過簡單的程序製作出可視度低的銀導線(即含銀之導電圖案層),使觸控面板具有更好的表現能力。 Based on the above, the technical solution of the present invention can produce a silver wire with low visibility (ie, a conductive pattern layer containing silver) through a simple program, so that the touch panel has better performance.
為讓本發明的上述特徵和優點能更明顯易懂,下文特以示範性實施方式作詳細說明如下。 The above described features and advantages of the present invention will be more apparent from the following description.
10‧‧‧觸控面板 10‧‧‧Touch panel
100、110、400‧‧‧基底 100, 110, 400‧‧‧ base
112‧‧‧顯示區 112‧‧‧ display area
114‧‧‧周邊區 114‧‧‧The surrounding area
130‧‧‧走線 130‧‧‧Wiring
130a‧‧‧連接部 130a‧‧‧Connecting Department
200‧‧‧感光性組合物 200‧‧‧Photosensitive composition
300‧‧‧導電圖案層 300‧‧‧conductive pattern layer
302‧‧‧金屬銀 302‧‧‧Metal silver
304‧‧‧低反射材料 304‧‧‧Low reflective material
306‧‧‧其他成分 306‧‧‧Other ingredients
402、502‧‧‧金屬導線 402, 502‧‧‧Metal wire
404、504‧‧‧低反射層 404, 504‧‧‧ low reflection layer
500‧‧‧覆蓋板 500‧‧‧covering board
C‧‧‧橋接線 C‧‧‧Bridge wiring
E‧‧‧感應電極 E‧‧‧Induction electrode
M‧‧‧微細金屬導線 M‧‧‧Micro metal wire
圖1是一種習知的觸控面板的上視圖。 FIG. 1 is a top view of a conventional touch panel.
圖2和圖3呈現習知的兩種金屬導線和低反射層結合的態樣。 Figures 2 and 3 show the combination of two conventional metal wires and a low reflection layer.
圖4是根據本發明的第一實施方式所繪示的形成含銀之導電圖案層的流程。 4 is a flow chart of forming a silver-containing conductive pattern layer according to a first embodiment of the present invention.
在本文中,由「一數值至另一數值」表示的範圍,是一種避免在說明書中一一列舉該範圍中的所有數值的概要性表示方式。因此,記載了某一特定數值範圍,等同於揭露了該數值範圍內的任意數值以及由該數值範圍內的任意數值界定出的較小數值範圍,如同在說明書中明文寫出該任意數值和該較小數值範圍一樣。例如,記載「尺寸為10到100μm」的範圍,就等同於揭露了「尺寸為20μm到50μm」的範圍,無論說明書中是否列舉其他數值。 In the present specification, the range represented by "a value to another value" is a schematic representation that avoids enumerating all the values in the range in the specification. Therefore, a particular numerical range is recited and is equivalent to the disclosure of any numerical value in the range of the value and the numerical range defined by any value in the numerical range, as the The smaller value range is the same. For example, the description of the "size of 10 to 100 μm" is equivalent to the disclosure of the "size of 20 μm to 50 μm" regardless of whether other values are listed in the specification.
根據本發明的一種實施方式,圖4呈現了形成含銀之導電圖案層的流程。參考圖4,在本實施方式中,首先是將感光性組合物200塗布在基底100上。 In accordance with an embodiment of the present invention, FIG. 4 presents a flow of forming a silver-containing conductive pattern layer. Referring to FIG. 4, in the present embodiment, first, the photosensitive composition 200 is coated on the substrate 100.
感光性組合物200是可以透過照射UV光而硬化(cure)的組合物;且較佳是其內含成分得以藉由UV光的照射轉變為金屬銀的組合物。就此而言,感光性組合物200包括溶劑、光起始劑、含氟有機銀絡合物、低反射率材料和光可聚合單體及/或其寡聚物。以下將對這些成分分別進行說明。 The photosensitive composition 200 is a composition which can be cured by irradiation with UV light; and is preferably a composition in which the contained component is converted into metallic silver by irradiation of UV light. In this regard, the photosensitive composition 200 includes a solvent, a photoinitiator, a fluorine-containing organic silver complex, a low reflectance material, and a photopolymerizable monomer and/or an oligomer thereof. These components will be described separately below.
