TWI500373B - 配線基板、其製造方法、以及半導體封裝 - Google Patents

配線基板、其製造方法、以及半導體封裝 Download PDF

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Publication number
TWI500373B
TWI500373B TW099144418A TW99144418A TWI500373B TW I500373 B TWI500373 B TW I500373B TW 099144418 A TW099144418 A TW 099144418A TW 99144418 A TW99144418 A TW 99144418A TW I500373 B TWI500373 B TW I500373B
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Taiwan
Prior art keywords
layer
wiring
alignment mark
wiring substrate
insulating layer
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TW099144418A
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English (en)
Chinese (zh)
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TW201136481A (en
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中村順一
小林和弘
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新光電氣工業股份有限公司
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Publication of TW201136481A publication Critical patent/TW201136481A/zh
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
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    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW099144418A 2010-01-13 2010-12-17 配線基板、其製造方法、以及半導體封裝 TWI500373B (zh)

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US8525356B2 (en) 2013-09-03
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JP5603600B2 (ja) 2014-10-08
TW201136481A (en) 2011-10-16
KR101764686B1 (ko) 2017-08-03
US20130269185A1 (en) 2013-10-17
KR20110083506A (ko) 2011-07-20
US8673744B2 (en) 2014-03-18

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