TWI479638B - 兩個或兩個以上晶粒之多晶粒面向下堆疊 - Google Patents

兩個或兩個以上晶粒之多晶粒面向下堆疊 Download PDF

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Publication number
TWI479638B
TWI479638B TW101114250A TW101114250A TWI479638B TW I479638 B TWI479638 B TW I479638B TW 101114250 A TW101114250 A TW 101114250A TW 101114250 A TW101114250 A TW 101114250A TW I479638 B TWI479638 B TW I479638B
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Taiwan
Prior art keywords
microelectronic
component
opening
edge
front surface
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TW101114250A
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English (en)
Chinese (zh)
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TW201248829A (en
Inventor
比加希姆 哈巴
華爾 柔伊
理查 狄威特 柯斯伯
艾里亞斯 穆翰米德
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泰斯拉公司
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Publication of TW201248829A publication Critical patent/TW201248829A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10W40/778—
    • H10W70/68—
    • H10W74/10—
    • H10W74/117—
    • H10W76/42—
    • H10W90/00—
    • H10W90/701—
    • H10W72/01—
    • H10W72/701—
    • H10W72/865—
    • H10W72/9445—
    • H10W90/24—
    • H10W90/288—
    • H10W90/291—
    • H10W90/732—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
TW101114250A 2011-04-21 2012-04-20 兩個或兩個以上晶粒之多晶粒面向下堆疊 TWI479638B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161477877P 2011-04-21 2011-04-21
US13/306,300 US8338963B2 (en) 2011-04-21 2011-11-29 Multiple die face-down stacking for two or more die

Publications (2)

Publication Number Publication Date
TW201248829A TW201248829A (en) 2012-12-01
TWI479638B true TWI479638B (zh) 2015-04-01

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Application Number Title Priority Date Filing Date
TW101114250A TWI479638B (zh) 2011-04-21 2012-04-20 兩個或兩個以上晶粒之多晶粒面向下堆疊

Country Status (7)

Country Link
US (1) US8338963B2 (enExample)
EP (1) EP2700098A1 (enExample)
JP (1) JP6033843B2 (enExample)
KR (1) KR20140028014A (enExample)
CN (1) CN103620773B (enExample)
TW (1) TWI479638B (enExample)
WO (1) WO2012145477A1 (enExample)

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Also Published As

Publication number Publication date
JP6033843B2 (ja) 2016-11-30
KR20140028014A (ko) 2014-03-07
CN103620773A (zh) 2014-03-05
US8338963B2 (en) 2012-12-25
WO2012145477A1 (en) 2012-10-26
CN103620773B (zh) 2016-08-17
JP2014512694A (ja) 2014-05-22
TW201248829A (en) 2012-12-01
EP2700098A1 (en) 2014-02-26
US20120267798A1 (en) 2012-10-25

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