〈溶劑〉 Solvent
溶劑不受特別限制,其可以是本發明所屬技術領域中所知的任意一種適於分散或溶解感光性組合物200的各種成分的溶劑,如甲乙酮(methylethylketone)、丙酮、環己酮、乙腈、乙酸乙酯、氯仿、甲醇、乙醇、正丙醇、異丙醇、二丙酮醇(diacetone alcohol)、3-甲氧基丙醇(3-methoxy propanol)、甲苯(toluene)、二甲苯、四甲基苯、乳酸乙酯(ethyl lactate)、甲基溶纖素(methylcellosolve)、乙基溶纖素 (ethylcellosolve)、丙基溶纖素(propylcellosolve)、乙二醇二甲醚(ethylene glycol dimethylether)、乙二醇二乙醚(ethylene glycol diethylether)、乙二醇甲乙醚(ethylene glycol methylethylether)、丙二醇二甲醚(propylene glycol dimethylether)、丙二醇二乙醚(propylglycol diethylether)、丙二醇甲乙醚(propylene glycol methylethylether)、2-乙氧基丙醇(2-ethoxypropanol)、2-甲氧基丙醇(2-methoxypropanol)、3-甲氧基丁醇(3-methoxybutanol)、環戊酮(cyclopentanone)、環己酮(cyclohexanone)、丙二醇甲醚醋酸酯(propyleneglycol methylether acetate,PGMEA)、丙二醇乙醚醋酸酯(propyleneglycol ethylether acetate)、3-甲氧基丁基乙酸酯(3-methoxybutyl acetate)、3-乙氧基丙酸乙酯(ethoxyethylpropionate,EEP)、乙基3-乙氧基丙酸酯(ethyl 3-ethoxy propionate)、乙基溶纖素醋酸酯(ethyl cellosolve acetate)、甲基溶纖素醋酸酯(methyl cellosolve acetate)、乙酸丁酯(butyl acetate)或二丙二醇單甲醚(dipropylene glycol monomethylether)。可以單獨使用一種溶劑,或組合使用兩種以上的溶劑。 The solvent is not particularly limited, and may be any solvent known in the art to which the composition of the photosensitive composition 200 is dispersed or dissolved, such as methylethylketone, acetone, cyclohexanone, acetonitrile, Ethyl acetate, chloroform, methanol, ethanol, n-propanol, isopropanol, diacetone alcohol, 3-methoxy propanol, toluene, xylene, tetramethyl Base benzene, ethyl lactate, methylcellosolve, ethyl cellosolve (ethylcellosolve), propylcellosolve, ethylene glycol dimethylether, ethylene glycol diethylether, ethylene glycol methylethylether, propylene glycol Propylene glycol dimethylether, propylglycol diethylether, propylene glycol methylethylether, 2-ethoxypropanol, 2-methoxypropanol, 3-methoxybutanol, cyclopentanone, cyclohexanone, propyleneglycol methylether acetate (PGMEA), propylene glycol ethyl ether acetate, 3-methoxybutyl acetate, ethoxyethylpropionate (EEP), ethyl 3-ethoxy propionate, Ethyl cellosolve acetate, methyl cellosolve acetate, butyl acetate or dipropylene glycol monomethyl ether (d Ipropylene glycol monomethylether). One solvent may be used alone or two or more solvents may be used in combination.
