CA2520132A1 - Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards - Google Patents
Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards Download PDFInfo
- Publication number
- CA2520132A1 CA2520132A1 CA002520132A CA2520132A CA2520132A1 CA 2520132 A1 CA2520132 A1 CA 2520132A1 CA 002520132 A CA002520132 A CA 002520132A CA 2520132 A CA2520132 A CA 2520132A CA 2520132 A1 CA2520132 A1 CA 2520132A1
- Authority
- CA
- Canada
- Prior art keywords
- powder coating
- coating according
- filler
- powder
- iii
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 238000000576 coating method Methods 0.000 title claims abstract description 102
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- 230000008569 process Effects 0.000 title claims abstract description 54
- 238000002360 preparation method Methods 0.000 title claims abstract description 24
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- 239000000654 additive Substances 0.000 claims description 16
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 14
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- 238000013007 heat curing Methods 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-UHFFFAOYSA-N hexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21 MUTGBJKUEZFXGO-UHFFFAOYSA-N 0.000 description 1
- 239000011346 highly viscous material Substances 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 206010022000 influenza Diseases 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004849 latent hardener Substances 0.000 description 1
- 239000012669 liquid formulation Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 229940102838 methylmethacrylate Drugs 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N phthalic anhydride Chemical compound C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000010454 slate Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920000428 triblock copolymer Polymers 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/03—Powdery paints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1355—Powder coating of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2003113556 DE10313556A1 (de) | 2003-03-26 | 2003-03-26 | Pulverlack und Verfahren für die Erzeugung dünner Schichten im Leiterplattenbau |
| DE10313556.1 | 2003-03-26 | ||
| DE10313555.3 | 2003-03-26 | ||
| DE2003113555 DE10313555A1 (de) | 2003-03-26 | 2003-03-26 | Pulverlack und Verfahren für die Erzeugung dünner Schichten im Leiterplattenbau |
| PCT/EP2004/003001 WO2004085550A2 (en) | 2003-03-26 | 2004-03-22 | Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2520132A1 true CA2520132A1 (en) | 2004-10-07 |
Family
ID=33099289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002520132A Abandoned CA2520132A1 (en) | 2003-03-26 | 2004-03-22 | Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20070093620A1 (enExample) |
| EP (1) | EP1606358A2 (enExample) |
| JP (1) | JP5602334B2 (enExample) |
| KR (1) | KR101159287B1 (enExample) |
| BR (1) | BRPI0408747A (enExample) |
| CA (1) | CA2520132A1 (enExample) |
| TW (1) | TWI392713B (enExample) |
| WO (1) | WO2004085550A2 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1854827B1 (de) * | 2006-05-11 | 2015-04-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Flammfeste, niedrigtemperaturhärtende, cyanatbasierte Harze mit verbesserten Eigenschaften |
| DE602007008593D1 (de) * | 2007-12-12 | 2010-09-30 | Atotech Deutschland Gmbh | Festpulverformulierungen für die Zubereitung von harzbeschichteten Folien und ihre Verwendung bei der Herstellung von Leiterplatten |
| WO2010079181A1 (de) * | 2009-01-06 | 2010-07-15 | Ewald Dörken Ag | Verfahren zur herstellung eines pulverlacks |
| DE102009009650B4 (de) | 2009-02-19 | 2013-10-10 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum Herstellen einer Kunststoffschicht sowie deren Verwendung |
| EP2448380A1 (en) * | 2010-10-26 | 2012-05-02 | ATOTECH Deutschland GmbH | Composite build-up material for embedding of circuitry |
| JP6680523B2 (ja) * | 2015-12-07 | 2020-04-15 | ソマール株式会社 | 粉体塗料 |
| JP6761573B2 (ja) * | 2015-12-21 | 2020-09-30 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
| WO2020130097A1 (ja) * | 2018-12-21 | 2020-06-25 | 日立化成株式会社 | 封止組成物及び半導体装置 |
| US11134575B2 (en) * | 2019-09-30 | 2021-09-28 | Gentherm Gmbh | Dual conductor laminated substrate |
| WO2021108775A1 (en) * | 2019-11-27 | 2021-06-03 | Hsio Technologies, Llc | Pcb fabrication with dielectric powder or suspension |
| US20230272209A1 (en) * | 2020-07-07 | 2023-08-31 | Ppg Industries Ohio, Inc. | Curable coating compositions |
