JP2016095615A - Touch sensor substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent electrode signal extraction wiring from breaking at a process of production of a touch sensor, the electrode signal extraction wiring configured to connect electrode wiring of the touch sensor substrate used in the process of production of the touch sensor to an external connection terminal.SOLUTION: A touch sensor substrate is used at a process of production of a touch sensor. The touch sensor substrate includes: an intersection part where X-direction electrode wiring and Y-direction electrode wiring are insulated and intersect; and electrode signal extraction wiring configured to connect the X-direction electrode wiring and the Y-direction electrode wiring to an external connection terminal. The electrode signal extraction wiring includes a bundle of plural element wires.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a touch sensor substrate that is processed during the manufacturing process of a capacitive touch panel used as coordinate input means.

  2. Description of the Related Art In recent years, touch panel type input devices (hereinafter referred to as touch sensors or simply referred to as sensors) have been adopted for operation units of various electronic devices such as mobile phones, personal digital assistants, and car navigation systems. The touch sensor is used as an input device that detects a contact position of a fingertip or a pen tip on a display surface of a display panel such as a liquid crystal display device or an organic EL device. There are various types of touch sensors such as a resistance film type and a capacitance type depending on the structure and detection method.

  There are two types of capacitive touch sensors: surface type and projection type. Both methods detect the position by capturing the change in capacitance between the fingertip and the conductive film. Since electrostatic coupling occurs only when the finger approaches the sensor surface, it is also possible to display a cursor immediately before contact. What is pressed against the sensor surface needs to be a finger or a material having electrostatic conductivity equivalent to that of the finger, but the alternating current that flows in accordance with the change in capacitance does not depend on the impedance of the contact medium.

  In particular, the projection-type capacitance method has a configuration in which a transparent substrate on which an electrode layer and a control IC are mounted is covered with a protective insulating resin, as in Patent Document 1. The electrode layer is composed of an X-direction electrode wiring group and a Y-direction electrode wiring group having a mesh structure of fine metal wires on a transparent substrate such as glass or plastic.

  Further, in Patent Document 2, stripe-shaped metal wiring that extends in only one direction and stripe-shaped metal wiring that is insulated from the metal wiring and extends in the vertical direction are laid on a transparent substrate.

  In the touch sensor, when the operator's finger touches or approaches the intersection of the X-direction electrode wiring and the Y-direction electrode wiring of the touch sensor, capacitive coupling occurs between the environment ground medium and the electrode wiring through the finger. . The touch position of the finger is detected by detecting a set of electrode rows that are affected by the change.

  Specifically, the method of detecting the electrode wiring touched by the finger is connected to each X-direction electrode wiring and Y-direction electrode wiring from an external connection terminal connected to the end of the electrode signal extraction wiring. Observe electrical signals by drawing current. Then, the X-direction electrode wiring and the Y-direction electrode wiring at the position touched by the finger are detected by detecting the external connection terminal whose electric signal has changed.

JP 2014-88771 A JP 9-51186 A

However, in the process of manufacturing the touch sensor, static electricity is easily generated on the substrate by transporting the substrate for the touch sensor or performing a protective process on the film surface of the substrate. When the generated static electricity contacts the ground outside the substrate, a large discharge current flows from the wiring of the touch sensor to the ground outside the substrate. In particular, when the electrode signal extraction wiring of the touch sensor is in contact with the ground outside the substrate, there is a problem that the electrode signal extraction wiring easily breaks due to a large discharge current flowing through the electrode signal extraction wiring.

  The object of the present invention is to solve the above problems, and to obtain a touch sensor substrate in which the electrode signal extraction wiring of the touch sensor is not disconnected as a whole even if electrostatic discharge current occurs in the manufacturing process of the touch sensor substrate. This is the issue.

  In order to solve the above-mentioned problem, the present invention is a touch sensor substrate used in the manufacturing process of a touch sensor, and includes an intersection where the X-direction electrode wiring and the Y-direction electrode wiring intersect and are insulated, An electrode signal extraction wiring for connecting the X direction electrode wiring and the Y direction electrode wiring to an external connection terminal is provided, and the electrode signal extraction wiring is constituted by a bundle of a plurality of element wirings. A substrate for a touch sensor.