〈光起始劑〉 <Photoinitiator>
光起始劑不受特別限制,只要具有起始光可聚合單體及/或其寡聚合之聚合的能力即可,其實例包括:Ciba公司的產品Darocur 1173(2-hydroxy-2-methyl-1-phenyl-propan-1-one,2-羥基-2-甲基-1-苯基-1-丙酮);BASF公司的產品Irgacure 184(1-hydroxy-cyclohexyl-phenyl-ketone,1-羥基環己基苯基甲酮)、Irgacure 369(2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone,2-芐基-2-二甲基氨基-1-(4-嗎啉苯基)丁酮)、Irgacure 651(2,2-dimethoxy-1,2-diphenylethan-1-one,安息香雙甲醚)、Irgacure 2959(1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1- propane-1-one,2-羥基-4'-(2-羥乙氧基)-2-甲基苯丙酮)、Irgacure 819(phenyl bis(2,4,6-trimethylbenzoyl)phosphine oxide,苯基雙(2,4,6-三甲基苯甲醯基)氧化膦)、Irgacure 1700(25%的雙(2,6-二甲氧基苯甲醯基)(2,4,4-三甲基戊基)氧化膦及75%的2-羥基-2-甲基-1-苯基-1-丙酮的混合物;Mixture of 25% bis(2,6-dimethoxybenzoyl)-(2,4,4-trimethyl pentyl)phosphineoxide and 75% 2-hydroxy-2-methyl-1-phenyl-propan-1-one)、Irgacure TPO(diphenyl(2,4,6-trimethylbenzoyl)-phosphineoxide,(2,4,6-三甲基苯甲醯基)二苯基氧化膦)。可以單獨使用一種光起始劑,或將兩種以上光起始劑混合使用。 The photoinitiator is not particularly limited as long as it has the ability to initiate polymerization of the photopolymerizable monomer and/or its oligomeric polymerization, and examples thereof include: Ciba's product Darocur 1173 (2-hydroxy-2-methyl-) 1-phenyl-propan-1-one, 2-hydroxy-2-methyl-1-phenyl-1-propanone); product of Irfaacure 184 (1-hydroxy-cyclohexyl-phenyl-ketone, 1-hydroxyl ring) Benzyl phenyl ketone), Irgacure 369 (2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-benzyl-2-dimethylamino-1-(4-morpholinylbenzene Butanone), Irgacure 651 (2,2-dimethoxy-1,2-diphenylethan-1-one, benzoin dimethyl ether), Irgacure 2959 (1-[4-(2-hydroxyethoxy)-phenyl]-2- Hydroxy-2-methyl-1- Propane-1-one, 2-hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone), Irgacure 819 (phenyl bis(2,4,6-trimethylbenzoyl)phosphine oxide, phenyl double (2,4,6-trimethylbenzimidyl)phosphine oxide), Irgacure 1700 (25% bis(2,6-dimethoxybenzylidene) (2,4,4-trimethyl) Mixture of pentylphosphine oxide and 75% 2-hydroxy-2-methyl-1-phenyl-1-propanone; Mixture of 25% bis(2,6-dimethoxybenzoyl)-(2,4,4-trimethyl Pentyl)phosphineoxide and 75% 2-hydroxy-2-methyl-1-phenyl-propan-1-one), Irgacure TPO (diphenyl(2,4,6-trimethylbenzoyl)-phosphineoxide, (2,4,6-trimethyl) Benzobenzino)diphenylphosphine oxide). A photoinitiator may be used alone or in combination of two or more photoinitiators.
〈含氟有機銀絡合物〉 <Fluorine-containing organic silver complex>
含氟有機銀絡合物是可溶於前述溶劑,且在UV光的照射下,其銀離子會還原成金屬銀的有機絡合物;其種類例如含氟乙酸銀絡合物(silver fluorinated-acetate type)、含氟磺酸銀絡合物(silver fluorinated-sulfonate type)、含氟的β-羰基酮銀絡合物(fluoro beta(β)-carbonylketone type silver(I)complex)、含氟的β-羰基酯銀絡合物(fluoro beta(β)-carbonylester type silver(I)complex)或前述絡合物的組合。