TWI400451B - Probe card - Google Patents

Description

Probe card

Example embodiments of the present invention relate to probe cards and, more particularly, to probe cards that include probes that are in contact with conductive pads of semiconductor components.

Semiconductor components are typically fabricated via a series of unit processes such as fabrication processes, electronic die sorting processes (EDS), and packaging processes. Various circuits and components are fabricated on a semiconductor substrate such as a germanium wafer during the manufacturing process, and electrical characteristics of the electronic circuit are detected during the EDS process and defective wafers in the wafer are detected. Next, the components are individually separated from the wafer, and each component is sealed with an epoxy resin and packaged into individual semiconductor components during the packaging process.

The EDS process for detecting a defective wafer in a semiconductor element can be performed by a detecting tool such as a probe card. A plurality of probes of the probe card are contacted with the semiconductor component and an electrical signal is applied to the probe card, and a response signal regarding the electrical signal is detected via the probe to thereby detect the defective wafer of the semiconductor component. The probe card typically includes a first structure having a circuit pattern, a second structure having a plurality of probes at a bottom surface thereof, and a connector for electrically connecting the circuit pattern to the probe.

Today, the trend is that the size of the probe card increases as the size of the wafer increases. However, a large probe card can cause deflection of the second substrate structure, and the probes of the second substrate structure may not be dispersed in the same plane due to the deflection of the second substrate structure. Therefore, the probe and the conductive pad of the semiconductor element There may be contact failures between them, thereby reducing the reliability of the probe card.

Accordingly, the present invention provides a probe card for preventing deflection of a substrate structure and improving the level of the substrate structure.

According to an aspect of the present invention, a probe card includes: a first substrate structure having a plurality of first through holes at a central portion thereof and a circuit pattern on an upper surface thereof; and a second substrate structure, It is in contact with the lower surface of the first substrate structure. The second substrate structure includes a plurality of through holes respectively connected to the first through holes of the first substrate structure, a plurality of bolt holes at the upper surface thereof, and a plurality of probes at the lower surface thereof. The probe card further includes: a flexible connecting medium electrically connected to the circuit pattern and the probe via the first through hole of the first substrate structure and the through hole of the second substrate structure; the plurality of support bolts penetrating the first a substrate structure and selectively bonded to the bolt holes of the second substrate structure to thereby control the horizontal level of the second substrate structure; and a plurality of pressing bolts that penetrate the first substrate structure and selectively press around the bolt holes The second substrate structure is thereby controlled to control the level of the second substrate structure.

In an example embodiment, the support bolt and the pressing bolt are replaced with each other.

In an example embodiment, the probe card may further include a center bolt that penetrates the first substrate structure and selectively engages a central portion of the second substrate structure to thereby control the level of the second substrate structure.

In an example embodiment, the second substrate structure includes: a substrate in contact with a lower surface of the first substrate structure and including a plurality of second through holes respectively connected to the first through holes of the first substrate structure; a plurality of guide bars , which is bonded to the substrate a lower surface and a plurality of third through holes respectively connected to the second through holes of the substrate; and a plurality of guiding members each joined to each of the guide bars and including a plurality of fourth through holes, Each of the probes is bonded to each of the guide members via the fourth through holes, and the through holes of the second substrate structure include the second and third through holes. Each of the guide bars is joined to the substrate by at least one engagement bolt. A plurality of engagement bolts are disposed along an edge portion of the guide bar such that the guide bar can be prevented from being bent downward.

In an example embodiment, the probe card may further include: a lower auxiliary plate coupled to the lower surface of the first substrate structure and including a sixth through hole in which the second substrate structure is positioned; and a plurality of elastic members that are fastened The lower auxiliary board is in contact with the lower surface of the second substrate structure to thereby support the second substrate structure. The elastic member may include a leaf spring.

In an example embodiment, the probe card may further include: a plurality of edge bolts penetrating the first substrate structure and applying pressure to an edge portion of the second substrate structure to thereby control a horizontal level of the second substrate structure; And a plurality of support members that are in contact with the edge bolts and the edge portions of the second substrate structure and transfer the pressure caused by the edge bolts to the second substrate structure. The support can have a spherical shape. The probe card may further include a plurality of reinforcing members interposed between the support member and an edge portion of the upper surface of the second substrate structure and having a strength greater than that of the second substrate structure. The reinforcing members can be inserted into the second substrate structure such that the top surface of each of the reinforcing members is coplanar with the upper surface of the second substrate structure.

In an example embodiment, the probe card may further include an upper auxiliary plate that spaces the lower surface of the upper auxiliary plate from the upper surface of the first substrate structure The configuration is bonded to the upper surface of the first substrate structure such that a holding space remains between the upper auxiliary plate and the first substrate structure, and the circuit pattern on the upper surface of the first substrate structure is located in the holding space. The upper auxiliary board may include: a body bonded to the upper surface of the first substrate structure and including a fifth through hole through which the circuit pattern on the upper surface of the first substrate structure is exposed; and a cover which is made to make the fifth through hole The cover is shielded to the main body such that the interior of the fifth through hole is converted into a holding space. The first substrate structure and the upper auxiliary plate are joined to each other by penetrating the first substrate structure from the lower surface of the first substrate structure and the first bolt of the upper auxiliary plate, and are assisted by the lower surface of the lower auxiliary plate. The plate, the first substrate structure, and the second bolt of the upper auxiliary plate engage the first substrate structure and the lower auxiliary plate with each other. The probe card may further include an insulating film on the upper surface and the lower surface of the first substrate structure to thereby prevent heat transfer to the first substrate structure. The probe card may further include a plurality of inserting members, the inserting member penetrating the first substrate structure in a configuration in which the inserting member protrudes from the upper surface and the lower surface of the first substrate structure, such that the first substrate structure and the upper auxiliary plate and the lower The auxiliary board and the second substrate structure are spaced apart.