  In the present invention, since the electrode signal extraction wiring is composed of a bundle of a plurality of element wirings, one of the plurality of element wirings of the electrode signal extraction wiring is disconnected due to electrostatic discharge in the manufacturing process of the touch sensor. However, some other element wirings constituting the electrode signal extraction wiring remain without being disconnected. Therefore, even if a static discharge current flows in the manufacturing process, there is an effect that the electrical connection of the electrode signal extraction wiring can be secured.

  Further, the present invention is the touch sensor substrate described above, comprising a ladder stage wiring that connects the element wirings of the electrode signal extraction wirings at positions where the lengths of the element wirings are divided at a plurality of locations. It is the board | substrate for touch sensors characterized.

  Further, the present invention is the touch sensor substrate, wherein the X-direction electrode wiring and the Y-direction electrode wiring are composed of a connection pattern of a mesh-like pattern of fine metal wires formed on one side of the transparent substrate, The touch sensor substrate is characterized in that the intersection is formed by insulating the X-direction electrode wiring and the Y-direction electrode wiring with an insulating resin layer.

  Further, the present invention is the touch sensor substrate as described above, wherein the X-direction electrode wiring is formed of a striped pattern or a mesh-shaped pattern of fine metal wires formed on one surface of a transparent substrate, and the Y-direction electrode The X-direction electrode wiring and the Y-direction electrode wiring, wherein the X-direction electrode wiring and the Y-direction electrode wiring are formed of a stripe pattern or a mesh-shaped pattern of fine metal wires formed on the other surface of the transparent substrate. It is a substrate for touch sensors, characterized in that it is formed by crossing in a grid pattern.

  The present invention is the touch sensor substrate, wherein the element wiring has a line width of 3 μm or more, and a gap between the element wirings is 20 μm or more.

  Further, the present invention is the touch sensor substrate, wherein the line width of the external connection terminal is 20 μm or more and 500 μm or less, and the line width of the element wiring is 20 minutes of the line width of the external connection terminal. It is a substrate for a touch sensor, characterized in that it is 1 to 1/5.

  According to another aspect of the present invention, there is provided the touch sensor substrate, wherein the electrode signal extraction wiring is formed of a bundle of three or more and five or less element wirings.

  In the touch sensor manufacturing process, the electrode signal extraction wiring that is drawn out from the X-direction electrode wiring or the Y-direction electrode wiring and connected to the external terminal for electrical inspection is formed by a bundle of a plurality of parallel element wirings. Even if a part of the bundle of element wires constituting the electrode signal take-out wiring is disconnected due to electrostatic discharge or the like, it is possible to ensure electrical connection of the electrode signal take-out lines by the remaining element wires in the bundle of element wires. .

(A) It is a schematic diagram of the plane of the touch sensor of the 1st Embodiment of this invention. (B) It is a sectional side view which shows the cross | intersection part (constriction part) of the X direction electrode wiring and Y direction electrode wiring of the touch sensor. It is a schematic diagram of the plane of the touch sensor of the modification 1 of the 1st Embodiment of this invention. It is a top view which shows the bundle | flux of the metal fine wire of the node of the electrode wiring of the 2nd Embodiment of this invention. It is a top view which shows the metal fine wire network of the node of the electrode wiring of the modification 2 of the 2nd Embodiment of this invention. (A) It is a schematic diagram of the plane of the touch sensor of the 2nd Embodiment of this invention. (B) It is a figure which shows typically the side cross section of the touch sensor of the 2nd Embodiment of this invention. It is a schematic diagram of the plane of the touch sensor of the modification 3 of the 2nd Embodiment of this invention.

  Hereinafter, a touch sensor according to an embodiment of the present invention will be described with reference to FIGS. The present invention manufactures a touch sensor substrate 10 as shown in FIGS. 1, 2, 5, and 6.

  The substrate 10 for touch sensors forms the X direction electrode wiring 2 and the Y direction electrode wiring 3 which connected the metal fine wire on the transparent substrate 1 of insulating resin films, such as PET (polyethylene terephthalate), PEN, and a polyimide-type film. The X-direction electrode wiring and the Y-direction electrode wiring have a crossing portion 4 or a crossing portion 9 which are insulated and cross each other.

  The touch sensor is used by adding an AC potential difference between the X direction electrode wiring 2 and the Y direction electrode wiring 3 of the touch sensor substrate 10. An electrostatic and conductive medium such as an operator's finger or hand is brought close to the X direction electrode wiring 2 and Y direction electrode wiring 3 of the touch sensor.

