TWI523914B - Hardened resin composition and hardened product thereof - Google Patents

Hardened resin composition and hardened product thereof Download PDF

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Publication number
TWI523914B
TWI523914B TW103100828A TW103100828A TWI523914B TW I523914 B TWI523914 B TW I523914B TW 103100828 A TW103100828 A TW 103100828A TW 103100828 A TW103100828 A TW 103100828A TW I523914 B TWI523914 B TW I523914B
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TW
Taiwan
Prior art keywords
group
resin composition
curable resin
formula
represent
Prior art date
Application number
TW103100828A
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English (en)
Chinese (zh)
Other versions
TW201431961A (zh
Inventor
Yasunobu Nakagawa
Shigeaki Kamuro
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Daicel Corp
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Publication of TW201431961A publication Critical patent/TW201431961A/zh
Application granted granted Critical
Publication of TWI523914B publication Critical patent/TWI523914B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW103100828A 2013-01-09 2014-01-09 Hardened resin composition and hardened product thereof TWI523914B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013002104 2013-01-09

Publications (2)

Publication Number Publication Date
TW201431961A TW201431961A (zh) 2014-08-16
TWI523914B true TWI523914B (zh) 2016-03-01

Family

ID=51166996

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103100828A TWI523914B (zh) 2013-01-09 2014-01-09 Hardened resin composition and hardened product thereof

Country Status (8)

Country Link
US (1) US9646904B2 (de)
EP (1) EP2944675B1 (de)
JP (1) JP5778875B2 (de)
KR (1) KR101598325B1 (de)
CN (1) CN104903404B (de)
MY (1) MY155102A (de)
TW (1) TWI523914B (de)
WO (1) WO2014109349A1 (de)

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JP5736525B1 (ja) * 2013-08-02 2015-06-17 株式会社ダイセル 硬化性樹脂組成物及びそれを用いた半導体装置
MY157548A (en) * 2013-08-06 2016-06-16 Daicel Corp Curing resin composition and semiconductor device employing same
JP5895958B2 (ja) * 2014-02-20 2016-03-30 横浜ゴム株式会社 偏波保持光ファイバー用接着剤組成物
CN106459584A (zh) * 2014-06-06 2017-02-22 株式会社大赛璐 固化性树脂组合物、固化物、密封材料及半导体装置
JPWO2016043082A1 (ja) * 2014-09-17 2017-07-06 株式会社ダイセル 硬化性シリコーン樹脂組成物及びその硬化物
JP6460714B2 (ja) * 2014-10-10 2019-01-30 株式会社ダイセル 硬化性樹脂組成物及びその硬化物、並びに半導体装置
JP6533387B2 (ja) * 2014-12-26 2019-06-19 株式会社ダイセル 硬化性樹脂組成物及びその硬化物、並びに半導体装置
JP6452545B2 (ja) * 2015-05-20 2019-01-16 株式会社ダイセル 硬化性シリコーン樹脂組成物及びその硬化物
JP6496185B2 (ja) * 2015-05-20 2019-04-03 株式会社ダイセル 硬化性シリコーン樹脂組成物及びその硬化物
JP2016216642A (ja) * 2015-05-22 2016-12-22 株式会社ダイセル 硬化性樹脂組成物及びその硬化物、封止剤、並びに半導体装置
JP2017002172A (ja) * 2015-06-09 2017-01-05 株式会社ダイセル 高硬度ポリシロキサン硬化物を与える硬化性樹脂組成物及びその硬化物
WO2017122712A1 (ja) * 2016-01-15 2017-07-20 株式会社ダイセル 硬化性樹脂組成物、硬化物、封止材、及び半導体装置
JPWO2017126538A1 (ja) * 2016-01-18 2018-11-08 株式会社ダイセル 新規ポリオルガノシロキシシルアルキレン、硬化性樹脂組成物及びその硬化物
US10870758B2 (en) 2016-02-22 2020-12-22 Daicel Corporation Curable resin composition, cured product thereof, and semiconductor device
WO2017164265A1 (ja) 2016-03-25 2017-09-28 株式会社ダイセル 硬化性樹脂組成物、その硬化物、及び半導体装置
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JP6771258B2 (ja) 2016-06-23 2020-10-21 株式会社ダイセル 硬化性樹脂組成物、硬化性樹脂組成物の製造方法、及び粘弾性材料表面のタックの測定方法
US11124649B1 (en) 2016-07-19 2021-09-21 Nichia Corporation Curable resin composition, cured product of same and semiconductor device
JP6944120B2 (ja) 2016-09-07 2021-10-06 日亜化学工業株式会社 硬化性樹脂組成物、その硬化物、及び半導体装置
CN106479134B (zh) * 2016-09-21 2018-06-22 沈阳化工大学 一种含l-poss交联剂的同质异构交联法改性聚对苯二甲酸丁二醇酯（pbt）及其制备方法
KR20180065185A (ko) * 2016-12-07 2018-06-18 한국과학기술연구원 자가-치유가 가능한 폴리실세스퀴옥산 및 이를 이용한 하이브리드 필름
CN106674522B (zh) * 2016-12-13 2018-10-26 沈阳化工大学 含有l-poss交联剂的同质异构交联法改性回收pc及其制备方法
CN106751095B (zh) * 2016-12-26 2018-10-26 沈阳化工大学 含有l-poss交联剂的同质异构改性回收ps及其制备方法
CN106832892B (zh) * 2016-12-27 2019-01-01 沈阳化工大学 一种含l-poss的硅烷交联剂改性回收尼龙及其制备方法
CN106832893B (zh) * 2016-12-27 2018-10-12 沈阳化工大学 一种含l-poss交联剂的同质异构回收尼龙及其制备方法
CN106589786B (zh) * 2016-12-27 2018-12-18 沈阳化工大学 一种含l-poss交联剂同质异构改性聚甲醛及其制备方法
CN106832929B (zh) * 2016-12-28 2018-10-26 沈阳化工大学 一种含有l-poss交联剂的同质异构交联法改性回收pps及其制备方法
KR102518155B1 (ko) 2017-01-16 2023-04-06 니치아 카가쿠 고교 가부시키가이샤 경화성 수지 조성물, 그의 경화물 및 반도체 장치
JP2018188563A (ja) * 2017-05-09 2018-11-29 株式会社ダイセル 絶縁膜形成用組成物、絶縁膜、及び絶縁膜を備えた半導体デバイス
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Also Published As

Publication number Publication date
CN104903404A (zh) 2015-09-09
JP5778875B2 (ja) 2015-09-16
US9646904B2 (en) 2017-05-09
TW201431961A (zh) 2014-08-16
KR101598325B1 (ko) 2016-02-26
WO2014109349A1 (ja) 2014-07-17
JPWO2014109349A1 (ja) 2017-01-19
US20150340299A1 (en) 2015-11-26
EP2944675A1 (de) 2015-11-18
CN104903404B (zh) 2016-07-20
MY155102A (en) 2015-09-07
KR20150065822A (ko) 2015-06-15
EP2944675B1 (de) 2017-04-12
EP2944675A4 (de) 2015-12-09

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