TWI399544B - Contactors for electrical testing and methods for their manufacture - Google Patents

Contactors for electrical testing and methods for their manufacture Download PDF

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Publication number
TWI399544B
TWI399544B TW098104020A TW98104020A TWI399544B TW I399544 B TWI399544 B TW I399544B TW 098104020 A TW098104020 A TW 098104020A TW 98104020 A TW98104020 A TW 98104020A TW I399544 B TWI399544 B TW I399544B
Authority
TW
Taiwan
Prior art keywords
contact
contact portion
reinforcing
recess
layer
Prior art date
Application number
TW098104020A
Other languages
English (en)
Chinese (zh)
Other versions
TW200940999A (en
Inventor
山田優子
平川秀樹
相馬亮
林崎孝幸
Original Assignee
日本麥克隆尼股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本麥克隆尼股份有限公司 filed Critical 日本麥克隆尼股份有限公司
Publication of TW200940999A publication Critical patent/TW200940999A/zh
Application granted granted Critical
Publication of TWI399544B publication Critical patent/TWI399544B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW098104020A 2008-03-25 2009-02-09 Contactors for electrical testing and methods for their manufacture TWI399544B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008078560A JP2009229410A (ja) 2008-03-25 2008-03-25 電気試験用接触子及びその製造方法

Publications (2)

Publication Number Publication Date
TW200940999A TW200940999A (en) 2009-10-01
TWI399544B true TWI399544B (zh) 2013-06-21

Family

ID=41244964

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098104020A TWI399544B (zh) 2008-03-25 2009-02-09 Contactors for electrical testing and methods for their manufacture

Country Status (3)

Country Link
JP (1) JP2009229410A (https=)
KR (1) KR101029987B1 (https=)
TW (1) TWI399544B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9052342B2 (en) 2011-09-30 2015-06-09 Formfactor, Inc. Probe with cantilevered beam having solid and hollow sections
JP2014016204A (ja) 2012-07-06 2014-01-30 Micronics Japan Co Ltd 電気的接触子及び電気的接触子の接触方法
JP5968158B2 (ja) 2012-08-10 2016-08-10 株式会社日本マイクロニクス コンタクトプローブ及びプローブカード
JP6068925B2 (ja) * 2012-10-23 2017-01-25 株式会社日本マイクロニクス プローブの製造方法
KR102466151B1 (ko) * 2015-11-30 2022-11-15 삼성전자주식회사 프로브 카드 및 그를 포함하는 테스트 장치
JP7353859B2 (ja) * 2019-08-09 2023-10-02 株式会社日本マイクロニクス 電気的接触子及び電気的接続装置
JP2021028603A (ja) 2019-08-09 2021-02-25 株式会社日本マイクロニクス 電気的接触子及び電気的接続装置
CN111825056B (zh) * 2020-07-17 2024-10-25 杭州电子科技大学 基于飞秒激光与高温成型悬臂梁探针的方法及悬臂梁探针
KR102762781B1 (ko) * 2022-06-24 2025-02-05 주식회사 가온닉스 전자부품의 회로 검사용 프로브 제조 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001337110A (ja) * 2000-05-29 2001-12-07 Bureijingu:Kk プローブピンおよびプローブカード
TW520545B (en) * 2000-11-13 2003-02-11 Tokyo Electron Ltd Contactor, method for manufacturing the same, and probe card using the same
TW531646B (en) * 1999-03-25 2003-05-11 Tokyo Cathode Lab Probecard probe and manufacturing method thereof
TWI277738B (en) * 2005-01-14 2007-04-01 Nihon Micronics Kabushiki Kais Continuity testing probe
JP2007192719A (ja) * 2006-01-20 2007-08-02 Japan Electronic Materials Corp プローブカード
US20070216433A1 (en) * 2003-05-13 2007-09-20 Kiyotoshi Miura Probe For Electric Test

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0390865A (ja) * 1989-09-01 1991-04-16 Sumitomo Electric Ind Ltd プローブカードのプローブ
JP2005351846A (ja) * 2004-06-14 2005-12-22 Micronics Japan Co Ltd プローブ針
JP2007271343A (ja) * 2006-03-30 2007-10-18 Sumitomo Electric Ind Ltd コンタクトプローブおよびその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW531646B (en) * 1999-03-25 2003-05-11 Tokyo Cathode Lab Probecard probe and manufacturing method thereof
JP2001337110A (ja) * 2000-05-29 2001-12-07 Bureijingu:Kk プローブピンおよびプローブカード
TW520545B (en) * 2000-11-13 2003-02-11 Tokyo Electron Ltd Contactor, method for manufacturing the same, and probe card using the same
US20070216433A1 (en) * 2003-05-13 2007-09-20 Kiyotoshi Miura Probe For Electric Test
TWI277738B (en) * 2005-01-14 2007-04-01 Nihon Micronics Kabushiki Kais Continuity testing probe
JP2007192719A (ja) * 2006-01-20 2007-08-02 Japan Electronic Materials Corp プローブカード

Also Published As

Publication number Publication date
TW200940999A (en) 2009-10-01
JP2009229410A (ja) 2009-10-08
KR101029987B1 (ko) 2011-04-20
KR20090102636A (ko) 2009-09-30

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