| TWI833095B (zh) | 2020-07-28 | 2024-02-21 | 美商聖高拜塑膠製品公司 | 敷銅層板、含其之印刷電路基板及其形成方法 |
| CN111909594A (zh) * | 2020-08-11 | 2020-11-10 | 江苏万源新材料股份有限公司 | 一种有防腐功能的分子筛涂层铝箔及其制备工艺 |
| CA3209305A1 (en) * | 2022-08-17 | 2024-02-17 | Ppg Industries Ohio, Inc. | Dielectric coatings |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3860557A (en) * | 1971-01-18 | 1975-01-14 | Beatrice Foods Co | Electrostatic method of applying multilayer coating and product produced thereby |
| JPS5853673B2 (ja) * | 1979-03-22 | 1983-11-30 | 日立化成工業株式会社 | 化学メッキ用粉末塗料の製造法 |
| JPS57162764A (en) * | 1981-03-31 | 1982-10-06 | Hitachi Chem Co Ltd | Preparation of chemically platable powder coating |
| JPS617331A (ja) * | 1984-06-21 | 1986-01-14 | Mitsubishi Gas Chem Co Inc | 難燃性の硬化性樹脂組成物 |
| JPH0660294B2 (ja) * | 1986-06-05 | 1994-08-10 | ソマ−ル株式会社 | エポキシ樹脂系粉体塗料組成物 |
| DE3737495A1 (de) * | 1987-11-05 | 1989-05-18 | Hoechst Ag | Verfahren zur erhoehung der elektrostatischen aufladbarkeit von pulverlacken oder pulvern und deren verwendung zur oberflaechenbeschichtung von festen gegenstaenden |
| JPH0370729A (ja) * | 1989-08-11 | 1991-03-26 | Mitsubishi Petrochem Co Ltd | エポキシ樹脂・ビスマレイミド系熱硬化性樹脂組成物 |
| JPH0420518A (ja) * | 1990-05-15 | 1992-01-24 | Nitto Denko Corp | 耐熱性粉体樹脂組成物 |
| JPH0493343A (ja) * | 1990-08-08 | 1992-03-26 | Nitto Denko Corp | 粉体樹脂組成物 |
| US5290882A (en) * | 1991-08-13 | 1994-03-01 | Shin-Etsu Chemical Co., Ltd. | Thermosetting resin compositions |
| DE69229383D1 (de) * | 1991-10-31 | 1999-07-15 | Daicel Chem | Epoxydharzzusammensetzungen |
| US5340912A (en) * | 1993-02-23 | 1994-08-23 | Shell Oil Company | Cyanate resins |
| CA2187820C (en) * | 1994-04-13 | 2000-05-30 | Chun-Tzer Chou | Thermosetting powder coating compositions |
| AU719294B2 (en) * | 1995-05-19 | 2000-05-04 | Basf Coatings Aktiengesellschaft | Aqueous powder coating dispersion |
| US20010002274A1 (en) * | 1996-06-14 | 2001-05-31 | Peter Lessmeister | Metal strip coating process |
| US20010020071A1 (en) * | 1997-10-10 | 2001-09-06 | Capote Miguel Albert | High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
| GB9814534D0 (en) * | 1998-07-03 | 1998-09-02 | Courtaulds Coatings Holdings | Powder coating compositions |
| US6103835A (en) * | 1998-11-11 | 2000-08-15 | Shell Oil Company | Epoxy-functional polyester advanced with carboxyl-functional polyester or dicarboxylic acid (anhydride) |
| US6180723B1 (en) * | 1999-04-27 | 2001-01-30 | Donald J. Keehan | Epoxy resin prepared by reacting poly-p-hydroxystyrene with epichlorohydrin |
| JP2000313736A (ja) * | 1999-04-28 | 2000-11-14 | Yuka Shell Epoxy Kk | エポキシ樹脂組成物及び粉体塗料組成物 |
| DE19933095A1 (de) * | 1999-07-15 | 2001-01-18 | Herberts Gmbh & Co Kg | Pulverlackzusammensetzung und Verfahren zur Substratbeschichtung |
| US6576718B1 (en) * | 1999-10-05 | 2003-06-10 | General Electric Company | Powder coating of thermosetting resin(s) and poly(phenylene ethers(s)) |
| US6437045B1 (en) * | 1999-11-10 | 2002-08-20 | Vantico Inc. | Powder coating of carboxyl polyester or (poly)methacrylate and cycloaliphatic polyepoxide |
| TW583258B (en) * | 2001-01-10 | 2004-04-11 | Hitachi Chemical Co Ltd | Thermosetting resin composition and laminated board for wiring board using the same |
| MY138485A (en) * | 2001-03-12 | 2009-06-30 | Hitachi Chemical Co Ltd | Process for producing benzoxazine resin |
-
2004
- 2004-03-17 TW TW093107126A patent/TWI392713B/zh not_active IP Right Cessation
- 2004-03-22 WO PCT/EP2004/003001 patent/WO2004085550A2/en not_active Ceased
- 2004-03-22 BR BRPI0408747-0A patent/BRPI0408747A/pt not_active IP Right Cessation
- 2004-03-22 CA CA002520132A patent/CA2520132A1/en not_active Abandoned
- 2004-03-22 JP JP2006504797A patent/JP5602334B2/ja not_active Expired - Fee Related
- 2004-03-22 KR KR1020057017704A patent/KR101159287B1/ko not_active Expired - Fee Related
- 2004-03-22 US US10/550,468 patent/US20070093620A1/en not_active Abandoned
- 2004-03-22 EP EP04722275A patent/EP1606358A2/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| TWI392713B (zh) | 2013-04-11 |
| WO2004085550A2 (en) | 2004-10-07 |
| TW200420692A (en) | 2004-10-16 |
| WO2004085550A3 (en) | 2005-08-18 |
| JP5602334B2 (ja) | 2014-10-08 |
| BRPI0408747A (pt) | 2006-03-28 |
| KR20050109598A (ko) | 2005-11-21 |
| US20070093620A1 (en) | 2007-04-26 |
| KR101159287B1 (ko) | 2012-07-03 |
| JP2006521434A (ja) | 2006-09-21 |
| EP1606358A2 (en) | 2005-12-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |