TWI533022B - 模製之光學物件及其製造之方法 - Google Patents
模製之光學物件及其製造之方法 Download PDFInfo
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- TWI533022B TWI533022B TW097104868A TW97104868A TWI533022B TW I533022 B TWI533022 B TW I533022B TW 097104868 A TW097104868 A TW 097104868A TW 97104868 A TW97104868 A TW 97104868A TW I533022 B TWI533022 B TW I533022B
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- 230000003287 optical effect Effects 0.000 title claims description 78
- 238000000034 method Methods 0.000 title claims description 51
- 229920005989 resin Polymers 0.000 claims description 104
- 239000011347 resin Substances 0.000 claims description 104
- 239000002131 composite material Substances 0.000 claims description 65
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 60
- 239000000758 substrate Substances 0.000 claims description 51
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 44
- 239000003054 catalyst Substances 0.000 claims description 42
- 230000005855 radiation Effects 0.000 claims description 38
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 30
- 229910052697 platinum Inorganic materials 0.000 claims description 29
- 125000001931 aliphatic group Chemical group 0.000 claims description 25
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 24
- 229910052707 ruthenium Inorganic materials 0.000 claims description 24
- 229910052739 hydrogen Inorganic materials 0.000 claims description 18
- 239000001257 hydrogen Substances 0.000 claims description 18
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 15
- 229910052684 Cerium Inorganic materials 0.000 claims description 10
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000178 monomer Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 229920001400 block copolymer Polymers 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 5
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 5
- 125000004122 cyclic group Chemical group 0.000 claims description 5
- 150000002430 hydrocarbons Chemical group 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 239000003060 catalysis inhibitor Substances 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 3
- 239000007795 chemical reaction product Substances 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000000379 polymerizing effect Effects 0.000 claims description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 150000003303 ruthenium Chemical class 0.000 claims 1
- 239000000463 material Substances 0.000 description 44
- 238000002474 experimental method Methods 0.000 description 30
- 239000000243 solution Substances 0.000 description 29
- 230000032683 aging Effects 0.000 description 28
- -1 polyethylene terephthalate Polymers 0.000 description 24
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000002184 metal Substances 0.000 description 20
- 229920003023 plastic Polymers 0.000 description 20
- 239000004033 plastic Substances 0.000 description 20
- 230000005540 biological transmission Effects 0.000 description 19
- 229920002098 polyfluorene Polymers 0.000 description 17
- 230000008569 process Effects 0.000 description 17
- 238000002834 transmittance Methods 0.000 description 17
- 239000011521 glass Substances 0.000 description 16
- 239000012778 molding material Substances 0.000 description 14
- 238000000465 moulding Methods 0.000 description 10
- 239000004594 Masterbatch (MB) Substances 0.000 description 9
- 238000001723 curing Methods 0.000 description 8
- 230000002070 germicidal effect Effects 0.000 description 8
- 239000000428 dust Substances 0.000 description 7
- 238000005984 hydrogenation reaction Methods 0.000 description 7
- 229920000515 polycarbonate Polymers 0.000 description 7
- 239000004417 polycarbonate Substances 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 238000000411 transmission spectrum Methods 0.000 description 7
- 229920002675 Polyoxyl Polymers 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 238000003491 array Methods 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000002877 alkyl aryl group Chemical group 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229910052703 rhodium Inorganic materials 0.000 description 3
- 239000010948 rhodium Substances 0.000 description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000006277 sulfonation reaction Methods 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000000304 alkynyl group Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000007857 degradation product Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 150000002923 oximes Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000003856 thermoforming Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- 125000004343 1-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000006017 1-propenyl group Chemical group 0.000 description 1
- 125000000530 1-propynyl group Chemical group [H]C([H])([H])C#C* 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 1
- 125000004975 3-butenyl group Chemical group C(CC=C)* 0.000 description 1
- 125000006043 5-hexenyl group Chemical group 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000013005 condensation curing Methods 0.000 description 1
- 238000002508 contact lithography Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 230000020335 dealkylation Effects 0.000 description 1
- 238000006900 dealkylation reaction Methods 0.000 description 1
- 150000001975 deuterium Chemical group 0.000 description 1
- 229910052805 deuterium Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007516 diamond turning Methods 0.000 description 1
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 235000013861 fat-free Nutrition 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000004404 heteroalkyl group Chemical group 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000025 interference lithography Methods 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000004038 photonic crystal Substances 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 230000000176 photostabilization Effects 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000010076 replication Effects 0.000 description 1
- 150000003284 rhodium compounds Chemical class 0.000 description 1
- 229910003450 rhodium oxide Inorganic materials 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/0073—Optical laminates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/02—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of crystals, e.g. rock-salt, semi-conductors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/041—Lenses
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US88962707P | 2007-02-13 | 2007-02-13 | |
| US12/018,298 US9944031B2 (en) | 2007-02-13 | 2008-01-23 | Molded optical articles and methods of making same |
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| Publication Number | Publication Date |
|---|---|
| TW200842398A TW200842398A (en) | 2008-11-01 |
| TWI533022B true TWI533022B (zh) | 2016-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW097104868A TWI533022B (zh) | 2007-02-13 | 2008-02-12 | 模製之光學物件及其製造之方法 |
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| Country | Link |
|---|---|
| US (1) | US9944031B2 (enExample) |
| EP (1) | EP2111645A4 (enExample) |
| JP (2) | JP2010519573A (enExample) |
| KR (1) | KR20090115802A (enExample) |
| CN (2) | CN101627477B (enExample) |
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Families Citing this family (80)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
| US20110006447A1 (en) * | 2008-02-13 | 2011-01-13 | Akiko Hara | Method for Producing Hybrid Optical Element Grouping |
| JP2009190300A (ja) * | 2008-02-15 | 2009-08-27 | Toppan Printing Co Ltd | インプリント法 |
| EP2349440B1 (en) | 2008-10-07 | 2019-08-21 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
| US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| US9123614B2 (en) | 2008-10-07 | 2015-09-01 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| US9238309B2 (en) * | 2009-02-17 | 2016-01-19 | The Board Of Trustees Of The University Of Illinois | Methods for fabricating microstructures |
| TW201101520A (en) * | 2009-06-25 | 2011-01-01 | Atomic Energy Council | Solar cell module condenser |
| WO2011041727A1 (en) | 2009-10-01 | 2011-04-07 | Mc10, Inc. | Protective cases with integrated electronics |
| DE102010002141A1 (de) * | 2010-02-19 | 2011-08-25 | Momentive Performance Materials GmbH, 51373 | Integrale Bestrahlungseinheit |
| CN104681694B (zh) * | 2010-08-18 | 2017-08-08 | 晶元光电股份有限公司 | 发光装置 |
| JP5490671B2 (ja) * | 2010-12-07 | 2014-05-14 | 信越化学工業株式会社 | シリコーン樹脂組成物の硬化方法 |
| TWI441361B (zh) * | 2010-12-31 | 2014-06-11 | 英特明光能股份有限公司 | 發光二極體封裝結構及其製造方法 |
| CN102650710A (zh) * | 2011-02-25 | 2012-08-29 | 富士康(昆山)电脑接插件有限公司 | 光波导结构及其制造方法 |
| JP5840377B2 (ja) | 2011-04-14 | 2016-01-06 | 日東電工株式会社 | 反射樹脂シートおよび発光ダイオード装置の製造方法 |
| WO2012160769A1 (ja) * | 2011-05-24 | 2012-11-29 | コニカミノルタアドバンストレイヤー株式会社 | 樹脂成形品の製造方法 |
| KR102000302B1 (ko) | 2011-05-27 | 2019-07-15 | 엠씨10, 인크 | 전자, 광학, 및/또는 기계 장치 및 시스템, 그리고 이를 제조하기 위한 방법 |
| CN102881801B (zh) * | 2011-07-12 | 2015-10-21 | 宏齐科技股份有限公司 | 背切式发光二极管封装结构及其制作方法 |
| US9757050B2 (en) | 2011-08-05 | 2017-09-12 | Mc10, Inc. | Catheter balloon employing force sensing elements |
| WO2013022853A1 (en) | 2011-08-05 | 2013-02-14 | Mc10, Inc. | Catheter balloon methods and apparatus employing sensing elements |
| EP2764335A4 (en) * | 2011-09-28 | 2015-04-29 | Mc10 Inc | ELECTRONICS FOR DETECTING A PROPERTY OF A SURFACE |
| JP2013087199A (ja) * | 2011-10-18 | 2013-05-13 | Shin-Etsu Chemical Co Ltd | 付加硬化型オルガノポリシロキサン組成物の硬化方法 |
| US8564004B2 (en) * | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
| CN103137826B (zh) * | 2011-11-30 | 2016-03-23 | 展晶科技(深圳)有限公司 | 发光二极管 |
| JP6309898B2 (ja) * | 2012-01-16 | 2018-04-11 | ダウ シリコーンズ コーポレーション | 光学物品及び形成方法 |
| KR102001403B1 (ko) | 2012-02-09 | 2019-07-18 | 다우 코닝 도레이 캄파니 리미티드 | 구배 중합체 구조물 및 방법 |
| DE102012008640A1 (de) * | 2012-05-02 | 2013-11-07 | Heraeus Noblelight Gmbh | Verfahren zur Herstellung eines optischen Moduls mit einer Polymeroptik |
| DE102012008639A1 (de) | 2012-05-02 | 2013-11-07 | Heraeus Noblelight Gmbh | Verfahren zur Herstellung eines optischen Moduls mit einer Silikonoptik |
| CN103474562B (zh) * | 2012-06-08 | 2016-11-23 | 展晶科技(深圳)有限公司 | 发光二极管的制造方法 |
| EP2858803B1 (de) | 2012-06-11 | 2018-08-29 | Momentive Performance Materials GmbH | Verfahren zur herstellung von kunststoff-verbundformkörpern |
| US9226402B2 (en) | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
| US9295842B2 (en) | 2012-07-05 | 2016-03-29 | Mc10, Inc. | Catheter or guidewire device including flow sensing and use thereof |
| EP2866645A4 (en) | 2012-07-05 | 2016-03-30 | Mc10 Inc | CATHETER DEVICE WITH FLOW MEASUREMENT |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| KR20150072415A (ko) | 2012-10-09 | 2015-06-29 | 엠씨10, 인크 | 의류에 집적되는 컨포멀 전자기기 |
| US9470395B2 (en) | 2013-03-15 | 2016-10-18 | Abl Ip Holding Llc | Optic for a light source |
| CA3015068C (en) | 2013-05-10 | 2019-07-16 | Abl Ip Holding Llc | Silicone optics |
| US9706647B2 (en) | 2013-05-14 | 2017-07-11 | Mc10, Inc. | Conformal electronics including nested serpentine interconnects |
| KR20160040670A (ko) | 2013-08-05 | 2016-04-14 | 엠씨10, 인크 | 곡면부착형 전자기기를 포함하는 유연한 온도 센서 |
| KR20160065948A (ko) | 2013-10-07 | 2016-06-09 | 엠씨10, 인크 | 감지 및 분석용 등각 센서 시스템 |
| DE102013220960A1 (de) * | 2013-10-16 | 2015-04-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
| JP6711750B2 (ja) | 2013-11-22 | 2020-06-17 | エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． | 心臓活動の検知および分析のためのコンフォーマルセンサシステム |
| EP3086145B1 (en) * | 2013-12-20 | 2018-12-05 | LG Chem, Ltd. | Optical film |
| CA2935372C (en) | 2014-01-06 | 2023-08-08 | Mc10, Inc. | Encapsulated conformal electronic systems and devices, and methods of making and using the same |
| KR20160129007A (ko) | 2014-03-04 | 2016-11-08 | 엠씨10, 인크 | 전자 디바이스를 위한 다부분 유연성 봉지 하우징 |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