其具體實例包括但不限於:三氟乙酸銀、1,5-環辛二烯-六氟乙醯丙酮銀(1,5-cyclooctadien-hexafluoroacetylacetonato silver(I)complex)、1,1,1-三氟-2,4-戊二酮銀(1,1,1-trifluoro-2,4-pentanedionatosilver(I)complex)、5,5-二甲基-1,1,1-三氟-2,4-己二酮銀(5,5-dimethyl-1,1,1-trifluoro-2,4-hexanedionatosilver(I)complex)、1-(4-甲氧基苯基)-4,4,4-三氟丁二酮銀(1-(4-methoxyphenyl)-4,4,4-trifluoro butanedionatosilver(I)complex)、5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,12-十七氟癸烷-2,4-二酮銀(5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,12-heptadecafluorodecane-2,4- dionatosilver(I)complex)、1,1,1,2,2,3,3-七氟-7,7-二甲基-4,6-辛二酮銀(1,1,1,2,2,3,3-heptafluoro-7,7-dimethyl-4,6-octanedionatosilver(I)complex)、1,1,1,3,5,5,5-七氟戊烷-2,4-二酮銀(1,1,1,3,5,5,5-heptafluoropentane-2,4-dionatosilver(I)complex)、1,1,1,5,5,5-六氟戊烷-2,4-二酮銀(1,1,1,5,5,5-hexafluoropentane-2,4-dionatosilver(I)complex)、5,5,6,6,7,7,8,8,8-九氟辛烷-2,4-二酮銀(5,5,6,6,7,7,8,8,8-nonafluorooctane-2,4-dionatosilver(I)complex)、5H,5H-全氟壬烷-二酮銀(5H,5H-perfluorononane-4,6-dionatosilver(I)complex)、8H,8H-全氟十五烷-7,8-二酮銀(8H,8H-perfluoropentadecane-7,8-dionatosilver(I)complex)、6H,6H-全氟十一烷-5,7-二酮銀(6H,6H-perfluoroundecane-5,7-dionatosilver(I)complex)、1-苯基-2H,2H-全氟己烷-1,3-二酮銀(1-phenyl-2H,2H-perfluorohexane-1,3-dionatosilver(I)complex)、1-苯基-2H,2H-全氟十一烷-1,3-二酮銀(1-phenyl-2H,2H-perfluoroundecane-1,3-dionatosilver(I)complex)、5,6,6,6-四氟-5-(七氟丙氧基)己烷-2,4-二酮銀(5,6,6,6-tetrafluoro-5-(heptafluoropropoxy)hexane-2,4-dionatosilver(I)complex)、1,1,5,5-四氟戊烷-2,4二酮銀(1,1,5,5-tetrafluoropentane-2,4-dionatosilver(I)complex)、5,5,6,6,7,7,8,8,9,9,9-十一氟-壬烷-2,4-二酮銀(5,5,6,6,7,7,8,8,9,9,9-undecafluorononane-2,4-dionatosilver(I)complex)、乙基3-氯-4,4,4-三氟乙醯乙酸銀(ethyl 3-chloro-4,4,4-trifluoroacetoacetatosilver(I)complex)、乙基-4,4-二氟乙醯乙酸銀(ethyl-4,4-difluoroacetoacetatosilver(I)complex)、乙基-4,4,4-三氟乙醯乙酸銀(ethyl-4,4,4-trifluoroacetoacetatosilver(I)complex)、異丙基-4,4,4-三氟乙醯乙酸銀(isopropyl-4,4,4-trifluoroacetoacetatosilver(I)complex)、甲基-4,4,5,5,5-五氟-3-氧代戊酸甲酯銀(methyl-4,4,5,5,5-pentafluoro-3- oxopentanonatosilver(I)complex)、乙基-4,4,5,5,5-五氟-3-氧代戊酸甲酯銀(ethyl-4,4,5,5,5-pentafluoro-3-oxo-pentanonatosilver(I)complex)和1,1,1,5,5,6,6,6-八氟-2,4-己二酮銀(1,1,1,5,5,6,6,6-octafluoro-2,4-hexanedionatosilver(I)complex)。較佳地,含氟有機銀絡合物是三氟乙酸銀、1,1,1-三氟-2,4-戊二酮銀或其組合。 The fluorine-containing organic silver complex is an organic complex which is soluble in the aforementioned solvent and whose silver ions are reduced to metallic silver under irradiation of UV light; and the kind thereof is, for example, silver fluorinated-silver fluorinated- Acetate type), silver fluorinated-sulfonate type, fluorine-containing β-carbonylketone type silver(I) complex, fluorine-containing A fluoro beta (β)-carbonylester type silver (I) complex or a combination of the foregoing complexes. Specific examples thereof include, but are not limited to, silver trifluoroacetate, 1,5-cyclooctadien-hexafluoroacetylacetonato silver (I) complex, 1,1,1-three. Fluorinated silver, 1,1,1-trifluoro-2,4-pentanedionatosilver (I) complex, 5,5-dimethyl-1,1,1-trifluoro-2,4 -5,5-dimethyl-1,1,1-trifluoro-2,4-hexanedionatosilver (I) complex, 1-(4-methoxyphenyl)-4,4,4-tri 1-(4-methoxyphenyl)-4,4,4-trifluoro butanedionatosilver (I) complex), 5,5,6,6,7,7,8,8,9,9,10, 10,11,11,12,12,12-heptadecafluorononane-2,4-dione silver (5,5,6,6,7,7,8,8,9,9,10,10, 11,11,12,12,12-heptadecafluorodecane-2,4- Dionatosilver (I) complex), 1,1,1,2,2,3,3-heptafluoro-7,7-dimethyl-4,6-octanedione silver (1,1,1,2,2 ,3,3-heptafluoro-7,7-dimethyl-4,6-octanedionatosilver (I) complex), 1,1,1,3,5,5,5-heptafluoropentane-2,4-dione silver (1,1,1,3,5,5,5-heptafluoropentane-2,4-dionatosilver(I)complex), 1,1,1,5,5,5-hexafluoropentane-2,4-di Ketone silver (1,1,1,5,5,5-hexafluoropentane-2,4-dionatosilver(I) complex), 5,5,6,6,7,7,8,8,8-nonafluorooctane -2,4-dione silver (5,5,6,6,7,7,8,8,8-nonafluorooctane-2,4-dionatosilver (I) complex), 5H, 5H-perfluorodecane-two Ketone silver (5H, 5H-perfluorononane-4, 6-dionatosilver (I) complex), 8H, 8H-perfluoropentadecane-7,8-dione silver (8H, 8H-perfluoropentadecane-7, 8-dionatosilver ( I) complex), 6H, 6H-perfluoroundecane-5,7-dione silver (6H, 6H-perfluoroundecane-5, 7-dionatosilver (I) complex), 1-phenyl-2H, 2H-all Fluorine-1,3-dione silver (1-phenyl-2H, 2H-perfluorohexane-1,3-dionatosilver (I) complex), 1-phenyl-2H, 2H-perfluoroundecane-1, 3-Dimethyl ketone (1-phenyl-2H, 2H-perfluoroundecane-1,3-dionatosilver (I) complex), 5,6,6,6-tetrafluoro-5-(heptafluoropropoxy)hexane- 2,4-two Silver (5,6,6,6-tetrafluoro-5-(heptafluoropropoxy)hexane-2,4-dionatosilver(I) complex), 1,1,5,5-tetrafluoropentane-2,4-dione silver ( 1,1,5,5-tetrafluoropentane-2,4-dionatosilver(I)complex), 5,5,6,6,7,7,8,8,9,9,9-undefluoro-decane- Silver 2,4-dione (5,5,6,6,7,7,8,8,9,9,9-undecafluorononane-2,4-dionatosilver(I) complex), ethyl 3-chloro-4 , 4,4-trifluoroacetate silver (ethyl 3-chloro-4,4,4-trifluoroacetoacetatosilver (I) complex), ethyl-4,4-difluoroacetic acid silver (ethyl-4,4- Difluoroacetoacetatosilver (I) complex), ethyl-4,4,4-trifluoroacetate (I) complex, isopropyl-4,4,4-trifluoro Acetylacetate (isopropyl-4,4,4-trifluoroacetoacetatosilver (I) complex), methyl-4,4,5,5,5-pentafluoro-3-oxopentanoate methyl silver (methyl-4, 4,5,5,5-pentafluoro-3- Oxopentanonatosilver (I) complex), ethyl-4,4,5,5,5-pentafluoro-3-oxopentanoate methyl silver (ethyl-4,4,5,5,5-pentafluoro-3-oxo -pentanonatosilver(I)complex) and silver 1,1,1,5,5,6,6,6-octafluoro-2,4-hexanedione (1,1,1,5,5,6,6, 6-octafluoro-2, 4-hexanedionatosilver (I) complex). Preferably, the fluorine-containing organic silver complex is silver trifluoroacetate, silver 1,1,1-trifluoro-2,4-pentanedione or a combination thereof.
含氟有機銀絡合物在感光性組合物200中的含量原則上沒有特別限制,例如,以感光性組合物的總固含量計,含氟有機銀絡合物可佔1重量%到90重量%,較佳是50重量%到90重量%。 The content of the fluorine-containing organic silver complex in the photosensitive composition 200 is not particularly limited in principle, and for example, the fluorine-containing organic silver complex may account for 1% by weight to 90% by weight based on the total solid content of the photosensitive composition. %, preferably from 50% by weight to 90% by weight.
〈低反射率材料〉 <Low reflectivity material>
本文所謂「低」反射率材料,指對可見光的反射率在80%以下的材料,其可以是無機或有機材料,例如碳黑;鉻、鈦或鋯的單氮化物或單氧化物;偶氮染料;蒽醌染料;酞菁染料;醌亞胺染料;喹啉染料;硝基染料;羰基染料;次甲基染料或其組合。 The term "low" reflectance material as used herein refers to a material having a reflectance of visible light of less than 80%, which may be an inorganic or organic material such as carbon black; a single nitride or a mono-oxide of chromium, titanium or zirconium; azo Dye; anthraquinone dye; phthalocyanine dye; quinone imine dye; quinoline dye; nitro dye; carbonyl dye; methine dye or a combination thereof.
〈光可聚合單體及/或其寡聚物〉 <Photopolymerizable monomer and/or its oligomer>
光可聚合單體及/或其寡聚物可以是會受光起始劑的催化而開始進行聚合反應的單體及/或寡聚物,其材料可以是本發明所屬技術領域中所知的光可聚合單體及/或其寡聚物,所述光可聚合單體如單官能、雙官能、三官能、四官能或六官能化合物。單官能化合物如丙烯酸異莰酯(Isobornylacrylate,IBOA,如Sartomer的SR506D)、辛基/癸基丙烯酸酯(Octyl decyl acrylate,ODA,如Sartomer的SR484)、丙烯酸己內酯(Caprolactone acrylatem如Sartomer的SR495)或丙烯酸十二烷酯(Lauryl acrylate,如Sartomer的SR335)。雙官能化合物如三丙二醇二丙烯酸酯(Tripropylene glycol diacrylate,TPGDA,如AKZO Nobel Resins的Actilane 424)、1,6-己二醇二丙烯酸酯(1,6-hexanediol diacrylate, HDDA,如AKZO Nobel Resins的Actilane 425)、二丙二醇二丙烯酸酯(Dipropylene glycol diacrylate,DPGDA,如Sartomer的SR508)、丙氧化(2)新戊二醇二丙烯酸酯(Propoxylated(2)neopentyl glycol diacrylate,PONPGDA,如Sartomer的SR9003)、三環癸烷二甲醇二丙烯酸酯(Tricyclodecanedimethanol diacrylate,TCDDMDA,如Sartomer的SR833S)或聚乙二醇(400)二丙烯酸酯(Polyethylene glycol 400 diacrylate,PEG400DA,如Sartomer的SR344)。三官能化合物如三羥甲基丙烷三丙烯酸酯(trimethylol propane triacrylate,TMPTA,如AKZO Nobel Resins的Actilane 431)、乙氧化(3)三羥甲基丙烷三丙烯酸酯(ethoxylated(3)trimethylol propane triacrylate,如Sartomer的SR454)或乙氧化(6)三羥甲基丙烷三丙烯酸酯(ethoxylated(6)trimethylol propane triacrylate,如Sartomer的SR499)。四官能化合物,如四官能基聚酯丙烯酸酯低聚物(tetrafunctional polyester acrylate oligomer,如AKZO Nobel Resins的Actilane 505)、乙氧化季戊四醇四丙烯酸酯(ethoxylated pentaerythritol tetraacrylate,PPTTA,如AKZO Nobel Resins的Actilane 440)或雙-三羥甲基丙烷四丙烯酸酯(ditrimethylolpropane tetraacrylate,di TMPTA,如AKZO Nobel Resins的Actilane 44)。六官能化合物如二季戊四醇六丙烯酸酯(dipentaerythritol hexaacrylate,DPHA,如AKZO Nobel Resins的Actilane 450)。 The photopolymerizable monomer and/or its oligomer may be a monomer and/or oligomer which initiates polymerization by catalysis by a photoinitiator, and the material may be light known in the art to which the present invention pertains. Polymerizable monomers and/or oligomers thereof, such as monofunctional, difunctional, trifunctional, tetrafunctional or hexafunctional compounds. Monofunctional compounds such as Isobornylacrylate (IBOA, such as SR506D from Sartomer), Octyl decyl acrylate (ODA, such as Sartomer's SR484), Caprolactone acrylatem (Sartomer's SR495) ) or Lauryl acrylate (such as Sartomer's SR335). Bifunctional compounds such as Tripropylene glycol diacrylate (TPGDA, such as Actilane 424 from AKZO Nobel Resins), 1,6-hexanediol diacrylate (1,6-hexanediol diacrylate, HDDA, such as Actilane 425 of AKZO Nobel Resins, Dipropylene glycol diacrylate (DPGDA, such as SR508 from Sartomer), Propoxylated (2) neopentyl glycol diacrylate, PONPGDA, such as Sartomer's SR9003), Tricyclodecanedimethanol diacrylate (TCDDMDA, such as Sartomer's SR833S) or polyethylene glycol (400) diacrylate (Polyethylene glycol 400 diacrylate, PEG400DA, such as Sartomer's) SR344). Trifunctional compounds such as trimethylol propane triacrylate (TMPTA, such as Actilane 431 of AKZO Nobel Resins), ethoxylated (3) trimethylol propane triacrylate, Such as Sartomer's SR454) or ethoxylated (6) trimethylol propane triacrylate (such as Sartomer's SR499). Tetrafunctional compounds such as tetrafunctional polyester acrylate oligomer (Actilane 505 of AKZO Nobel Resins), ethoxylated pentaerythritol tetraacrylate (PPTTA, Actilane 440 such as AKZO Nobel Resins) Or ditrimethylolpropane tetraacrylate (di TMPTA, such as Actilane 44 from AKZO Nobel Resins). A hexafunctional compound such as dipentaerythritol hexaacrylate (DPHA, such as Actilane 450 from AKZO Nobel Resins).
除了前揭段落描述的各種成分之外,感光性組合物200還可能包括其他成分,例如密著助劑(adhesive promoter)等。 In addition to the various ingredients described in the preceding paragraphs, the photosensitive composition 200 may also include other ingredients such as adhesive promoters and the like.
前述感光性組合物200中各種成分的比例,原則上沒有特別限制,在配製感光性組合物200時,可視各種因素來調整其相對比例,如:溶劑對各成分的分散溶解能力、光起始劑促使光可聚合單體及/或其寡聚物 進行聚合反應的能力、UV光硬化產物對基底100的附著力和光硬化產物的導電性質之間的權衡等等。 The ratio of the various components in the photosensitive composition 200 is not particularly limited in principle. When the photosensitive composition 200 is prepared, the relative proportion can be adjusted depending on various factors, such as the solvent dispersing ability of each component, and the light initiation. Agent promotes photopolymerizable monomers and/or their oligomers The tradeoff between the ability to carry out the polymerization reaction, the adhesion of the UV photohardenable product to the substrate 100, and the conductive properties of the photohardenable product, and the like.
基底100的材料不受特別限制。以製造觸控顯示裝置為例,可以是適於該應用的任意透明材料,如玻璃或塑膠材料;其中塑膠材料又可列舉聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)、聚萘二甲酸乙二醇酯(polyethylene naphthalate,PEN)和聚碳酸酯(polycarbonate)等實例。此外,基底100可以是硬質基底,也可以具有可撓性。 The material of the substrate 100 is not particularly limited. For example, the manufacturing of the touch display device may be any transparent material suitable for the application, such as glass or plastic materials; and the plastic material may also be a polyethylene terephthalate (PET) or a polyphthalate. Examples of polyethylene naphthalate (PEN) and polycarbonate (polycarbonate). Further, the substrate 100 may be a rigid substrate or may have flexibility.
在本實施方式中,將感光性組合物200塗布在基底100上的方法沒有特別限制,以圖4所示的態樣而言,可利用噴墨印刷、膠印、轉印或網版印刷等方法,在基底100上形成圖案化的感光性組合物200。在此類實施方式中,由於無須使感光性組合物200進行顯影製程,因此,感光性組合物200中可以不含有鹼可溶樹脂。 In the present embodiment, the method of applying the photosensitive composition 200 on the substrate 100 is not particularly limited, and in the aspect shown in FIG. 4, inkjet printing, offset printing, transfer printing or screen printing may be used. A patterned photosensitive composition 200 is formed on the substrate 100. In such an embodiment, since the photosensitive composition 200 is not required to be subjected to a developing process, the photosensitive composition 200 may not contain an alkali-soluble resin.
塗布之後,感光性組合物200的厚度介於0.1μm到5μm之間;其線寬則介於0.5μm到50μm之間。 After coating, the photosensitive composition 200 has a thickness of between 0.1 μm and 5 μm; and a line width of between 0.5 μm and 50 μm.
如圖4所示,在塗布感光性組合物200後,透過照射UV光使感光性組合物200轉變成導電圖案層300;其中,導電圖案層300包括金屬銀302、低反射材料304和其他成分306。 As shown in FIG. 4, after the photosensitive composition 200 is applied, the photosensitive composition 200 is converted into a conductive pattern layer 300 by irradiating UV light; wherein the conductive pattern layer 300 includes metallic silver 302, a low reflective material 304, and other components. 306.
導電圖案層300的厚度在0.1μm到2μm之間,其寬度在0.5μm到50μm之間。 The conductive pattern layer 300 has a thickness of between 0.1 μm and 2 μm and a width of between 0.5 μm and 50 μm.
在感光性組合物200受UV光照時,其所含的光可聚合單體及/或其寡聚物在光起始劑的作用下進行聚合反應,形成導電圖案層300的聚合物基質(為其他成分306的全部或一部分),其所需的UV照射能量密度可為1500~10000J/cm2。此外,進行UV光硬化之前,也可以對感光性組合物200進行烘烤。 When the photosensitive composition 200 is exposed to UV light, the photopolymerizable monomer and/or its oligomer are polymerized by a photoinitiator to form a polymer matrix of the conductive pattern layer 300 (for All or a portion of the other components 306 may have a UV irradiation energy density of 1500 to 10000 J/cm 2 . Further, the photosensitive composition 200 may be baked before UV light curing.
金屬銀302是感光性組合物200中的含氟有機銀絡合物經UV光照射的產物,其散布於聚合物基質中,為導電圖案層300提供導電能力。如果含氟有機銀絡合物在感光性組合物200中的含量夠高,那麼,在UV光硬化步驟之後,導電圖案層300的導電率可以滿足觸控顯示裝置對微細金屬導線的要求,無須再額外進行其他金屬沈積步驟(例如無電鍍製程)。就此方面而言,含氟有機銀絡合物的含量,以感光性組合物200的總固含量計,應大於50重量%,例如是50重量%到90重量%。 The metallic silver 302 is a product of the fluorine-containing organic silver complex in the photosensitive composition 200 irradiated with UV light, which is dispersed in the polymer matrix to provide electrical conductivity to the conductive pattern layer 300. If the content of the fluorine-containing organic silver complex in the photosensitive composition 200 is sufficiently high, after the UV light curing step, the conductivity of the conductive pattern layer 300 can satisfy the requirements of the touch display device for the fine metal wire, without Additional metal deposition steps (such as electroless plating) are performed. In this regard, the content of the fluorine-containing organic silver complex should be more than 50% by weight, for example, 50% by weight to 90% by weight based on the total solid content of the photosensitive composition 200.
至於低反射材料304,則是0030段記載的該些低反射材料中的一種。它能夠降低最後得到的金屬銀302的可視程度,藉此,本實施方式的形成含銀之導電圖案層的方法適用於觸控顯示裝置的製作,可以提高觸控顯示裝置的顯示品質。基於此理由,本發明也涉及一種觸控顯示裝置的製造方法以及由該方法獲得的觸控顯示裝置。 As for the low-reflection material 304, it is one of the low-reflection materials described in paragraph 0030. The method for forming the silver-containing conductive pattern layer of the present embodiment is suitable for the production of the touch display device, and the display quality of the touch display device can be improved. For this reason, the present invention also relates to a method of manufacturing a touch display device and a touch display device obtained by the method.
本發明提供的觸控顯示裝置的製造方法的特徵在於,使用了第一實施方式中的形成含銀之導電圖案層的方法,至於其他步驟、材料則可以由已知的技術中任意選擇。舉例來說,觸控顯示裝置的製造方法可包括在透明基底上形成導線、在覆蓋板上形成導線(此二步驟中至少一者使用了第一實施方式的方法),以及藉由絕緣黏著層接合覆蓋板和透明基底的步驟。 The method for manufacturing a touch display device according to the present invention is characterized in that the method of forming a silver-containing conductive pattern layer in the first embodiment is used, and other steps and materials can be arbitrarily selected from known techniques. For example, the manufacturing method of the touch display device may include forming a wire on the transparent substrate, forming a wire on the cover plate (at least one of the two steps uses the method of the first embodiment), and insulating the adhesive layer The step of joining the cover sheet and the transparent substrate.
雖然已以示範性實施方式對本發明作說明如上,然而,其並非用以限定本發明。任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍的前提內,當可作些許的更動與潤飾。故本申請案的保護範圍當以後附的申請專利範圍所界定者為準。 While the present invention has been described above by way of exemplary embodiments, it is not intended to limit the invention. Any changes and modifications may be made without departing from the spirit and scope of the invention. Therefore, the scope of protection of this application is subject to the definition of the scope of the patent application attached.
100‧‧‧基底 100‧‧‧Base
200‧‧‧感光性組合物 200‧‧‧Photosensitive composition
300‧‧‧導電圖案層 300‧‧‧conductive pattern layer
302‧‧‧金屬銀 302‧‧‧Metal silver
304‧‧‧低反射材料 304‧‧‧Low reflective material
306‧‧‧其他成分 306‧‧‧Other ingredients
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