  Then, capacitive coupling is generated between the conductive medium connected to the ground medium in the environment where the touch sensor is installed and the electrode wiring of the touch sensor. Due to the capacitive coupling, a part of the alternating current applied between the X-direction electrode wiring 2 and the Y-direction electrode wiring 3 of the touch sensor leaks from the electrode wiring to the ground medium and flows.

  The X direction electrode wiring 2 and the Y direction electrode wiring 3 of the touch sensor are connected to the external connection terminal 7 via the electrode signal extraction wiring 6. The electronic circuit of the touch sensor detects the touch position of the operator's finger by detecting a change in the current flowing through the external connection terminal 7.

  In the touch sensor, since it is not necessary for the finger to directly touch the X-direction electrode wiring 2 and the Y-direction electrode wiring 3, the X-direction electrode wiring 2 and the Y-direction electrode wiring 3 are antifouling as shown in FIG. Cover and protect with a protective insulator 8 of transparent resin. Then, contact or proximity of the operator's finger is detected via the protective insulator 8. The X-direction electrode wiring 2 and the Y-direction electrode wiring 3 do not necessarily exist on the same plane on one side of the transparent substrate 1, and may be disposed between the transparent substrates 1 as shown in FIG.

In the touch sensor substrate 10 processed in the manufacturing process of the touch sensor, the electrode signal extraction wiring 6 is drawn out from the X direction electrode wiring 2 and the Y direction electrode wiring 3 of the touch sensor and is electrically connected to the external connection terminal 7.

  In the touch sensor substrate of the present invention, the electrode signal extraction wiring 6 is formed by a bundle of a plurality of parallel element wirings 6a, and the line width of the element wiring 6a is 1/20 or more of the line width of the external connection terminal 7. Set it to 1/5 or less.

<First Embodiment>
In the first embodiment, for the touch sensor, as shown in the plan view of FIG. 1A, the X-direction electrode wiring 2, the Y-direction electrode wiring 3, and the extraction copper wiring having a mesh structure are formed on the transparent substrate 1 of the touch sensor. 6 and the touch sensor substrate 10 on which the patterns of the external connection terminals 7 are formed.

  That is, the touch sensor substrate 10 is formed by connecting rectangular regions of a mesh structure composed of fine metal wires inclined at 45 degrees on the transparent substrate 1 in the X direction at the corner points (constriction portions 4). The wiring 2 is formed.

  As shown in FIG. 1 (a), the mesh structure is a thin metal wire that crosses a thin metal wire that runs in a 45 ° upward slanting direction and a thin metal wire that runs in a 45 ° slanting downward direction in a rectangular area. It is the formed network structure. The thin metal wire has a line width of 20 μm or less, which is not noticeable visually.

  On the transparent substrate 1, rectangular regions having a mesh structure composed of fine metal wires inclined at 45 degrees are connected to each other in the Y direction at the corners (constricted portions 4) to form Y-direction electrode wirings 3. That is, the constricted portion 4 is set to the intersection of the X-direction electrode wiring 2 and the Y-direction electrode wiring 3.

  In order to manufacture the X-direction electrode wiring 2 and the Y-direction electrode wiring 3, the copper thin film formed on one side of the transparent substrate 1 is etched, and the X-direction electrode wiring 2 and the Y-direction electrode wiring 3 having a mesh structure of fine metal wires The pattern of the extracted copper wiring 6 and the external connection terminal 7 is formed in a lump, and the X-direction electrode wiring 2 and the Y-direction electrode wiring 3 having a metal wire mesh structure are formed on one surface of the transparent substrate 1.

  The fine metal wires forming the mesh structure have a line width of 5 μm or more and 20 μm or less. Then, the X-direction electrode wiring 2 and the Y-direction electrode wiring 3 are crossed at a constricted portion 4 that connects the rectangular regions of the mesh structure of fine metal wires. In the constricted portion 4, as shown in the sectional view of FIG. 1B, the X-direction electrode wiring 2 and the Y-direction electrode wiring 3 are insulated by an insulating resin 5 so as not to contact each other.

  The X-direction electrode wiring 2 and the Y-direction electrode wiring 3 in the upper and lower layers of the constricted portion 4 are insulated with an insulating resin layer 5 such as an acrylic material having a thickness of about 2 μm to 10 μm interposed therebetween. The shoulder of the insulating resin layer 5 is smoothly changed. After forming the lower electrode wiring, the insulating resin layer 5 is formed on the lower electrode wiring, and the upper electrode wiring is formed thereon.

  In this way, a square lattice is formed by the X-direction electrode wiring 2 in the X-direction chain and the Y-direction electrode wiring 3 in the Y-direction chain in the rectangular region of the mesh pattern of fine metal wires inclined 45 degrees.

  The X-direction electrode wiring 2 and the Y-direction electrode wiring 3 on the surface of the transparent substrate 1 of the touch sensor substrate 10 are covered and protected with a protective insulator 8 such as melamine resin, and the surface of the protective insulator 8 is protected. The touch surface is operated by an operator touching with a finger.

The touch sensor substrate 10 is configured by arranging X-direction electrode wirings 2 and Y-direction electrode wirings 3 formed in a chain of fine metal mesh structures in an XY matrix, and the X-direction electrode wirings 2 at the touch position. And the Y-direction electrode wiring 3 are detected independently, and the position of the intersection (constriction) 4 between the X-direction electrode wiring 2 and the Y-direction electrode wiring 3 is calculated to detect the touch position of the operator's finger. .

  As shown in FIG. 1A, each X direction electrode wiring 2 and Y direction electrode wiring 3 of the touch sensor substrate 10 is connected via an electrode signal extraction wiring 6 constituted by a bundle of a plurality of parallel element wirings 6a. Then, the external connection terminal 7 is electrically connected.

  It is desirable that the line width of the element wiring 6a of the electrode signal extraction wiring 6 is approximately 3 μm or more, and the gap between the parallel element wirings 6a is 20 μm or more. When the line width of the element wiring is less than 3 μm, it becomes difficult to form the element wiring 6a having a stable pattern, and there is a problem that a defect in which the wiring is easily broken occurs.

  When the gap between the parallel element wirings 6a is less than 20 μm, the insulation between the element wirings 6a becomes insufficient, and when one element wiring 6a is disconnected due to a large current due to electrostatic discharge, the element is disconnected. The element wiring 6b adjacent to the wiring 6b at a distance of less than 20 μm also causes a problem that a large current flows due to electrostatic discharge and is disconnected.

  The element wiring 6a observes the condition that the gap between the parallel element wirings 6a is 20 μm or more, and in a portion other than the region overlapping the image display unit, the line width is increased within an allowable range to make it difficult to disconnect. Things are desirable.

  The electrode signal extraction wiring 6 is constituted by a bundle of element wirings 6a. The line width of each element wiring 6a of the bundle is formed to be 1/20 or more and 1/5 or less of the line width of the external connection terminal 7. When the line width of the element wiring 6a is smaller than 1/20 of the line width of the external connection terminal 7, there is a problem that the wiring pattern is easily disconnected when the wiring pattern is formed on the surface of the transparent substrate 1 or in the subsequent manufacturing process. Further, when the line width of the element wiring 6a is larger than one fifth of the line width of the external connection terminal 7, there arises a problem that the electrode signal extraction wiring 6 cannot be constituted by a bundle of a plurality of element wirings 6a.

  It is desirable that the number of element wires 6a to be drawn out from one external connection terminal 7 is 3 to 5 in number. By forming three or more element wirings 6a, the element wiring 6a of the electrode signal extraction wiring 6 from the X-direction electrode wiring 2 or the Y-direction electrode wiring 3 to the external connection terminal 7 due to a defect in the manufacturing process of the touch sensor. Is disconnected at several places, some of the plurality of parallel element wirings 6a remain without being disconnected. Thereby, there is an effect that the electrical connection of the electrode signal extraction wiring 6 by the bundle of the element wirings 6a can be secured.

  Particularly, for the external connection terminal 7 having a line width of 20 μm or more and 500 μm or less, it is desirable that the line width of the element wiring 6a is 3 μm or more, and the gap between the parallel element wirings 6a is 20 μm or more. . In particular, it is desirable that the number of the element wirings 6a to be drawn out from the external connection terminal 7 is 3 or more and 5 or less. For example, three element wirings 6 a having a width of 10 μm or more and 40 μm or less are drawn out from the external connection terminal 7 having a width of 200 μm.

