TWI392713B - 粉體塗料及在製造印刷電路板中製備薄層的方法 - Google Patents
粉體塗料及在製造印刷電路板中製備薄層的方法 Download PDFInfo
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- TWI392713B TWI392713B TW093107126A TW93107126A TWI392713B TW I392713 B TWI392713 B TW I392713B TW 093107126 A TW093107126 A TW 093107126A TW 93107126 A TW93107126 A TW 93107126A TW I392713 B TWI392713 B TW I392713B
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- powder coating
- coating
- substrate
- powder
- filler
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- 230000009969 flowable effect Effects 0.000 description 1
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- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- FLBJFXNAEMSXGL-UHFFFAOYSA-N het anhydride Chemical compound O=C1OC(=O)C2C1C1(Cl)C(Cl)=C(Cl)C2(Cl)C1(Cl)Cl FLBJFXNAEMSXGL-UHFFFAOYSA-N 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- 239000011346 highly viscous material Substances 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000004849 latent hardener Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical group [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- 239000000825 pharmaceutical preparation Substances 0.000 description 1
- 229940127557 pharmaceutical product Drugs 0.000 description 1
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 1
- 229920000090 poly(aryl ether) Polymers 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- 229920000428 triblock copolymer Polymers 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/03—Powdery paints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1355—Powder coating of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2003113555 DE10313555A1 (de) | 2003-03-26 | 2003-03-26 | Pulverlack und Verfahren für die Erzeugung dünner Schichten im Leiterplattenbau |
| DE2003113556 DE10313556A1 (de) | 2003-03-26 | 2003-03-26 | Pulverlack und Verfahren für die Erzeugung dünner Schichten im Leiterplattenbau |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200420692A TW200420692A (en) | 2004-10-16 |
| TWI392713B true TWI392713B (zh) | 2013-04-11 |
Family
ID=33099289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093107126A TWI392713B (zh) | 2003-03-26 | 2004-03-17 | 粉體塗料及在製造印刷電路板中製備薄層的方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20070093620A1 (enExample) |
| EP (1) | EP1606358A2 (enExample) |
| JP (1) | JP5602334B2 (enExample) |
| KR (1) | KR101159287B1 (enExample) |
| BR (1) | BRPI0408747A (enExample) |
| CA (1) | CA2520132A1 (enExample) |
| TW (1) | TWI392713B (enExample) |
| WO (1) | WO2004085550A2 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2542716T3 (es) * | 2006-05-11 | 2015-08-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Resinas a base de cianato, de curado a baja temperatura, resistentes a las llamas con propiedades mejoradas |
| DE602007008593D1 (de) * | 2007-12-12 | 2010-09-30 | Atotech Deutschland Gmbh | Festpulverformulierungen für die Zubereitung von harzbeschichteten Folien und ihre Verwendung bei der Herstellung von Leiterplatten |
| ES2572829T3 (es) * | 2009-01-06 | 2016-06-02 | Ewald Dörken Ag | Procedimiento para la preparación de un barniz en polvo |
| DE102009009650B4 (de) | 2009-02-19 | 2013-10-10 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum Herstellen einer Kunststoffschicht sowie deren Verwendung |
| EP2448380A1 (en) * | 2010-10-26 | 2012-05-02 | ATOTECH Deutschland GmbH | Composite build-up material for embedding of circuitry |
| JP6680523B2 (ja) * | 2015-12-07 | 2020-04-15 | ソマール株式会社 | 粉体塗料 |
| JP6761573B2 (ja) * | 2015-12-21 | 2020-09-30 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
| JP7392659B2 (ja) * | 2018-12-21 | 2023-12-06 | 株式会社レゾナック | 封止組成物及び半導体装置 |
| US11134575B2 (en) * | 2019-09-30 | 2021-09-28 | Gentherm Gmbh | Dual conductor laminated substrate |
| WO2021108775A1 (en) * | 2019-11-27 | 2021-06-03 | Hsio Technologies, Llc | Pcb fabrication with dielectric powder or suspension |
| WO2022010972A1 (en) * | 2020-07-07 | 2022-01-13 | Ppg Industries Ohio, Inc. | Curable coating compositions |
| TWI833095B (zh) | 2020-07-28 | 2024-02-21 | 美商聖高拜塑膠製品公司 | 敷銅層板、含其之印刷電路基板及其形成方法 |
| CN111909594A (zh) * | 2020-08-11 | 2020-11-10 | 江苏万源新材料股份有限公司 | 一种有防腐功能的分子筛涂层铝箔及其制备工艺 |
| CA3209305A1 (en) * | 2022-08-17 | 2024-02-17 | Ppg Industries Ohio, Inc. | Dielectric coatings |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010020071A1 (en) * | 1997-10-10 | 2001-09-06 | Capote Miguel Albert | High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