| US9899330B2 (en) | 2014-10-03 | 2018-02-20 | Mc10, Inc. | Flexible electronic circuits with embedded integrated circuit die |
| US10297572B2 (en) | 2014-10-06 | 2019-05-21 | Mc10, Inc. | Discrete flexible interconnects for modules of integrated circuits |
| USD781270S1 (en) | 2014-10-15 | 2017-03-14 | Mc10, Inc. | Electronic device having antenna |
| DE102014116370A1 (de) * | 2014-11-10 | 2016-05-12 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines Trägers und Verfahren zum Herstellen eines optoelektronischen Bauelements |
| AU2016205433A1 (en) * | 2015-01-05 | 2017-07-27 | E-Vision Smart Optics, Inc. | Methods and systems for mold releases |
| US10409078B2 (en) * | 2015-01-26 | 2019-09-10 | Omnivision Technologies, Inc. | Lensed beam-splitter prism array and associated method |
| US10477354B2 (en) | 2015-02-20 | 2019-11-12 | Mc10, Inc. | Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation |
| WO2016140961A1 (en) | 2015-03-02 | 2016-09-09 | Mc10, Inc. | Perspiration sensor |
| US10653332B2 (en) | 2015-07-17 | 2020-05-19 | Mc10, Inc. | Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers |
| JP6553980B2 (ja) * | 2015-08-13 | 2019-07-31 | 株式会社ダイセル | 硬化性組成物及びその硬化物 |
| US10709384B2 (en) | 2015-08-19 | 2020-07-14 | Mc10, Inc. | Wearable heat flux devices and methods of use |
| EP4079383A3 (en) | 2015-10-01 | 2023-02-22 | Medidata Solutions, Inc. | Method and system for interacting with a virtual environment |
| US10532211B2 (en) | 2015-10-05 | 2020-01-14 | Mc10, Inc. | Method and system for neuromodulation and stimulation |
| US11367959B2 (en) | 2015-10-28 | 2022-06-21 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
| US10476164B2 (en) | 2015-10-28 | 2019-11-12 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
| WO2017147053A1 (en) | 2016-02-22 | 2017-08-31 | Mc10, Inc. | System, device, and method for coupled hub and sensor node on-body acquisition of sensor information |
| EP3829187A1 (en) | 2016-02-22 | 2021-06-02 | Medidata Solutions, Inc. | System, devices, and method for on-body data and power transmission |
| CN109310340A (zh) | 2016-04-19 | 2019-02-05 | Mc10股份有限公司 | 用于测量汗液的方法和系统 |
| US10447347B2 (en) | 2016-08-12 | 2019-10-15 | Mc10, Inc. | Wireless charger and high speed data off-loader |
| US11283189B2 (en) | 2017-05-02 | 2022-03-22 | Rogers Corporation | Connected dielectric resonator antenna array and method of making the same |
| JP6788131B2 (ja) | 2017-05-02 | 2020-11-18 | シグニファイ ホールディング ビー ヴィＳｉｇｎｉｆｙ Ｈｏｌｄｉｎｇ Ｂ．Ｖ． | Ｌｅｄストリップの固定 |
| US11876295B2 (en) | 2017-05-02 | 2024-01-16 | Rogers Corporation | Electromagnetic reflector for use in a dielectric resonator antenna system |
| EP3424740B1 (en) * | 2017-07-05 | 2022-06-15 | The Procter & Gamble Company | Method of printing 3d-microoptic images on packing systems |
| EP4420867A1 (en) | 2017-10-17 | 2024-08-28 | Magic Leap, Inc. | A system for molding a photocurable material into a planar object |
| US11616302B2 (en) | 2018-01-15 | 2023-03-28 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
| US11552390B2 (en) | 2018-09-11 | 2023-01-10 | Rogers Corporation | Dielectric resonator antenna system |
| TWI820237B (zh) | 2018-10-18 | 2023-11-01 | 美商羅傑斯公司 | 聚合物結構、其立體光刻製造方法以及包含該聚合物結構之電子裝置 |
| CN113169455A (zh) * | 2018-12-04 | 2021-07-23 | 罗杰斯公司 | 电介质电磁结构及其制造方法 |
| CN118994491A (zh) | 2019-05-30 | 2024-11-22 | 罗杰斯公司 | 用于立体光刻的可光固化组合物、使用该组合物的立体光刻方法、通过立体光刻方法形成的聚合物组件、以及包含该聚合物组件的装置 |
| US11482790B2 (en) | 2020-04-08 | 2022-10-25 | Rogers Corporation | Dielectric lens and electromagnetic device with same |
| TWI806744B (zh) * | 2022-08-19 | 2023-06-21 | 友達光電股份有限公司 | 光源模組 |
Family Cites Families (120)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3159662A (en) * | 1962-07-02 | 1964-12-01 | Gen Electric | Addition reaction |
| US3220972A (en) * | 1962-07-02 | 1965-11-30 | Gen Electric | Organosilicon process using a chloroplatinic acid reaction product as the catalyst |
| US3410886A (en) * | 1965-10-23 | 1968-11-12 | Union Carbide Corp | Si-h to c=c or c=c addition in the presence of a nitrile-platinum (ii) halide complex |
| US4530879A (en) * | 1983-03-04 | 1985-07-23 | Minnesota Mining And Manufacturing Company | Radiation activated addition reaction |
| US4632899A (en) * | 1983-12-01 | 1986-12-30 | Fuji Photo Film Co., Ltd. | Photopolymerizable image-recording process of producing a visible image |
| US4510094A (en) * | 1983-12-06 | 1985-04-09 | Minnesota Mining And Manufacturing Company | Platinum complex |
| US4585669A (en) * | 1984-09-28 | 1986-04-29 | General Electric Company | Novel dual cure silicone compositions |
| US4609574A (en) * | 1985-10-03 | 1986-09-02 | Dow Corning Corporation | Silicone release coatings containing higher alkenyl functional siloxanes |
| FR2592221B1 (fr) * | 1985-12-20 | 1988-02-12 | Radiotechnique Compelec | Procede d'encapsulation d'un composant electronique au moyen d'une resine synthetique |
| US4670531A (en) * | 1986-01-21 | 1987-06-02 | General Electric Company | Inhibited precious metal catalyzed organopolysiloxane compositions |
| US5145886A (en) * | 1988-05-19 | 1992-09-08 | Minnesota Mining And Manufacturing Company | Radiation activated hydrosilation reaction |
| US5169727A (en) * | 1988-08-04 | 1992-12-08 | Minnesota Mining And Manufacturing Company | Silicone-based pressure-sensitive adhesives having high solids content |
| US4916169A (en) * | 1988-09-09 | 1990-04-10 | Minnesota Mining And Manufacturing Company | Visible radiation activated hydrosilation reaction |
| US6046250A (en) * | 1990-12-13 | 2000-04-04 | 3M Innovative Properties Company | Hydrosilation reaction utilizing a free radical photoinitiator |
| US6376569B1 (en) * | 1990-12-13 | 2002-04-23 | 3M Innovative Properties Company | Hydrosilation reaction utilizing a (cyclopentadiene)(sigma-aliphatic) platinum complex and a free radical photoinitiator |
| GB2252746B (en) * | 1991-01-17 | 1995-07-12 | Towa Corp | A method of molding resin to seal an electronic part on a lead frame and apparatus therefor |
| SG50596A1 (en) * | 1991-07-26 | 2001-01-16 | Rolic Ag | Photo-oriented polymer networks and method of their manufacture |
| US5248716A (en) | 1992-01-30 | 1993-09-28 | General Electric Company | Silicone pressure-sensitive adhesives with control removal property |
| JP3147481B2 (ja) * | 1992-04-21 | 2001-03-19 | 松下電器産業株式会社 | ガラス製回折格子の成形用金型及びその製造方法及びガラス製回折格子の製造方法 |
| DE69316792T2 (de) * | 1992-06-17 | 1998-05-28 | Nitto Denko Corp | Verfahren zur Herstellung von Polymerisation oder vernetzter Rate-distribuierte Produkte und Verfahren zur Herstellung einer Linse, Linsenanordnung oder Lichtwellenleiter durch dieses Verfahren |
| JP3211381B2 (ja) * | 1992-06-25 | 2001-09-25 | 住友化学工業株式会社 | 光制御板の製造方法 |
| US5300263A (en) * | 1992-10-28 | 1994-04-05 | Minnesota Mining And Manufacturing Company | Method of making a microlens array and mold |
| DE4242469A1 (de) * | 1992-12-16 | 1994-06-23 | Wacker Chemie Gmbh | Katalysatoren für Hydrosilylierungsreaktionen |
| JP2524955B2 (ja) * | 1993-04-22 | 1996-08-14 | トーワ株式会社 | 電子部品の樹脂封止成形方法及び装置 |
| US5536455A (en) * | 1994-01-03 | 1996-07-16 | Omron Corporation | Method of manufacturing lens array |
| JP3423766B2 (ja) * | 1994-03-11 | 2003-07-07 | Ｔｏｗａ株式会社 | 電子部品の樹脂封止成形方法及び金型装置 |
| FR2717481B1 (fr) | 1994-03-18 | 1996-06-28 | Rhone Poulenc Chimie | Nouveaux complexes du platine utiles, notamment, comme catalyseurs d'hydrosilylation photoactivables et procédé en faisant application. |
| JPH07268219A (ja) * | 1994-03-31 | 1995-10-17 | Toray Dow Corning Silicone Co Ltd | 光学充填用シリコーンゲル組成物 |
| DE4423195A1 (de) * | 1994-07-01 | 1996-01-04 | Wacker Chemie Gmbh | Triazenoxid-Übergangsmetall-Komplexe als Hydrosilylierungskatalysatoren |
| JPH10182770A (ja) * | 1996-03-13 | 1998-07-07 | Tokuyama Corp | 光重合性組成物及び透明硬化体 |
| DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| JPH10158349A (ja) | 1996-11-28 | 1998-06-16 | Dainippon Printing Co Ltd | 光学シート用電離放射線硬化型樹脂組成物、光学シート及びその製造方法 |
| US6473554B1 (en) * | 1996-12-12 | 2002-10-29 | Teledyne Lighting And Display Products, Inc. | Lighting apparatus having low profile |
| US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
| JP3609942B2 (ja) | 1998-06-29 | 2005-01-12 | 株式会社巴川製紙所 | 光学接続部品およびその作製方法 |
| US6670207B1 (en) * | 1999-03-15 | 2003-12-30 | Gentex Corporation | Radiation emitter device having an integral micro-groove lens |
| SE9803481D0 (sv) * | 1998-10-13 | 1998-10-13 | Pharmacia & Upjohn Ab | Photocurable siloxane polymers |
| US6204523B1 (en) * | 1998-11-06 | 2001-03-20 | Lumileds Lighting, U.S., Llc | High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range |
| JP2000208822A (ja) * | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | 半導体発光装置 |
| JP3349111B2 (ja) | 1999-03-15 | 2002-11-20 | 株式会社シチズン電子 | 表面実装型発光ダイオード及びその製造方法 |
| US6808509B1 (en) * | 1999-04-22 | 2004-10-26 | Scimed Life Systems, Inc. | Valved introducer sheath and related methods |
| US6150546A (en) * | 1999-05-03 | 2000-11-21 | General Electric Company | Irradiation-curable silicone compositions, photo-active platinum (IV) compounds, and method |
| US6367949B1 (en) * | 1999-08-04 | 2002-04-09 | 911 Emergency Products, Inc. | Par 36 LED utility lamp |
| US6432137B1 (en) * | 1999-09-08 | 2002-08-13 | Medennium, Inc. | High refractive index silicone for use in intraocular lenses |
| KR20010037679A (ko) * | 1999-10-19 | 2001-05-15 | 오주언 | 광섬유 리본 제조용 수지 조성물 및 이를 이용한 광섬유 리본 제조용 수지의 제조방법 |
| WO2001074554A2 (en) * | 2000-03-31 | 2001-10-11 | Bausch & Lomb Incorporated | Method and mold to control optical device polymerization |
| US6650044B1 (en) * | 2000-10-13 | 2003-11-18 | Lumileds Lighting U.S., Llc | Stenciling phosphor layers on light emitting diodes |
| DE10051242A1 (de) * | 2000-10-17 | 2002-04-25 | Philips Corp Intellectual Pty | Lichtemittierende Vorrichtung mit beschichtetem Leuchtstoff |
| JP4275890B2 (ja) | 2001-02-13 | 2009-06-10 | 株式会社カネカ | 発光ダイオード及びその製造方法 |
| US6623667B2 (en) * | 2001-02-28 | 2003-09-23 | 3M Innovative Properties Company | Method for continuous fabrication of structured surface light guides |
| JP4009067B2 (ja) * | 2001-03-06 | 2007-11-14 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物 |
| US6598998B2 (en) * | 2001-05-04 | 2003-07-29 | Lumileds Lighting, U.S., Llc | Side emitting light emitting device |
| FR2825709B1 (fr) * | 2001-06-07 | 2005-07-01 | Rhodia Chimie Sa | Composition silicone reticulable en elastomere par hydrosilylation, en presence de catalyseurs metalliques a base de carbenes, et catalyseurs de ce type |
| DE10129785B4 (de) * | 2001-06-20 | 2010-03-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
| US6617401B2 (en) * | 2001-08-23 | 2003-09-09 | General Electric Company | Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst |
| US20030115907A1 (en) * | 2001-09-07 | 2003-06-26 | Patton Edward K. | Multiple lens molding system and method |
| US6804062B2 (en) * | 2001-10-09 | 2004-10-12 | California Institute Of Technology | Nonimaging concentrator lens arrays and microfabrication of the same |
| JP4009097B2 (ja) * | 2001-12-07 | 2007-11-14 | 日立電線株式会社 | 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム |
| US6897164B2 (en) | 2002-02-14 | 2005-05-24 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
| US20030199603A1 (en) * | 2002-04-04 | 2003-10-23 | 3M Innovative Properties Company | Cured compositions transparent to ultraviolet radiation |
| US6679621B2 (en) * | 2002-06-24 | 2004-01-20 | Lumileds Lighting U.S., Llc | Side emitting LED and lens |
| CN1678639A (zh) * | 2002-07-24 | 2005-10-05 | 粘合剂研究公司 | 可转换的压敏粘合剂胶带及其在显示屏上的用途 |
| US20050076376A1 (en) * | 2002-07-24 | 2005-04-07 | Raymond Lind | Video entertainment satellite network system |
| CN100550430C (zh) | 2002-09-09 | 2009-10-14 | 皇家飞利浦电子股份有限公司 | 半导体器件及其制造方法 |
| US6908682B2 (en) * | 2002-09-12 | 2005-06-21 | 3M Innovative Properties Company | Photocured silicone sealant having improved adhesion to plastic |
| US6682331B1 (en) * | 2002-09-20 | 2004-01-27 | Agilent Technologies, Inc. | Molding apparatus for molding light emitting diode lamps |
| US7143609B2 (en) | 2002-10-29 | 2006-12-05 | Corning Incorporated | Low-temperature fabrication of glass optical components |
| US7595113B2 (en) * | 2002-11-29 | 2009-09-29 | Shin-Etsu Chemical Co., Ltd. | LED devices and silicone resin composition therefor |
| JP2004186168A (ja) * | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
| MXPA05006154A (es) * | 2002-12-13 | 2005-08-26 | Koninkl Philips Electronics Nv | Metodo para elaborar una replica, asi como tambien una replica obtenida al realizar un tratamiento de curado termico o iniciado con luz uv de una mezcla reactiva. |
| US7245435B2 (en) * | 2002-12-16 | 2007-07-17 | 3M Innovative Properties Company | Lens array sheet and molding method |
| US20040159900A1 (en) * | 2003-01-27 | 2004-08-19 | 3M Innovative Properties Company | Phosphor based light sources having front illumination |
| US20040173808A1 (en) * | 2003-03-07 | 2004-09-09 | Bor-Jen Wu | Flip-chip like light emitting device package |
| TW200427111A (en) | 2003-03-12 | 2004-12-01 | Shinetsu Chemical Co | Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device |
| US7927703B2 (en) * | 2003-04-11 | 2011-04-19 | 3M Innovative Properties Company | Adhesive blends, articles, and methods |
| US6921929B2 (en) * | 2003-06-27 | 2005-07-26 | Lockheed Martin Corporation | Light-emitting diode (LED) with amorphous fluoropolymer encapsulant and lens |
| US20050006659A1 (en) * | 2003-07-09 | 2005-01-13 | Ng Kee Yean | Light emitting diode utilizing a discrete wavelength-converting layer for color conversion |
| JP4908736B2 (ja) * | 2003-10-01 | 2012-04-04 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP4503271B2 (ja) * | 2003-11-28 | 2010-07-14 | 東レ・ダウコーニング株式会社 | シリコーン積層体の製造方法 |
| KR100624414B1 (ko) * | 2003-12-06 | 2006-09-18 | 삼성전자주식회사 | 회절 렌즈 어레이 몰드의 제조 방법 및 ｕｖ 디스펜서 |
| JP4801320B2 (ja) * | 2003-12-19 | 2011-10-26 | 東レ・ダウコーニング株式会社 | 付加反応硬化型オルガノポリシロキサン樹脂組成物 |
| JP2005217369A (ja) | 2004-02-02 | 2005-08-11 | Three M Innovative Properties Co | 発光ダイオード装置用接着シート及び発光ダイオード装置 |
| JP2005248122A (ja) | 2004-03-08 | 2005-09-15 | Dow Corning Corp | 耐レーザ光性光学材料および耐レーザ光性光学素子 |
| US7279346B2 (en) * | 2004-03-31 | 2007-10-09 | Cree, Inc. | Method for packaging a light emitting device by one dispense then cure step followed by another |
| JP4300418B2 (ja) * | 2004-04-30 | 2009-07-22 | 信越化学工業株式会社 | エポキシ・シリコーン混成樹脂組成物及び発光半導体装置 |
| JP4875858B2 (ja) | 2004-05-28 | 2012-02-15 | 株式会社朝日ラバー | 半導体光学素子用レンズの製造方法 |
| WO2005121641A1 (en) | 2004-06-11 | 2005-12-22 | Koninklijke Philips Electronics N.V. | Illumination system |
| US7255920B2 (en) * | 2004-07-29 | 2007-08-14 | 3M Innovative Properties Company | (Meth)acrylate block copolymer pressure sensitive adhesives |
| JP4617761B2 (ja) | 2004-08-03 | 2011-01-26 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| JP2006049533A (ja) | 2004-08-04 | 2006-02-16 | Wacker Asahikasei Silicone Co Ltd | 樹脂封止発光ダイオード装置及び封止方法 |
| JP2006049657A (ja) * | 2004-08-06 | 2006-02-16 | Citizen Electronics Co Ltd | Ｌｅｄランプ |
| US7256483B2 (en) | 2004-10-28 | 2007-08-14 | Philips Lumileds Lighting Company, Llc | Package-integrated thin film LED |
| US7304425B2 (en) * | 2004-10-29 | 2007-12-04 | 3M Innovative Properties Company | High brightness LED package with compound optical element(s) |
| US7352011B2 (en) | 2004-11-15 | 2008-04-01 | Philips Lumileds Lighting Company, Llc | Wide emitting lens for LED useful for backlighting |
| JP2006137895A (ja) | 2004-11-15 | 2006-06-01 | Ge Toshiba Silicones Co Ltd | 光学材料用ポリオルガノシロキサン組成物 |
| US7314770B2 (en) | 2004-11-18 | 2008-01-01 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing encapsulant |
| US7192795B2 (en) * | 2004-11-18 | 2007-03-20 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing encapsulant |
| KR100580753B1 (ko) | 2004-12-17 | 2006-05-15 | 엘지이노텍 주식회사 | 발광소자 패키지 |
| ITRM20040633A1 (it) * | 2004-12-23 | 2005-03-23 | St Microelectronics Srl | Trasmettitore ottico multi-sorgente e dispositivo di visualizzazione fotonico. |
| US20060138443A1 (en) * | 2004-12-23 | 2006-06-29 | Iii-N Technology, Inc. | Encapsulation and packaging of ultraviolet and deep-ultraviolet light emitting diodes |
| TWI261654B (en) * | 2004-12-29 | 2006-09-11 | Ind Tech Res Inst | Lens and LED with uniform light emitted applying the lens |
| US7833208B2 (en) * | 2004-12-29 | 2010-11-16 | Kimberly-Clark Worldwide, Inc. | Multilayer absorbent article |
| US7885003B2 (en) * | 2005-01-11 | 2011-02-08 | Dai Nippon Printing Co., Ltd. | Optical diffusing sheet, optical deflecting sheet, and transmission type screen |
| US8012774B2 (en) | 2005-01-11 | 2011-09-06 | SemiLEDs Optoelectronics Co., Ltd. | Coating process for a light-emitting diode (LED) |
| JP4167659B2 (ja) * | 2005-01-11 | 2008-10-15 | 大日本印刷株式会社 | 透過型スクリーン及び背面投射型表示装置 |
| KR101197046B1 (ko) * | 2005-01-26 | 2012-11-06 | 삼성디스플레이 주식회사 | 발광다이오드를 사용하는 2차원 광원 및 이를 이용한 액정표시 장치 |
| KR20060104432A (ko) | 2005-03-30 | 2006-10-09 | 알티전자 주식회사 | 고휘도 박형 플래시 장치 |
| TWI258877B (en) * | 2005-05-17 | 2006-07-21 | Young Lighting Technology Inc | Method of utilizing the surface mount technology to assemble LED light source, and combination of its LED light source and lens lid |
| JP5138158B2 (ja) * | 2005-05-23 | 2013-02-06 | 信越化学工業株式会社 | Ｌｅｄ発光装置用シリコーンレンズ成形材料 |
| US7294861B2 (en) * | 2005-06-30 | 2007-11-13 | 3M Innovative Properties Company | Phosphor tape article |
| US20070001182A1 (en) | 2005-06-30 | 2007-01-04 | 3M Innovative Properties Company | Structured phosphor tape article |
| JP4717542B2 (ja) | 2005-07-27 | 2011-07-06 | オリンパスイメージング株式会社 | ガラス光学素子成形装置 |
| US7365371B2 (en) * | 2005-08-04 | 2008-04-29 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed encapsulants |
| KR100621154B1 (ko) | 2005-08-26 | 2006-09-07 | 서울반도체 주식회사 | 발광 다이오드 제조방법 |
| US20070092736A1 (en) * | 2005-10-21 | 2007-04-26 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing encapsulant |
| WO2007050483A2 (en) * | 2005-10-24 | 2007-05-03 | 3M Innovative Properties Company | Method of making light emitting device having a molded encapsulant |
| US7655486B2 (en) * | 2006-05-17 | 2010-02-02 | 3M Innovative Properties Company | Method of making light emitting device with multilayer silicon-containing encapsulant |
| US7763478B2 (en) * | 2006-08-21 | 2010-07-27 | Cree, Inc. | Methods of forming semiconductor light emitting device packages by liquid injection molding |
| TWI434890B (zh) * | 2007-04-06 | 2014-04-21 | Shinetsu Chemical Co | 加成可硬化聚矽氧樹脂組成物及使用彼之聚矽氧鏡片 |
| US7960192B2 (en) * | 2007-09-14 | 2011-06-14 | 3M Innovative Properties Company | Light emitting device having silicon-containing composition and method of making same |
-
2008
- 2008-01-23 US US12/018,298 patent/US9944031B2/en not_active Expired - Fee Related
- 2008-02-01 CN CN2008800048785A patent/CN101627477B/zh not_active Expired - Fee Related
- 2008-02-01 KR KR1020097018976A patent/KR20090115802A/ko not_active Abandoned
- 2008-02-01 EP EP08714157A patent/EP2111645A4/en not_active Withdrawn
- 2008-02-01 JP JP2009549661A patent/JP2010519573A/ja active Pending
- 2008-02-01 WO PCT/US2008/052742 patent/WO2008100719A1/en not_active Ceased
- 2008-02-12 TW TW097104868A patent/TWI533022B/zh not_active IP Right Cessation
- 2008-02-13 CN CN2008800049383A patent/CN101611502B/zh not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| US9944031B2 (en) | 2018-04-17 |
| EP2111645A1 (en) | 2009-10-28 |
| CN101611502B (zh) | 2013-06-12 |
| WO2008100719A1 (en) | 2008-08-21 |
| CN101611502A (zh) | 2009-12-23 |
| CN101627477B (zh) | 2011-05-11 |
| TW200842398A (en) | 2008-11-01 |
| CN101627477A (zh) | 2010-01-13 |
| US20080193749A1 (en) | 2008-08-14 |
| JP2010519573A (ja) | 2010-06-03 |
| EP2111645A4 (en) | 2010-07-21 |
| JP2014006545A (ja) | 2014-01-16 |
| KR20090115802A (ko) | 2009-11-06 |
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