  Thus, as shown in FIG. 1A, the electrode signal extraction wiring 6 is constituted by a bundle of a plurality of parallel element wirings 6a. As a result, in the manufacturing process, a large current due to electrostatic discharge flows through one element wiring 6a among the electrode signal extraction wirings 6 constituted by a bundle of a plurality of element wirings 6a, and the element wiring 6a is disconnected. However, there is an effect that electrical connection of the electrode signal extraction wiring 6 can be secured by the remaining element wiring 6a.

(Modification 1)
As a first modification of the present embodiment, as shown in the plan view of FIG. 2, the electrode signal extraction wiring 6 is arranged at a position where a bundle of element wirings 6a and the length of the element wiring 6a are divided at a plurality of locations. A ladder stage wiring 6b connecting the 6a to each other is added.

  When the ladder wiring 6b that connects the element wirings 6a is added in this way, the long element wiring 6a is disconnected at any point, and all the element wirings 6a of the electrode signal extraction wiring 6 are disconnected. However, since the ladder stage wiring 6b at the position where the length of the element wiring 6a is divided at a plurality of locations bypasses the disconnected portion of the element wiring 6a, there is an effect that electrical connection of the electrode signal extraction wiring 6 can be ensured.

<Second Embodiment>
FIG. 5 shows a plan view and a schematic side view of the touch sensor substrate 10 according to the second embodiment of the present invention. FIG. 3 shows one node of the X-direction electrode wiring 2 and the Y-direction electrode wiring 3. 2 shows a bundle structure of striped metal fine wires.

  As shown in FIG. 3, the bundle structure of striped thin metal wires of one node of the electrode wiring is arranged with, for example, nine copper fine metal wires dispersed in a width of several mm, and the fine metal wires are bundled. The both ends are connected to form an electrode wiring of one node. The line width of each thin metal wire is formed to a line width of 5 μm to 20 μm.

(Modification 2)
FIG. 4 shows the X-direction electrode wiring 2 in the strip-shaped region with a width of several mm facing the X direction and the Y of the strip-shaped region with a width of several mm facing the Y direction in the second modification of the second embodiment. One node of the direction electrode wiring 3 is shown.

  As shown in FIG. 4, the structure of one node of this electrode wiring is a metal fine wire network having a line width of 5 μm to 20 μm inclined 45 degrees from the X direction in a band-like region having a width of several mm facing the X direction ( The X-direction electrode wiring 2 is filled with a mesh structure. Further, the Y-direction electrode wiring 3 is filled with a metal wire network (mesh structure) having a line width of 5 μm to 20 μm inclined 45 degrees from the Y direction in the band-like region having a width of several mm facing the Y direction.

  The structure of one node of the electrode wiring of the second embodiment includes a bundle structure of striped fine metal wires as shown in FIG. 3 and a mesh structure in which the band-like region is filled with a fine metal wire network as shown in FIG. Two types of structures can be used. In the following description of the present embodiment, the case of using a bundle structure of striped fine metal wires as shown in FIG. 3 will be described. Similarly, the band-like region as shown in FIG. 4 is filled with a fine metal wire network. A mesh structure can also be used.

  As shown in FIG. 5, the touch sensor substrate 10 has an X-direction electrode wiring 2 and a Y-direction on both surfaces (front and back surfaces) of a transparent substrate 1 such as PET, PEN, or polyimide film having a thickness of about 50 μm to 200 μm. Electrode wiring 3 is formed.

  Specifically, a plurality of X-direction electrode wires 2 that run parallel to each other are provided on the surface of the transparent substrate 1, and a plurality of Y-direction electrodes that are orthogonal to the X-direction electrode wires 2 are provided on the back surface of the transparent substrate 1. Wiring 3 is wired. In FIG. 5, the electrode signal extraction wiring 6 connected to the Y-direction electrode wiring 3 formed on the upper surface of the transparent substrate 1 is shown by a solid line, and the electrode signal extraction wiring connected to the X-direction electrode wiring 2 formed on the lower surface of the transparent substrate 1. 6 is indicated by a broken line.

