JP2006105630A - 電子回路 - Google Patents
電子回路 Download PDFInfo
- Publication number
- JP2006105630A JP2006105630A JP2004289268A JP2004289268A JP2006105630A JP 2006105630 A JP2006105630 A JP 2006105630A JP 2004289268 A JP2004289268 A JP 2004289268A JP 2004289268 A JP2004289268 A JP 2004289268A JP 2006105630 A JP2006105630 A JP 2006105630A
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- lsi
- test
- probe
- transmission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 claims abstract description 58
- 230000005540 biological transmission Effects 0.000 claims abstract description 33
- 239000000523 sample Substances 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 4
- 238000004891 communication Methods 0.000 abstract description 15
- 239000000872 buffer Substances 0.000 abstract description 14
- 230000008878 coupling Effects 0.000 abstract description 12
- 238000010168 coupling process Methods 0.000 abstract description 12
- 238000005859 coupling reaction Methods 0.000 abstract description 12
- 230000001939 inductive effect Effects 0.000 abstract description 11
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/315—Contactless testing by inductive methods
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/3025—Wireless interface with the DUT
Abstract
【解決手段】第1、第2送信コイル21a、21b、及び第1、第2受信コイル23a、23bによる誘導性結合で構成される通信チャネルにプローブ15を介入させて、テスタ11、バッファ12、13、及びTx/Rxスイッチ14によってLSIを試験する。これにより、電子回路試験装置に電子回路のパッドやリードと接触する針を設ける必要がなくなり寿命を長くすることができる。
【選択図】図1
Description
12、13 バッファ
14 Tx/Rxスイッチ
20 LSIチップ
21 送信コイル
22 送信回路
23 受信コイル
24 受信回路
25 パッド
26、27 リード
31 LSIチップ
32 送信回路
33 送信コイル
34 受信回路
35 受信コイル
Txdata 送信データ
Rxdata 受信データ
Clk クロック
Claims (6)
- 信号を送信及び受信するコイルを有するプローブを備えることを特徴とする電子回路試験装置。
- 前記プローブは、2次元上で移動可能であることを特徴とする請求項1記載の電子回路試験装置。
- 前記プローブを複数備えることを特徴とする請求項1又は2記載の電子回路試験装置。
- 信号を送信する送信コイルと、
信号を受信する受信コイルと
を有するプローブを備えることを特徴とする電子回路試験装置。 - 前記送信コイル及び受信コイルは、1つの基板上の配線により形成されていることを特徴とする請求項4記載の電子回路試験装置。
- 前記送信コイル及び対応する受信コイルは、同軸に配設されていることを特徴とする請求項5記載の電子回路試験装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004289268A JP5024740B2 (ja) | 2004-09-30 | 2004-09-30 | Lsiチップ試験装置 |
PCT/JP2005/017364 WO2006035644A1 (ja) | 2004-09-30 | 2005-09-21 | 電子回路試験装置 |
US11/664,262 US8648614B2 (en) | 2004-09-30 | 2005-09-21 | Electronic circuit testing apparatus |
KR1020077009061A KR101212042B1 (ko) | 2004-09-30 | 2005-09-21 | 전자 회로 시험 장치 |
TW094133825A TW200619652A (en) | 2004-09-30 | 2005-09-28 | Electronic circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004289268A JP5024740B2 (ja) | 2004-09-30 | 2004-09-30 | Lsiチップ試験装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006105630A true JP2006105630A (ja) | 2006-04-20 |
JP2006105630A5 JP2006105630A5 (ja) | 2008-10-23 |
JP5024740B2 JP5024740B2 (ja) | 2012-09-12 |
Family
ID=36118793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004289268A Active JP5024740B2 (ja) | 2004-09-30 | 2004-09-30 | Lsiチップ試験装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8648614B2 (ja) |
JP (1) | JP5024740B2 (ja) |
KR (1) | KR101212042B1 (ja) |
TW (1) | TW200619652A (ja) |
WO (1) | WO2006035644A1 (ja) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009017557A (ja) * | 2007-07-02 | 2009-01-22 | Siemens Medical Instruments Pte Ltd | マルチコンポーネント補聴器、マルチコンポーネント補聴器の補聴器部品およびマルチコンポーネント補聴器の駆動方法 |
US8005119B2 (en) | 2008-02-02 | 2011-08-23 | Keio University | Integrated circuit |
KR20110134387A (ko) | 2009-02-25 | 2011-12-14 | 각고호우징 게이오기주크 | 인덕터 소자 및 집적 회로 장치 |
KR20120031164A (ko) | 2009-06-12 | 2012-03-30 | 각고호우징 게이오기주크 | 밀봉형 반도체 기록 매체 및 밀봉형 반도체 기록 장치 |
US8276822B2 (en) | 2008-04-28 | 2012-10-02 | Keio University | Electronic circuit |
US8283944B2 (en) | 2008-07-04 | 2012-10-09 | Keio University | Electronic circuit device |
US8467256B2 (en) | 2008-12-26 | 2013-06-18 | Keio University | Electronic circuit |
US8564093B2 (en) | 2008-08-12 | 2013-10-22 | Keio University | Semiconductor device and manufacturing method therefor |
US8588683B2 (en) | 2010-11-19 | 2013-11-19 | Semiconductor Energy Laboratory Co., Ltd. | Electronic circuit, semiconductor device, and electronic device |
US8611816B2 (en) | 2008-10-21 | 2013-12-17 | Keio University | Electronic circuit and communication functionality inspection method |
US8704627B2 (en) | 2008-05-14 | 2014-04-22 | Keio University | Inductor element, integrated circuit device, and three-dimensional circuit device |
US8704609B2 (en) | 2008-10-21 | 2014-04-22 | Keio University | Electronic circuit |
US8744349B2 (en) | 2009-10-15 | 2014-06-03 | Keio University | Multi-stack semiconductor integrated circuit device |
US9053950B2 (en) | 2007-11-26 | 2015-06-09 | Keio University | Electronic circuit |
US9312925B2 (en) | 2012-03-21 | 2016-04-12 | Advantest Corporation | Wireless communication apparatus and wireless communication system |
JP2016054309A (ja) * | 2008-12-09 | 2016-04-14 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US9979441B2 (en) | 2008-06-03 | 2018-05-22 | Thruchip Japan Inc. | Inductive relayed coupling circuit between substrates |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7999383B2 (en) * | 2006-07-21 | 2011-08-16 | Bae Systems Information And Electronic Systems Integration Inc. | High speed, high density, low power die interconnect system |
KR20100015206A (ko) * | 2008-08-04 | 2010-02-12 | 삼성전자주식회사 | 무선 테스트용 인터페이스 장치, 그것을 포함하는 반도체소자와 반도체 패키지 및 그것을 이용한 무선 테스트 방법 |
JP5554937B2 (ja) * | 2009-04-22 | 2014-07-23 | パナソニック株式会社 | 非接触給電システム |
KR101313555B1 (ko) * | 2011-11-10 | 2013-10-01 | 삼성중공업 주식회사 | 인쇄 회로 기판에 실장된 아이솔레이터의 검사 장치 |
TWI482971B (zh) * | 2013-09-13 | 2015-05-01 | Nat University Of Kaohsuing | Inductive three - dimensional double - sided electrical measurement fixture |
CN105676109B (zh) * | 2016-01-08 | 2019-08-02 | 青岛海信电器股份有限公司 | 一种主板测试方法及设备 |
US10612992B2 (en) * | 2017-11-03 | 2020-04-07 | Lockheed Martin Corporation | Strain gauge detection and orientation system |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002063675A1 (fr) * | 2001-02-02 | 2002-08-15 | Hitachi, Ltd. | Circuit integre, procede de test et de fabrication d'un circuit integre |
JP2004037213A (ja) * | 2002-07-02 | 2004-02-05 | Konica Minolta Holdings Inc | 半導体パッケージ及びその製造方法並びに半導体パッケージの検査方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH022967A (ja) * | 1988-06-17 | 1990-01-08 | Nec Corp | ブロービング装置 |
US5701037A (en) | 1994-11-15 | 1997-12-23 | Siemens Aktiengesellschaft | Arrangement for inductive signal transmission between the chip layers of a vertically integrated circuit |
DE19503329C2 (de) | 1995-02-02 | 2000-05-18 | Ita Ingb Testaufgaben Gmbh | Testvorrichtung für elektronische Flachbaugruppen |
JPH08334541A (ja) * | 1995-06-05 | 1996-12-17 | Mitsubishi Electric Corp | 電流検出器及びそれを利用したプリント板配線の接触部検出方法 |
JP3528367B2 (ja) | 1995-09-30 | 2004-05-17 | ソニーケミカル株式会社 | リーダ・ライタ用アンテナ |
JP3634074B2 (ja) * | 1996-06-28 | 2005-03-30 | 日本発条株式会社 | 導電性接触子 |
US6242923B1 (en) | 1997-02-27 | 2001-06-05 | International Business Machines Corporation | Method for detecting power plane-to-power plane shorts and I/O net-to power plane shorts in modules and printed circuit boards |
US6154043A (en) * | 1997-05-07 | 2000-11-28 | Advanced Micro Devices, Inc. | Method and apparatus for identifying the position of a selected semiconductor die relative to other dice formed from the same semiconductor wafer |
US6236223B1 (en) * | 1998-11-09 | 2001-05-22 | Intermec Ip Corp. | Method and apparatus for wireless radio frequency testing of RFID integrated circuits |
JP3603996B2 (ja) | 1999-04-28 | 2004-12-22 | シャープ株式会社 | シート抵抗測定器 |
TW536627B (en) | 2000-07-24 | 2003-06-11 | Sentec Ltd | Current sensor |
US6693426B1 (en) * | 2002-02-09 | 2004-02-17 | Intematix Corporation | Spatially resolved spin resonance detection |
CA2404183C (en) * | 2002-09-19 | 2008-09-02 | Scanimetrics Inc. | Non-contact tester for integrated circuits |
US6958616B1 (en) * | 2003-11-07 | 2005-10-25 | Xilinx, Inc. | Hybrid interface apparatus for testing integrated circuits having both low-speed and high-speed input/output pins |
JP4131544B2 (ja) | 2004-02-13 | 2008-08-13 | 学校法人慶應義塾 | 電子回路 |
JP4286182B2 (ja) | 2004-05-13 | 2009-06-24 | 富士通マイクロエレクトロニクス株式会社 | 電気的接続方法 |
-
2004
- 2004-09-30 JP JP2004289268A patent/JP5024740B2/ja active Active
-
2005
- 2005-09-21 US US11/664,262 patent/US8648614B2/en active Active
- 2005-09-21 KR KR1020077009061A patent/KR101212042B1/ko active IP Right Grant
- 2005-09-21 WO PCT/JP2005/017364 patent/WO2006035644A1/ja active Application Filing
- 2005-09-28 TW TW094133825A patent/TW200619652A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002063675A1 (fr) * | 2001-02-02 | 2002-08-15 | Hitachi, Ltd. | Circuit integre, procede de test et de fabrication d'un circuit integre |
JP2004037213A (ja) * | 2002-07-02 | 2004-02-05 | Konica Minolta Holdings Inc | 半導体パッケージ及びその製造方法並びに半導体パッケージの検査方法 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009017557A (ja) * | 2007-07-02 | 2009-01-22 | Siemens Medical Instruments Pte Ltd | マルチコンポーネント補聴器、マルチコンポーネント補聴器の補聴器部品およびマルチコンポーネント補聴器の駆動方法 |
US9053950B2 (en) | 2007-11-26 | 2015-06-09 | Keio University | Electronic circuit |
US8005119B2 (en) | 2008-02-02 | 2011-08-23 | Keio University | Integrated circuit |
US8276822B2 (en) | 2008-04-28 | 2012-10-02 | Keio University | Electronic circuit |
US8704627B2 (en) | 2008-05-14 | 2014-04-22 | Keio University | Inductor element, integrated circuit device, and three-dimensional circuit device |
US9979441B2 (en) | 2008-06-03 | 2018-05-22 | Thruchip Japan Inc. | Inductive relayed coupling circuit between substrates |
US8283944B2 (en) | 2008-07-04 | 2012-10-09 | Keio University | Electronic circuit device |
US8564093B2 (en) | 2008-08-12 | 2013-10-22 | Keio University | Semiconductor device and manufacturing method therefor |
US8704609B2 (en) | 2008-10-21 | 2014-04-22 | Keio University | Electronic circuit |
US8611816B2 (en) | 2008-10-21 | 2013-12-17 | Keio University | Electronic circuit and communication functionality inspection method |
JP2016054309A (ja) * | 2008-12-09 | 2016-04-14 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US8467256B2 (en) | 2008-12-26 | 2013-06-18 | Keio University | Electronic circuit |
US8872609B2 (en) | 2009-02-25 | 2014-10-28 | Keio University | Inductor element and integrated circuit device |
KR20110134387A (ko) | 2009-02-25 | 2011-12-14 | 각고호우징 게이오기주크 | 인덕터 소자 및 집적 회로 장치 |
KR20120031164A (ko) | 2009-06-12 | 2012-03-30 | 각고호우징 게이오기주크 | 밀봉형 반도체 기록 매체 및 밀봉형 반도체 기록 장치 |
US8744349B2 (en) | 2009-10-15 | 2014-06-03 | Keio University | Multi-stack semiconductor integrated circuit device |
US8588683B2 (en) | 2010-11-19 | 2013-11-19 | Semiconductor Energy Laboratory Co., Ltd. | Electronic circuit, semiconductor device, and electronic device |
US9312925B2 (en) | 2012-03-21 | 2016-04-12 | Advantest Corporation | Wireless communication apparatus and wireless communication system |
Also Published As
Publication number | Publication date |
---|---|
US8648614B2 (en) | 2014-02-11 |
KR101212042B1 (ko) | 2012-12-13 |
TW200619652A (en) | 2006-06-16 |
US20080258744A1 (en) | 2008-10-23 |
WO2006035644A1 (ja) | 2006-04-06 |
TWI377352B (ja) | 2012-11-21 |
KR20070067160A (ko) | 2007-06-27 |
JP5024740B2 (ja) | 2012-09-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5024740B2 (ja) | Lsiチップ試験装置 | |
US7466158B2 (en) | Multilayer semiconductor device | |
US7546106B2 (en) | Electronic circuit | |
US7541680B2 (en) | Semiconductor device package | |
US20140028341A1 (en) | Probe card and testing apparatus | |
US8334759B2 (en) | Semiconductor device, method of manufacturing thereof, signal transmission/reception method using such semiconductor device, and tester apparatus | |
JP4193060B2 (ja) | 電子回路 | |
US20110018121A1 (en) | Semiconductor packages and methods of fabricating the same | |
KR20150096889A (ko) | 적층형 반도체 메모리 장치 및 이를 위한 테스트 회로 | |
US7449902B2 (en) | Probe system | |
TW202041873A (zh) | 用於測試晶片或晶粒的設備 | |
US20220262718A1 (en) | Isolating electric paths in semiconductor device packages | |
US20110148454A1 (en) | Semiconductor wafer, semiconductor circuit, substrate for testing and test system | |
US7564255B2 (en) | Semiconductor integrated circuit for reducing number of contact pads to be probed in probe test | |
JP5638738B2 (ja) | 半導体装置 | |
JP2011112369A (ja) | 半導体素子およびそれを用いた半導体装置ならびに半導体素子の検査方法 | |
US20090243639A1 (en) | Circuit for Multi-Pads Test | |
JP4457648B2 (ja) | 半導体装置 | |
CN116779570A (zh) | 在差分对连接焊盘之间具有有序引线布置的半导体封装 | |
JP2011203034A (ja) | 被検査装置用インタフェース回路 | |
KR20140080306A (ko) | 반도체 칩 및 그를 포함하는 반도체 패키지 | |
KR20140068690A (ko) | 3차원 패키징 모듈 | |
JP2009302180A (ja) | 半導体装置 | |
JP2012253208A (ja) | 半導体集積回路及びbgaパッケージ | |
JP2011196969A (ja) | 被検査装置用インタフェース回路及び、検査方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070618 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20080125 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20080215 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080909 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100901 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101025 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110629 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110826 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20111116 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120215 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20120215 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20120308 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120530 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120611 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150629 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5024740 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |