TW200840150A - Probe card including a plurality of connectors and method of bonding the connectors to a substrate of the probe card - Google Patents

Abstract

In a probe card for inspecting a semiconductor device and a flat panel display device, first and second substrate structures and a plurality of connectors are provided. The first substrate structure has a plurality of connection holes. A conductive layer is located on an inner surface of each of the connection holes and connected to a signal line in the first substrate. The second substrate structure has a contact pad at an upper portion thereof and a plurality of probes that make contact with an inspection object at a lower portion thereof. Each of the connectors includes a first contact portion secured to the contact pad of the second substrate structure and a second contact portion inserted into each of the connection holes and making contact with the conductive layer. Accordingly, the second substrate structure may be prevented from being deformed by a vertical external force due to the connectors.

Description

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Cj 200840150 IX. Description of the invention: [Technical field of the invention] The exemplary embodiment of the present invention relates to a probe card for detecting (dUCt〇r device) and/or flat panel display device (pr〇be(4) And the method of the connector in the e-card, and more specifically the type of the probe card and the connector "to the probe = [prior art] usually through such as manufacturing, ^ grain + body „ „件. In the process of, for example, 11 wafers, circuits and devices, and in the process of (4), the electrical characteristics are detected in the wafer. Next, the device wafers will be individually-- The device is sealed in epoxy and encapsulated into individual semiconductor devices. 7 Y Live Eight regenerates the repairable defective wafer and removes the unrepairable defective wafer in the circle of the packaging process. Therefore the side reduces the cost of the assembly process. The well-known device for increasing the semiconductor device needle to the EDS process includes installing a plurality of probe cards, each of the vibrating pins and the inspection object (the

Jt^(conductivepad)^^ Figure 1 is a cross-sectional view illustrating a conventional probe card. 6 200840150 Mai see Figure 1 'The conventional probe card 1 package A: J has = contact hole Μ; second substrate structure 2. , having two or two places = contact pad 22 and j-biasing needles (not shown) that are in direct contact with the inspection object, and the connector 3〇, the connection plate, the mouth structure 10 And a second substrate structure. The elastic port of the soil touches p 32, and the insertion hole] 斤 Ο part 34. _心^== Straight! Contacting the top surface of W 22 in the direction of contact with 烊塾 2 knowing that the card contains a plurality of connectors 30, and the connection is crying 3〇 2 ^: the level of the structure 10, the second structure 2〇: The horizontal position is different from the surface contour of the factory. To contact welding (4) 塾 22 ^ contact force, and therefore the connector is chased by contact welding, the problem is that the compressive force applied to the connector 30 applies pressure: the second structure is configured to be connected to the connection benefit 30 〇 And may be combined with the deformation of C 2〇. As the first structure 10 and the second structure θ 20 are added and the number of connections ^ 3G is increased, the force applied to the outer portion of the second structure 20 is increased to thereby cause a much larger deformation of the second structure 2 . Contaminants and/or contaminants at the other end portions may additionally: cause contact failure between the connected state 30 and the contact pads 22. The extension of the sexual extension of the device 3 elastic deformation (elasticdefo) requires an increase in the elasticity and the extension of the i3Q 2 portion 32 may result in a decrease in the electrical performance of the resistance 夂 connection state 30. 200840150 SUMMARY OF THE INVENTION Accordingly, the present invention provides a probe card in which text can be prevented from being deformed by a vertical external force caused by a connector. The side of the soil = the invention also provides a substrate to be connected to the lower portion of the probe card. According to an aspect of the invention, a probe card is provided, the number of turns = the base structure and a plurality of connectors. The fourth plate junction "eight eves a few brothers - connection holes; and the first - conductive layer is located on the inner surface of each of them and connected to the first substrate structure of the signal wide: two substrate junction: 冓 has the first The upper portion of the second substrate structure is connected to the inspection object by a probe at a lower portion of the first substrate structure. Each of the connectors includes a first contact portion f. The first contact portion Fixed to the second substrate structure, and the second contact portion is inserted into each of the first connection holes and connected to the first conductive layer in each of the first connection holes; In an embodiment, the first contact portion (four) solder is fixed to the contact 2. The contact portion is formed into a ring, and the first conductive layer and the second contact portion are in point contact at at least two positions of the second contact portion. The "one contact portion is formed into a ring-shaped ring. The structure of the probe card can further include positioning on the surface of the first substrate, and having a second connection hole (in each of these connectors) !! Socket. The second conductive layer is located on the inner surface of the second connection hole To Di - the signal lines in the substrate structure comprises a socket fixed to the first 8

200840150 a first sub-socket of a lower surface of the substrate structure, and a second sub-socket coupled to the first sub-socket and sliding relative to the first sub-socket to cause sliding of the second sub-socket relative to the first sub-socket, The connectors inserted into the first connection holes are fixed to the first substrate structure. In a typical embodiment, each of the first connection holes is connected to a mate-connection hole. In a typical embodiment, the second contact portion has substantially the same dimensions as the upper first aperture and the second contact aperture. A typical implementation, the diameter of the second connection hole of the insertion is smaller than the diameter of each of the connectors. According to another aspect of the present invention, another probe card is provided and includes and = 3, the first substrate structure of the line, the second substrate structure: a plurality of: r - a plurality of probes in contact with the object ==== contact Welding Φ. The socket is positioned on the lower surface of the _substrate structure ^: the inner surface of each of the connection holes is connected to the middle of the first structure. Substrate surface ΐ:: In the embodiment, the 'the socket includes the sub-substrate fixed to the sub-substrate structure' and the sub-socket is connected to the first sub-socket and is opposite to: the second sub-socket is inserted so that the second sub-socket is opposite In the first sub-manufacture to the first substrate structure. The second connection of the mother 9 200840150 In the typical shell example, the connection hole is formed into a rod body, the diameter of which is larger than the diameter of these connectors. In a typical embodiment, the connector firmly solidifies the slid through the connection hole of the first substrate structure to the first substrate structure, so that although the first US board gentleman; The displacement substrate, the U-cap, and the connection state of the diterpenoid do not add external force to the second substrate to terminate the deformation of the second substrate structure. In addition, the connection is cried by the crucible to minimize the connection. The contact between the device and the connection failed. In addition, the connection of this connector can be in the short lead, the second is elastic cross-section, and therefore minus / 丨, + 1: day & long brother has a larger cross-sectional area to borrow! The card's electrical performance can be increased substantially. Measure the card j's offer - the kind of sticking the connector to the probe

