JP5631131B2 - 通電試験用プローブ及びプローブ組立体 - Google Patents
通電試験用プローブ及びプローブ組立体 Download PDFInfo
- Publication number
- JP5631131B2 JP5631131B2 JP2010208822A JP2010208822A JP5631131B2 JP 5631131 B2 JP5631131 B2 JP 5631131B2 JP 2010208822 A JP2010208822 A JP 2010208822A JP 2010208822 A JP2010208822 A JP 2010208822A JP 5631131 B2 JP5631131 B2 JP 5631131B2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- recess
- pedestal
- needle tip
- needle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/303—Contactless testing of integrated circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
22 プローブ組立体
26,100,102 プローブ
34,124,130 針本体部
36,126,132 針先部
44,104,112,128,134 台座部
46,136 凹所
48 開放面
50 開放端
52 中央領域
54 側方領域
56,106,114,138 結合部
58,108,116,140 延在部
60 先端
62,110,118 境界部
120 垂直プローブ
122 スパイラルスプリング型プローブ
Claims (5)
- 平板状の針本体部と、該針本体部に設けられた板状の台座部であって、左右方向を厚さ方向とする台座部と、該台座部から下方に延びる針先部であって、下端が被検査体に当接される先端とされた針先部とを含み、
前記台座部は、少なくとも下方に開放する凹所であって、その開放面に対向する中央領域と、前後方向における前記中央領域の各端に連続しかつ該中央領域から前記凹所の開放端に達する側方領域とにより規定される凹所を備え、
該針先部は、前記台座部より硬質の材料で製作されており、また前記台座部に埋め込まれ又は嵌め込まれて結合された結合部と、前記凹所から下方に延びる板状の延在部であって、前記凹所の厚さ寸法よりも小さい厚さ寸法を有する延在部とを備え、
前記延在部は、前記中央領域から各側方領域に渡って前記凹所に接する境界部と、前記先端とを備え、前記境界部は前記中央領域及び前記側方領域が並ぶ第1の方向に沿って弧状、V字状又はコの字状の凹形状に形成されている、通電試験用プローブ。 - 前記中央領域及び前記側方領域は、前後方向に延びる1つの弧面を共同して形成している、請求項1に記載の通電試験用プローブ。
- 前記結合部は、左右方向における前記凹所のほぼ中央に位置されている、請求項1に記載の通電試験用プローブ。
- 複数のプローブランドを下面に備えるプローブ基板と、前記プローブランドに取り付けられた複数のプローブとを含み、
前記複数のプローブは、請求項1に記載の通電試験用プローブである、プローブ組立体。 - 各プローブは、片持ち梁状に前記プローブ基板に取り付けられている、請求項4に記載のプローブ組立体。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010208822A JP5631131B2 (ja) | 2010-09-17 | 2010-09-17 | 通電試験用プローブ及びプローブ組立体 |
KR1020110087062A KR101310643B1 (ko) | 2010-09-17 | 2011-08-30 | 통전 시험용 프로브 및 프로브 조립체 |
US13/235,155 US8975908B2 (en) | 2010-09-17 | 2011-09-16 | Electrical test probe and probe assembly with improved probe tip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010208822A JP5631131B2 (ja) | 2010-09-17 | 2010-09-17 | 通電試験用プローブ及びプローブ組立体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012063288A JP2012063288A (ja) | 2012-03-29 |
JP5631131B2 true JP5631131B2 (ja) | 2014-11-26 |
Family
ID=45817182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010208822A Active JP5631131B2 (ja) | 2010-09-17 | 2010-09-17 | 通電試験用プローブ及びプローブ組立体 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8975908B2 (ja) |
JP (1) | JP5631131B2 (ja) |
KR (1) | KR101310643B1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101136534B1 (ko) * | 2010-09-07 | 2012-04-17 | 한국기계연구원 | 프로브 카드 및 이의 제조 방법 |
KR102466151B1 (ko) * | 2015-11-30 | 2022-11-15 | 삼성전자주식회사 | 프로브 카드 및 그를 포함하는 테스트 장치 |
TWI713939B (zh) * | 2017-12-18 | 2020-12-21 | 義大利商探針科技公司 | 用於測試電子裝置的測試頭的接觸探針 |
JP1646397S (ja) * | 2019-05-21 | 2019-11-25 | ||
JP7439338B1 (ja) * | 2022-03-30 | 2024-02-27 | 日本電子材料株式会社 | プローブ、プローブカード、およびプローブの製造方法 |
TWI825798B (zh) * | 2022-06-22 | 2023-12-11 | 吳俊杰 | 彈性探針及電路測試裝置 |
CN115951203B (zh) * | 2023-03-14 | 2023-06-16 | 杭州朗迅科技股份有限公司 | 一种双模组集成电路高频测试设备 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5974662A (en) * | 1993-11-16 | 1999-11-02 | Formfactor, Inc. | Method of planarizing tips of probe elements of a probe card assembly |
JPH0850144A (ja) * | 1994-08-08 | 1996-02-20 | N Pii S Kk | 電極探針 |
US6183268B1 (en) * | 1999-04-27 | 2001-02-06 | The Whitaker Corporation | High-density electrical connectors and electrical receptacle contacts therefor |
JP5195825B2 (ja) | 2000-02-15 | 2013-05-15 | 日本精工株式会社 | 車両用ステアリング装置 |
JP3641609B2 (ja) * | 2001-12-13 | 2005-04-27 | 日本電子材料株式会社 | プローブカード用鉛筆型プローブの製造方法 |
US7567089B2 (en) * | 2003-02-04 | 2009-07-28 | Microfabrica Inc. | Two-part microprobes for contacting electronic components and methods for making such probes |
DE102004036407A1 (de) * | 2003-08-27 | 2005-06-09 | Japan Electronic Materials Corp., Amagasaki | Prüfkarte und Verbinder für diese |
WO2006075408A1 (ja) | 2005-01-14 | 2006-07-20 | Kabushiki Kaisha Nihon Micronics | 通電試験用プローブ |
TW200815763A (en) * | 2006-09-26 | 2008-04-01 | Nihon Micronics Kabushiki Kaisha | Electrical test probe and electrical test probe assembly |
JP5123508B2 (ja) * | 2006-09-26 | 2013-01-23 | 株式会社日本マイクロニクス | 通電試験用プローブおよび通電試験用プローブ組立体 |
JP2008145238A (ja) | 2006-12-08 | 2008-06-26 | Micronics Japan Co Ltd | 電気接続器及びこれを用いた電気的接続装置 |
US20110043192A1 (en) * | 2009-08-24 | 2011-02-24 | Shih-Ming Liu | Coaxial-cable probe structure |
-
2010
- 2010-09-17 JP JP2010208822A patent/JP5631131B2/ja active Active
-
2011
- 2011-08-30 KR KR1020110087062A patent/KR101310643B1/ko active IP Right Grant
- 2011-09-16 US US13/235,155 patent/US8975908B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20120029995A (ko) | 2012-03-27 |
KR101310643B1 (ko) | 2013-09-23 |
US20120068726A1 (en) | 2012-03-22 |
US8975908B2 (en) | 2015-03-10 |
JP2012063288A (ja) | 2012-03-29 |
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