According to another aspect of the present invention, a probe card is provided, comprising: a first substrate structure having a plurality of first through holes at a central portion thereof and a circuit pattern on an upper surface thereof; and a second substrate a structure that is in contact with a lower surface of the first substrate structure. The second substrate structure includes a plurality of vias respectively connected to the first via holes of the first substrate structure and a plurality of probes at the lower surface thereof. The probe card further includes: an upper auxiliary plate bonded to the upper surface of the first substrate structure in a configuration in which a lower surface of the upper auxiliary plate is spaced apart from an upper surface of the first substrate structure, such that the upper auxiliary plate and the first substrate Between structures Retaining a holding space, and the circuit pattern on the upper surface of the first substrate structure is located in the holding space; the lower auxiliary plate is bonded to the lower surface of the first substrate structure and includes a sixth through hole in which the second substrate structure is positioned; a plurality of elastic members fastened to the lower auxiliary plate and in contact with the lower surface of the second substrate structure to thereby support the second substrate structure; the flexible connection medium through the first through hole of the first substrate structure and a through hole of the second substrate structure electrically connected to the circuit pattern and the probe; a plurality of edge bolts penetrating the first substrate structure and applying pressure to an edge portion of the second substrate structure to thereby control the second substrate structure a horizontal level; and a plurality of support members that contact the edge bolts and the edge portions of the second substrate structure and transfer the pressure caused by the edge bolts to the second substrate structure.

In an example embodiment, the probe card may further include a center bolt that penetrates the upper auxiliary plate and the first substrate structure and is bonded to a central portion of the second substrate structure to thereby control the level of the second substrate structure.

In an example embodiment, the probe card may further include: a plurality of support bolts penetrating the upper auxiliary plate and the first substrate structure and selectively bonding between the central portion and the peripheral portion of the upper surface of the second substrate structure a plurality of bolt holes; and a plurality of pressing bolts penetrating the upper auxiliary plate and the first substrate structure and selectively pressing the second substrate structure around the bolt holes to thereby control the horizontal level of the second substrate structure. The support bolt and the pressing bolt are replaced with each other.

In an example embodiment, the resilient member includes a leaf spring and the support has a spherical shape.

In an example embodiment, the upper auxiliary plate includes: a body that is coupled to the a surface of the upper surface of the substrate structure and including a fifth via hole through which the circuit pattern on the upper surface of the first substrate structure is exposed; and a cover that is bonded to the body in a configuration in which the fifth via hole is shielded by the cover, such that The inside of the fifth through hole is transformed into a holding space.

In an example embodiment, the second substrate structure includes: a substrate in contact with a lower surface of the first substrate structure and including a plurality of second through holes respectively connected to the first through holes of the first substrate structure; a plurality of guide bars a plurality of third through holes joined to the lower surface of the substrate and including second through holes respectively connected to the substrate; and a plurality of guiding members each joined to each of the guide bars and including a plurality of The fourth through holes are such that each of the probes is bonded to each of the guiding members via the fourth through holes, and the through holes of the second substrate structure include the second and third through holes. Each of the guide bars is coupled to the substrate by at least one engagement bolt, and the plurality of engagement bolts are disposed along an edge portion of the guide bar such that the guide bar can be prevented from bending downward.

In an example embodiment, the probe card may further include a plurality of reinforcing members interposed between the support member and an edge portion of the upper surface of the second substrate structure and having a strength greater than that of the second substrate structure. The reinforcing members are inserted into the second substrate structure such that the top surface of each of the reinforcing members is coplanar with the upper surface of the second substrate structure.

In an example embodiment, the first substrate structure and the upper auxiliary plate are joined to each other by a bolt that penetrates the first substrate structure and the upper auxiliary plate from a lower surface of the first substrate structure.

In an example embodiment, the first substrate structure is formed by penetrating the lower auxiliary plate, the first substrate structure, and the upper auxiliary plate from the lower surface of the lower auxiliary plate. Engaged with the lower auxiliary plates.

In an example embodiment, the probe card may further include an insulating film on the upper surface and the lower surface of the first substrate structure to thereby prevent heat transfer to the first substrate structure.

In an example embodiment, the probe card may further include a plurality of insertion members that penetrate the first substrate structure in a configuration in which the insertion member protrudes from the upper surface and the lower surface of the first substrate structure, such that the first substrate structure is respectively It is spaced apart from the upper auxiliary plate, the lower auxiliary plate, and the second substrate structure.

According to still another aspect of the present invention, a probe card includes: a first substrate structure having a plurality of first through holes at a central portion thereof and a circuit pattern on an upper surface thereof; and a second substrate a structure that is in contact with a lower surface of the first substrate structure. The second substrate structure includes a plurality of through holes respectively connected to the first through holes of the first substrate structure, a plurality of bolt holes at the upper surface thereof, and a plurality of probes at the lower surface thereof. The probe card further includes: an upper auxiliary plate bonded to the upper surface of the first substrate structure in a configuration in which a lower surface of the upper auxiliary plate is spaced apart from an upper surface of the first substrate structure, such that the upper auxiliary plate and the first substrate Retaining space remains between the structures, and the circuit pattern on the upper surface of the first substrate structure is located in the holding space; the lower auxiliary board is bonded to the lower surface of the first substrate structure and includes a sixth substrate structure positioned therein a through hole; a plurality of elastic members fastened to the lower auxiliary plate and in contact with the lower surface of the second substrate structure to thereby support the second substrate structure; the flexible connection medium, which is first through the first substrate structure a through hole and a through hole of the second substrate structure electrically connected to the circuit pattern and the probe; a plurality of support bolts penetrating the first substrate structure and selectively bonding to the second a bolt hole of the substrate structure to thereby control a horizontal level of the second substrate structure; and a plurality of pressing bolts penetrating the first substrate structure and selectively pressing the second substrate structure around the bolt hole to thereby control The horizontal level of the second substrate structure.

According to still another aspect of the present invention, a probe card includes: a first substrate structure having a plurality of first through holes at a central portion thereof and a circuit pattern on an upper surface thereof; and a second substrate a structure that is in contact with a lower surface of the first substrate structure. The second substrate structure includes a plurality of through holes respectively connected to the upper through holes of the first substrate structure, a plurality of bolt holes between the central portion and the peripheral portion of the upper surface thereof, and a plurality of probes at the lower surface thereof needle. The probe card further includes: an upper auxiliary plate bonded to the upper surface of the first substrate structure in a configuration in which a lower surface of the upper auxiliary plate is spaced apart from an upper surface of the first substrate structure, such that the upper auxiliary plate and the first substrate Retaining space remains between the structures, and the circuit pattern on the upper surface of the first substrate structure is located in the holding space; the lower auxiliary board is bonded to the lower surface of the first substrate structure and includes a sixth substrate structure positioned therein a through hole; a plurality of elastic members fastened to the lower auxiliary plate and in contact with the lower surface of the second substrate structure to thereby support the second substrate structure; the flexible connection medium, which is first through the first substrate structure a through hole and a through hole of the second substrate structure are electrically connected to the circuit pattern and the probe; a plurality of edge bolts penetrating the first substrate structure and applying pressure to an edge portion of the second substrate structure, thereby controlling the a horizontal level of the two substrate structures; a plurality of support members that are in contact with the edge bolts and the edge portions of the second substrate structure and transfer the pressure caused by the edge bolts to the second substrate structure; Bolt, penetrating the first auxiliary plate and a substrate structure and bonded to a central portion of the second substrate structure to thereby control a horizontal level of the second substrate structure; a plurality of support bolts penetrating the first substrate structure and selectively bonding to the second substrate structure a bolt hole to thereby control a horizontal level of the second substrate structure; and a plurality of pressing bolts penetrating the first substrate structure and selectively pressing the second substrate structure around the bolt hole to thereby control the second substrate The level of structure.

According to still another aspect of the present invention, a probe card includes: a first substrate structure having a plurality of first through holes at a central portion thereof and a circuit pattern at an upper surface thereof; and a second substrate a structure under the first substrate structure; and a plurality of flexible connection media electrically connected to the circuit pattern and the probe via the second via and the third via. The second substrate structure may include: a substrate in contact with a lower surface of the first substrate structure and including a plurality of second through holes respectively connected to the first through holes of the first substrate structure; a plurality of guiding rods bonded to the substrate a lower surface and a plurality of third through holes respectively connected to the second through holes of the substrate; and a plurality of guiding members each joined to each of the guide bars and including a plurality of fourth through holes, Each of the probes is bonded to each of the guide members via the fourth through holes, and the through holes of the second substrate structure include the second and third through holes.

According to an exemplary embodiment of the present invention, a probe card includes a plurality of bolts for adjusting a horizontal level of a substrate such that a horizontal level of the substrate is controlled at a periphery, a center, and an intermediate portion of the substrate of the probe card by bolts, respectively. In order to improve the accuracy of the horizontal level control.

The present invention will be described with reference to the following detailed description when considered in conjunction with the drawings. The above and other features and advantages will become readily apparent.

The invention is described more fully hereinafter with reference to the accompanying drawings in which, However, the invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.

It will be understood that when an element or layer is referred to as "on", "connected to" or "coupled to" another element or layer, Directly coupled or directly coupled to another element or layer, or an intervening element or layer may be present. In contrast, when an element is referred to as “directly on,” “directly connected,” or “directly connected” or “directly connected” to another element or layer, there are no intervening elements or layers. The same numbers refer to the same elements throughout the text. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

It will be understood that the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and/or regions, but such elements, components, regions, layers And/or districts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or layer with another region, layer or region. Thus, a first element, component, region, layer or layer that is discussed below may be referred to as a second element, component, region, layer or region, without departing from the teachings of the invention.

For ease of description, spatially relevant terms may be used herein (such as "Under", "below", "lower", "above", "upper" and the like) are used to describe one element or feature and another element or feature as illustrated in the figures. Or feature) relationship. It will be understood that the spatially relative terms are intended to encompass different orientations of the elements in use or operation. For example, elements in the "following" or "beneath" or "an" or "an" Accordingly, the exemplary term "lower" can encompass the above and the following. The elements may be oriented in other ways (rotated 90 degrees or in other orientations) and the spatially related descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of the description and the embodiments As used herein, the singular forms "" It is to be further understood that the term "comprises and/or "comprising", when used in the specification, is used to specify the presence of the specified features, integers, steps, operations, components and/or components, but does not exclude one or more other features, The presence or addition of integers, steps, operations, components, components, and/or groups thereof.

Embodiments of the invention are described herein with reference to the cross-section illustrations, and the cross-section illustrations are a schematic illustration of a preferred embodiment (and intermediate structure) of the invention. Thus, variations to the shapes of the descriptions are contemplated as a result of, for example, manufacturing techniques and/or tolerances. Thus, embodiments of the invention should not be construed as limited to the particular shapes of For example, illustrated The implanted region that is rectangular will typically have rounded or curved features and/or a gradient of implant concentration at its edges rather than a binary change from the implanted region to the non-implanted region. Likewise, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which implantation occurs. The area illustrated in the figures is, therefore, in the nature of the invention, and is not intended to limit the scope of the invention.

All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art. It should be further understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the related art and are not idealized or overly formal unless otherwise explicitly defined herein. To interpret it.

1 is a cross-sectional view illustrating the structure of a probe card according to an exemplary embodiment of the present invention, and FIG. 2 is an exploded cross-sectional view illustrating the probe card of FIG. 1.

1 and 2, a probe card 100 according to an example embodiment of the present invention may include a first substrate structure 110; a second substrate structure 120; an upper auxiliary plate 130 and a lower auxiliary plate 140; an elastic member 150; a flexible connection The medium 160; a plurality of edge bolts 170; a plurality of support members 172; a center bolt 174; a plurality of support bolts 176 and pressing bolts 178; joint bolts 180, 182 and 184; an insulating film 190; and an inserting member 192.

The first substrate structure 110 may include a first substrate 112 and a connector 114.

The first substrate structure 110 is shaped as a disk and includes a plurality of through holes 116. A circuit pattern is formed on an upper surface of the first substrate structure 112. A plurality of connectors 114 are respectively located on the upper surface of the first substrate structure 112 adjacent to the upper through holes 116. The connector 114 is electrically connected to the circuit pattern.

A connection terminal of a pogo pin electrically connected to the test head is positioned along an edge portion of the upper surface of the first substrate 112 and is electrically connected to the circuit pattern.

3 is a cross-sectional view showing the structure of a second substrate of the probe card of FIG. 1.

Referring to FIG. 3, the second substrate structure 120 may be located on a lower surface of the first substrate structure 110. In an example embodiment, the second substrate structure 120 may include a second substrate 121, a plurality of guide bars 122, a plurality of guiding members 123, and a plurality of probes 124.

The second substrate 121 is formed as a plate 121 and is located at a lower surface of the first substrate 112. The second substrate 121 may include a plurality of second through holes 126 respectively corresponding to the first through holes 116. Each of the second through holes 126 is connected to a respective first through hole 116. The second substrate 121 may include a plurality of bolt holes 129 between a central portion and a peripheral portion of the upper surface thereof. The bolt hole 129 may be configured in a circular or radiating shape with respect to a central portion of the upper surface of the second substrate 121. The second substrate 121 may include a ceramic composition or an iron alloy. Examples of iron alloys may include iron-nickel (Fe-Ni) alloys, widely known as nickel steel, iron-nickel-cobalt (Fe-Ni-Co) alloys, widely known as ultra-nickel steels, which are widely known. It is made of iron-cobalt-chromium (Fe-Co-Cr) alloy of stainless nickel steel and iron-lead (Fe-Pb) alloy.

Figure 4 is a bottom plan view showing the guide bar of the second substrate shown in Figure 3.

Referring to FIG. 4, each of the guide bars 122 is shaped as a rod and spaced apart from each other on the lower surface of the second substrate 121. Each of the guide bars 122 may include a plurality of third through holes 127 instead of one long holes, so that the guide bars 122 may be sufficiently prevented from being deformed by heat. The third through hole 127 is connected to the second through hole 126.

The guide bar 122 is joined to the second substrate 121 by the first joint bolt 180. In the present embodiment, each of the guide bars 122 is shaped into a longitudinal shape and can be easily bent such that a plurality of first engagement bolts 180 are disposed along the edge portion of the guide bar 122, thereby preventing the guide bar 122 from being thereby prevented. Skewed.

The guide bar 122 may comprise a material having a coefficient of thermal expansion of around zero, such as an iron alloy. Examples of the iron alloy may include an iron-nickel (Fe-Ni) alloy, or a nickel steel including about 63.5% of iron (Fe) and about 36.5% of nickel (Ni); iron-nickel-cobalt (Fe-Ni-Co) An alloy, or an ultra-nickel steel comprising about 63% iron (Fe), about 32% nickel (Ni), and about 5% cobalt (Co); an iron-cobalt-chromium (Fe-Co-Cr) alloy, or A stainless steel comprising about 36.5% iron (Fe), about 9.5% chromium (Cr), and about 54% cobalt (Co); and about 57% iron (Fe) and about 43% lead ( Pb) iron-lead (Fe-Pb) alloy.

The guide member 123 may have a plate shape and may include a fourth through hole 128. The number of the fourth through holes 128 and the gap distance are the same as the number of conductive pads of the semiconductor element to be inspected and the gap distance. The fourth through holes 128 may be disposed in such a manner that the pair of fourth through holes 128 face each other or are staggered with each other. In reality In an example embodiment, the guide member 123 may comprise a material including bismuth (Si).

Each of the probes 124 is in direct contact with the conductive pads of the semiconductor component and an electrical signal can be communicated between the probe card 100 and the semiconductor components via the probes 124. A stepped portion is formed at an upper portion of each of the probes 124, and is inserted downward into each of the fourth through holes 128 of each of the guide members 123. A stepped portion of each of the probes 124 may span each of the guide members 123 at a peripheral portion of each of the fourth through holes 128 such that each of the guide members 123 The probe 124 can be supported. An adhesive such as an epoxy resin may be interposed between each of the guiding members 123 and the stepped portion of each of the probes 124. The terminals protrude upward from each of the probes 124 and are positioned adjacent to the center of each of the guide members 123.

As is known to those skilled in the art, the probe 124 can be coupled to the guide member 123 by a variety of modified fastening methods and tools.

The guide member 123 coupled to the probe 124 may be mounted to the lower surface of the guide bar 122 in a configuration in which the probe 124 is inserted into the third through hole 127 of the guide bar 122.

The upper auxiliary plate 130 may include a body 132 and a cover 134 and may include aluminum or an aluminum alloy.

The body 132 is bonded to the upper surface of the first substrate 112 and includes a fifth through hole 136 through which the connector 114 of the first substrate 110 is exposed. The body 132 enhances the strength of the upper portion of the first substrate 112 to thereby prevent deformation such as deflection and distortion of the first substrate 112.

The cover 134 can open or close the fifth through hole 136. In the cover 134 and the main body When the 132 is coupled and the fifth through hole 136 is covered by the cover 134, a holding space 138 is formed between the upper auxiliary plate 130 and the first substrate 112, so that the connector 114 protrudes from the first substrate 110 and is located in the holding space 138. Thus, when there is a connection failure between the connector 114 and the flexible connection medium 160, the separation of the cover 134 from the body 132 may be sufficient to repair the connection failure, and thus the upper auxiliary board 130 does not have to be separated from the first substrate structure 110.

The second engagement bolt 182 can engage the first substrate 112 with the body 132 of the upper auxiliary plate 130. In the present embodiment, the second joint bolt 182 penetrates the first substrate 112 and is screwed into the body 132 of the upper auxiliary plate 130.

The lower auxiliary plate 140 is shaped as a plate and includes a sixth through hole 142 for holding the second substrate structure 120 such that the lower auxiliary plate 140 is shaped into a ring plate. In the present embodiment, the lower auxiliary plate 140 may include an iron-nickel (Fe-Ni) alloy, or nickel steel. The lower auxiliary board 140 holds the second substrate structure 120 and is coupled to the lower surface of the first substrate 112. In particular, the second substrate 121 is located in the sixth via 142 of the lower auxiliary board 140, and thus the sidewalls of the second substrate 121 of the second substrate structure 120 are surrounded by the lower auxiliary board 140. The top surface of the lower auxiliary board 140 is coupled to the lower surface of the first substrate 112 of the first substrate structure 110. The lower auxiliary board 140 enhances the strength of the lower portion of the first substrate structure 110 to thereby prevent deformation such as skewing and distortion of the first substrate 112.

The third joint bolt 184 can engage the first substrate 112 with the lower auxiliary plate 140. In the present embodiment, the third joint bolt 184 penetrates the lower auxiliary plate 140 and the first substrate 112 and is screwed up into the main body 132 of the upper auxiliary plate 130.

A pair of elastic members 150 are fastened to the lower side of the side wall of the sixth through hole 142 And elastically supporting the lower surface of the second substrate 121, in particular, the edge portion of the lower surface of the second substrate 121. The resilient member 150 can include a spring member, such as a leaf spring.

The elastic force of the elastic member 150 may cause deformation of the second substrate 121. An auxiliary ring (not shown) including a step portion may be additionally located between the lower auxiliary plate 140 and the second substrate 121, and the second substrate 121 is auxiliaryly supported by the stepped portion of the auxiliary ring. In the present example, the auxiliary ring may have a greater strength than the second substrate 121. The elastic member 150 of the lower auxiliary plate 140 may also support the auxiliary ring such that the supporting force for the second substrate 121 is uniformly dispersed by the auxiliary ring without causing any deformation of the second substrate 121.

Connection medium 160 is electrically coupled to the terminals of each of probes 124 and is electrically coupled to connector 114 of first substrate structure 110. In the present embodiment, the connection medium 160 is secured to the terminals of each of the probes 124 by soldering and to the connectors 114 of the first substrate structure 110. The probe card 100 of the present embodiment can be further provided with a sealing member such that the connection region of the terminal of each of the flexible connection medium 160 and the probe 124 and the probe 124 protruding from the guide member 123 are sealed from the periphery. Examples of the sealing member may include an epoxy resin. The connecting medium 160 can penetrate the first through hole 116 of the first substrate 112, the second through hole 126 of the second substrate 121, and the third through hole 127 of the guiding rod 122. The connection medium 160 may include a flexible conductive member such as a flexible printed circuit board (FPCB).

Figure 5 is a cross-sectional view showing the edge bolt of the probe card shown in Figure 1.

Referring to FIG. 5, the edge bolt 170 can penetrate the main body of the upper auxiliary plate 130. 132 and the first substrate 112, and pressure is applied to an edge portion of the second substrate 121 of the second substrate structure 120. The horizontal level of the second substrate 121 can be controlled by the pressure of the edge bolt 170 on the second substrate 121 supported by the elastic member 150.

The support member 172 is in contact with an edge portion of the second substrate 121 and supports the edge bolt 170. The pressure of the edge bolt 170 can be transferred to the second substrate 121 via the support 172. The support 172 can have a spherical shape.

The reinforcing member 125 may be inserted between the support 172 and the upper surface of the second substrate 121. In the present embodiment, the reinforcing member 125 may be inserted into the upper surface of the second substrate 121 such that the top surface of the reinforcing member 125 may be coplanar with the upper surface of the second substrate 121. The reinforcing member 125 may have a greater strength than the second substrate 121. As a result, the second substrate 121 can be sufficiently prevented from being damaged by the pressure of the edge bolts 170 via the support 172.

Figure 6 is a cross-sectional view showing the center bolt of the probe card shown in Figure 1.

Referring to FIG. 6, the center bolt 174 can penetrate the cover 134 of the upper auxiliary board 130 and the first substrate 112 and can be joined to the central portion of the upper surface of the second substrate 121. The center bolt 174 prevents the central portion of the upper surface of the second substrate 121 from being deflected downward, thereby improving the horizontal level of the second substrate 121.

Figure 7 is a cross-sectional view showing the support bolt of the probe card shown in Figure 1, and Figure 8 is a cross-sectional view showing the push bolt of the probe card shown in Figure 1.

Referring to FIGS. 7 and 8 , the support bolt 176 can penetrate the cover 134 of the upper auxiliary plate 130 and the first substrate 112 and be coupled to the bolt hole 129 of the second substrate 121 . The pressing bolt 178 can penetrate the cover 134 of the upper auxiliary plate 130 and the first A substrate 112 and a second substrate 121 around the bolt hole 129 is pressed. As an example embodiment, the pressing bolt 178 may press the upper portion of the bolt hole 129 when the diameter of the pressing bolt 178 may be larger than the diameter of the bolt hole 129. Conversely, when the diameter of the pressing bolt 178 may be smaller than the diameter of the bolt hole 129, the pressing bolt 178 may press the lower portion of each of the bolt holes 129. In addition, the adjacent portion of the second substrate 121 adjacent to the bolt hole 129 may have a greater strength than any other portion of the second substrate 121, thereby sufficiently preventing the bolt hole 129 and the thread in the bolt hole 129 from being pressed by the bolt 178 caused damage. As a result, the horizontal level of the second substrate 121 can be controlled by the support bolts 176 and the pressing bolts 178.

The support bolt 176 and the pressing bolt 178 may be replaced with each other according to the horizontal level of the central portion and the peripheral portion of the second substrate 121. For example, when the second substrate 121 is bent downward or downward, a support bolt 176 may be used instead of the pressing bolt 178. Conversely, when the second substrate 121 is bent upward, a pressing bolt 178 may be used instead of the support bolt 176.

The insulating film 190 is located on the upper surface and the lower surface of the first substrate 112. The insulating film 190 can prevent heat conduction to the first substrate 112 due to heat in the semiconductor element. The insulating film 190 may include polyimide. Therefore, thermal deformation of the first substrate 112 can be sufficiently prevented by the insulating film 190.

The insertion member 192 may be shaped into a cylinder and penetrate the first substrate 112 such that the insertion member 192 may protrude from the upper surface and the lower surface of the first substrate 112. Therefore, the first substrate 112 can be spaced apart from the upper auxiliary board 130, the lower auxiliary board 140, and the second substrate 121 by the insertion member 192 to borrow This sufficiently prevents heat conduction from the semiconductor element to the first substrate structure 110. Therefore, thermal deformation of the first substrate structure 110 can be sufficiently prevented by the insertion member 192.

The insert member 192 can be formed as an elongated plate and can be inserted between the first substrate 112 and the upper auxiliary plate 130, between the first substrate 112 and the lower auxiliary plate 140, and between the first substrate 112 and the second substrate 121.

According to an exemplary embodiment of the present invention, a probe card includes a plurality of bolts for adjusting a horizontal level of a substrate such that a horizontal level of the substrate is controlled at a periphery, a center, and an intermediate portion of the substrate of the probe card by bolts, respectively. In order to improve the accuracy of the horizontal level control. The peripheral portion of the substrate is in contact with the probe of the probe card, and the central portion of the substrate is adjacent to the center of the substrate. The middle portion of the substrate is interposed between the peripheral portion and the central portion of the substrate. Additionally, the probe card can include a plurality of engagement bolts for preventing deflection of the guide bars that are coupled to the substrate. In addition, the probe card may also include an insulating film or an insert member for preventing thermal deformation of the substrate.

Although the exemplary embodiments of the present invention have been described, it should be understood that the present invention is not limited to the exemplary embodiments, but various modifications may be made by those skilled in the art in the spirit and scope of the invention as claimed hereinafter. And modifications.

100‧‧‧ Probe card

110‧‧‧First substrate structure

112‧‧‧First substrate

114‧‧‧Connector

116‧‧‧through hole

120‧‧‧Second substrate structure

121‧‧‧second substrate

122‧‧‧ Guide rod

123‧‧‧Guide parts

124‧‧‧Probe

125‧‧‧Rigid parts

126‧‧‧second through hole

127‧‧‧ third through hole

128‧‧‧fourth through hole

129‧‧‧Bolt holes

130‧‧‧Upper auxiliary board

132‧‧‧ Subject

134‧‧‧ Cover

136‧‧‧5th through hole

138‧‧‧ Holding space

140‧‧‧Auxiliary board

142‧‧‧ sixth through hole

150‧‧‧Flexible parts

160‧‧‧Connected media

170‧‧‧Edge bolts

172‧‧‧Support

174‧‧‧Center bolt

176‧‧‧Support bolts

178‧‧‧Press bolts

180‧‧‧Joint bolt

182‧‧‧Joint bolt

184‧‧‧Joint bolt

190‧‧‧Insulation film

192‧‧‧Insert parts

1 is a cross-sectional view illustrating the structure of a probe card in accordance with an exemplary embodiment of the present invention.

Figure 2 is an exploded cross-sectional view showing the probe card of Figure 1.

Figure 3 is a cross section showing the structure of the second substrate of the probe card of Figure 1. Figure.

Figure 4 is a bottom plan view showing the guide bar of the second substrate shown in Figure 3.

Figure 5 is a cross-sectional view showing the edge bolt of the probe card shown in Figure 1.

Figure 6 is a cross-sectional view showing the center bolt of the probe card shown in Figure 1.

Figure 7 is a cross-sectional view showing the support bolt of the probe card shown in Figure 1.

Figure 8 is a cross-sectional view showing the pressing bolt of the probe card shown in Figure 1.

100‧‧‧ Probe card

110‧‧‧First substrate structure

112‧‧‧First substrate

120‧‧‧Second substrate structure

130‧‧‧Upper auxiliary board

132‧‧‧ Subject

134‧‧‧ Cover

138‧‧‧ Holding space

140‧‧‧Auxiliary board

150‧‧‧Flexible parts

160‧‧‧Connected media

170‧‧‧Edge bolts

172‧‧‧Support

174‧‧‧Center bolt

176‧‧‧Support bolts

178‧‧‧Press bolts

180‧‧‧Joint bolt

182‧‧‧Joint bolt

184‧‧‧Joint bolt

Claims (35)

A probe card comprising: a first substrate structure having a plurality of first through holes and a circuit pattern, the first through holes being at a central portion of the first substrate structure, the circuit pattern being on the first substrate a second substrate structure contacting the lower surface of the first substrate structure, the second substrate structure including a plurality of passes respectively connected to the first through holes of the first substrate structure a hole, a plurality of bolt holes at an upper surface of the second substrate structure, and a plurality of probes at a lower surface of the second substrate structure; a flexible connection medium via the first substrate structure The first via and the via of the second substrate structure are electrically connected to the circuit pattern and the probe; a plurality of support bolts penetrating the first substrate structure and selectively bonding a bolt hole to the second substrate structure to thereby control a horizontal level of the second substrate structure; and a plurality of pressing bolts penetrating the first substrate structure and selectively pressing the bolt The second substrate junction around the hole , Thereby controlling the level to a second level of the substrate structure. The probe card of claim 1, wherein the support bolt and the pressing bolt are replaced with each other. The probe card of claim 1, further comprising a central bolt that penetrates the first substrate structure and is selectively coupled to a central portion of the second substrate structure to thereby control The second The level of the substrate structure. The probe card of claim 1, wherein the second substrate structure comprises: a substrate in contact with a lower surface of the first substrate structure, and including the first connection to the first substrate structure a plurality of second through holes of a through hole; a plurality of guiding rods joined to the lower surface of the substrate, and including a plurality of third through holes respectively connected to the second through holes of the substrate; and Guide members, each coupled to each of the guide bars, and including a fourth through hole such that each of the probes is coupled to the via via the fourth through hole Each of the guiding members, and the through hole of the second substrate structure includes the second through hole and the third through hole. The probe card of claim 4, wherein each of the guide bars is joined to the substrate by at least one engagement bolt. The probe card of claim 5, wherein the plurality of the engagement bolts are disposed along an edge portion of the guide bar such that the guide bar is prevented from being bent downward. The probe card of claim 1, further comprising: a lower auxiliary plate bonded to a lower surface of the first substrate structure, and including a sixth through hole, wherein the second substrate structure is positioned in the first And a plurality of elastic members fastened to the lower auxiliary plate and in contact with a lower surface of the second substrate structure to thereby support the second substrate structure. The probe card of claim 7, wherein the elastic member comprises a leaf spring. The probe card of claim 7, further comprising: a plurality of edge bolts penetrating the first substrate structure and applying pressure to an edge portion of the second substrate structure to thereby control the a horizontal level of the second substrate structure; and a plurality of supports in contact with the edge bolts and edge portions of the second substrate structure and transferring pressure caused by the edge bolts to the second substrate structure. The probe card of claim 9, wherein the support member has a spherical shape. The probe card of claim 9, further comprising a plurality of reinforcing members, the reinforcing member being inserted between the support member and an edge portion of the upper surface of the second substrate structure, and having a ratio The strength of the second substrate structure is large. The probe card of claim 11, wherein the reinforcing member is inserted into the second substrate structure such that a top surface of each of the reinforcing members and the second substrate structure are The surface is coplanar. The probe card of claim 7, further comprising an upper auxiliary plate, wherein the upper auxiliary plate is configured to space the lower surface of the upper auxiliary plate from the upper surface of the first substrate structure Bonding to an upper surface of the first substrate structure such that a retention space remains between the upper auxiliary plate and the first substrate structure, and the circuit pattern on the upper surface of the first substrate structure is located In the holding space. The probe card of claim 13, wherein the upper auxiliary plate comprises: a body joined to an upper surface of the first substrate structure, and including a fifth through hole, the first substrate structure The circuit pattern on the surface is exposed by the fifth through hole; and the cover is joined to the body in a configuration in which the fifth through hole is shielded by the cover such that the inside of the fifth through hole Converted into the holding space. The probe card of claim 13, wherein the first substrate structure and the upper auxiliary plate are formed by penetrating the first substrate structure from a lower surface of the first substrate structure and The first bolts of the upper auxiliary plate are joined to each other, and the first substrate structure and the lower auxiliary plate are formed by penetrating the lower auxiliary plate from the lower surface of the lower auxiliary plate, the first substrate structure And the second bolts of the upper auxiliary plate are joined to each other. The probe card of claim 13, further comprising an insulating film on the upper surface and the lower surface of the first substrate structure to thereby prevent heat transfer to the first substrate structure. The probe card of claim 13, further comprising a plurality of inserting members, the inserting member penetrating in a configuration in which the inserting member protrudes from an upper surface and a lower surface of the first substrate structure The first substrate structure is such that the first substrate structure is spaced apart from the upper auxiliary plate, the lower auxiliary plate, and the second substrate structure, respectively. A probe card comprising: a first substrate structure having a plurality of first through holes and a circuit pattern, the first through holes being at a central portion of the first substrate structure, the circuit a pattern on an upper surface of the first substrate structure; a second substrate structure in contact with a lower surface of the first substrate structure, the second substrate structure including the first connection to the first substrate structure a plurality of through holes of a through hole and a plurality of probes at a lower surface of the second substrate structure; an upper auxiliary plate on a lower surface of the upper auxiliary plate and an upper surface of the first substrate structure Bonded to the upper surface of the first substrate structure in a spaced apart configuration such that a retention space remains between the upper auxiliary plate and the first substrate structure, and the upper surface of the first substrate structure a circuit pattern is located in the holding space; a lower auxiliary plate is bonded to the lower surface of the first substrate structure, and includes a sixth through hole, wherein the second substrate structure is positioned in the sixth through hole; Elastic members fastened to the lower auxiliary plate and in contact with a lower surface of the second substrate structure to thereby support the second substrate structure; flexible connecting medium via the first substrate structure The first through hole and the second The through hole of the plate structure is electrically connected to the circuit pattern and the probe; a plurality of edge bolts penetrating the first substrate structure and applying pressure to an edge portion of the second substrate structure to Thereby controlling the horizontal level of the second substrate structure; and a plurality of supports contacting the edge bolts and edge portions of the second substrate structure, and transferring pressure caused by the edge bolts to the Second substrate structure. For example, the probe card described in claim 18 of the patent scope includes a central bolt penetrating the upper auxiliary plate and the first substrate structure and joined to a central portion of the second substrate structure to thereby control a horizontal level of the second substrate structure. The probe card of claim 18, further comprising: a plurality of support bolts penetrating the upper auxiliary plate and the first substrate structure and selectively bonding to the second substrate structure a plurality of bolt holes between the central portion and the peripheral portion of the surface; and a plurality of pressing bolts penetrating the upper auxiliary plate and the first substrate structure and selectively pressing the second around the bolt holes a substrate structure to thereby control the level of the second substrate structure. The probe card of claim 20, wherein the support bolt and the pressing bolt are replaced with each other. The probe card of claim 18, wherein the elastic member comprises a leaf spring and the support has a spherical shape. The probe card of claim 18, wherein the upper auxiliary plate comprises: a body joined to an upper surface of the first substrate structure, and including a fifth through hole, the first substrate structure The circuit pattern on the surface is exposed by the fifth through hole; and the cover is joined to the body in a configuration in which the fifth through hole is shielded by the cover such that the inside of the fifth through hole Converted into the holding space. The probe card of claim 18, wherein the second substrate structure comprises: a substrate in contact with a lower surface of the first substrate structure, and includes a plurality of second vias connected to the first via of the first substrate structure; a plurality of guide bars bonded to the lower surface of the substrate, and including the first connection to the substrate a plurality of third through holes of the two through holes; and a plurality of guiding members each joined to each of the guide bars and including a plurality of fourth through holes such that each of the probes Each of the guiding members is joined via the fourth through hole, and the through hole of the second substrate structure includes the second through hole and the third through hole. The probe card of claim 24, wherein each of the guide bars is joined to the substrate by at least one engagement bolt. The probe card of claim 25, wherein the plurality of the engagement bolts are disposed along an edge portion of the guide bar such that the guide bar is prevented from being bent downward. The probe card of claim 18, further comprising a plurality of reinforcing members, the reinforcing member being inserted between the support member and an edge portion of the upper surface of the second substrate structure, and having a ratio The strength of the second substrate structure is large. The probe card of claim 27, wherein the reinforcing member is inserted into the second substrate structure such that a top surface of each of the reinforcing members and the second substrate structure are The surface is coplanar. The probe card of claim 18, wherein the first substrate structure and the upper auxiliary plate are from the first substrate structure The lower surface penetrates the first substrate structure and the bolts of the upper auxiliary plate to engage each other. The probe card of claim 18, wherein the first substrate structure and the lower auxiliary plate are formed by penetrating the lower auxiliary plate from the lower surface of the lower auxiliary plate, the first The substrate structure and the bolts of the upper auxiliary plate are joined to each other. The probe card of claim 18, further comprising an insulating film on the upper surface and the lower surface of the first substrate structure to thereby prevent heat transfer to the first substrate structure. The probe card of claim 18, further comprising a plurality of inserting members, the inserting member penetrating in a configuration in which the inserting member protrudes from an upper surface and a lower surface of the first substrate structure The first substrate structure is such that the first substrate structure is spaced apart from the upper auxiliary plate, the lower auxiliary plate, and the second substrate structure, respectively. A probe card comprising: a first substrate structure having a plurality of first through holes and a circuit pattern, the first through holes being at a central portion of the first substrate structure, the circuit pattern being on the first substrate a second substrate structure contacting the lower surface of the first substrate structure, the second substrate structure including a plurality of passes respectively connected to the first through holes of the first substrate structure a hole, a plurality of bolt holes at an upper surface of the second substrate structure, and a plurality of probes at a lower surface of the second substrate structure; an upper auxiliary plate on a lower surface of the upper auxiliary plate And the first base Bonding to the upper surface of the first substrate structure in a configuration in which the upper surface of the plate structure is spaced apart, such that a holding space is left between the upper auxiliary plate and the first substrate structure, and the first substrate structure is The circuit pattern on the upper surface is located in the holding space; the lower auxiliary plate is bonded to the lower surface of the first substrate structure, and includes a sixth through hole, and the second substrate structure is positioned at the sixth a plurality of elastic members fastened to the lower auxiliary plate and in contact with a lower surface of the second substrate structure to thereby support the second substrate structure; flexible connection medium via the The first via hole of the first substrate structure and the through hole of the second substrate structure are electrically connected to the circuit pattern and the probe; and a plurality of support bolts penetrating the first substrate structure And selectively bonding to the bolt holes of the second substrate structure to thereby control a horizontal level of the second substrate structure; and a plurality of pressing bolts penetrating the first substrate structure and selectively Pressing around the bolt hole Said second substrate structure, thereby controlling the level to a second level of the substrate structure. A probe card comprising: a first substrate structure having a plurality of first through holes and a circuit pattern, the first through holes being at a central portion of the first substrate structure, the circuit pattern being on the first substrate a second substrate structure contacting the lower surface of the first substrate structure, the second substrate structure including a plurality of passes respectively connected to the first through holes of the first substrate structure a hole on the surface of the second substrate structure a plurality of bolt holes between the central portion and the peripheral portion, and a plurality of probes at a lower surface of the second substrate structure; an upper auxiliary plate at a lower surface of the upper auxiliary plate and the first Bonding to the upper surface of the first substrate structure in a configuration in which the surface of the substrate structure is spaced apart, such that a holding space is left between the upper auxiliary board and the first substrate structure, and the first substrate structure is The circuit pattern on the upper surface is located in the holding space; the lower auxiliary plate is bonded to the lower surface of the first substrate structure, and includes a sixth through hole, and the second substrate structure is positioned at the sixth a plurality of elastic members fastened to the lower auxiliary plate and in contact with a lower surface of the second substrate structure to thereby support the second substrate structure; flexible connection medium via the The first through hole of the first substrate structure and the through hole of the second substrate structure are electrically connected to the circuit pattern and the probe; and a plurality of edge bolts penetrating the first substrate structure And applying pressure to the second substrate An edge portion of the structure to thereby control a horizontal level of the second substrate structure; a plurality of support members in contact with the edge bolt and an edge portion of the second substrate structure, and which are caused by the edge bolt Transferring pressure to the second substrate structure; a center bolt penetrating the upper auxiliary plate and the first substrate structure and bonded to a central portion of the second substrate structure to thereby control the second substrate structure a horizontal level; a plurality of support bolts penetrating the first substrate structure and selectively connecting Closing the bolt holes of the second substrate structure to thereby control a horizontal level of the second substrate structure; and a plurality of pressing bolts penetrating the first substrate structure and selectively pressing the The second substrate structure around the bolt hole to thereby control the level of the second substrate structure. A probe card comprising: a first substrate structure having a plurality of first through holes and a circuit pattern, the first through holes being at a central portion of the first substrate structure, the circuit pattern being on the first substrate a second substrate structure under the first substrate structure, the second substrate structure comprising: a substrate in contact with the lower surface of the first substrate structure, and including a connection to the first a plurality of second through holes of the first through hole of a substrate structure; a plurality of guiding rods bonded to a lower surface of the substrate, and including a plurality of second through holes respectively connected to the substrate a third through hole; and a plurality of guiding members, each joined to each of the guide bars, and including a plurality of fourth through holes such that each of the probes passes through the fourth through holes And bonding to each of the guiding members, and the through hole of the second substrate structure includes the second through hole and the third through hole; and a plurality of flexible connecting media via The second through hole and the third through hole are electrically connected to Said circuit pattern and said probe.