Plate) soil. Guide plate spoon. A guide plate containing a plurality of stacked plates (gfu e holes. One of the connectors is inserted into one of the plates to make a hole in the edge of the hole. The hunting is made by the court and will be coupled to the guide μ, he (d) moving the connection to the guide plate, and the connectors to the yoke plate are fixed to the upper surface of the substrate, and the plurality of probes at the lower surface of the cymbal 3. The soil is connected in the exemplary embodiment. The device is fixed to the base. The guide plate is uncoupled from the connector, and the guide i and the connector are separated by a substrate, and the connectors are fixed to the mouthpiece 14 by the following steps. Solder contact. These solders 10 200840150 are heated so that they are reflowed and then cooled by a cooling process. In a typical embodiment, the gap distance between the solders and the gap between the penetration holes is substantially The same is true. According to an exemplary embodiment of the present invention, the connector* can be accurately adhered to a desired position using a guide plate. [Embodiment] Hereinafter, the embodiment of the present invention will be described with reference to the accompanying drawings. Filling the description of the invention The present invention is not limited to the embodiments set forth herein. More specifically, such embodiments are provided so that this disclosure will be thorough and complete, and The scope of the present invention is fully described by those skilled in the art. In the drawings, the dimensions and relative dimensions of layers and regions may be exaggerated for clarity. It will be understood that when the elements or layers are referred to When a layer is "upper", "connected" or "coupled" to another element or layer, it can be connected or coupled to another element or layer in one layer or layer or intervening element (J piece (inter) Inverse elements or layers. Conversely, when an element is referred to as being "directly" or "directly connected" or "directly connected" to another element or layer, there is no intervening element or layer. In the text, the same reference numerals refer to the same elements. As used herein, the term "and/or" includes any and all combinations of one or more of the listed listed items. The second, third, etc. can be used in the text to describe Various elements, components, regions, layers and/or parts, but such elements, components, regions, layers and/or parts are not limited by these terms. These terms 11 200840150 are only used to distinguish - components, components, regions And the elements, components, regions, layers or parts, components, regions, layers or sections discussed in the following paragraphs without departing from the teachings of the present invention. For ease of description, spatially relative terms (such as "below", "below", "lower", "above" to describe the "component or" side from the similar terms) γ, levy, and other (other) components or features may be used herein. The relationship, Ο Ο As shown in the figure, it should be understood that the spatial relative term is intended to cover the different orientations of the device in the direction of the device. By way of example, the elements in the """""""""""""""""" Therefore, the exemplary term "below" can encompass both the top and the bottom. The device can be oriented in other ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein can be interpreted accordingly. The terminology used herein is for the purpose of the description and the embodiments As used herein, the singular forms "a" and "the" It should be further understood that when the term "comprises and/or compliing" is used in this specification, it specifies the existence of the features, the number, the steps, the operations, the components and/or components, but does not exclude The presence or addition of other features, integers, steps, operations, components, components, and/or groups thereof. Embodiments of the present invention are described herein with reference to cross-section illustrations that illustrate a preferred embodiment (and an intermediate structure) of the invention. 12 200840150 Ο Ο Thus, the shape of the schematic is expected to vary due to, for example, manufacturing techniques and/or tolerances. Therefore, the embodiments of the present invention should not be construed as limited! The specific shape of the area described in the text, but contains, for example, the shape deviation caused by the clothing ie. For example, an implanted region illustrated as a rectangle will typically have rounded or curved features and 7 or have an implant gradient at its edges rather than a binary change from the implanted region to the unimplanted region. . The buried area formed by the implanted person can cause a certain implant in the area between the buried area and the surface (planting). Accordingly, the regions of the present invention are intended to be illustrative in nature and are not intended to limit the scope of the invention. All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art, unless otherwise defined. It should be further understood that terms (such as those defined in the dictionary) should be interpreted as having the meaning of the meaning of the case, and unless the definition in this article is = I, the * will be idealized or too formal. Interpretation of the meaning of the. Fig. 3 is a cross-sectional view of a probe card according to an exemplary embodiment of the present invention: and Fig. 3 is a partially enlarged view of a portion A of Fig. 2. </ RTI> and FIG. 3, the probe according to an exemplary embodiment of the present invention includes a first substrate structure 11 () and a second substrate structure 12 splicer 130, a fixed plate 14G, and a horizontal level control member 15 . In the embodiment of the present invention, the first substrate structure 110 is included in its interior = a plurality of (four) lines (not shown) and includes a plurality of connection holes ι ΐ 2 . Second, the vias m are connected to the (four) lines and (iv) the first substrate structure 13 200840150 110. A conductive layer 114 is formed on the inner surfaces of the connection holes. The conductive layer 1 Μ may comprise a conductive material such as copper (Cu). These signal lines are additional detectors (not shown). #第二基板结构120 is positioned below the first substrate structure 11〇, including bottom substrate 122, contact pads 124, probes 126, and signal lines.

For example, the bottom substrate 122 can be formed as a board and have a smaller size than the first panel structure 110. A plurality of contact pads 124 are disposed on the top surface of the base substrate 122 and comprise a conductive material. A plurality of probes 126 protrude from the bottom surface of the bottom substrate 122. The probe 126 can be formed by separating the bottom plate 122 and can be mounted on the bottom substrate 2. Alternatively, the probe 126 can be formed on the bottom surface of the bottom substrate 122. Although the current exemplary embodiment discloses Cantilever type probe: but can be used to replace or combine with a cantilever type probe using a vertical type probe or any of the groups known to those skilled in the art. Signal line U8 is positioned at In the inner portion of the bottom substrate m, and the probe (3) is connected to the contact pad 124. For example, the signal line i28 may include multiple = wiring to bring each of the multilayer wirings to each other via a contact plug or a channel. The state (not shown) can be connected to the signal line 128. For example, = can be positioned on the top or bottom surface of the bottom substrate 122. In addition, the power is located in the interior of the bottom substrate 122. The noise or distortion signal in the number can be grounded by the capacitor to prevent the distortion and the distortion. In addition, when the input power is insufficiently applied, the capacitor can compensate for the shortage of the wheel power. η ^接及amp; ^ make the first substrate junction The structure 11G and the second substrate structure 4 are connected to each other. In an exemplary embodiment, the connector 1 can electrically connect the conductive layer 114 of each of the pull holes 1U to the contact pad 124, and may include, for example, a metal. Conductive material.

In a typical implementation, the _13() may include a first contact portion 132 that is fixed to the contact pad m of the second substrate Ί 120, and the connection holes 112 that are connected to the σ 卩 132 and inserted into the first substrate structure. The second contact portion 134 in each of the two. For example, the 'first contact portion 132' can be shaped as a block as shown in Fig. 3 and Fig. 3, and the second f touch portion 134 can be shaped as a hook. Alternatively, although not shown in the drawings, the first contact portion 134 may be shaped as a domed ring. The first contact portion 132 is fixed to the contact pad 124 by solder, and thus the connection $13G is fixed to the second substrate structure 12Q. The second contact portion 134 is inserted into each of the connection holes 112. In the present embodiment, the hook-shaped second contact portion 134 is inserted into each of the connection holes 112 by a shrink fitting method to thereby compress it into the connection hole η]. Once the second contact portion 134 is installed in each of the connection holes 112 using a shrink fit method, a restoring force is applied to the second contact portion 134 due to the elasticity of the second contact portion 134. The conductive layer 114 of the connection hole 112 is in contact with the second contact portion 134 of the connector 130. In the current embodiment, since the second contact portion ι34 is formed as a hook, the conductive layer Π4 and the second contact portion 134 are in contact at at least two points 15 200840150. Any modification to the shape of the second contact portion 134 will result in an increase in the number of contact points of the second contact portion 134 with the conductive layer 114, as is generally known to those skilled in the art. ’ Therefore, the connector 130 is fixed to the second substrate structure 120 and movably connected to the first substrate structure 110 such that the connector 130 can move up and down Π%, and the contact with the substrate structure 11 准. That is, although the first substrate structure 110 and the second substrate structure 120 are not parallel to each other or one of the first substrate structure 110 and the second substrate structure 120 moves up and down, the second contact portion 134 of the two connectors 130 maintains and conducts electricity. The physical contact of layer 114 is simultaneously moved up and down. Therefore, since the connector 13 is slid along the conductive layer ι4, the connector 130 does not apply an external vertical force to the second substrate structure 120' to thereby prevent deformation of the second substrate structure 12. Additionally, the connection boundary 130 is secured to the contact pads 124 by solder 136, thereby minimizing contact failure between the connector 130 and the contact pads 124. Further, the connector 13A need not be elastically deformed, thereby reducing the length of the connector 130. As a result, the resistance of the connection 130 can be sufficiently reduced to thereby improve the electrical performance of the probe card 100. The first contact embodiment above has a hook-shaped second contact portion 134, but as is generally known to those skilled in the art, as long as the second contact portion ^4 is in contact with the conductive layer 114, the second contact portion 134 can There are any other modifications in shape, such as a domed ring. The fixing plate 140 fixes the first substrate structure 110 and the second substrate structure U0 to each other, and includes a first plate 141, a second plate 142, a third plate 143, a leaf spring 144, and a plurality of screws (not Graphic). 16 200840150 The disc-plate 141 is formed as a disc and positioned on the first substrate structure 〇 face. The second plate 142 is shaped as a ring and is positioned at the first substrate junction = lower surface edge portion. The first plate 141, the first substrate junction 110, and the second plate 142 are fixed to each other by the first screw 145. The third ^ 143 is formed to be smaller than the ring of the second plate 142 and surrounds the second substrate structure 2, the wall. The leaf spring 144 is in contact with the second plate 142 and the third plate 143, and the plate spring 144 is passed by the second screw 146.

Ο = fixed, and the third plate 143 and the leaf spring 144 are fixed to each other by the third screw 147. (4) „Quasi-control component—penetrating the first plate 141 and the first substrate° and contacting the upper surface of the substrate structure 120. When the thickness of the bottom substrate 122 of the second plate structure 12G is changed in the longitudinal direction ^ ' The first substrate structure 110 and the second substrate structure 12 are positioned at the same level. The probe 126 may be difficult to locate at the same level. The water component 15 is positioned at the same level with the tip of the probe 126. The amount of force applied to the upper surface of the second substrate structure 12〇 is controlled to control the horizontal level of the surface of the second substrate structure 12〇. FIG. 4 is another embodiment of the present invention. A loose cross-sectional view of the probe card of the exemplary embodiment, and a partial enlarged view of part A of FIG. 5, Fig. 4 and Fig. 5, the wooden test card according to another exemplary embodiment of the present invention includes - Substrate structure (10) and café 'connection H230' fixed plate 24G' horizontal level control == and socket 260. The probe card of the present embodiment has a reference to FIG. 2 and FIG.

Ο 200840150 The probe card 100 is substantially identical: two: therefore, in the following... and any of the substrate structure 22, any more detailed description of the fixture 250 / anti-zero and horizontal level control and the ' connector 230 causes the first substrate structure 210 to be electrically connected by this. For example, the connector (10), the first conductive layer 214 of the vehicle 2 is electrically connected to the contact pad 224 and includes a conductive material such as a metal. &quot; In the present embodiment, the connector 23A may include the first contact portion 232 fixed to the contact pad 224 of H2 and the first connection hole 212 of the second earth plate structure 210 and the first of the insertion holes The second contact portion 234 in the connection hole 262. For example, the first contact portion 232 can be shaped as a block and soldered to the contact pad 224 by solder 236 (4) to secure the connector 230 to the second substrate structure 230. The second contact portion 234 is formed as a rod having a size smaller than the first connection hole 212 and the second connection hole 262. The socket 260 is positioned at a lower surface of the first substrate structure 21 and has a second connection hole 262 corresponding to the first connection hole 212. In the present embodiment, the second connection hole 262 is connected to the first connection hole 212 and has a diameter substantially the same as the diameter of the first connection hole 212. The second conductive layer 264 is located on the inner surface of the second connection hole 262 and is electrically connected to the first substrate, . Line k in line 210. The second conductive layer 264 may comprise a conductive material such as copper (Cu). The jack 260 includes a first sub-socket 260a and a second sub-socket 18 200840150 260b. The first sub-socket 260a is fixed to the bottom surface of the first substrate structure 21, and the second sub-socket 260b is movably positioned relative to the first sub-socket 260a at a lower portion of the first sub-socket 260a. Therefore, the second contact portion 234 of the connector 23 is inserted into the first connection hole 212 and the second connection hole 262, and the second sub-outlet 260b is slid with respect to the first sub-socket 26A, thereby thereby making the first contact Portion 234 is secured to socket 260 (as shown in Figure 5). Therefore, the second contact portion 234 is in contact with the first conductive layer 214 and the second conductive layer 264. Further, the gap distance between the first substrate structure 210 and the second substrate structure 220 can be reduced by the socket 260. Therefore, when the first substrate structure 21 and the second substrate structure 22 are not parallel to each other, when moving relative to each other, the connector 23 can be moved along the first connection hole 212 and the second connection hole 262 while maintaining the first Electrical contact between the substrate structure 210 and the socket 26〇. That is, although the first substrate structure 22 is displaced, the connector 23 does not apply an external force to the first substrate structure 22G, thereby preventing deformation of the second substrate structure 22Q. In addition, the connector 230 is fixed to the contact pad by solder = the contact between the domain connector 230 and the contact pad 224 fails. This misalignment 230 may not need to be elastically deformed so that the connector 23 can have a larger cross-sectional area to reduce the resistance. As a result, the electrical performance of the test card 200 can be sufficiently increased. Although the connector 230 touches the portion 234 along the first connecting hole 212, and is removed by the μ ^ / 不 且 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The aperture 262 is so the connector 23 is still in electrical contact with the second conductor 19 200840150 electrical layer 264. J is a loose cross-sectional view of the probe card according to still another exemplary embodiment of the present invention, and Fig. 7 is a partially enlarged view of a portion A of Fig. 6.

Referring to FIG. 6 and FIG. 7, a test card 3GG according to still another exemplary embodiment of the present invention includes a first substrate structure 31Q 320, a connector 330, a fixed plate 34〇, an earth plate, and a mouth structure. Socket 36〇. The W anti-zero water level control component 350 has the same structure as the probe card 200, and the exception is the first beauty handle, as shown in FIG. 4 and FIG. Therefore, any more detailed description of the second substrate structure 32, the connection, the fixing plate 340, the horizontal level control member 35, and the socket will be omitted hereinafter. As compared with the substrate structure 210 including the first connection hole=Electrical: FIG. 4 and FIG. 5, there is no connection hole and conductive it in the substrate-substrate structure 3ig. Therefore, the second 接触 contact portion 334 of the connector 33Q is inserted into the connection hole 362 of the σ 36G and is in contact with the conductive layer 364 。. The direct contact portion 334 has a straight diameter smaller than the diameter of the connecting hole. Therefore, when the first substrate structure 31 〇 and the second substrate structure are mutually moved or moved relative to each other, the connector 330 can be along the connection hole 362 • f while maintaining electrical connection with the first substrate structure 31G and the socket. 2. That is, although the first substrate structure 32'' and the second substrate structure 33 are moved', the connector 330 does not apply an external force to the second substrate structure 32'' to deform by the second substrate structure 320. In addition, the connector 330 is secured to the contact pads 324 by a baffle to thereby minimize contact failure between the connector 33 and the contact pads 324. In addition, the connector 33 may be elastically deformed so that the connector 330 may have a relatively small cross-sectional area at a shorter length to thereby reduce the electrical resistance. As a result, the electrical performance of the probe card 3 can be sufficiently increased. 8A to 8F are cross-sectional views illustrating a method of attaching a connector in a probe card in accordance with an exemplary embodiment of the present invention. Referring to Fig. 8A, the guide plate 500 is prepared as a multilayer structure, and a plurality of penetration holes 510 penetrate the guide plate 500. In the current embodiment, three plates ° are stacked in the guide plate 50 () to stably adhere the connector in the probe card. Two or four or more plates may also be stacked in the guide plate 500 as is known to those skilled in the art. The gap distance between adjacent penetration holes is substantially the same as the gap distance between adjacent connectors. The penetration holes 510 are positioned at the same position ' at each of the plates of the guide plate 500 such that the penetration holes 510 are continuous before and after all of the plates of the guide plate 5'. Referring to Fig. 8B, a plurality of connectors 130 are respectively inserted into the penetration holes 510 of the guide plates 5''. The height of the guide plate 500 is smaller than the height ij of the connector 13b, thereby allowing the action of inserting the connector 130 into the penetration hole 510 to be easily checked. That is, the first contact portion 132 of the connector 130 (which is formed as a block) protrudes from the bottom surface of the guide plate 500, and the second contact portion 134 of the connector (which is formed into a ring) is guided from the guide plate 5 The top surface of the dragonfly stretched out. Referring to Figure 8C', one of the plates slides relative to the other of the guide plates 5''. In the current embodiment, the center panel slides relative to the upper and lower panels. However, as is generally known to those skilled in the art, the upper or lower panels can also slide with other panels. When one of the plates slides 21 200840150, the non-sliding plate is maintained stationary. Hereinafter, the non-sliding plate is referred to as a stationary plate. The slide plate is in contact with the first side wall of the connector 13, and an external force is applied to the connection state 130 in a first direction parallel to the sliding direction by the slide plate. In contrast, the stationary plate is in contact with the second side wall of the connector 130 opposite to the first side wall of the connector 13〇, and the reaction force is reacted by the stationary plate in the opposite direction to the first direction (reacti 〇nf〇rce) is applied to the connector 130. As a result, the connector 130 is coupled to the guide plate 500 by an external force and a reaction force (couPling force). Referring to Figure 8D, a plurality of contact pads 124 are disposed on the top surface of the base substrate 122, and a plurality of solders 136 are applied to the contact pads 124, respectively. For example, a slurry can be used as the solder 136. A plurality of probes 126 are located at the bottom surface of the bottom substrate 122. The gap distance of these contact pads 124 is substantially the same as the gap distance between the penetration holes 51 of the guide plate 500. In the current embodiment, the solder l36 may be applied to the contact pads 124 using a mask pattern or an automatic dispenser. Referring to Fig. 8E, the base substrate 122 and the guide plate 500 are aligned with each other in such a manner that the connectors 13 in the guide plate 500 are positioned above the contact pads 124 on the base substrate I22. Next, the guide plates % 〇 are moved downwards, • so these connectors 130 are in contact with the solder 136 on the contact pads 124, respectively. Each of these solders 136 is heated by heat transfer to thereby be heated to reflux; then sufficiently cooled. Solder 136 may be cooled by a passive cooling process or by injecting a cooling gas to solder 136. As a result, the connector 130 is firmly adhered to the contact heat 124 by the solder 136, respectively. twenty two

C Ο 200840150 Referring to Fig. 8F, the sliding plate of the guide plate 500 is returned to the original position, and the connecting body 130 is spaced apart from the inner surface of the through hole 51 of the guide plate 5 to untie the connector 13 and guide. The age of the board 5 (10). Then, the guide plates are moved upward, and the connectors 13 are separated from the guide plates 5, thereby completing the action of the connectors 130 being adhered to the bottom substrate 122 by the above adhesion, and the connector 13 is fixed to the bottom. Substrate 122. Manganese g. The exemplary embodiment of the present invention discusses a method in which the connectors 130 described with reference to FIGS. 2 and 3 can be used to the bottom substrate 122, but as known from the prior art, it can also be substantially Plum picks up and pots to the bottom base 122 It can bond a plurality of connectors 13G to the bottom substrate at the same time to make the connector 130 accurate and sturdy on the bottom substrate (2). 4' Hunting improved connector 13 ° adhesion process efficiency in the common plate embodiment 'connector firmly fixed to the connection hole of the second substrate sliding way squared up - two connectors can be water on the first substrate Beam ground movement: this: ii: an if vertical direction is not subject to any application of the second substrate structure pad, in order to dream that the other 'connector hunting is fixed by solder to the contact welding, even the connector and the rotating pad The contact between the failed. This port. The hot cloth is elastically deformed so that the connector can have a larger cross-sectional area at a shorter length of 23 200840150 degrees to thereby reduce electrical resistance. As a result, the electrical performance of the probe card can be sufficiently increased. In addition, the connectors can be bonded to the precise position on the contact pads on the bottom substrate at the same time, thereby improving the effectiveness and reliability of the bonding process of the connector. g ί t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t Other features and advantages of the present invention will become apparent from the above description taken in conjunction with the accompanying drawings, in which: Fig. 2 is a cross-sectional view illustrating a conventional probe card. Fig. 2 is a partially enlarged view showing a portion of a cross section of the probe card in accordance with an exemplary embodiment of the present invention. Fig. 4 is a cross-sectional view taken in accordance with the present invention. FIG. 5 of the probe card of another exemplary embodiment of the month is the A of FIG. 4, and part of the cross-section of the probe is as follows: according to the present invention, the typical fine probe card is as shown in FIG. 6: Part of the if part _ Snap-on connection The cross-sectional view of the method of detecting the transfer according to an exemplary embodiment of the present invention. 24 200840150 [Description of main component symbols] 1 : Probe card 10 : First substrate structure ' 14 : Connection hole 20 · · Second substrate structure 22 : Contact pad 30 : Connector 32 : Elastic portion ◎ 34 : Fixed portion 100 : Probe card 110: first substrate structure 112: connection hole 114: conductive layer 120: second substrate structure 122: bottom substrate 124: contact pad 126: probe 128: signal line - 130 · · connector. 132 · · One contact portion 134: second contact portion 136: solder 140: fixing plate 141: first plate 25 200840150 142: second plate 143: third plate 144: plate spring 145: first screw 146: second screw 147 Third screw 150: horizontal level control member 200: probe cassette 210: first substrate structure 212: first connection hole 214: first conductive layer 220 · second substrate structure 222: bottom substrate 224: contact pad 230: Connector 232: First contact portion q 234: Second contact portion 236: Solder. 240 · Fixing plate 250: Horizontal level control member 260: Socket 260a · First sub-socket 260b: Second sub-socket 262 ··Second connection hole 26 200840150 —— i 264 : Conductive layer 300: probe card 310: first substrate structure 320: second substrate structure 322: bottom substrate 324: contact pad 330: connector 334: second contact portion 340: fixed plate 350: horizontal level control member 360: Socket 362: connection hole 364: conductive layer 500: guide plate 510: through hole Ο 27

Claims (1)

200840150 X. Patent application scope: 1. A probe card comprising: a first substrate structure having a plurality of first connection holes, wherein a first conductive layer is located on an inner surface of each of the first connection holes and a signal line connected to the first substrate structure; a second substrate structure having a contact pad at an upper portion of the second substrate structure and a contact with an inspection object at a lower portion of the second substrate structure a plurality of probes; and a plurality of connectors each including a first contact portion and a second contact portion, the first contact portion being fixed to the contact pads of the second substrate structure and the second A contact portion is inserted into each of the first connection holes and is in contact with the first conductive layer in each of the first connection holes. 2. The probe card of claim 1, wherein the first contact portion is fixed to the contact pad by solder. 3. The probe card of claim 1, wherein the second contact portion is shaped as a ring such that the first conductive layer and the second contact portion are at the second contact portion Contact at least two locations. 4. The probe card of claim 1, wherein the second contact portion is shaped as a ring-shaped ring such that the first conductive layer and the second contact portion are in the second contact portion At least two locations are in point contact. 5. The probe card of claim 1, further comprising a plug 28 200840150 positioned at a lower surface of the first substrate structure and having a second connection hole, each of the connectors Inserting into the second connection hole, a second conductive layer is located on an inner surface of the second connection hole and connected to a signal line in the first substrate structure. 6. The probe card of claim 5, wherein the plug includes: a first sub-socket fixed to the lower surface of the first substrate structure; and a sub-socket, lightly coupled Sliding to the first sub-socket and relative to the wide first sub-socket, so that the sliding of the second sub-socket relative to the first sub-socket is caused to be inserted into the first connecting holes Each of the connectors in each of the connectors is secured to the first substrate structure. 7. The probe card of claim 5, wherein the one of the plurality of connection holes is connected to the second connection hole. 8. The probe card of claim 7, wherein the second contact portion has substantially the same size as the first connection hole and the second connection hole (j. 9) as claimed in claim 7 The probe card, wherein the second connection holes of the sockets are smaller than the straight detectors of the connectors, and include: a first substrate structure having a plurality of signal lines; a 'substrate structure' having a contact pad located at an upper portion of the second substrate structure and a plurality of portions of the second substrate structure lower portion 29 Ο Ο wherein the 200840150 is in contact with the inspection object a probe; and a plurality of connectors fixed to the contact pads of the second substrate structure; and a funnel socket positioned at a lower surface of the first substrate structure and having a plurality of connection holes, the connections The device is respectively inserted into the connection holes, and the conductive layer is located on the inner surface of each of the connection holes and is connected to the signal lines in the first substrate structure. The probe card of claim 10, wherein the face sub-slot is fixed to the lower surface of the first substrate structure, the second sub-fine, and the shirt is inserted into the first sub-π and relative to the The splaying of the second sub-socket with respect to the sliding of the sub-socket causes the connectors of the connecting holes to be fixed to the first substrate structure. Each of the connecting holes of the detecting card described in the claim 1G of the patent application is formed into a rod body. 13, as described in the scope of claim 10, the connecting holes of the detecting card J: the diameter is larger than The diameter of the surface. H. - The method of connecting the read to the substrate, comprising: providing a mixture of a plurality of plates of the mold ^ ^ each of the plates is transparent: the directional plate contains through, a majority The connector is divided into the penetration holes; the 30 200840150 is used to slid the connector to the guide plate by sliding the one of the plates relative to the other plates; The connectors to the guide plate are fixed to an upper surface of the substrate, and the substrate includes a probe at the lower surface of the substrate. 15. A method of attaching a connector to a substrate as described in claim 14, wherein the connectors are fixed to the upper surface of the substrate Thereafter, the method further comprises: χ Ο ο uncoupling the guiding plate from the connector; and separating the guiding plate from the connector. As disclosed in claim 14 a method of bonding to the substrate, wherein the step of fixing the connectors to the surface of the substrate comprises: forming a plurality of solders on the upper surface of the substrate; Said joint solder contacts; I, said if said solder to thereby return said solder; and hunting to cool said solder by cooling. The gap between the 14 items is as follows: the gap between the following: