CN101271126A - Probe needle - Google Patents
Probe needle Download PDFInfo
- Publication number
- CN101271126A CN101271126A CNA2008100868305A CN200810086830A CN101271126A CN 101271126 A CN101271126 A CN 101271126A CN A2008100868305 A CNA2008100868305 A CN A2008100868305A CN 200810086830 A CN200810086830 A CN 200810086830A CN 101271126 A CN101271126 A CN 101271126A
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- Prior art keywords
- underlying structure
- hole
- probe
- screw
- accessory plate
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a probe card, comprising: a first substrate structure having a circuit pattern; a second substrate structure in contact with the first one, having a plurality of probe. An upper backing plate and a lower one are combined respectively with an upper surface and a lower surface of the first substrate structure. An elastic component is fixed to the lower backing plate, supporting the second substrate structure. Flexible connection media is connected electrically to the circuit pattern and the probe. An edge screw and a central screw are combined to an edge part and a central part of the second substrate structure respectively. A support screw is combined to a screw hole of the second substrate structure. A compression screw around a screw hole compresses the second substrate structure. Therefore, it is easy to control the horizontal plane of the second substrate structure.
Description
Technical field
Exemplary embodiment of the present invention relates to a kind of probe, more particularly, relates to a kind of probe that comprises the probe that contacts with the conductive pad that is used for semiconductor device.
Background technology
Usually (for example, semiconductor device is made in processing technology (fab process), electrical chip classification (electrical die sorting, EDS) technology and packaging technology) by a series of cell process.In processing technology, (for example, silicon wafer) goes up various circuit of assembling and device at the semiconductor-based end, and in EDS technology, the electrology characteristic of check circuit also detects defective chip in the wafer.Then, described device and wafer are separated separately, in packaging technology, be sealed in each device in the epoxy resin and be packaged into independent semiconductor device.
Can pass through checking tool (for example, probe) and carry out the EDS technology that is used for detecting the defective chip of semiconductor device.A plurality of probes of probe contact with semiconductor device, and electric signal is applied to probe, by the response signal of probe in detecting about electric signal, thereby detect the defective chip of semiconductor device.The connector that probe comprises first structure with circuit pattern usually, have second structure of a plurality of probes and be used for circuit pattern and described probe are electrically connected on its basal surface.
Current, the size of probe has the trend that increases along with the increase of wafer size.But the large scale of probe can cause the deflection of second underlying structure, owing to the deflection of second underlying structure may not can distribute at grade the probe of second underlying structure.Therefore, can occur probe and semiconductor device conductive pad contact failure, thereby make the reliability variation of probe.
Summary of the invention
Therefore, the invention provides a kind of probe that is used to prevent the deflection of underlying structure and improves the surface level of underlying structure.
According to each side of the present invention, a kind of probe is provided, this probe comprises: first underlying structure has a plurality of first through holes and the lip-deep circuit pattern of part in the central thereon; Second underlying structure contacts with the lower surface of first underlying structure.Second underlying structure comprise first through hole that is connected respectively to first underlying structure a plurality of through holes, be positioned at second underlying structure upper surface a plurality of screw holes and be positioned at a plurality of probes of the lower surface of second underlying structure.Probe also comprises: flexibly connect medium, this flexibly connects medium and is electrically connected to circuit pattern and probe by first through hole of first underlying structure and the described through hole of second underlying structure; A plurality of supporting screws penetrate first underlying structure and optionally are attached to the described screw hole of second underlying structure, thereby control the surface level of second underlying structure; A plurality of housing screws penetrate first underlying structure and optionally push down second underlying structure around screw hole, thereby control the surface level of second underlying structure.
In the exemplary embodiment, described supporting screw and described housing screw replace each other.
In the exemplary embodiment, this probe also can comprise central screw, and described central screw penetrates first underlying structure and optionally is attached to the middle body of second underlying structure, thereby controls the surface level of second underlying structure.
In the exemplary embodiment, second underlying structure comprises: substrate contacts with the lower surface of first underlying structure, and comprises a plurality of second through holes of first through hole that is connected respectively to first underlying structure; A plurality of guide rods are attached to the lower surface of described substrate, and comprise a plurality of third through-holes of second through hole that is connected respectively to described substrate; A plurality of guiding elements, each of described guiding elements is attached to each of described guide rod, and comprise a plurality of fourth holes, thereby each probe is incorporated into each guiding elements by fourth hole, the described through hole of second underlying structure comprises described second through hole and described third through-hole.Each guide rod is incorporated into described substrate by at least one in conjunction with screw.A plurality of in conjunction with the marginal portion layout of screw along described guide rod, sagging downwards thereby described guide rod can be prevented from.
In the exemplary embodiment, described probe also can comprise: following accessory plate is attached to the lower surface of first underlying structure, and comprises that the 6th through hole, second underlying structure are arranged in described the 6th through hole; A plurality of elastic components are fixed to down accessory plate and contact with the lower surface of second underlying structure, thereby support second underlying structure.Described elastic component can comprise the sheet spring.
In the exemplary embodiment, described probe also can comprise: a plurality of edges screw penetrates first underlying structure, and pressure is applied to the marginal portion of second underlying structure, thereby controls the surface level of second underlying structure; A plurality of support members contact with the marginal portion of the described edge screw and second underlying structure, and will be delivered to second underlying structure by the pressure that the edge screw causes.Described support member can be spherical in shape.Described probe also can comprise a plurality of reinforcements, and described reinforcement and has the intensity bigger than the intensity of second underlying structure between the marginal portion of the upper surface of the described support member and second underlying structure.Described reinforcement can be inserted in second underlying structure, thus the upper surface coplane of the top surface of each reinforcement and second underlying structure.
In the exemplary embodiment, described probe also can comprise accessory plate, describedly go up the upper surface that structure that accessory plate separates with the upper surface of its lower surface and first underlying structure is attached to first underlying structure, keep the space thereby between the last accessory plate and first underlying structure, reserve, and circuit pattern on the upper surface of first underlying structure is arranged in keep the space.Last accessory plate can comprise: main body, and be attached to the upper surface of first underlying structure, and comprise fifth hole, the circuit pattern on the upper surface of first underlying structure is exposed by described fifth hole; Cap is attached to main body with fifth hole by the structure that sunshade covers, so that the inner transformation of described through hole becomes to keep the space.First underlying structure and last accessory plate are bonded to each other by first screw that the lower surface from first underlying structure penetrates first underlying structure and last accessory plate, and first underlying structure is bonded to each other by second screw that the lower surface from following accessory plate penetrates down accessory plate, first underlying structure and last accessory plate with following accessory plate.Described probe also can comprise dielectric film, and described dielectric film is positioned on the upper surface and lower surface of first underlying structure, thereby prevents that heat is delivered on first underlying structure.Described probe also can comprise a plurality of insertion members, described a plurality of insertion member penetrates first underlying structure with its upper surface and outstanding structure of lower surface from first underlying structure, thereby first underlying structure separates with last accessory plate, following accessory plate and second underlying structure respectively.
According to a further aspect in the invention, provide a kind of probe, this probe comprises: first underlying structure has a plurality of first through holes and the lip-deep circuit pattern of part in the central thereon; Second underlying structure contacts with the lower surface of first underlying structure.Second underlying structure comprises a plurality of through holes of first through hole that is connected respectively to first underlying structure and is positioned at a plurality of probes of the lower surface of second underlying structure.This probe also comprises: go up accessory plate, the structure that separates with the upper surface of its lower surface and first underlying structure is attached to the upper surface of first underlying structure, keep the space thereby between the last accessory plate and first underlying structure, reserve, and circuit pattern on the upper surface of first underlying structure is arranged in keep the space; Following accessory plate is attached to the lower surface of first underlying structure, and comprises that the 6th through hole, second underlying structure are arranged in described the 6th through hole; A plurality of elastic components are fixed to down accessory plate and contact with the lower surface of second underlying structure, thereby support second underlying structure; Flexibly connect medium, be electrically connected to circuit pattern and probe by first through hole of first underlying structure and the described through hole of second underlying structure; A plurality of edges screw penetrates first underlying structure, and pressure is applied to the marginal portion of second underlying structure, thereby controls the surface level of second underlying structure; A plurality of support members contact with the marginal portion of the described edge screw and second underlying structure, and will be delivered to second underlying structure by the pressure that the edge screw causes.
In the exemplary embodiment, this probe also can comprise central screw, and described central screw penetrates the accessory plate and first underlying structure and is attached to the middle body of second underlying structure, thereby controls the surface level of second underlying structure.
Described probe also can comprise: a plurality of supporting screws penetrate the accessory plate and first underlying structure, and optionally are attached at the middle body of the upper surface of second underlying structure and a plurality of screw holes between the periphery; A plurality of housing screws penetrate the accessory plate and first underlying structure and optionally push down second underlying structure around screw hole, thereby control the surface level of second underlying structure.Described supporting screw and described housing screw replace each other.
In the exemplary embodiment, described elastic component comprises the sheet spring, and described support member is spherical.
In the exemplary embodiment, the described accessory plate of going up comprises: main body, and be attached to the upper surface of first underlying structure, and comprise fifth hole, the circuit pattern on the upper surface of first underlying structure is exposed by described fifth hole; Cap is attached to main body with fifth hole by the structure that sunshade covers, so that the inner transformation of described through hole becomes to keep the space.
In the exemplary embodiment, described second underlying structure comprises: substrate contacts with the lower surface of first underlying structure, and comprises a plurality of second through holes of first through hole that is connected respectively to first underlying structure; A plurality of guide rods are attached to the lower surface of described substrate, and comprise a plurality of third through-holes of second through hole that is connected respectively to described substrate; A plurality of guiding elements, each of described guiding elements is attached to each of described guide rod, and comprise a plurality of fourth holes, thereby each probe is incorporated into each guiding elements by fourth hole, the described through hole of second underlying structure comprises described second through hole and described third through-hole.Each guide rod is incorporated into described substrate by at least one in conjunction with screw, and is a plurality of in conjunction with the marginal portion layout of screw along described guide rod, sagging downwards thereby described guide rod can be prevented from.
In the exemplary embodiment, described probe also can comprise a plurality of reinforcements, and described reinforcement and has the intensity bigger than the intensity of second underlying structure between the marginal portion of the upper surface of the described support member and second underlying structure.Described reinforcement is inserted in second underlying structure, makes the top surface of each reinforcement and the upper surface coplane of second underlying structure.
In the exemplary embodiment, first underlying structure and last accessory plate are bonded to each other by the screw that the lower surface from first underlying structure penetrates first underlying structure and last accessory plate.
In the exemplary embodiment, first underlying structure and following accessory plate are bonded to each other by the screw that the lower surface from following accessory plate penetrates down accessory plate, first underlying structure and last accessory plate.
In the exemplary embodiment, described probe also can comprise dielectric film, and described dielectric film is positioned on the upper surface and lower surface of first underlying structure, thereby prevents that heat is delivered on first underlying structure.
In the exemplary embodiment, described probe also can comprise a plurality of insertion members, described a plurality of insertion member penetrates first underlying structure with its upper surface and outstanding structure of lower surface from first underlying structure, thereby first underlying structure separates with last accessory plate, following accessory plate and second underlying structure respectively.
According to a further aspect in the invention, provide a kind of probe, this probe comprises: first underlying structure has a plurality of first through holes and the lip-deep circuit pattern of part in the central thereon; Second underlying structure contacts with the lower surface of first underlying structure.Second underlying structure comprise first through hole that is connected respectively to first underlying structure a plurality of through holes, be positioned at second underlying structure upper surface a plurality of screw holes and be positioned at a plurality of probes of the lower surface of second underlying structure.This probe also comprises: go up accessory plate, the structure that separates with the upper surface of its lower surface and first underlying structure is attached to the upper surface of first underlying structure, keep the space thereby between the last accessory plate and first underlying structure, reserve, and circuit pattern on the upper surface of first underlying structure is arranged in keep the space; Following accessory plate is attached to the lower surface of first underlying structure, and comprises that the 6th through hole, second underlying structure are arranged in described the 6th through hole; A plurality of elastic components are fixed to down accessory plate and contact with the lower surface of second underlying structure, thereby support second underlying structure; Flexibly connect medium, be electrically connected to circuit pattern and probe by first through hole of first underlying structure and the described through hole of second underlying structure; A plurality of supporting screws penetrate first underlying structure and optionally are attached to the described screw hole of second underlying structure, thereby control the surface level of second underlying structure; A plurality of housing screws penetrate first underlying structure and optionally press position second underlying structure around screw hole, thereby control the surface level of second underlying structure.
According to a further aspect in the invention, provide a kind of probe, this probe comprises: first underlying structure has a plurality of first through holes and the lip-deep circuit pattern of part in the central thereon; Second underlying structure contacts with the lower surface of first underlying structure.Second underlying structure comprises a plurality of through holes of first through hole that is connected respectively to first underlying structure, at the middle body of the upper surface of second underlying structure and a plurality of screw holes between the periphery and a plurality of probes of being positioned at the lower surface of second underlying structure.This probe also comprises: go up accessory plate, the structure that separates with the upper surface of its lower surface and first underlying structure is attached to the upper surface of first underlying structure, keep the space thereby between the last accessory plate and first underlying structure, reserve, and circuit pattern on the upper surface of first underlying structure is arranged in keep the space; Following accessory plate is attached to the lower surface of first underlying structure, and comprises that the 6th through hole, second underlying structure are arranged in described the 6th through hole; A plurality of elastic components are fixed to down accessory plate and contact with the lower surface of second underlying structure, thereby support second underlying structure; Flexibly connect medium, be electrically connected to circuit pattern and probe by first through hole of first underlying structure and the described through hole of second underlying structure; A plurality of edges screw penetrates first underlying structure, and pressure is applied to the marginal portion of second underlying structure, thereby controls the surface level of second underlying structure; A plurality of support members contact with the marginal portion of the described edge screw and second underlying structure, and will be delivered to second underlying structure by the pressure that the edge screw causes; Central authorities' screw, described central screw penetrates the accessory plate and first underlying structure and is attached to the middle body of second underlying structure, thereby controls the surface level of second underlying structure; A plurality of supporting screws penetrate first underlying structure and optionally are attached to the described screw hole of second underlying structure, thereby control the surface level of second underlying structure; A plurality of housing screws penetrate first underlying structure and optionally push down second underlying structure around screw hole, thereby control the surface level of second underlying structure.
According to a further aspect in the invention, provide a kind of probe, this probe comprises: first underlying structure has a plurality of first through holes and the lip-deep circuit pattern of part in the central thereon; Second underlying structure is positioned under first underlying structure; A plurality of media that flexibly connect are electrically connected to circuit pattern and described probe by described second through hole and third through-hole.Second underlying structure can comprise the substrate that contacts with the lower surface of first underlying structure, and comprise a plurality of second through holes of first through hole that is connected respectively to first underlying structure and be attached to a plurality of guide rods of the lower surface of described substrate, second underlying structure comprises a plurality of third through-holes and a plurality of guiding elements of second through hole that is connected respectively to described substrate, each of described a plurality of guiding elements is attached to each of described guide rod, and described a plurality of guiding elements comprises a plurality of fourth holes, thereby each of described probe is attached to each of described guiding elements by fourth hole, and the described through hole of second underlying structure comprises described second through hole and described third through-hole.
According to exemplary embodiment of the present invention, probe comprises a plurality of screws of the surface level that is used to regulate substrate, thereby the surface level of the substrate of probe is the screw Be Controlled of periphery, middle body and the center section by being positioned at described substrate respectively, thereby improves the precision of surface level control.
Description of drawings
By the detailed description of carrying out below in conjunction with accompanying drawing, above-mentioned and other characteristics of the present invention and advantage will become clear, wherein:
Fig. 1 is the cut-open view that illustrates according to the structure of the probe of exemplary embodiment of the present invention;
Fig. 2 is the view sub-anatomy that the probe among Fig. 1 is shown;
Fig. 3 is the cut-open view that second underlying structure of the probe among Fig. 1 is shown;
Fig. 4 is the upward view that the guide rod of second substrate shown in Fig. 3 is shown;
Fig. 5 is the cut-open view of edge screw (edge bolt) that the probe shown in Fig. 1 is shown;
Fig. 6 is the cut-open view of central screw (center bolt) that the probe shown in Fig. 1 is shown;
Fig. 7 is the cut-open view that the supporting screw of the probe shown in Fig. 1 is shown;
Fig. 8 is the cut-open view of housing screw (pressing bolt) that the probe shown in Fig. 1 is shown.
Embodiment
Below, the present invention is described with reference to the accompanying drawings more all sidedly, example of the present invention illustrates in the accompanying drawings.Yet the present invention can implement with multiple different form, should not be understood that to be confined to embodiment set forth herein.More definite is, these embodiment are provided so that of the present invention openly will be thoroughly and completely, and scope of the present invention is fully conveyed to those skilled in the art.In the accompanying drawings, for clarity, can exaggerate the layer and the zone size and relative size.
It should be understood that, when element or the layer be known as another element or the layer " on ", when perhaps being known as " being connected to " or " being attached to " another element or layer, this element or layer can be directly on another element or layers, directly connect or be attached to another element or the layer, perhaps also can have intermediary element or middle layer.On the contrary, when element be known as " directly " another element " on " or " being directly connected to " or " directly being attached to " another element or when layer, do not have intermediary element or middle layer.Identical label will be indicated components identical all the time.As here using, term " and/or " comprise combination in any and all combinations of one or more relevant listed projects.
It should be understood that, describe different element, assembly, zone, layer and/or part although can use term " first ", " second ", " the 3rd " to wait here, these elements, assembly, zone, layer and/or part are not subjected to the restriction of these terms.These terms only are to be used for an element, assembly, zone, layer and/or part and another element, assembly, zone, layer and/or part are made a distinction.Therefore, under the situation that does not break away from instruction of the present invention, first element of discussing below, first assembly, first area, ground floor or first can be named as second element, second assembly, second area, the second layer or second portion.
But usage space relative terms here, as " under ", " in ... below ", " following ", " on " and " top " etc., be used for describing simply as shown in FIG. element or the relation of feature and other element or feature.It should be understood that the space relative terms is intended to comprise the different azimuth of device in using or operating except the orientation that is described in the drawings.For example, if device is reversed in the accompanying drawings, the element that then is described as other element of other element or feature " under " or " " or feature " below " will be positioned as subsequently other element or feature " on ".Therefore, exemplary term " following " can comprise two kinds of orientation, above and below.Described device can be by other location (revolve turn 90 degrees or in other orientation), explains that correspondingly space used herein describes term relatively.
Term used herein is only in order to describe the purpose of specific embodiment, and is not intended to limit the present invention.As used herein, unless context spells out in addition, otherwise singulative also is intended to comprise plural form.It will also be understood that, when using term " to comprise " in this manual and/or when " comprising ", illustrate to have described feature, integral body, step, operation, element and/or assembly, do not exist or additional one or more further features, integral body, step, operation, element, assembly and/or its combination but do not get rid of.
As the cut-open view of the illustrative examples of desirable embodiment of the present invention (and intermediate structure) embodiments of the invention are described in this reference.Like this, the change of shape of the example that the variation by manufacturing technology and/or tolerance causes for example can appear in expectation.Therefore, embodiments of the invention should not be understood that to be limited to the concrete shape in the zone shown in this, and should comprise the form variations that is for example caused by manufacturing.For example, the injection zone that is depicted as rectangle has rounding or the feature of bending and/or the gradient of implantation concentration usually at its edge, rather than the binary from injection zone to non-injection zone changes.Similarly, the buried region that forms by injection can cause at masks area with by the zone appearance injection to a certain degree between surface of its generation injection.Therefore, the zone that illustrates in the drawings is actually schematically, and their shape is not intended to illustrate the true form in the zone of device, also is not intended to limit the scope of the invention.
Unless otherwise defined, otherwise all terms used herein (comprising technical term and scientific and technical terminology) have the meaning equivalent in meaning with those skilled in the art institute common sense.Will be further understood that, unless clearly definition here, otherwise term (for example term that defines in general dictionary) should be interpreted as having in the context with association area their meaning equivalent in meaning, rather than explains their meaning ideally or too formally.
Fig. 1 is the cut-open view according to the structure of the probe of exemplary embodiment of the present invention, and Fig. 2 is the view sub-anatomy that the probe among Fig. 1 is shown.
See figures.1.and.2, according to the probe 100 of exemplary embodiment of the present invention can comprise first underlying structure 110, second underlying structure 120, go up accessory plate 130 and following accessory plate 140, elastic component 150, flexibly connect medium 160, a plurality of edges screw 170, a plurality of support member 172, central screw 174, a plurality of supporting screw 176, a plurality of housing screw 178, in conjunction with screw 180,182 and 184, dielectric film 190 and insertion member 192.
First underlying structure 110 can comprise first substrate 112 and web member 114.
First underlying structure 110 forms plate-like, and comprises a plurality of first through holes 116.Circuit pattern is formed on the upper surface of first underlying structure 110.A plurality of web members 114 lay respectively on the upper surface of first substrate 112, and are adjacent with first through hole 116.Web member 114 is electrically connected to circuit pattern.
The splicing ear that is electrically connected to the thimble (pogo pin) of measuring head is arranged along the marginal portion of the upper surface of first substrate 112, and is electrically connected to circuit pattern.
Fig. 3 is the cut-open view that second underlying structure of the probe among Fig. 1 is shown.
With reference to Fig. 3, second underlying structure 120 can be positioned on the lower surface of first underlying structure 110.In exemplary embodiment, second underlying structure 120 can comprise second substrate 121, a plurality of guide rod 122, a plurality of guiding elements 123 and a plurality of probe 124.
Fig. 4 is the upward view that the guide rod of second substrate shown in Fig. 3 is shown.
With reference to Fig. 4, each guide rod 122 forms shaft-like, and spaced from each other on the lower surface of second substrate 121.Each guide rod 122 can comprise a plurality of third through-holes 127 rather than a slotted hole, so that guide rod 122 can prevent fully owing to the distortion that produces of heat.Third through-hole 127 is connected to second through hole 126.
Each probe 124 directly contacts with the conductive pad of semiconductor device, and electric signal can communicate by probe 124 between probe 100 and semiconductor device.Step part is formed on the top of each probe 124, and is inserted into downwards in each fourth hole 128 of each guiding elements 123.The step part of each probe 124 can be disposed across the periphery of each fourth hole 128 on each guiding elements 123, thus but each guiding elements 123 supporting probe 124.Bonding agent (for example, epoxy resin) can be inserted between the step part of each guiding elements 123 and each probe 124.Terminal projects upwards from each probe 124, and is positioned at the center position adjacent with each guiding elements 123.
The guiding elements 123 that is combined with probe 124 can be installed in the lower surface of guide rod 122 according to the structure in the third through-hole 127 that probe 124 is inserted into guide rod 122.
Second can carry out combination with the main body 132 of first substrate 112 and last accessory plate 130 in conjunction with screw 182.In the present embodiment, second penetrate first substrate 112 and screw in to go up in the main body 132 of accessory plate 130 in conjunction with screw 182.
Following accessory plate 140 forms tabular, and comprises the 6th through hole 142 that is used to support second underlying structure 120, thereby accessory plate 140 forms annular plate down.In the present embodiment, following accessory plate 140 can comprise iron-nickel (Fe-Ni) alloy or invar alloy.Following accessory plate 140 is supported second underlying structure 120 and is incorporated into the lower surface of first substrate 112.Especially, second substrate 121 is arranged in the 6th through hole 142 of accessory plate 140 down, thereby the sidewall of second substrate 121 of second underlying structure 120 is by accessory plate 140 encirclements down.The top surface of following accessory plate 140 is attached to the lower surface of first substrate 121 of first underlying structure 110.Following accessory plate 140 strengthens the intensity of the bottom of first underlying structure 110, thereby prevents first substrate, 112 distortion (for example, deflection or reverse).
The 3rd can carry out combination with first substrate 121 and following accessory plate 140 in conjunction with screw 184.In the present embodiment, the 3rd penetrates down the accessory plate 140 and first substrate 121 in conjunction with screw 184, and upwards is screwed in the main body 132 of accessory plate 130.
A pair of elastic component 150 is fixed to the bottom of the sidewall of the 6th through hole 142, and flexibly supports the lower surface of second substrate 121, especially, flexibly supports the marginal portion of the lower surface of second substrate 121.Elastic component 150 can comprise spring member (for example, sheet spring).
The elastic force of elastic component 150 can cause the distortion of second substrate 121.The subring (not shown) that comprises step part also can be down between the accessory plate 140 and second substrate 121, and second substrate 121 is supported by the step part of subring complementaryly.In this example, subring can have the intensity bigger than second substrate 121.The elastic component 150 of following accessory plate 140 also can support subring, thereby the anchorage force of second substrate 121 is distributed equably by subring, and can not cause any distortion of second substrate 121.
Connect the web member 114 that medium 160 flexibly is connected to the terminal of each probe 124 and is connected to first underlying structure 110.In the present embodiment, connect the web member 114 that medium 160 is fixed by welding to the terminal of each probe 124 and is fixed to first underlying structure 110.Containment member also can be set to the probe 100 of this exemplary embodiment, thus flexibly connect the join domain of medium 160 and the terminal of each probe 124 and from the outstanding probe 124 of guiding elements 123 from sealed on every side.The example of containment member can comprise epoxy resin.First through hole 116, second through hole 126 of second substrate 121 and the third through-hole 127 of guide rod 122 that connect medium 160 penetrable first substrates 112.Connect medium 160 can comprise flexible conductive members (for example, flexible printed circuit board, FPCB).
Fig. 5 is the cut-open view of the edge screw of the probe shown in Fig. 1.
With reference to Fig. 5, the penetrable main body 132 and first substrates 112 of going up accessory plates 130 of edge screw 170 are applied to pressure the marginal portion of second substrate 121 of second underlying structure 120.The surface level of second substrate 121 can be controlled by 170 pairs of pressure by second substrate 121 of elastic component 150 supports of edge screw.
Fig. 6 is the cut-open view that the central screw of the probe shown in Fig. 1 is shown.
With reference to Fig. 6, the 174 penetrable cap 134 and first substrates 121 of going up accessory plates 130 of central screw, and can be attached to the middle body of the upper surface of second substrate 121.Central authorities' screw 174 can prevent that the middle body of the upper surface of second substrate 121 from deflecting down, thereby improves the surface level of second substrate 121.
Fig. 7 is the cut-open view that the supporting screw of the probe shown in Fig. 1 is shown, and Fig. 8 is the cut-open view that the housing screw shown in Fig. 1 is shown.
With reference to Fig. 7 and Fig. 8, the penetrable cap 134 and first substrates 112 of going up accessory plates 130 of supporting screw 176, and combine with the screw hole 129 of second substrate 121.The penetrable cap 134 and first substrates 112 of going up accessory plates 130 of housing screw 178, and press second substrate 121 round screw hole 129.As exemplary embodiment, when the diameter of housing screw 178 during greater than the diameter of screw hole 129, housing screw 178 can be pushed down the top of screw hole 129.On the contrary, when the diameter of housing screw 178 during less than the diameter of screw hole 129, housing screw 178 can be pushed down the bottom of each screw hole 129.In addition, the hole adjacent part adjacent with screw hole 129 of second substrate 121 can have the big intensity of any other parts than second substrate 121, thereby prevents that fully screw thread in screw hole 129 and the screw hole 129 is owing to housing screw 178 damages.Like this, can control the surface level of second substrate 121 by supporting screw 176 and housing screw 178.
Supporting screw 176 and housing screw 178 can be replaced each other according to the surface level of the middle body of second substrate 121 and periphery.For example, sagging downwards or when deflecting down, supporting screw 176 can replace housing screw 178 to use when second substrate 121.On the contrary, when second substrate 121 was bent upwards, housing screw 178 can replace supporting screw 176 to use.
According to exemplary embodiment of the present invention, probe comprises a plurality of screws, described a plurality of screw is used to adjust the surface level of substrate, so that the surface level of the substrate of the probe screw Be Controlled by the peripheral of substrate and central authorities and center section respectively, thereby improve the accuracy that surface level is controlled.The periphery of substrate contacts with the probe of probe, and the middle body of substrate is adjacent with the center of substrate.The scope of the center section of substrate is between the periphery and middle body of substrate.In addition, probe can comprise deflection a plurality of in conjunction with screw of the guide rod that is used to prevent to be attached to substrate.In addition, probe also can comprise the dielectric film of the thermal deformation that is used to prevent substrate or insert member.
Though described exemplary embodiment of the present invention, but should be appreciated that, the invention is not restricted to these exemplary embodiments, can under the situation of the spirit and scope of the present invention that do not break away from the claim qualification, carry out various changes and modification by those skilled in the art.
Claims (35)
1, a kind of probe comprises:
First underlying structure has a plurality of first through holes and the lip-deep circuit pattern of part in the central thereon;
Second underlying structure, contact with the lower surface of first underlying structure, second underlying structure comprise first through hole that is connected respectively to first underlying structure a plurality of through holes, be positioned at second underlying structure upper surface a plurality of screw holes and be positioned at a plurality of probes of the lower surface of second underlying structure;
Flexibly connect medium, be electrically connected to circuit pattern and probe by first through hole of first underlying structure and the described through hole of second underlying structure;
A plurality of supporting screws penetrate first underlying structure and optionally are attached to the described screw hole of second underlying structure, thereby control the surface level of second underlying structure;
A plurality of housing screws penetrate first underlying structure and optionally push down second underlying structure around screw hole, thereby control the surface level of second underlying structure.
2, probe as claimed in claim 1, wherein, described supporting screw and described housing screw replace each other.
3, probe as claimed in claim 1 also comprises central screw, and described central screw penetrates first underlying structure and optionally is attached to the middle body of second underlying structure, thereby controls the surface level of second underlying structure.
4, probe as claimed in claim 1, wherein, second underlying structure comprises:
Substrate contacts with the lower surface of first underlying structure, and comprises a plurality of second through holes of first through hole that is connected respectively to first underlying structure;
A plurality of guide rods are attached to the lower surface of described substrate, and comprise a plurality of third through-holes of second through hole that is connected respectively to described substrate;
A plurality of guiding elements, each of described guiding elements is attached to each of described guide rod, and comprise a plurality of fourth holes, thereby each probe is incorporated into each guiding elements by fourth hole, the described through hole of second underlying structure comprises described second through hole and described third through-hole.
5, probe as claimed in claim 4, wherein, each guide rod is incorporated into described substrate by at least one in conjunction with screw.
6, probe as claimed in claim 5, wherein a plurality of in conjunction with the marginal portion layout of screw along described guide rod, sagging downwards thereby described guide rod is prevented from.
7, probe as claimed in claim 1 also comprises:
Following accessory plate is attached to the lower surface of first underlying structure, and comprises that the 6th through hole, second underlying structure are arranged in described the 6th through hole;
A plurality of elastic components are fixed to down accessory plate and contact with the lower surface of second underlying structure, thereby support second underlying structure.
8, probe as claimed in claim 7, wherein, described elastic component comprises the sheet spring.
9, probe as claimed in claim 7 also comprises:
A plurality of edges screw penetrates first underlying structure, and pressure is applied to the marginal portion of second underlying structure, thereby controls the surface level of second underlying structure;
A plurality of support members contact with the marginal portion of the described edge screw and second underlying structure, and will be delivered to second underlying structure by the pressure that the edge screw causes.
10, probe as claimed in claim 9, wherein, described support member is spherical in shape.
11, probe as claimed in claim 9 also comprises a plurality of reinforcements, and described reinforcement and has the intensity bigger than the intensity of second underlying structure between the marginal portion of the upper surface of the described support member and second underlying structure.
12, probe as claimed in claim 11, wherein, described reinforcement is inserted in second underlying structure, makes the top surface of each reinforcement and the upper surface coplane of second underlying structure.
13, probe as claimed in claim 7, also comprise accessory plate, describedly go up the upper surface that structure that accessory plate separates with the upper surface of its lower surface and first underlying structure is attached to first underlying structure, keep the space thereby between the last accessory plate and first underlying structure, reserve, and circuit pattern on the upper surface of first underlying structure is arranged in keep the space.
14, probe as claimed in claim 13, wherein, last accessory plate comprises:
Main body is attached to the upper surface of first underlying structure, and comprises fifth hole, and the circuit pattern on the upper surface of first underlying structure is exposed by described fifth hole;
Cap is attached to main body with fifth hole by the structure that described sunshade covers, so that the inner transformation of described through hole becomes to keep the space.
15, probe as claimed in claim 13, wherein, first underlying structure and last accessory plate are bonded to each other by first screw that the lower surface from first underlying structure penetrates first underlying structure and last accessory plate, and first underlying structure is bonded to each other by second screw that the lower surface from following accessory plate penetrates down accessory plate, first underlying structure and last accessory plate with following accessory plate.
16, probe as claimed in claim 13 also comprises dielectric film, and described dielectric film is positioned on the upper surface and lower surface of first underlying structure, thereby prevents that heat is delivered on first underlying structure.
17, probe as claimed in claim 13, also comprise a plurality of insertion members, described a plurality of insertion member penetrates first underlying structure with its upper surface and outstanding structure of lower surface from first underlying structure, thereby first underlying structure separates with last accessory plate, following accessory plate and second underlying structure respectively.
18, a kind of probe comprises:
First underlying structure has a plurality of first through holes and the lip-deep circuit pattern of part in the central thereon;
Second underlying structure contacts with the lower surface of first underlying structure, and second underlying structure comprises a plurality of through holes of first through hole that is connected respectively to first underlying structure and is positioned at a plurality of probes of the lower surface of second underlying structure;
Last accessory plate, the structure that separates with the upper surface of its lower surface and first underlying structure is attached to the upper surface of first underlying structure, keep the space thereby between the last accessory plate and first underlying structure, reserve, and circuit pattern on the upper surface of first underlying structure is arranged in keep the space;
Following accessory plate is attached to the lower surface of first underlying structure, and comprises that the 6th through hole, second underlying structure are arranged in described the 6th through hole;
A plurality of elastic components are fixed to down accessory plate and contact with the lower surface of second underlying structure, thereby support second underlying structure;
Flexibly connect medium, be electrically connected to circuit pattern and probe by first through hole of first underlying structure and the described through hole of second underlying structure;
A plurality of edges screw penetrates first underlying structure, and pressure is applied to the marginal portion of second underlying structure, thereby controls the surface level of second underlying structure;
A plurality of support members contact with the marginal portion of the described edge screw and second underlying structure, and will be delivered to second underlying structure by the pressure that the edge screw causes.
19, probe as claimed in claim 18 also comprises central screw, and described central screw penetrates accessory plate and first underlying structure also is attached to the middle body of second underlying structure, thereby controls the surface level of second underlying structure.
20, probe as claimed in claim 18 also comprises:
A plurality of supporting screws penetrate the accessory plate and first underlying structure, and optionally are attached at the middle body of the upper surface of second underlying structure and a plurality of screw holes between the periphery;
A plurality of housing screws penetrate the accessory plate and first underlying structure and optionally push down second underlying structure around screw hole, thereby control the surface level of second underlying structure.
21, probe as claimed in claim 20, wherein, described supporting screw and described housing screw replace each other.
22, probe as claimed in claim 18, wherein, described elastic component comprises the sheet spring, and described support member is spherical.
23, probe as claimed in claim 18, wherein, last accessory plate comprises:
Main body is attached to the upper surface of first underlying structure, and comprises fifth hole, and the circuit pattern on the upper surface of first underlying structure is exposed by described fifth hole;
Cap is attached to main body with fifth hole by the structure that described sunshade covers, so that the inner transformation of described through hole becomes to keep the space.
24, probe as claimed in claim 18, wherein, second underlying structure comprises:
Substrate contacts with the lower surface of first underlying structure, and comprises a plurality of second through holes of first through hole that is connected respectively to first underlying structure;
A plurality of guide rods are attached to the lower surface of described substrate, and comprise a plurality of third through-holes of second through hole that is connected respectively to described substrate;
A plurality of guiding elements, each of described guiding elements is attached to each of described guide rod, and comprise a plurality of fourth holes, thereby each probe is incorporated into each guiding elements by fourth hole, the described through hole of second underlying structure comprises described second through hole and described third through-hole.
25, probe as claimed in claim 24, wherein, each guide rod is incorporated into described substrate by at least one in conjunction with screw.
26, probe as claimed in claim 25, wherein a plurality of in conjunction with the marginal portion layout of screw along described guide rod, sagging downwards thereby described guide rod is prevented from.
27, probe as claimed in claim 18 also comprises a plurality of reinforcements, and described reinforcement and has the intensity bigger than the intensity of second underlying structure between the marginal portion of the upper surface of the described support member and second underlying structure.
28, probe as claimed in claim 27, wherein, described reinforcement is inserted in second underlying structure, makes the top surface of each reinforcement and the upper surface coplane of second underlying structure.
29, probe as claimed in claim 18, wherein, first underlying structure and last accessory plate are bonded to each other by the screw that the lower surface from first underlying structure penetrates first underlying structure and last accessory plate.
30, probe as claimed in claim 18, wherein, first underlying structure and following accessory plate are bonded to each other by the screw that the lower surface from following accessory plate penetrates down accessory plate, first underlying structure and last accessory plate.
31, probe as claimed in claim 18 also comprises dielectric film, and described dielectric film is positioned on the upper surface and lower surface of first underlying structure, thereby prevents that heat is delivered on first underlying structure.
32, probe as claimed in claim 18, also comprise a plurality of insertion members, described a plurality of insertion member penetrates first underlying structure with its upper surface and outstanding structure of lower surface from first underlying structure, thereby first underlying structure separates with last accessory plate, following accessory plate and second underlying structure respectively.
33, a kind of probe comprises:
First underlying structure has a plurality of first through holes and the lip-deep circuit pattern of part in the central thereon;
Second underlying structure, contact with the lower surface of first underlying structure, second underlying structure comprise first through hole that is connected respectively to first underlying structure a plurality of through holes, be positioned at second underlying structure upper surface a plurality of screw holes and be positioned at a plurality of probes of the lower surface of second underlying structure;
Last accessory plate, the structure that separates with the upper surface of its lower surface and first underlying structure is attached to the upper surface of first underlying structure, keep the space thereby between the last accessory plate and first underlying structure, reserve, and circuit pattern on the upper surface of first underlying structure is arranged in keep the space;
Following accessory plate is attached to the lower surface of first underlying structure, and comprises that the 6th through hole, second underlying structure are arranged in described the 6th through hole;
A plurality of elastic components are fixed to down accessory plate and contact with the lower surface of second underlying structure, thereby support second underlying structure;
Flexibly connect medium, be electrically connected to circuit pattern and probe by first through hole of first underlying structure and the described through hole of second underlying structure;
A plurality of supporting screws penetrate first underlying structure and optionally are attached to the described screw hole of second underlying structure, thereby control the surface level of second underlying structure;
A plurality of housing screws penetrate first underlying structure and optionally push down second underlying structure around screw hole, thereby control the surface level of second underlying structure.
34, a kind of probe comprises:
First underlying structure has a plurality of first through holes and the lip-deep circuit pattern of part in the central thereon;
Second underlying structure, contact with the lower surface of first underlying structure, second underlying structure comprises a plurality of through holes of first through hole that is connected respectively to first underlying structure, at the middle body of the upper surface of second underlying structure and a plurality of screw holes between the periphery and a plurality of probes of being positioned at the lower surface of second underlying structure;
Last accessory plate, the structure that separates with the upper surface of its lower surface and first underlying structure is attached to the upper surface of first underlying structure, keep the space thereby between the last accessory plate and first underlying structure, reserve, and circuit pattern on the upper surface of first underlying structure is arranged in keep the space;
Following accessory plate is attached to the lower surface of first underlying structure, and comprises that the 6th through hole, second underlying structure are arranged in described the 6th through hole;
A plurality of elastic components are fixed to down accessory plate and contact with the lower surface of second underlying structure, thereby support second underlying structure;
Flexibly connect medium, be electrically connected to circuit pattern and probe by first through hole of first underlying structure and the described through hole of second underlying structure;
A plurality of edges screw penetrates first underlying structure, and pressure is applied to the marginal portion of second underlying structure, thereby controls the surface level of second underlying structure;
A plurality of support members contact with the marginal portion of the described edge screw and second underlying structure, and will be delivered to second underlying structure by the pressure that the edge screw causes;
Central authorities' screw, described central screw penetrates the accessory plate and first underlying structure and is attached to the middle body of second underlying structure, thereby controls the surface level of second underlying structure;
A plurality of supporting screws penetrate first underlying structure and optionally are attached to the described screw hole of second underlying structure, thereby control the surface level of second underlying structure;
A plurality of housing screws penetrate first underlying structure and optionally push down second underlying structure around screw hole, thereby control the surface level of second underlying structure.
35, a kind of probe comprises:
First underlying structure has a plurality of first through holes and the lip-deep circuit pattern of part in the central thereon;
Second underlying structure, be positioned under first underlying structure, second underlying structure comprises the substrate that contacts with the lower surface of first underlying structure, and comprise a plurality of second through holes of first through hole that is connected respectively to first underlying structure and be attached to a plurality of guide rods of the lower surface of described substrate, second underlying structure comprises a plurality of third through-holes and a plurality of guiding elements of second through hole that is connected respectively to described substrate, each of described a plurality of guiding elements is attached to each of described guide rod, and described a plurality of guiding elements comprises a plurality of fourth holes, thereby each of described probe is attached to each of described guiding elements by fourth hole, and the described through hole of second underlying structure comprises described second through hole and described third through-hole;
A plurality of media that flexibly connect are electrically connected to circuit pattern and described probe by described second through hole and third through-hole.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070026650A KR101242004B1 (en) | 2007-03-19 | 2007-03-19 | Probe card |
| KR10-2007-0026650 | 2007-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101271126A true CN101271126A (en) | 2008-09-24 |
Family
ID=40005219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100868305A Pending CN101271126A (en) | 2007-03-19 | 2008-03-19 | Probe needle |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101242004B1 (en) |
| CN (1) | CN101271126A (en) |
| TW (1) | TWI400451B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102420203A (en) * | 2011-11-16 | 2012-04-18 | 中国科学院金属研究所 | Solder bump/metallization layer connecting structure body in microelectronic package and application of solder bump/metallization layer connecting structure body |
| CN104508499A (en) * | 2012-08-01 | 2015-04-08 | 日本电子材料株式会社 | Guide plate for probe guard and probe guard provided with same |
| CN106104280A (en) * | 2014-03-06 | 2016-11-09 | 泰克诺探头公司 | High flatness probe card for the test device of electronic device |
| CN109725180A (en) * | 2017-10-27 | 2019-05-07 | 和硕联合科技股份有限公司 | Jig platform |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101506623B1 (en) * | 2009-02-04 | 2015-03-27 | (주) 미코에스앤피 | Probe Card |
| KR101696419B1 (en) * | 2010-04-14 | 2017-01-16 | (주)엠투엔 | Probe card |
| KR101410991B1 (en) * | 2012-11-20 | 2014-06-23 | 리노정밀(주) | Jig |
| JP6209375B2 (en) | 2013-07-08 | 2017-10-04 | 株式会社日本マイクロニクス | Electrical connection device |
| KR101754175B1 (en) * | 2014-12-27 | 2017-07-05 | 싱크-테크 시스템 코포레이션 | Testing station with upgrading function |
| IT201700046645A1 (en) | 2017-04-28 | 2018-10-28 | Technoprobe Spa | Measurement board for a test device of electronic devices |
| TWI676032B (en) * | 2018-10-24 | 2019-11-01 | 中華精測科技股份有限公司 | Horizontal support structure and horizontal support system for integrated circuit |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6586954B2 (en) * | 1998-02-10 | 2003-07-01 | Celadon Systems, Inc. | Probe tile for probing semiconductor wafer |
| WO2001071779A2 (en) | 2000-03-17 | 2001-09-27 | Formfactor, Inc. | Method and apparatus for planarizing a semiconductor contactor |
| JP3621938B2 (en) * | 2002-08-09 | 2005-02-23 | 日本電子材料株式会社 | Probe card |
| JP2005010052A (en) * | 2003-06-19 | 2005-01-13 | Japan Electronic Materials Corp | Probe card |
| DE102004036407A1 (en) * | 2003-08-27 | 2005-06-09 | Japan Electronic Materials Corp., Amagasaki | Probe card and connector for this |
| US7071715B2 (en) * | 2004-01-16 | 2006-07-04 | Formfactor, Inc. | Probe card configuration for low mechanical flexural strength electrical routing substrates |
| KR100661254B1 (en) * | 2005-01-06 | 2006-12-28 | (주) 미코티엔 | Probe card for testing semiconductor |
-
2007
- 2007-03-19 KR KR1020070026650A patent/KR101242004B1/en not_active IP Right Cessation
-
2008
- 2008-03-18 TW TW097109481A patent/TWI400451B/en not_active IP Right Cessation
- 2008-03-19 CN CNA2008100868305A patent/CN101271126A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102420203A (en) * | 2011-11-16 | 2012-04-18 | 中国科学院金属研究所 | Solder bump/metallization layer connecting structure body in microelectronic package and application of solder bump/metallization layer connecting structure body |
| CN102420203B (en) * | 2011-11-16 | 2014-07-30 | 中国科学院金属研究所 | Solder bump/metallization layer connecting structure body in microelectronic package and application of solder bump/metallization layer connecting structure body |
| CN104508499A (en) * | 2012-08-01 | 2015-04-08 | 日本电子材料株式会社 | Guide plate for probe guard and probe guard provided with same |
| CN106104280A (en) * | 2014-03-06 | 2016-11-09 | 泰克诺探头公司 | High flatness probe card for the test device of electronic device |
| CN106104280B (en) * | 2014-03-06 | 2019-08-06 | 泰克诺探头公司 | The high flatness probe card of test device for electronic device |
| CN109725180A (en) * | 2017-10-27 | 2019-05-07 | 和硕联合科技股份有限公司 | Jig platform |
| CN109725180B (en) * | 2017-10-27 | 2021-09-03 | 和硕联合科技股份有限公司 | Jig platform |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101242004B1 (en) | 2013-03-11 |
| KR20080085322A (en) | 2008-09-24 |
| TWI400451B (en) | 2013-07-01 |
| TW200842369A (en) | 2008-11-01 |
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Open date: 20080924 |