| CN1402767A (zh) * | 1999-10-05 | 2003-03-12 | 通用电气公司 | 粉末涂料组合物 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3860557A (en) * | 1971-01-18 | 1975-01-14 | Beatrice Foods Co | Electrostatic method of applying multilayer coating and product produced thereby |
| JPS5853673B2 (ja) * | 1979-03-22 | 1983-11-30 | 日立化成工業株式会社 | 化学メッキ用粉末塗料の製造法 |
| JPS57162764A (en) * | 1981-03-31 | 1982-10-06 | Hitachi Chem Co Ltd | Preparation of chemically platable powder coating |
| JPS617331A (ja) * | 1984-06-21 | 1986-01-14 | Mitsubishi Gas Chem Co Inc | 難燃性の硬化性樹脂組成物 |
| JPH0660294B2 (ja) * | 1986-06-05 | 1994-08-10 | ソマ−ル株式会社 | エポキシ樹脂系粉体塗料組成物 |
| DE3737495A1 (de) * | 1987-11-05 | 1989-05-18 | Hoechst Ag | Verfahren zur erhoehung der elektrostatischen aufladbarkeit von pulverlacken oder pulvern und deren verwendung zur oberflaechenbeschichtung von festen gegenstaenden |
| JPH0370729A (ja) * | 1989-08-11 | 1991-03-26 | Mitsubishi Petrochem Co Ltd | エポキシ樹脂・ビスマレイミド系熱硬化性樹脂組成物 |
| JPH0420518A (ja) * | 1990-05-15 | 1992-01-24 | Nitto Denko Corp | 耐熱性粉体樹脂組成物 |
| JPH0493343A (ja) * | 1990-08-08 | 1992-03-26 | Nitto Denko Corp | 粉体樹脂組成物 |
| US5290882A (en) * | 1991-08-13 | 1994-03-01 | Shin-Etsu Chemical Co., Ltd. | Thermosetting resin compositions |
| EP0540027B1 (en) * | 1991-10-31 | 1999-06-09 | Daicel Chemical Industries, Ltd. | Compositions, expoxidized compositions, a heat-curable resin composition, an epoxy resin composition, radically polymerized composition, a curable resin composition and a polymer having epoxy groups |
| US5340912A (en) * | 1993-02-23 | 1994-08-23 | Shell Oil Company | Cyanate resins |
| EP0755420B1 (en) * | 1994-04-13 | 1999-10-20 | PPG Industries Ohio, Inc. | Thermosetting powder coating compositions |
| US6159556A (en) * | 1995-05-19 | 2000-12-12 | Basf Coatings Ag | Process for preparing an aqueous powder coating dispersion and using the same |
| EP0844913B1 (de) * | 1996-06-14 | 2002-09-25 | BASF Lacke und Farben AG | Verfahren zur beschichtung von metallbändern |
| GB9814534D0 (en) * | 1998-07-03 | 1998-09-02 | Courtaulds Coatings Holdings | Powder coating compositions |
| US6103835A (en) * | 1998-11-11 | 2000-08-15 | Shell Oil Company | Epoxy-functional polyester advanced with carboxyl-functional polyester or dicarboxylic acid (anhydride) |
| US6180723B1 (en) * | 1999-04-27 | 2001-01-30 | Donald J. Keehan | Epoxy resin prepared by reacting poly-p-hydroxystyrene with epichlorohydrin |
| JP2000313736A (ja) * | 1999-04-28 | 2000-11-14 | Yuka Shell Epoxy Kk | エポキシ樹脂組成物及び粉体塗料組成物 |
| DE19933095A1 (de) * | 1999-07-15 | 2001-01-18 | Herberts Gmbh & Co Kg | Pulverlackzusammensetzung und Verfahren zur Substratbeschichtung |
| US6437045B1 (en) * | 1999-11-10 | 2002-08-20 | Vantico Inc. | Powder coating of carboxyl polyester or (poly)methacrylate and cycloaliphatic polyepoxide |
| TW583258B (en) * | 2001-01-10 | 2004-04-11 | Hitachi Chemical Co Ltd | Thermosetting resin composition and laminated board for wiring board using the same |
| MY138485A (en) * | 2001-03-12 | 2009-06-30 | Hitachi Chemical Co Ltd | Process for producing benzoxazine resin |
-
2004
- 2004-03-17 TW TW093107126A patent/TWI392713B/zh not_active IP Right Cessation
- 2004-03-22 KR KR1020057017704A patent/KR101159287B1/ko not_active Expired - Fee Related
- 2004-03-22 BR BRPI0408747-0A patent/BRPI0408747A/pt not_active IP Right Cessation
- 2004-03-22 EP EP04722275A patent/EP1606358A2/en not_active Withdrawn
- 2004-03-22 CA CA002520132A patent/CA2520132A1/en not_active Abandoned
- 2004-03-22 JP JP2006504797A patent/JP5602334B2/ja not_active Expired - Fee Related
- 2004-03-22 US US10/550,468 patent/US20070093620A1/en not_active Abandoned
- 2004-03-22 WO PCT/EP2004/003001 patent/WO2004085550A2/en not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010020071A1 (en) * | 1997-10-10 | 2001-09-06 | Capote Miguel Albert | High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
| CN1402767A (zh) * | 1999-10-05 | 2003-03-12 | 通用电气公司 | 粉末涂料组合物 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200420692A (en) | 2004-10-16 |
| WO2004085550A2 (en) | 2004-10-07 |
| KR20050109598A (ko) | 2005-11-21 |
| KR101159287B1 (ko) | 2012-07-03 |
| JP2006521434A (ja) | 2006-09-21 |
| BRPI0408747A (pt) | 2006-03-28 |
| WO2004085550A3 (en) | 2005-08-18 |
| EP1606358A2 (en) | 2005-12-21 |
| US20070093620A1 (en) | 2007-04-26 |
| JP5602334B2 (ja) | 2014-10-08 |
| CA2520132A1 (en) | 2004-10-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |