JP4679588B2 - プリント配線板の製造方法 - Google Patents
プリント配線板の製造方法 Download PDFInfo
- Publication number
- JP4679588B2 JP4679588B2 JP2007551130A JP2007551130A JP4679588B2 JP 4679588 B2 JP4679588 B2 JP 4679588B2 JP 2007551130 A JP2007551130 A JP 2007551130A JP 2007551130 A JP2007551130 A JP 2007551130A JP 4679588 B2 JP4679588 B2 JP 4679588B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- diameter
- opening
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 238000000034 method Methods 0.000 title description 25
- 229910000679 solder Inorganic materials 0.000 claims description 157
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 238000002844 melting Methods 0.000 claims description 25
- 230000008018 melting Effects 0.000 claims description 24
- 238000007639 printing Methods 0.000 claims description 8
- 239000010410 layer Substances 0.000 description 60
- 239000000758 substrate Substances 0.000 description 32
- 238000007747 plating Methods 0.000 description 23
- 239000004020 conductor Substances 0.000 description 20
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 239000011229 interlayer Substances 0.000 description 12
- 230000004907 flux Effects 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 238000009413 insulation Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- NRTDAKURTMLAFN-UHFFFAOYSA-N potassium;gold(3+);tetracyanide Chemical compound [K+].[Au+3].N#[C-].N#[C-].N#[C-].N#[C-] NRTDAKURTMLAFN-UHFFFAOYSA-N 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
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- H01L2224/05568—Disposition the whole external layer protruding from the surface
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- H—ELECTRICITY
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Wire Bonding (AREA)
Description
(1)パッケージ基板に形成された接続パッドにフラックスを印刷する工程。
(2)フラックスの印刷された接続パッドに、半田ボールを搭載する工程。
(3)リフローを行い半田ボールから半田バンプを形成する工程。
パッケージ基板に半田バンプを形成した後、半田バンプ上にICチップを載置し、リフローにより半田バンプとICチップのパッド(端子)とを接続することで、パッケージ基板にICチップを実装している。上述した半田ボールを接続パッドに搭載する工程では、例えば、特許文献1に示されているボール整列用マスクとスキージを併用する印刷技術が用いられている。
[半田ボール搭載装置]
多層プリント配線板の接続パッド上に微少(直径200μmΦ未満)な半田ボール77を搭載する半田ボール搭載装置について、図14を参照して説明する。
図14(A)は、本発明の一実施例に係る半田ボール搭載装置の構成を示す構成図であり、図14(B)は、図14(A)の半田ボール搭載装置を矢印B側から見た矢視図である。
(1)厚さ0.2〜0.8mmのガラスエポキシ樹脂またはBT(ビスマレイミドトリアジン)樹脂からなる絶縁性基板30の両面に5〜250μmの銅箔32がラミネートされている銅張積層板30Aを出発材料とした(図1(A))。まず、この銅張積層板をドリル削孔して通孔33を穿設し(図1(B))、無電解めっき処理および電解めっき処理を施し、スルーホール36の側壁導体層36bを形成した(図1(C))。
〔電解めっき水溶液〕
硫酸 180 g/l
硫酸銅 80 g/l
添加剤(アトテックジャパン製、商品名:カパラシドGL)
1 ml/l
〔電解めっき条件〕
電流密度 1A/dm2
時間 70分
温度 室温
さらに、粗面化処理(粗化深さ3μm)した該基板の表面に、パラジウム触媒を付与することにより、層間樹脂絶縁層の表面およびバイアホール用開口の内壁面に触媒核を付着させた。すなわち、上記基板を塩化パラジウム(PbCl2 )と塩化第一スズ(SnCl2 )とを含む触媒液中に浸漬し、パラジウム金属を析出させることにより触媒を付与した。
〔無電解めっき条件〕
34℃の液温度で45分
〔電解めっき液〕
硫酸 2.24 mol/l
硫酸銅 0.26 mol/l
添加剤 19.5 ml/l
(アトテックジャパン社製、カパラシドGL)
〔電解めっき条件〕
電流密度 1 A/dm2
時間 70 分
温度 22±2 ℃
そして、さらに、80℃で1時間、100℃で1時間、120℃で1時間、150℃で3時間の条件でそれぞれ加熱処理を行ってソルダーレジスト層を硬化させ、開口を有し、その厚さが15〜25μmのソルダーレジストパターン層を形成した。
引き続き、図14を参照して上述した半田ボール搭載装置100による多層プリント配線板10への半田ボールの搭載工程について図7〜図9を参照して説明する。
(I)多層プリント配線板の位置認識、補正
図7(A)に示すように多層プリント配線板10のアライメントマーク34Mをアライメントカメラ146により認識し、ボール整列用マスク16に対して多層プリント配線板10の位置をXYθ吸引テーブル114によって補正する。即ち、ボール整列用マスク16の開口16aがそれぞれ多層プリント配線板10の小径開口71S及び大径開口71Pに対応するように位置調整する。
図7(B)に示すように半田ボール供給装置122から半田ボール77(直径75μm、Sn63Pb37(日立金属社製))を搭載筒124側へ定量供給する。なお、予め搭載筒内に供給しておいても良い。実施例では、半田ボールにSn/Pb半田を用いたが、SnとAg、Cu、In、Bi、Zn等の群から選ばれるPbフリー半田であってもよい。
図8(A)に示すように、ボール整列用マスク16の上方に、該ボール整列用マスクとの所定のクリアランス(例えば、ボール径の0.5〜4倍)を保ち搭載筒124を位置させ、吸引部24bから空気を吸引することで、搭載筒とプリント配線板間の隙間の流速を5m/sec〜35m/secにして、当該搭載筒124の開口部124A直下のボール整列用マスク16上に半田ボール77を集合させた。
図9(B)に示すように、搭載筒124により余剰の半田ボール77をボール整列用マスク16上に開口16aの無い位置まで誘導した後、吸着ボール除去筒161により吸引除去する。
図12を参照して本発明の第2実施例に係るプリント配線板の製造方法について説明する。
上述した第1実施例では、先ず、半田ペーストをリフローした後、半田ボール77を多層プリント配線板に搭載し、半田ボール77をリフローした。これに対して、第2実施例では、半田ペースト75と半田ボール77とを同時にリフローする。
図13を参照して本発明の第3実施例に係るプリント配線板の製造方法について説明する。第3実施例は、第2実施例と同様に半田ペースト75と半田ボール77とを同時にリフローする。
36 スルーホール
40 樹脂充填層
50 層間樹脂絶縁層
58 導体回路
60 バイアホール
70 ソルダーレジスト層
71S 小径開口
71P 大径開口
77 小径半田ボール
77 大径半田ボール
78S 小径半田バンプ
78P 大径半田バンプ
100 半田ボール搭載装置
124 搭載筒(筒部材)
Claims (1)
- 少なくとも以下の(a)〜(d)工程を備えるバンプを有するプリント配線板の製造方法:
(a)接続パッドを露出させる小径の開口と大径の開口とを有するソルダーレジスト層を形成する工程;
(b)前記ソルダーレジスト層の大径の開口にペースト状低融点金属を印刷する工程;
(c)前記ソルダーレジスト層の小径の開口及び大径の開口に対応する開口部を備えるマスクを用い、該小径の開口及び大径の開口に低融点金属球を搭載する工程;
(d)リフローを行い前記小径の開口の前記低融点金属球から小径バンプを、前記大径の開口のペースト状低融点金属及び低融点金属球から大径バンプを形成する工程;を備え、
前記(c)工程において、
前記マスクの上方に、該マスクに対向する開口部を備える筒部材を位置させ、該筒部材で空気を吸引することで、当該筒部材直下の前記マスク上に前記低融点金属球を集合させ、前記筒部材を水平方向に移動させることで、前記マスクの上に集合させた前記低融点金属球を移動させ、前記マスクの開口部を介して、前記低融点金属球を前記ソルダーレジスト層の小径の開口及び大径の開口へ落下させることを特徴とするプリント配線板の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005366485 | 2005-12-20 | ||
JP2005366485 | 2005-12-20 | ||
PCT/JP2006/325407 WO2007072876A1 (ja) | 2005-12-20 | 2006-12-20 | プリント配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JPWO2007072876A1 JPWO2007072876A1 (ja) | 2009-06-04 |
JP4679588B2 true JP4679588B2 (ja) | 2011-04-27 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007551130A Expired - Fee Related JP4679588B2 (ja) | 2005-12-20 | 2006-12-20 | プリント配線板の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7845547B2 (ja) |
EP (1) | EP1965620A1 (ja) |
JP (1) | JP4679588B2 (ja) |
TW (1) | TW200810647A (ja) |
WO (1) | WO2007072876A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007004658A1 (ja) * | 2005-06-30 | 2007-01-11 | Ibiden Co., Ltd. | プリント配線板 |
TWI384925B (zh) * | 2009-03-17 | 2013-02-01 | Advanced Semiconductor Eng | 內埋式線路基板之結構及其製造方法 |
US9975206B2 (en) | 2011-04-08 | 2018-05-22 | Micronic Mydata AB | Composition of solid-containing paste |
WO2012150105A1 (en) * | 2011-04-08 | 2012-11-08 | Micronic Mydata AB | Composition of solid-containing paste |
CN111725081A (zh) * | 2020-06-08 | 2020-09-29 | 北京时代民芯科技有限公司 | 一种针对塑封倒装焊基板的不同尺寸sop制备方法 |
Citations (4)
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JPH07201870A (ja) * | 1994-01-11 | 1995-08-04 | Matsushita Electric Ind Co Ltd | バンプの形成方法 |
JPH0957432A (ja) * | 1995-08-21 | 1997-03-04 | Ibiden Co Ltd | 半田供給用キャリア |
JPH09107045A (ja) * | 1995-10-13 | 1997-04-22 | Japan Aviation Electron Ind Ltd | Bgaパッケージのボール取付け方法 |
JP2005209847A (ja) * | 2004-01-22 | 2005-08-04 | Kyocera Corp | 配線基板の製造方法 |
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JPH0817860A (ja) * | 1994-06-30 | 1996-01-19 | Oki Electric Ind Co Ltd | 電子部品の製造方法 |
JPH1013007A (ja) * | 1996-03-29 | 1998-01-16 | Ngk Spark Plug Co Ltd | 半田バンプを有する配線基板及びその製造方法及び平坦化治具 |
US7007833B2 (en) * | 1997-05-27 | 2006-03-07 | Mackay John | Forming solder balls on substrates |
US7654432B2 (en) * | 1997-05-27 | 2010-02-02 | Wstp, Llc | Forming solder balls on substrates |
JP3565047B2 (ja) * | 1998-10-07 | 2004-09-15 | 松下電器産業株式会社 | 半田バンプの形成方法および半田バンプの実装方法 |
US6191022B1 (en) * | 1999-04-18 | 2001-02-20 | Cts Corporation | Fine pitch solder sphere placement |
JP3423930B2 (ja) * | 1999-12-27 | 2003-07-07 | 富士通株式会社 | バンプ形成方法、電子部品、および半田ペースト |
JP2001267731A (ja) | 2000-01-13 | 2001-09-28 | Hitachi Ltd | バンプ付き電子部品の製造方法および電子部品の製造方法 |
CN102413643A (zh) * | 2004-08-04 | 2012-04-11 | 揖斐电株式会社 | 焊球搭载方法及焊球搭载装置 |
US7566650B2 (en) * | 2005-09-23 | 2009-07-28 | Stats Chippac Ltd. | Integrated circuit solder bumping system |
US7472473B2 (en) * | 2006-04-26 | 2009-01-06 | Ibiden Co., Ltd. | Solder ball loading apparatus |
US7823762B2 (en) | 2006-09-28 | 2010-11-02 | Ibiden Co., Ltd. | Manufacturing method and manufacturing apparatus of printed wiring board |
-
2006
- 2006-12-20 TW TW095147881A patent/TW200810647A/zh unknown
- 2006-12-20 JP JP2007551130A patent/JP4679588B2/ja not_active Expired - Fee Related
- 2006-12-20 WO PCT/JP2006/325407 patent/WO2007072876A1/ja active Application Filing
- 2006-12-20 EP EP06835027A patent/EP1965620A1/en not_active Withdrawn
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2008
- 2008-05-13 US US12/120,046 patent/US7845547B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH07201870A (ja) * | 1994-01-11 | 1995-08-04 | Matsushita Electric Ind Co Ltd | バンプの形成方法 |
JPH0957432A (ja) * | 1995-08-21 | 1997-03-04 | Ibiden Co Ltd | 半田供給用キャリア |
JPH09107045A (ja) * | 1995-10-13 | 1997-04-22 | Japan Aviation Electron Ind Ltd | Bgaパッケージのボール取付け方法 |
JP2005209847A (ja) * | 2004-01-22 | 2005-08-04 | Kyocera Corp | 配線基板の製造方法 |
Also Published As
Publication number | Publication date |
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US7845547B2 (en) | 2010-12-07 |
JPWO2007072876A1 (ja) | 2009-06-04 |
TWI330511B (ja) | 2010-09-11 |
TW200810647A (en) | 2008-02-16 |
EP1965620A1 (en) | 2008-09-03 |
US20080283580A1 (en) | 2008-11-20 |
WO2007072876A1 (ja) | 2007-06-28 |
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