TWI377352B - - Google Patents

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Publication number
TWI377352B
TWI377352B TW094133825A TW94133825A TWI377352B TW I377352 B TWI377352 B TW I377352B TW 094133825 A TW094133825 A TW 094133825A TW 94133825 A TW94133825 A TW 94133825A TW I377352 B TWI377352 B TW I377352B
Authority
TW
Taiwan
Prior art keywords
lsi
test
probe
coil
wafer
Prior art date
Application number
TW094133825A
Other languages
English (en)
Chinese (zh)
Other versions
TW200619652A (en
Inventor
Tadahiro Kuroda
Daisuke Mizoguchi
Noriyuki Miura
Original Assignee
Univ Keio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Keio filed Critical Univ Keio
Publication of TW200619652A publication Critical patent/TW200619652A/zh
Application granted granted Critical
Publication of TWI377352B publication Critical patent/TWI377352B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/315—Contactless testing by inductive methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/3025—Wireless interface with the DUT

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW094133825A 2004-09-30 2005-09-28 Electronic circuit TW200619652A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004289268A JP5024740B2 (ja) 2004-09-30 2004-09-30 Ｌｓｉチップ試験装置

Publications (2)

Publication Number Publication Date
TW200619652A TW200619652A (en) 2006-06-16
TWI377352B true TWI377352B (enExample) 2012-11-21

Family

ID=36118793

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133825A TW200619652A (en) 2004-09-30 2005-09-28 Electronic circuit

Country Status (5)

Country Link
US (1) US8648614B2 (enExample)
JP (1) JP5024740B2 (enExample)
KR (1) KR101212042B1 (enExample)
TW (1) TW200619652A (enExample)
WO (1) WO2006035644A1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7999383B2 (en) * 2006-07-21 2011-08-16 Bae Systems Information And Electronic Systems Integration Inc. High speed, high density, low power die interconnect system
DE102007030745A1 (de) * 2007-07-02 2009-01-08 Siemens Medical Instruments Pte. Ltd. Mehrkomponentiges Hörgerätesystem und ein Verfahren zu seinem Betrieb
US9053950B2 (en) 2007-11-26 2015-06-09 Keio University Electronic circuit
JP5600237B2 (ja) 2008-02-02 2014-10-01 学校法人慶應義塾 集積回路
JP5475962B2 (ja) 2008-04-28 2014-04-16 学校法人慶應義塾 電子回路
JP5252486B2 (ja) 2008-05-14 2013-07-31 学校法人慶應義塾 インダクタ素子、集積回路装置、及び、三次元実装回路装置
JP5671200B2 (ja) 2008-06-03 2015-02-18 学校法人慶應義塾 電子回路
JP4982778B2 (ja) 2008-07-04 2012-07-25 学校法人慶應義塾 電子回路装置
KR20100015206A (ko) * 2008-08-04 2010-02-12 삼성전자주식회사 무선 테스트용 인터페이스 장치, 그것을 포함하는 반도체소자와 반도체 패키지 및 그것을 이용한 무선 테스트 방법
JP5325495B2 (ja) 2008-08-12 2013-10-23 学校法人慶應義塾 半導体装置及びその製造方法
JP5433199B2 (ja) 2008-10-21 2014-03-05 学校法人慶應義塾 電子回路
JP5326088B2 (ja) 2008-10-21 2013-10-30 学校法人慶應義塾 電子回路と通信機能検査方法
US7935549B2 (en) * 2008-12-09 2011-05-03 Renesas Electronics Corporation Seminconductor device
JP5283075B2 (ja) 2008-12-26 2013-09-04 学校法人慶應義塾 電子回路
JP5395458B2 (ja) 2009-02-25 2014-01-22 学校法人慶應義塾 インダクタ素子及び集積回路装置
JP5554937B2 (ja) * 2009-04-22 2014-07-23 パナソニック株式会社 非接触給電システム
JP5374246B2 (ja) 2009-06-12 2013-12-25 学校法人慶應義塾 密封型半導体記録媒体及び密封型半導体記録装置
JP5635759B2 (ja) 2009-10-15 2014-12-03 学校法人慶應義塾 積層半導体集積回路装置
JP5750031B2 (ja) 2010-11-19 2015-07-15 株式会社半導体エネルギー研究所 電子回路及び半導体装置
KR101313555B1 (ko) * 2011-11-10 2013-10-01 삼성중공업 주식회사 인쇄 회로 기판에 실장된 아이솔레이터의 검사 장치
JP2013197988A (ja) 2012-03-21 2013-09-30 Advantest Corp 無線通信装置および無線通信システム
TWI482971B (zh) * 2013-09-13 2015-05-01 Nat University Of Kaohsuing Inductive three - dimensional double - sided electrical measurement fixture
CN105676109B (zh) * 2016-01-08 2019-08-02 青岛海信电器股份有限公司 一种主板测试方法及设备
US10612992B2 (en) * 2017-11-03 2020-04-07 Lockheed Martin Corporation Strain gauge detection and orientation system

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Publication number Priority date Publication date Assignee Title
JPH022967A (ja) * 1988-06-17 1990-01-08 Nec Corp ブロービング装置
US5701037A (en) 1994-11-15 1997-12-23 Siemens Aktiengesellschaft Arrangement for inductive signal transmission between the chip layers of a vertically integrated circuit
DE19503329C2 (de) * 1995-02-02 2000-05-18 Ita Ingb Testaufgaben Gmbh Testvorrichtung für elektronische Flachbaugruppen
JPH08334541A (ja) * 1995-06-05 1996-12-17 Mitsubishi Electric Corp 電流検出器及びそれを利用したプリント板配線の接触部検出方法
JP3528367B2 (ja) 1995-09-30 2004-05-17 ソニーケミカル株式会社 リーダ・ライタ用アンテナ
JP3634074B2 (ja) * 1996-06-28 2005-03-30 日本発条株式会社 導電性接触子
US6242923B1 (en) 1997-02-27 2001-06-05 International Business Machines Corporation Method for detecting power plane-to-power plane shorts and I/O net-to power plane shorts in modules and printed circuit boards
US6154043A (en) * 1997-05-07 2000-11-28 Advanced Micro Devices, Inc. Method and apparatus for identifying the position of a selected semiconductor die relative to other dice formed from the same semiconductor wafer
US6236223B1 (en) * 1998-11-09 2001-05-22 Intermec Ip Corp. Method and apparatus for wireless radio frequency testing of RFID integrated circuits
JP3603996B2 (ja) 1999-04-28 2004-12-22 シャープ株式会社 シート抵抗測定器
TW536627B (en) 2000-07-24 2003-06-11 Sentec Ltd Current sensor
WO2002063675A1 (en) * 2001-02-02 2002-08-15 Hitachi, Ltd. Integrated circuit, method of testing integrated circuit and method of manufacturing integrated circuit
US6693426B1 (en) * 2002-02-09 2004-02-17 Intematix Corporation Spatially resolved spin resonance detection
JP2004037213A (ja) * 2002-07-02 2004-02-05 Konica Minolta Holdings Inc 半導体パッケージ及びその製造方法並びに半導体パッケージの検査方法
CA2404183C (en) * 2002-09-19 2008-09-02 Scanimetrics Inc. Non-contact tester for integrated circuits
US6958616B1 (en) * 2003-11-07 2005-10-25 Xilinx, Inc. Hybrid interface apparatus for testing integrated circuits having both low-speed and high-speed input/output pins
JP4131544B2 (ja) 2004-02-13 2008-08-13 学校法人慶應義塾 電子回路
JP4286182B2 (ja) * 2004-05-13 2009-06-24 富士通マイクロエレクトロニクス株式会社 電気的接続方法

Also Published As

Publication number Publication date
US8648614B2 (en) 2014-02-11
JP2006105630A (ja) 2006-04-20
KR20070067160A (ko) 2007-06-27
JP5024740B2 (ja) 2012-09-12
WO2006035644A1 (ja) 2006-04-06
TW200619652A (en) 2006-06-16
KR101212042B1 (ko) 2012-12-13
US20080258744A1 (en) 2008-10-23

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