TWI428692B - Black solder resist composition and hardened material - Google Patents

Black solder resist composition and hardened material Download PDF

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Publication number
TWI428692B
TWI428692B TW097112333A TW97112333A TWI428692B TW I428692 B TWI428692 B TW I428692B TW 097112333 A TW097112333 A TW 097112333A TW 97112333 A TW97112333 A TW 97112333A TW I428692 B TWI428692 B TW I428692B
Authority
TW
Taiwan
Prior art keywords
black
solder resist
pigment
resist composition
black solder
Prior art date
Application number
TW097112333A
Other languages
English (en)
Chinese (zh)
Other versions
TW200907566A (en
Inventor
Shuichi Yamamoto
Chiho Ueta
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39980670&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI428692(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of TW200907566A publication Critical patent/TW200907566A/zh
Application granted granted Critical
Publication of TWI428692B publication Critical patent/TWI428692B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW097112333A 2007-04-06 2008-04-03 Black solder resist composition and hardened material TWI428692B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007100685A JP4994923B2 (ja) 2007-04-06 2007-04-06 黒色ソルダーレジスト組成物およびその硬化物

Publications (2)

Publication Number Publication Date
TW200907566A TW200907566A (en) 2009-02-16
TWI428692B true TWI428692B (zh) 2014-03-01

Family

ID=39980670

Family Applications (2)

Application Number Title Priority Date Filing Date
TW102119589A TW201337454A (zh) 2007-04-06 2008-04-03 黑色阻焊劑組成物及其硬化物
TW097112333A TWI428692B (zh) 2007-04-06 2008-04-03 Black solder resist composition and hardened material

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW102119589A TW201337454A (zh) 2007-04-06 2008-04-03 黑色阻焊劑組成物及其硬化物

Country Status (5)

Country Link
JP (1) JP4994923B2 (ja)
KR (1) KR20080091034A (ja)
CN (1) CN101281368B (ja)
HK (1) HK1121815A1 (ja)
TW (2) TW201337454A (ja)

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JP2012237864A (ja) * 2011-05-11 2012-12-06 Kaneka Corp 新規な黒色感光性樹脂組成物及びその利用
US10030133B2 (en) 2011-12-06 2018-07-24 Kaneka Corporation Black photosensitive resin composition and use of same
WO2013171888A1 (ja) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
JP5991040B2 (ja) * 2012-06-22 2016-09-14 凸版印刷株式会社 黒色感光性樹脂組成物、ブラックマトリックス及びカラーフィルタ
TWI586230B (zh) 2012-07-18 2017-06-01 鐘化股份有限公司 補強板一體型軟性印刷基板
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JP5766671B2 (ja) * 2012-09-05 2015-08-19 株式会社タムラ製作所 黒色硬化性樹脂組成物およびそれを用いたプリント配線基板
JP5695622B2 (ja) 2012-09-24 2015-04-08 株式会社タムラ製作所 黒色硬化性樹脂組成物
KR101658374B1 (ko) * 2013-01-25 2016-09-22 롬엔드하스전자재료코리아유한회사 컬럼 스페이서 및 블랙 매트릭스를 동시에 구현할 수 있는 착색 감광성 수지 조성물
TWI484295B (zh) * 2013-03-19 2015-05-11 Chi Mei Corp 感光性樹脂組成物、黑色矩陣、彩色濾光片及液晶顯示元件
WO2014156424A1 (ja) * 2013-03-28 2014-10-02 協立化学産業株式会社 紫外線硬化性遮光用組成物
JP6134187B2 (ja) * 2013-04-03 2017-05-24 株式会社カネカ 黒色感光性樹脂組成物及びその利用
WO2015025925A1 (ja) * 2013-08-23 2015-02-26 味の素株式会社 感光性樹脂組成物
JP5670533B1 (ja) * 2013-10-16 2015-02-18 台湾太陽油▲墨▼股▲分▼有限公司 熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材
CN104749883B (zh) * 2013-12-30 2022-04-01 上海飞凯光电材料股份有限公司 一种光刻胶
JP6383621B2 (ja) 2014-09-24 2018-08-29 太陽インキ製造株式会社 硬化性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板の製造方法
JP6368380B2 (ja) * 2014-12-10 2018-08-01 互応化学工業株式会社 ソルダーレジスト組成物及び被覆プリント配線板
CN105785716A (zh) * 2014-12-26 2016-07-20 上海飞凯光电材料股份有限公司 一种光刻胶
JP6185943B2 (ja) * 2015-02-10 2017-08-23 互応化学工業株式会社 ソルダーレジスト組成物、被覆プリント配線板
KR102092910B1 (ko) * 2015-06-30 2020-03-24 동우 화인켐 주식회사 착색 경화성 수지 조성물, 컬러 필터 및 표시 장치
JP6799949B2 (ja) * 2015-07-21 2020-12-16 東友ファインケム株式会社Ｄｏｎｇｗｏｏ Ｆｉｎｅ−Ｃｈｅｍ Ｃｏ．， Ｌｔｄ． 着色硬化性樹脂組成物、カラーフィルタ及び表示装置
JP6610069B2 (ja) * 2015-08-06 2019-11-27 住友ベークライト株式会社 ソルダーレジスト用樹脂組成物、キャリア付樹脂膜、配線基板、電子装置、および電子装置の製造方法
JP6346228B2 (ja) * 2015-09-29 2018-06-20 株式会社タムラ製作所 感光性樹脂組成物
JP6764874B2 (ja) 2015-11-06 2020-10-07 株式会社カネカ 黒色樹脂組成物、黒色樹脂硬化膜付きポリイミドとその製造方法および黒色樹脂硬化膜を用いたフレキシブルプリント配線基板
TW201842064A (zh) 2017-03-02 2018-12-01 日商捷恩智股份有限公司 熱硬化性樹脂組成物、硬化膜、帶硬化膜基板、電子零件及噴墨用墨水組成物
JP6542435B2 (ja) * 2017-07-14 2019-07-10 株式会社タムラ製作所 感光性樹脂組成物
CN109254498B (zh) * 2017-07-14 2023-07-14 株式会社田村制作所 感光性树脂组合物
JP7052482B2 (ja) * 2018-03-29 2022-04-12 住友ベークライト株式会社 プリプレグ用樹脂組成物、プリプレグ、金属張積層板、プリント配線板、および半導体装置
JP7324595B2 (ja) * 2018-03-30 2023-08-10 太陽ホールディングス株式会社 黒色感光性樹脂組成物、その硬化物、およびリジッドフレキシブルプリント配線板
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Also Published As

Publication number Publication date
HK1121815A1 (en) 2009-04-30
JP4994923B2 (ja) 2012-08-08
CN101281368A (zh) 2008-10-08
TWI561917B (ja) 2016-12-11
TW200907566A (en) 2009-02-16
KR20080091034A (ko) 2008-10-09
JP2008257045A (ja) 2008-10-23
TW201337454A (zh) 2013-09-16
CN101281368B (zh) 2011-07-13

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