In this way, a plurality of X-direction electrode wirings 2 formed by nodes having a bundle structure in which fine metal wires are bundled are arranged in parallel, and a plurality of Y-direction electrode wirings 3 formed by nodes having a structure in which fine metal wires are bundled are arranged in parallel. The touch sensor substrate 10 is configured by wiring and arranging the X direction electrode wiring 2 and the Y direction electrode wiring 3 in an XY matrix. Then, the X-direction electrode wiring 2 and the Y-direction electrode wiring 3 are crossed at the intersection 9.

  A bundle of fine metal wires of the X-direction electrode wiring 2 and the Y-direction electrode wiring 3 intersect at a crossing portion 9 in a lattice shape. Here, when the X-direction electrode wiring 2 and the Y-direction electrode wiring 3 are configured with a mesh structure in which the inside of the band-like region is filled with a metal fine wire network as shown in FIG. A bundle of thin wires of a fine metal wire network forms a portion where the crossing portion 9 intersects in a lattice shape and a pair of metal thin wires that run in parallel (this relationship is also considered as a kind of relationship intersecting in a lattice shape). .

  The X direction electrode wiring 2 and the Y direction electrode wiring 3 on both surfaces of the transparent substrate 1 of the touch sensor substrate 10 are covered with a protective insulator 8 such as melamine resin to protect the surface, and the surface of the protective insulator 8 is The touch surface is operated by an operator touching with a finger.

  The touch sensor configured using this touch sensor 10 detects the X-direction electrode wiring 2 and the Y-direction electrode wiring 3 at the touch position independently, and thereby intersects the X-direction electrode wiring 2 and the Y-direction electrode wiring 3. The position of 9 is calculated to detect the touch position of the operator's finger.

  The individual X-direction electrode wiring 2 and Y-direction electrode wiring 3 of the touch sensor substrate 10 are electrically connected to an external connection terminal 7 near the outline via an electrode signal extraction wiring 6. The line width of the external connection terminal 7 is formed in the range of 20 μm to 500 μm.

  As in the first embodiment, as shown in FIG. 5, the electrode signal extraction wiring 6 is constituted by a bundle of a plurality of element wirings 6a. The line width of the element wiring 6a is preferably formed to be 1/20 to 1/5 of the line width of the external connection terminal 7. Then, the width of the electrode signal extraction wiring 6 constituted by a bundle of element wirings 6 a is formed to be approximately equal to the line width of the external connection terminal 7.

  In particular, the line width of the element wiring 6a is preferably 3 μm or more, and the gap between the parallel element wirings 6a is preferably 20 μm or more. In addition, it is desirable that the number of the element wirings 6a to be drawn out from one external connection terminal 7 is particularly from 3 to 5 element wirings 6a. For example, three element wirings 6 a having a width of 10 μm or more and 40 μm or less are drawn out from the external connection terminal 7 having a width of 200 μm.

  Thus, as shown in FIG. 5, the electrode signal lead-out wiring 6 that is drawn out from the X-direction electrode wiring 2 and the Y-direction electrode wiring 3 and connected to the external connection terminal 7 is constituted by a bundle of a plurality of parallel element wirings 6a. Thereby, even if one element wiring 6a of the bundle of the plurality of element wirings 6a constituting the electrode signal extraction wiring 6 is disconnected, the remaining element wiring 6a ensures electrical connection of the electrode signal extraction wiring 6 as a whole. There is an effect that can be done.

  That is, in the manufacturing process, even if a large current due to electrostatic discharge flows through one element wiring 6a and the element wiring 6a is disconnected, the electrical connection of the electrode signal extraction wiring 6 can be secured by the remaining element wiring 6a. effective.

(Modification 3)
As a third modification of the second embodiment, as shown in the plan view of FIG. 6, the electrode signal extraction wiring 6 is divided into a bundle of element wirings 6 a and the length of the element wiring 6 a at a plurality of locations. A ladder stage wiring 6b for connecting the element wirings 6a to each other is added.

When the ladder wiring 6b that connects the element wirings 6a is added in this way, the long element wiring 6a is disconnected at any point, and all the element wirings 6a of the electrode signal extraction wiring 6 are disconnected. However, since the ladder stage wiring 6b at the position where the length of the element wiring 6a is divided at a plurality of locations bypasses the disconnected portion of the element wiring 6a, there is an effect that electrical connection of the electrode signal extraction wiring 6 can be ensured.

Example 1
As the first embodiment, in the touch sensor substrate 10 having the configuration shown in FIG. 6, each electrode signal extraction wiring 6 is connected to a bundle of two parallel element wirings 6a and a plurality of ladder stage wirings 6b connecting the element wirings 6a. Consists of.

  The line width of the external connection terminal 7 is set to 50 μm, and two element wirings 6 a having a line width of 5 μm are connected to the external connection terminal 7 with a gap of 40 μm, and a bundle of the two element wirings 6 a is formed. An electrode signal extraction wiring 6 having a width of 50 μm was formed.

  Further, the gap between the external connection terminals 7 or between the electrode signal extraction wirings 6 was set to 50 μm, and the pitch thereof was set to 100 μm.

  The disconnection / electrical failure occurrence rate of the electrode signal extraction wiring 6 of the touch sensor substrate 10 of Example 1 was about 0%.

(Comparative Example 1)
As a comparative example 1, in the touch sensor substrate 10 having the configuration shown in FIG. 6, the line width of the external connection terminal 7 is set to 50 μm, and one electrode signal extraction wiring 6 having a line width of 50 μm is connected to the external connection terminal 7. Connected. As in Example 1, the gap between the external connection terminals 7 or between the electrode signal extraction wirings 6 was set to 50 μm, and their pitch was set to 100 μm.

  The disconnection / electric failure occurrence rate of the electrode signal extraction wiring 6 of the touch sensor substrate 10 of Comparative Example 1 was about 2%.

  In addition, the above embodiment is an illustration of this invention and this invention is not limited to the above embodiment. For example, the wiring pattern of the touch sensor substrate 10 is not limited to that formed by etching a metal film. That is, wiring patterns such as the X-direction electrode wiring 2 and the Y-direction electrode wiring 3 can be formed on the surface of the transparent substrate 1 by screen printing or gravure offset printing.

DESCRIPTION OF SYMBOLS 1 ... Transparent substrate 2 ... X direction electrode wiring 3 ... Y direction electrode wiring 4 ... Constriction part (intersection part)
5 ... Insulating resin layer 6 ... Electrode signal extraction wiring 6a ... Element wiring 6b ... Ladder step wiring 7 ... External connection terminal 8 ... Protective insulator 9 ... Intersection 10 ..Touch sensor substrates

Claims (7)

  A touch sensor substrate used in a manufacturing process of a touch sensor, having an intersection where an X-direction electrode wiring and a Y-direction electrode wiring are insulated and intersect, and externally connecting the X-direction electrode wiring and the Y-direction electrode wiring A touch sensor substrate comprising an electrode signal extraction wiring connected to a terminal for use, wherein the electrode signal extraction wiring is constituted by a bundle of a plurality of element wirings.   The touch sensor substrate according to claim 1, further comprising a ladder stage wiring that connects the element wirings of the electrode signal lead-out wiring at a position where the length of the element wiring is divided at a plurality of locations. Touch sensor substrate.   The touch sensor substrate according to claim 1 or 2, wherein the X-direction electrode wiring and the Y-direction electrode wiring are formed of a connection pattern of a mesh-like pattern of fine metal wires formed on one side of a transparent substrate, A crossing portion is formed by insulating the X-direction electrode wiring and the Y-direction electrode wiring with an insulating resin layer.   3. The touch sensor substrate according to claim 1, wherein the X-direction electrode wiring is formed of a striped pattern or a mesh-shaped pattern of fine metal wires formed on one surface of a transparent substrate, and the Y-direction electrode. The X-direction electrode wiring and the Y-direction electrode wiring, wherein the X-direction electrode wiring and the Y-direction electrode wiring are formed of a stripe pattern or a mesh-shaped pattern of fine metal wires formed on the other surface of the transparent substrate. A substrate for a touch sensor, characterized in that the substrate is formed by crossing in a grid pattern.   5. The touch sensor substrate according to claim 1, wherein the element wiring has a line width of 3 μm or more and a gap between the element wirings of 20 μm or more. substrate.   6. The touch sensor substrate according to claim 1, wherein the external connection terminal has a line width of 20 μm or more and 500 μm or less, and the element wiring has a line width of the external connection terminal. A touch sensor substrate having a line width of 1/20 to 1/5.   The touch sensor substrate according to any one of claims 1 to 6, wherein the electrode signal extraction wiring is constituted by a bundle of 3 or more and 5 or less element wirings. Substrate.

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