KR101029987B1 - 전기 시험용 접촉자 및 그 제조방법 - Google Patents
전기 시험용 접촉자 및 그 제조방법 Download PDFInfo
- Publication number
- KR101029987B1 KR101029987B1 KR1020090015145A KR20090015145A KR101029987B1 KR 101029987 B1 KR101029987 B1 KR 101029987B1 KR 1020090015145 A KR1020090015145 A KR 1020090015145A KR 20090015145 A KR20090015145 A KR 20090015145A KR 101029987 B1 KR101029987 B1 KR 101029987B1
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- KR
- South Korea
- Prior art keywords
- contact
- contact portion
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Geometry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2008-078560 | 2008-03-25 | ||
| JP2008078560A JP2009229410A (ja) | 2008-03-25 | 2008-03-25 | 電気試験用接触子及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20090102636A KR20090102636A (ko) | 2009-09-30 |
| KR101029987B1 true KR101029987B1 (ko) | 2011-04-20 |
Family
ID=41244964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020090015145A Active KR101029987B1 (ko) | 2008-03-25 | 2009-02-24 | 전기 시험용 접촉자 및 그 제조방법 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2009229410A (https=) |
| KR (1) | KR101029987B1 (https=) |
| TW (1) | TWI399544B (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240000932A (ko) * | 2022-06-24 | 2024-01-03 | 주식회사 가온닉스 | 전자부품의 회로 검사용 프로브 제조 방법 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9052342B2 (en) | 2011-09-30 | 2015-06-09 | Formfactor, Inc. | Probe with cantilevered beam having solid and hollow sections |
| JP2014016204A (ja) | 2012-07-06 | 2014-01-30 | Micronics Japan Co Ltd | 電気的接触子及び電気的接触子の接触方法 |
| JP5968158B2 (ja) | 2012-08-10 | 2016-08-10 | 株式会社日本マイクロニクス | コンタクトプローブ及びプローブカード |
| JP6068925B2 (ja) * | 2012-10-23 | 2017-01-25 | 株式会社日本マイクロニクス | プローブの製造方法 |
| KR102466151B1 (ko) * | 2015-11-30 | 2022-11-15 | 삼성전자주식회사 | 프로브 카드 및 그를 포함하는 테스트 장치 |
| JP7353859B2 (ja) * | 2019-08-09 | 2023-10-02 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
| JP2021028603A (ja) | 2019-08-09 | 2021-02-25 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
| CN111825056B (zh) * | 2020-07-17 | 2024-10-25 | 杭州电子科技大学 | 基于飞秒激光与高温成型悬臂梁探针的方法及悬臂梁探针 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000338131A (ja) | 1999-03-25 | 2000-12-08 | Tokyo Cathode Laboratory Co Ltd | プローブカード用探針及びその製造方法 |
| JP2001337110A (ja) | 2000-05-29 | 2001-12-07 | Bureijingu:Kk | プローブピンおよびプローブカード |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0390865A (ja) * | 1989-09-01 | 1991-04-16 | Sumitomo Electric Ind Ltd | プローブカードのプローブ |
| JP4527267B2 (ja) * | 2000-11-13 | 2010-08-18 | 東京エレクトロン株式会社 | コンタクタの製造方法 |
| KR100664393B1 (ko) * | 2003-05-13 | 2007-01-04 | 가부시키가이샤 니혼 마이크로닉스 | 통전 시험용 프로브 |
| JP2005351846A (ja) * | 2004-06-14 | 2005-12-22 | Micronics Japan Co Ltd | プローブ針 |
| JP4932499B2 (ja) * | 2005-01-14 | 2012-05-16 | 株式会社日本マイクロニクス | 通電試験用プローブ |
| JP2007192719A (ja) * | 2006-01-20 | 2007-08-02 | Japan Electronic Materials Corp | プローブカード |
| JP2007271343A (ja) * | 2006-03-30 | 2007-10-18 | Sumitomo Electric Ind Ltd | コンタクトプローブおよびその製造方法 |
-
2008
- 2008-03-25 JP JP2008078560A patent/JP2009229410A/ja active Pending
-
2009
- 2009-02-09 TW TW098104020A patent/TWI399544B/zh active
- 2009-02-24 KR KR1020090015145A patent/KR101029987B1/ko active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000338131A (ja) | 1999-03-25 | 2000-12-08 | Tokyo Cathode Laboratory Co Ltd | プローブカード用探針及びその製造方法 |
| JP2001337110A (ja) | 2000-05-29 | 2001-12-07 | Bureijingu:Kk | プローブピンおよびプローブカード |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240000932A (ko) * | 2022-06-24 | 2024-01-03 | 주식회사 가온닉스 | 전자부품의 회로 검사용 프로브 제조 방법 |
| KR102762781B1 (ko) | 2022-06-24 | 2025-02-05 | 주식회사 가온닉스 | 전자부품의 회로 검사용 프로브 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200940999A (en) | 2009-10-01 |
| JP2009229410A (ja) | 2009-10-08 |
| KR20090102636A (ko) | 2009-09-30 |
| TWI399544B (zh) | 2013-06-21 |
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