TWI284205B - Modulized probe head for high frequency - Google Patents

Abstract

A modulized probe head for high frequency is provided. The probe head mainly includes a probing panel, a mounting PCB and an interposer between the panel and the PCB. The probing panel has a plurality of cavities on its back side. A plurality of decoupling components are installed inside the cavities and are electrically coupled to ground/power traces of the probing panel in by-pass connection. The interposer has a covering surface corresponding to the back side of the probing panel, and includes a plurality of connectors on the covering surface. Some of the connectors connect the decoupling components to electrically couple to the ground layer of the mounting PCB.

Description

1284205 V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a probe card for an integrated circuit test device, and relates to a modular high frequency probe card. [Prior Art] · The integrated circuit is developed toward high frequency and high density. It is known that the integrated circuit = test equipment is equipped with a probe card (pr〇be card), which is known only in one capture test. Can test an integrated circuit product, such as a wafer in a wafer, a tape or a chip package on a substrate. In order to improve the test speed, the probe J card has to be more complicated and counts the complex line, which can be used in one detection operation. Detecting = integrated circuit products, in the test process, sensitive to electromagnetic interference, can not really know the quality of integrated circuit products, resulting in test loss Φ and test efficiency.

U.S. Patent No. 5,491,426 discloses a probe card assembly structure. A plurality of cantilever probes are fixed on the lower surface of a probe card, and a decoupling device is installed. On the upper surface of a probe card and located in a hole of a load b〇ard to eliminate noise caused by electromagnetic waves, but it can only filter the connection cable from the test equipment to the probe card. The noise, because the noise generated by the detection card itself will not be able to be used, the second device is too sloppy, and the effect is limited. It is only applicable to the original applicant of the old cantilever probe in the Chinese patent public probe. Probe head, the conductive layer in the probe head and a plurality of probe terminals τ 586627 "can eliminate noise, can be combined with the probe head of the probe card to form a ground conductive layer, connected at the joint Between the mats is appropriate

1284205 V. INSTRUCTIONS (2) Interval dielectric layers to form a built-in bypass capacitor (internai bypass capaci tor), which can be used to filter noise by approaching the probes as a built-in solution. Decoupling component, however, because the conventional probe (or probe panel) is a high-density multilayer ceramic, the road plate needs to be implanted with various types of probe ends, and the manufacturing yield is low and the unit price is quite high. If a dielectric f of a built-in bypass capacitor needs to be formed inside the probe, the material process and the process are different. Generally, the circuit process of the ceramic substrate will not be easily formed, thereby increasing the cost of the probe. [Summary of the Invention]

The main purpose of the present invention is to provide a modular high frequency detection card, which mainly comprises a probe panel, a circuit carrier board and a interface panel between the probe panel and the circuit board, the probe panel The system has a plurality of receiving holes on the back side thereof, and a plurality of decoupling components are embedded in the receiving holes and bypassed to the grounding line of the detecting panel. The surface of the cover surface covers the back surface of the probe panel, and a part of the n= connection is connected to the decoupling components to be connected to the circuit to achieve low module cost. The condition is that the decoupling component is configured to filter the noise transmitted by the internal line of the probe card, and

No need for built-in capacitors, no increase in the cost of the probe panel (probe). The panel-modular co-frequency capture card mainly includes a probe cup, a C-up, a circuit board and an I panel, and the probe panel has a front panel and a front panel. The back side and 1284205 V. The invention description (3). a plurality of receiving holes on the back surface, a plurality of detecting ends are disposed on the front surface of the detecting panel, and the decoupling components are embedded in the receiving holes and Electrically connected to a portion of the probe end, the circuit carrier is used for bonding to a test head of a test device, the interface panel is disposed between the touch panel and the circuit carrier A cover surface and a plurality of first 'guide ends' covering the surface of the cover surface cover the back surface of the probe panel, and a portion of the first conductive ends are connected to the depletion elements. [Embodiment] The present invention will be described by way of the following examples. According to the first embodiment of the present invention, referring to FIG. 1 , a modular high frequency detecting card 1 〇〇 mainly includes a probe panel 1 1 〇, a plurality of decommissioning components 130, and a circuit. The carrier board 140 and the interface panel 150 are used as the first electrical transmission substrate for detecting the integrated circuit to be tested. In the embodiment, the probe panel 11 is a dense line. In other embodiments, the probe panel 110 can be selected from one of a glass substrate, a wafer and a printed circuit board. The probe touch panel 110 has a front ill and a back surface. 112 and a plurality of receiving holes 11 3 on the back surface 1 1 2 , preferably, the receiving holes 11 3 are arranged in a matrix. The detecting panel 1 1 includes a plurality of power/ground lines 114 . A plurality of power supply/ground pads 117 and a plurality of signal pads 118 are formed on the back surface 112 of the touch panel 110, and the plurality of signal transmission lines 116 are formed on the back surface 112 of the touch panel 110. The grounding line 114 is connected to the power/ground pads 117 and the pair The power/ground probe end 1 20, the bypass lines 丨5 are tapped to the corresponding power/ground

Page 9 1284205 V. Description of the Invention (4) Line 114' The signal transmission lines 116 are connected to the signal pads u 8 and the corresponding signal probe terminals 120. Preferably, the lengths of the bypass lines 115 are smaller than the lengths of the corresponding power/ground lines 114, so that the de-energized components 1 30 are closer to the corresponding power/ground probes.丨2 〇. In this embodiment, the bypass lines 1丨5 are via holes, so that the light-dissolving elements 1 30 are vertically aligned with the power/ground probe terminals 丨2 〇. The plurality of board contacts 1 2 0 are not on the front side 111 of the probe panel 11 , and in the embodiment, the probe terminals 20 are elastic probes for contacting the body circuit to be tested. Electrode portion, such as a pad, bump, or substrate of a wafer

The connection pad or the solder ball, the probe terminals 1 2 can be distinguished as a power/ground probe end and a signal probe end to be electrically connected to the power supply/ground line 1 of the probe panel respectively 1 4 and the signal transmission line 1 1 6 . The decoupling elements 13 are embedded in the receiving holes 113, and the decoupling elements 13 can be selected from a bypass capacitor, a decoupling capacitor (dec〇upHng capacitor), and an ultra-wideband With the filter, the 13 turns are independent components, and the composition can be any material. There is no need to disassemble the probe panel 110. Each decoupling component 30 has a first electrode 131 and a first The electrodes 13 2 are embedded in the accommodating holes 113, and the first electrodes 131 are connected to the bypass lines 115 or/and the

The power/ground line 114 is electrically connected to a portion of the probe terminals 12'' (ie, the power/ground contact end), and the second electrode 丨3 2 is exposed on the back surface of the probe panel 11 11 2 .

1284205 V. Inventive Description (5) A circuit board for carrying the probe panel 1 1 〇 and the interface panel 15 系 having at least one ground layer 1 41 and a plurality of layers on the lower surface thereof The connection pads 142, a plurality of pads 44 are connected outside the upper surface thereof, and a portion of the inner connection pads 142 are connected to the ground layer 141 by a line 143. The interface panel 150 is disposed between the probe panel 11 and the circuit carrier ,4〇. In the embodiment, the interface panel 150 is a ceramic circuit board with a conductive line. In an embodiment, the interface panel 150 can be selected from glass substrates.

One of a board, a wafer and a printed circuit board, the interface panel 15 has a cover surface 151 and a corresponding joint surface 152, and the cover surface of the panel 丨5 对准 is aligned toward the probe Preferably, the interface panel 150 is the same size as the probe panel 110, and the interface surface 152 of the interface panel 15 is aligned with a predetermined position toward the circuit carrier 丨4〇. For example, a plurality of first guiding ends 15 3 of the stud bumps are formed on the covering surface 151 of the interface panel 150, such as a junction bump (a plurality of second guiding ends 154 of the stud are formed on the interface) After the modular combination, the cover surface 丨5 of the panel 覆盖5 covers the back surface 丨丨2 of the probe panel 11 , and the portion thereof The first conductive terminals 153 are connected to the second electrodes 132 of the decoupling components ,3, and the other first conductive terminals 153 are connected to the power/ground pads of the sensing panel 11Q. 117 and a plurality of signal pads 118, the second guiding ends 154 are connected to the circuit carrier 丨 4 The first connection terminal 154 electrically connected to the decoupling elements 13 is electrically connected to the line 143 via the connection pads 142 of the circuit carrier 140. Grounding layer 141, and other electrical connections to the power/ground pads 117 and signal pads 1284205

The second conductive terminals 54 of the 118 are electrically connected to the connection pads 144 outside the circuit carrier 140 through the ground layer 141. The modular high-frequency probe card 1 further includes a coupling kit 丨6 〇 and a plurality of guide pins 170, the coupling kit 16 has an opening 1 61, which is aligned and exposed The front side of the touch panel 1 i is coupled to the touch panel 11 〇 and the interface panel 〇 5 to the circuit carrier 140, and the guide stubs 70 are passed through the The probe panel 11 is formed in a corner hole and a hole in the corner plate. Preferably, the front surface 111 of the probe panel 1 is formed with a notch 11 9 to facilitate the combination kit.嵌合6 〇 Chimeric Alignment 'The splicing kit 160 can be provided with a plurality of adjustment pins 162 to slightly adjust the χ-γ position of the probe panel 110. .

Therefore, the decoupling component 1 30 can be embedded in the probe panel 11 by the modular high-frequency probe card 1 described above, and can be protected by the panel 丨 5 并 and can be used by the interface. The board 1 50 is electrically connected to the ground plane 141 of the circuit board 以 4 , to eliminate the noise generated by the internal circuit of the probe cassette, and does not need built-in capacitors on the probe panel 丨丨〇 Generally, the manufacturing cost of the probe panel achieves the effect of modularization.

According to the second embodiment of the present invention, referring to FIG. 2, a modular high frequency detecting card 2 〇〇 mainly includes a probe panel 21 〇, a plurality of decoupling components 230, a circuit carrier 240, and a The panel 250 has a front surface 211, a back surface 212, and a plurality of receiving holes 213 on the back surface 212. The detecting panel 21 includes a plurality of power/ground lines 214 and a plurality of bypass lines. The road 21 5 and the plurality of signal transmission lines 21 6 ′ are further formed with a plurality of power sources/connections on the back surface 21 2 of the probe panel 2 1 〇

Page 12 1284205 V. Description of the Invention (7) Ground pad 217 and a plurality of signal pads 218, the power/ground lines 214 are connected to the power/ground pads 2 17 and corresponding power/ground probes In the terminal 220, the bypass lines 215 are connected to the corresponding power/ground lines 2 1 4 '. The signal transmission lines 2 16 are connected to the signal interfaces 2 1 8 and the corresponding signal probe ends. 2 20. Preferably, the length of the bypass lines 215 is less than the length of the corresponding power/ground lines 214, so that the decoupling elements 230 are closer to the corresponding power/ground probes 220. . A plurality of probe terminals 220 are disposed on the front surface 211 of the probe panel 21, and in the embodiment, the probe terminals 220 are conductive bumps, but the probe terminals 2 2 0 may also be micro Electromechanical probes, the probe terminals 2 2 can be distinguished as a power/ground probe and a signal probe end to be electrically connected to the power/ground line 2 1 4 of the panel 21 Signal transmission line 2 1 6. The decoupling elements 230 are embedded in the receiving holes 213, and the decoupling elements 230 are independent components, and do not need to be built in the detecting panel 2, each decoupling element 230 has a first An electrode 231 and a second electrode 232 are embedded in the accommodating holes 213, and the first electrodes 231 are connected to the power supply/ground lines via the bypass lines 2 15 or 2 14 is electrically connected to a portion of the probe terminals 22 (ie, the power/ground probe end), and the second electrode 2 3 2 is exposed on the back surface 2 1 2 of the probe panel 21 . Referring to FIG. 2, the circuit carrier board is used for bonding to a test head (not shown) for carrying the test panel 2 and the interface panel 250. The circuit The carrier board 205 has at least one ground layer 241, a plurality of connection pads 242 on the lower surface thereof, a plurality of connection pads 244 ′ outside the upper surface thereof, and a portion of the inner connection pads 242 connected to the line 243 The ground

Page 13 1284205 V. Description of the invention (8) Layer 241. The interface panel 2 is disposed between the probe panel 21 and the circuit carrier 2, 40. Referring to FIG. 3, in the embodiment, the interface panel 250 is a via 255. A ceramic circuit board having a cover surface 251 and a corresponding engagement surface 252, the cover surface 151 of the interface panel 150 is aligned toward the probe panel 21, the interface panel 25 The bonding surface 252 is aligned with a predetermined position toward the circuit carrier 24 , and a plurality of first guiding ends 253 are formed on the covering surface 251 of the interface panel 250. The plurality of second guiding ends 254 are formed on the interface The first surface 253 and the second conductive ends 254 are electrically connected to the first and second guiding ends 253. In this embodiment, each of the first guiding ends 253 is electrically connected to the second guiding end 253. The system includes a dielectric elastic block 2 53a and at least one metal layer 253b surrounding the elastic block 253a, and similarly, each second guiding end 254 includes a dielectric elastic block 2 5 4 a and at least one The metal layer 254b surrounding the elastic block 2 5 4 a, after modular combination, the interface The cover surface 251 of the board 25 covers the back surface 2 12 of the touch panel 21 , and some of the first conductive ends 253 are connected to the second electrodes 232 of the decoupling elements 230 , and other The first conductive terminal 253 is connected to the power/ground interface 21 7 of the probe panel 21 and the plurality of signal connectors 218. The second conductive terminals 254 are connected to the circuit carrier 240. The inner connecting pad 242, wherein the second connecting end of the decoupling component 2 3 is electrically connected to the connecting pad 2 4 2 and the line 2 through the circuit carrier 2404 4 3 is electrically connected to the ground layer 241, and the other second conductive terminals 254 electrically connected to the power/ground pads 217 and the signal pads 218 are electrically connected to the ground layer 241 to The remote circuit carrier 2 4 塾 is connected to 塾 2 4 4 .

1284205 5, the invention description (9), in addition, the modular high-frequency detection card 2 can further comprise a binding kit 260, the opening 261 of the bonding kit 260 is aligned and reveals the probe panel 210 The front side 211 ′′ is coupled to the touch panel 2 1 〇 and the interface panel 250 to the circuit carrier 24 . Any changes made within the scope defined by the scope of this patent application are intended to be within the scope of protection of the invention.

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BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a schematic exploded cross-sectional view of a test card according to a first embodiment of the present invention; FIG. 2 is an exploded view of a probe card according to a second embodiment of the present invention. Cross-sectional schematic view; and FIG. 3 is a schematic cross-sectional view of a dielectric panel according to a second embodiment of the present invention. ~ Simple description of component symbols · 10 0 modular high-frequency detection card 110 probe panel 113 receiving hole 11 9 notch 120 probe end 1 3 0 depletion component 140 circuit carrier 14 3 line 150 interface panel 153 first The guiding end 160 is combined with the sleeve 170 of the kit 170. The detecting panel is a modular high type, a modular high frequency, a high frequency, a south frequency probe 111, a front surface 112, a back surface 114, a power/ground line 115, a bypass line 117. Power/ground pad 118 signal pad 131 first electrode 132 second electrode 141 144 ground layer outer connection pad 142 inner connection pad 151 154 cover surface second guide end 152 joint surface 161 opening 162 adjustment plug test card 211 front 212 Back 1284205 Simple description of the drawing 213 Rong 1 hole 214 Power / ground line 215 Bypass line · 216 Signal transmission line 217 Power / ground pad 218 Signal pad 220 Probe end 230 Decoupling element 231 First electrode 232 Second Electrode 240 circuit carrier 241 ground plane 242 inner connection 塾 243 line 244 outer connection pad 250 interface panel 251 cover surface 252 joint surface 253 first guide end 253a elastic block 253b metal layer 254 second terminal 254a elastic block 254b metal layer 255 through hole 260 bonding kit 261 opening

Page 17

Claims (1)

1284205 VI. Scope of Application for Patent Application [Scope of Application] 1. A modular high-frequency probe card, including a probe panel, which has a front surface, a back surface, and a plurality of pockets on the back surface; The probe end is disposed on the front side of the probe panel; a plurality of decupupUng c〇mponent elements embedded in the valleys and electrically connected to the portions of the probes a test board for bonding to a test device; and a panel being disposed between the touch panel and the circuit carrier, the panel having a cover surface and a plurality of At the first end of the covering surface, the covering surface covers the back surface of the detecting panel, and a part of the first guiding ends are connected to the decoupling elements. 2. The modular high frequency probe card of claim 2, wherein the circuit carrier has a ground layer electrically connected to the surface uncoupling elements by the dielectric panel. 3. The modular high-frequency probe card according to claim 2, wherein the panel has a plurality of second guide ends formed on the surface of the cover panel. Surface for guiding to the ground plane of the board. 4. The modular high frequency probe card according to the scope of the patent application, wherein the interface panel is a ceramic circuit board. 5. A modular high frequency probe as described in claim 4 or 4 wherein the glow panel is a ceramic circuit board.卞 6. As set forth in the patent application scope, the vibration-organized south frequency detection card, In the scope of the patent application, the dielectric panel is selected from the group consisting of a glass substrate, a wafer, and a printed circuit board. 模组/, · 7 The modular high-frequency detection card described in claim 1 of the patent application scope, wherein The touch panel is selected from the group consisting of a glass substrate, a wafer and a printed circuit board. The modular high frequency detection card according to claim 1, wherein the first conductive connection The end system is a stud bump. 9. The modular high frequency probe card of claim 2, wherein the first conductive ends comprise elastic blocks. The modular high-frequency detection card of claim 9, wherein the elastic blocks are dielectric #, and the first guiding ends further comprise at least one surrounding the elastic blocks. The metal layer. The modular high frequency probe card described in the patent range & item has a beta φ Ϊ 4, ° 〇 kit for combining the probe panel with the interface panel on the circuit carrier. ^1 The modular high-frequency detection card described in the middle item has 13 holes and a hole to reveal the front surface of the probe panel. In the middle, the modular high-frequency detection card described in the item "Terminal" is fitted with the fitting. (4) The material is formed into a gap, so as to facilitate the combined sleeve 14 as in the modular high-frequency detection card described in the scope of claim i, the panel comprises a plurality of electric J on the back side, and several bypass lines. Road and a plurality of power/grounding lines; grounding lines are connected to the electrical traceback/garbage ##人=I,, grounding pads and corresponding power/grounding probes, page 19, 1284205 Sixth, the scope of application for patents is a bypass circuit that is connected to the corresponding power/ground wires. 2) The modular high-frequency detection card described in item 14 of Shenqing Patent Range, some of which are next to each other. The length of the line is less than the length of the corresponding power/ground lines. The modular high frequency probe card of claim 14, wherein the bypass lines are via holes. Page 20