JP2010524180A - Fine pitch electrical interconnect assembly - Google Patents

Abstract

  A socket assembly; a first circuit member electrically coupled to the contact member along the first side of the socket assembly; and a second electrical member coupled to the contact member along the second side of the socket assembly. An electrical assembly having a circuit member. A flexible circuit member is interposed between the socket assembly and the second circuit member. The flexible circuit member has a number of electrical wires that are electrically coupled to contact members on the socket assembly. In one embodiment, the flexible circuit member has a distal portion that extends the wire beyond the socket assembly.

Description

  The present invention is directed to a method and apparatus for redistributing electrical signals from high performance sockets.

  High performance integrated circuits are drawing demand for high performance sockets, such as disclosed in US Pat. As bus configurations become more complex, the signal frequency becomes higher and more sensitive to impedance changes. The next generation system is running at about 5 GHz. High performance sockets as identified above have reduced pin pitch from about 1 millimeter ("mm") to about 0.4 mm to about 0.5 mm, and the pin count has increased.

  This decrease in pitch creates at least two main problems. First, it is difficult and expensive to produce a printed circuit board having a pitch of about 0.4 mm to about 0.5 mm, which corresponds to the pitch of a high performance socket assembly. Second, during the validation or testing of an integrated circuit, the user of such a socket assembly is free to route individual signals or a collection of signals from the associated printed circuit board ("PCB"). There are times when it may be desirable to shut off.

  With regard to validation and testing issues, users are currently designing printed circuit boards in such a way as to allow the spring probe to access the desired circuit lines that result in the signal of interest. This probe access point consists of a known distance from the signal source and the user can interconnect the logic analyzer to know the response of the silicon under known conditions. Test socket contact resistance (Cres) and impedance mismatch have become a major concern, and spring probes have reached electrical limits.

  In many cases, there is no convenient location to place the probe access point on the top surface of the PCB, so the designer places the point on the bottom surface of the PCB near the device. . However, this area of the PCB includes other decoupling capacitors and, in many cases, support plates to prevent PCB deflection when sockets are used that cover many possible probe locations. Are often loaded. This problem is complicated by the increase in multi-chip packages.

US 6,247,938 US 6,409,521 US 6,939,143 US 6,957,963 US 6,830,460 US 7,114,960 US 7,121,839 US 7,160,119 US 5,913,687 US 6,178,629

  The present invention is directed to a method and apparatus for redistributing electrical signals from high performance sockets, including integrated circuit devices.

  In one embodiment, a flexible circuit is electrically coupled to the contacts and extends beyond the integrated circuit and the socket assembly. The distal end of the flexible circuit member is then connected to another device, such as a logic analyzer or printed circuit board.

  In another embodiment, the flexible circuit is interposed between the socket assembly and the printed circuit board. The flexible circuit includes a series of contact pads arranged at a pitch, corresponding to the socket assembly on the one hand, and a series of contact pads corresponding to a larger pitch on the printed circuit board on the other hand. Contains. This approach allows for a cheaper printed circuit board with a larger pitch that can be used in high performance socket assemblies.

  The method and apparatus can be used in various applications such as packaged IC devices, such as spring probe contacts, elastomer-based interfaces, intended to be placed in sockets, but soldered to system PCBs instead of in sockets Can be used with any type of socket.

  The present invention includes an electrical assembly including a socket assembly, a first circuit member electrically coupled with a contact member along a first side of the socket assembly, and a contact member and electrical along a second side of the socket assembly. Directed to a second circuit member coupled together. The flexible circuit member is interposed between the socket assembly and the second circuit member. The flexible circuit member includes a number of electrical wires that are electrically coupled to contact members on the socket assembly. In one embodiment, the flexible circuit member includes a distal portion that extends the wire beyond the socket assembly.

  In one embodiment, the contact member on the socket assembly extends through a hole in the flexible circuit member. In another embodiment, the solder electrically couples the contact member on the socket assembly with both wires on the flexible circuit member and the second circuit member. In other embodiments, the holes in the flexible circuit member compressively engage around a contact member on the socket assembly. In yet another embodiment, a conductive member is disposed in the hole in the flexible circuit member and is electrically coupled to the electrical wire. The conductive member electrically couples the contact member on the socket assembly with the second circuit member.

  In one embodiment, the flexible circuit member is held compressed (by force) between the socket assembly and the second circuit member. Additional circuit members are selectively electrically coupled with the flexible circuit members. In other embodiments, the flexible circuit member acts as a seal layer to substantially prevent wicking of solder into the socket assembly along the contact member. The flexible circuit member preferably has at least one dielectric layer that covers at least a portion of the wire.

  In one embodiment, the contact members in the socket assembly have a first pitch and the electrical wires on the distal portion have a second pitch that is greater than the first pitch.

  In other embodiments, the flexible circuit member includes a first surface with a row of first contact pads electrically coupled to the electrical wires. The first contact pad has a first pitch corresponding to (corresponding to) the pitch of the contact member on the socket assembly. The second surface of the flexible circuit member includes a series of second contact pads that are electrically coupled to the electrical wires. The second contact pad includes a second pitch corresponding to the pitch of the second circuit member. In one embodiment, the second pitch is greater than the first pitch. The second circuit member is optionally a printed circuit board.

  The external device is optionally electrically coupled to a wire on the distal portion of the flexible circuit member. The external device can be a logic analyzer, a printed circuit board, or various other types of devices.

  The present invention is also directed to an electrical assembly that includes a first circuit member having a series of electrical contacts (electrical contacts) electrically coupled to contact members on the socket assembly. The continuous contact member has a first pitch. The first surface of the flexible circuit member includes a series of first contact pads corresponding to the row of contact members on the socket assembly and electrically coupled to the contact members. The second surface of the flexible circuit member includes a series of second contact pads that are selectively coupled to the series of first contact pads by electrical wires. The series of second contact pads has a second pitch that is greater than the first pitch. The second circuit member includes a series of electrical contacts that correspond to and are electrically coupled to the series of second contact pads on the flexible circuit member.

1 is a schematic cross-sectional side view of an electrical interconnect assembly having a contact system according to the present invention. 1 is a more detailed schematic cross-sectional side view of a portion of the contact system. It is a typical sectional side view of the interlock operation for couple | bonding the contact member of FIG. 2 with a housing. It is a typical sectional side view of both operation of an engagement position and a releasing position of the contact member of FIG. FIG. 3 is a schematic cross-sectional side view of lateral movement of the contact member of FIG. 2 within a housing. 2 is a schematic cross-sectional side view of the electrical interconnect assembly or socket assembly of FIG. 1 electrically coupled to a pair of circuit members. FIG. FIG. 3 is a schematic top view of a portion of the housing of the contact system, representing a drilling pattern according to the present invention. FIG. 6 is a schematic top view of an alternative housing portion of a contact system, which represents a drilling pattern and an elongated contact member according to the present invention. FIG. 2 is a schematic side view of an interconnect assembly having one interlock portion formed from two separate housing portions according to the present invention. FIG. 6 is a schematic side view of an alternative interconnect assembly having one interlock formed from two separate housing portions according to the present invention. FIG. 6 is a side cross-sectional view of an alternative interconnect assembly having two beam contact members according to the present invention. FIG. 6 is a side cross-sectional view of another alternative interconnect assembly having two beam contact members according to the present invention. FIG. 13 is a side cross-sectional view illustrating removal of circuit members from the interconnect assembly of FIG. 12. FIG. 4 is a cross-sectional side view of an alternative interconnect assembly that allows for extensive axial displacement of a contact member in accordance with the present invention. 2 is a cross-sectional side view of an alternative interconnect assembly according to the present invention. FIG. FIG. 16 is a diagram of one method of configuring the interconnect assembly of FIG. FIG. 16 is a diagram of one method of configuring the interconnect assembly of FIG. FIG. 16 is a diagram of one method of configuring the interconnect assembly of FIG. FIG. 5 is a diagram of an alternative interconnect assembly having additional circuit surfaces in accordance with the present invention. FIG. 17B is a view of a contact coupled to the layer of FIG. 17A. FIG. 17B is an operation diagram of the interconnect assembly of FIG. 17A. FIG. 17B is an operation diagram of the interconnect assembly of FIG. 17A. FIG. 6 is a diagram of an alternative interconnect assembly having a seal layer in accordance with the present invention. 1 is a top view of an interconnect assembly according to the present invention. FIG. 6 is a side cross-sectional view of an alternative interconnect assembly according to the present invention. FIG. 6 is a side cross-sectional view of an alternative interconnect assembly according to the present invention. FIG. 6 is a side cross-sectional view of an alternative interconnect assembly according to the present invention. FIG. 6 is a side sectional view of an alternative connector member according to the present invention. FIG. 6 is a side sectional view of an alternative connector member according to the present invention. FIG. 6 is a side sectional view of an alternative connector member according to the present invention. FIG. 6 is a side sectional view of an alternative connector member according to the present invention. FIG. 6 is a side sectional view of an alternative connector member according to the present invention. 2 is a cross-sectional side view of an alternative interconnect assembly according to the present invention. FIG. 1 is a side sectional view of an interconnect assembly according to the present invention. 1 is a cross-sectional side view of an interconnect assembly with a two-part housing in accordance with the present invention. 1 is a side sectional view of an interconnect assembly according to the present invention. 1 is a cross-sectional side view of an interconnect assembly with a two-part housing in accordance with the present invention. 1 is a cross-sectional side view of an interconnect assembly with a two-part housing in accordance with the present invention. 1 is a side sectional view of an interconnect assembly according to the present invention. 1 is a side sectional view of an interconnect assembly according to the present invention. It is a sectional side view of the interconnect assembly provided with the two-part contact member based on this invention. FIG. 3 is a diagram of a contact member optimal for use with an LGA device, according to the present invention. FIG. 3 is a diagram of a contact member optimal for use with an LGA device, according to the present invention. FIG. 3 is a diagram of a contact member optimal for use with an LGA device, according to the present invention. FIG. 4 is a diagram of an alternative contact member optimal for use with an LGA device, in accordance with the present invention. FIG. 4 is a diagram of an alternative contact member optimal for use with an LGA device, in accordance with the present invention. FIG. 4 is a diagram of an alternative contact member optimal for use with an LGA device, in accordance with the present invention. FIG. 4 is a diagram of an alternative contact member optimal for use with an LGA device, in accordance with the present invention. FIG. 4 is a diagram of an alternative contact member optimal for use with an LGA device, in accordance with the present invention. FIG. 4 is a diagram of an alternative contact member optimal for use with an LGA device, in accordance with the present invention. FIG. 3 is a view of a contact member optimal for use with a BGA device according to the present invention. FIG. 3 is a view of a contact member optimal for use with a BGA device according to the present invention. FIG. 3 is a view of a contact member optimal for use with a BGA device according to the present invention. FIG. 4 is a diagram of an alternative contact member that is optimal for use with a BGA device in accordance with the present invention. FIG. 4 is a diagram of an alternative contact member that is optimal for use with a BGA device in accordance with the present invention. FIG. 4 is a diagram of an alternative contact member that is optimal for use with a BGA device in accordance with the present invention. FIG. 6 is a diagram of an alternative double loop connector member with a solder member attachment mechanism in accordance with the present invention. FIG. 43 is a view of the solder member attachment mechanism of FIG. 42 engaged with a solder member according to the present invention. FIG. 43 is a view of the solder member attachment mechanism of FIG. 42 engaged with a solder member according to the present invention. FIG. 43 is a view of the solder member attachment mechanism of FIG. 42 engaged with a solder member according to the present invention. FIG. 43 is a cross-sectional side view of an interconnect assembly using the double loop connector member of FIG. 42 in accordance with the present invention. FIG. 42 is a cross-sectional side view of an interconnect assembly using the double loop connector member of FIG. 41 in accordance with the present invention. FIG. 43 is a side cross-sectional view of an alternative interconnect assembly using the dual loop connector member of FIG. 42 in accordance with the present invention. It is a side view of the solder member attaching mechanism concerning the present invention. FIG. 45B is an end view of the solder member attachment mechanism of FIG. 45A engaged with a cylindrical solder member. FIG. 45B is an end view of the solder member attachment mechanism of FIG. 45A engaged with a spherical solder member. It is a side view of the barbed solder member attachment mechanism which concerns on this invention. It is a side view of the alternative solder member attachment mechanism which concerns on this invention. FIG. 47B is an end view of the solder member mounting mechanism of FIG. 47A. FIG. 47B is an end view of the solder member attachment mechanism of FIG. 47A that is crimped according to the present invention. FIG. 47B is an end view of the solder member mounting mechanism of FIG. 47A provided with a hexagonal solder member. FIG. 47B is an end view of the solder member attachment mechanism of FIG. 47A with an alternative engagement component according to the present invention. It is a side view of the alternative solder member attachment mechanism which concerns on this invention. It is a side view of the alternative solder member attachment mechanism provided with the nonspherical solder member concerning the present invention. It is a side view of the alternative solder member attachment mechanism provided with the nonspherical solder member concerning the present invention. FIG. 47 is a side view of the alternative solder member mounting mechanism of FIG. 46 provided with a cubic solder member according to the present invention. FIG. 47B is a side view of the alternative solder member mounting mechanism of FIG. 47A provided with a cubic solder member according to the present invention. FIG. 6 is a side view of an alternative solder member attachment mechanism with a single tab according to the present invention. FIG. 53B is an end view of the solder member attachment mechanism of FIG. 53A. 1 is a view of a connector member with a pair of beams formed from a continuous piece of material according to the present invention. FIG. 1 is a view of a connector member with a pair of beams formed from a continuous piece of material according to the present invention. FIG. FIG. 6 is an alternative connector member with a pair of beams formed from a continuous piece of material in accordance with the present invention. FIG. 6 is an alternative connector member with a pair of beams formed from a continuous piece of material in accordance with the present invention. FIG. 55B is a side view of the contact member of FIGS. 55A and 55B. FIG. 6 is an alternative connector member with a pair of beams formed from a continuous piece of material in accordance with the present invention. FIG. 6 is an alternative connector member with a pair of beams formed from a continuous piece of material in accordance with the present invention. FIG. 6 is a diagram of an alternative interconnect assembly in accordance with the present invention. FIG. 57B is an end view of the contact member of FIG. 57A. FIG. 57B is a side view of the contact member of FIG. 57A. 1 is a top view of a flexible circuit attached for electrical coupling with a socket assembly, in accordance with one embodiment of the present invention. FIG. 1 is a side cross-sectional view of a socket assembly electrically coupled to a flexible circuit member according to an embodiment of the present invention. 6 is a cross-sectional side view of an alternative socket assembly electrically coupled to a flexible circuit member, in accordance with an embodiment of the present invention. FIG. It is a sectional side view of the flexible circuit member concerning one embodiment of the present invention compressed and engaged between a socket assembly and other circuit members. FIG. 5 is a cross-sectional side view of an alternative flexible circuit member according to one embodiment of the present invention, compressed and engaged between a socket assembly and another circuit member. 1 is a top view of a flexible circuit member having contact pads arranged at a first pitch, in accordance with an embodiment of the present invention. FIG. FIG. 63B is a bottom view of the flexible circuit member of FIG. 63A with contact pads arranged in a second pitch. FIG. 63B is a cross-sectional side view of the flexible circuit member of FIG. 63A that redistributes signals from the socket assembly to the printed circuit board in accordance with one embodiment of the present invention.

  The present invention is directed to techniques for creating low, medium, or high volume insulator housings by laminating layers of precisely patterned materials. Patterned layers can be composed of the same or many different types of materials. The layer is optionally laminated to relieve stress caused by thermal expansion differences.

  This construction method allows molding or mechanical processing of internal parts that would normally not be moldable or mechanically processed. For large pin count devices, the laminating process produces a unique flat part without the need for molding. A reinforcement layer made of a material such as BeCu, Cu, ceramic, or ceramic-filled polymer can be added to provide additional strength during solder reflow and to provide thermal stability.

  The multilayer housing can also include circuit component layers. Output, ground, and / or isolation capacitance can be applied between layers or pins, and special components such as embedded IC devices or RF antennas can be selectively combined. In some cases, the layers can be used to assist with device insertion or removal, such as ZIF or stripper plate actuation mechanisms. This allows the interconnect assembly to be further improved in an unusable manner with conventional molding or machining techniques.

  The interconnect assembly allows for contact de-bending on fine contacts that contact spacing (pitch) by creating high aspect ratio through holes and slots with internal cavities with non-moldable parts. it can. The interconnect assembly accommodates a pin count of 1000 to 2500 I / O width on a 1.0 mm pitch, more preferably about 0.8 millimeters on one pitch, and most preferably about 0.5 millimeters on a pitch. Such fine pitch interconnect assemblies are particularly useful for communications, wireless, and memory devices.

  This interconnect assembly provides the function of pressing and positioning the contact in the lower layer, the function of holding it against the contact, and the function of blocking the interface to prevent solder or flux from wicking during reflow . Post-insert solder masks (such as those made on printed circuit boards and IC packages) can also be added to improve solder deposit formation and wick avoidance.

  The lamination process allows reinforcement layers, spacers, circuit components, and / or protective layers to be added to the interconnect assembly. The lamination system also allows the creation of high aspect ratio contacts where approximately 80-90% of the contact's physical height can be compressed vertically even within the quad contact beam system. The low cost and high signal performance interconnect assembly that can be soldered to a low profile and system PC board is particularly useful for desktop and mobile PC applications.

  The use of this interconnect assembly allows manufacturers to install expensive IC devices during system construction and provides an opportunity to later customize the system without storing a substitute circuit board. Use of the present interconnect assembly allows the original release IC device to be replaced with a new IC device in the field (or OEM) without having to disassemble the system or rework the circuit board. The trend toward lead-free electronics will also increase the attractiveness of this interconnect assembly. IC suppliers can exclude solder balls from packages or equipment to reduce lead content.

  FIG. 1 illustrates an interconnect assembly 20 according to the present invention. Interconnect assembly 20 includes a contact system 22 and a housing 24 having electrical insulation properties. The housing 24 includes a number of through openings 26. Contact members 28 A, 28 B, 28 C and 28 D (collectively “28”) are disposed within at least some of the through openings 26 and are coupled to the housing 24. In the illustrated embodiment, the interconnect assembly 20 is electrically coupled to the circuit member 40. As used herein, the term “circuit member” refers to, for example, a packaged integrated circuit device, an unpackaged integrated circuit device, a printed circuit board, a flexible circuit, a bare-die device, Mean organic or inorganic, rigid circuit, or any other device capable of carrying electrical current.

  The housing 24 can be constructed of a dielectric material such as plastic. Suitable plastics include phenolic resin, polyester, and Ryton® available from Phillips Petroleum. Alternatively, the housing 24 may be constructed from a metal, such as aluminum, having a non-conductive surface, such as an anodized surface. For some applications, the metal housing may provide additional shielding of the contact member. In an alternative embodiment, the housing is grounded to the electrical system, thereby providing a controlled impedance environment. Some of the contact members can be grounded by contacting the surface of the uncoated metal housing. As used herein, an “electrically insulated connector housing” or “module housing” is non-conductive or non-conductive, as described above, to prevent unwanted electrical conductivity between the contact member and the housing. By a housing that is substantially covered by a conductive material.

  The housing of the present invention can be selectively constructed from a number of discontinuous layers. The layer can be etched or stripped and stacked without the need for expensive molding equipment. Such a layer can create a housing part having a much larger aspect ratio than is typically possible by molding or machining. The layer is an internal part, undercut, or difficult to make by using conventional molding or machining techniques, typically referred to herein as “non-moldable parts”, or undercut, or It also makes it possible to create cavities. The housing can also be provided with a reinforcing layer, such as metal, ceramic, or alternative filler resin, to maintain flatness where the molded or machined part may distort. .

  The housing of the present invention can optionally have circuitry, an output source, and / or a ground plane to selectively connect or insulate contact members within a given field. The layers can be selectively bonded or removed to provide a continuous material or a removable layer. As used herein, “bonded” or “bonded” refers to, for example, adhesive bonding, solvent bonding, ultrasonic welding, thermal bonding, or any means for attaching adjacent layers of a housing. It also means other appropriate technology. Multiple layers of different contact members can be provided to interact with each other while being permanently engaged or separable. The layer may be configured to hold the contact member hard or to float or move the contact along the X, Y and / or Z axis of the contact member. The layer is configured in such a way that either the bottom of the contact member is in a blocked state as a result of an insertion process to prevent solder or flux wicking during reflow or the interface can be blocked after assembly. Can be done.

  FIG. 2 illustrates more details of one of the contact members 28 interlocked with the housing 24. The contact member 28 has a first interface part 30 and a second interface part 36. When the first and second circuit members 34, 40 are biased toward the housing 24, the first interface 30 is installed to electrically couple with the terminals 32 on the first circuit member 34; In addition, the second interface portion 36 is installed to be electrically coupled to the terminal 38 on the second circuit member 40. Any fastening method can be used, including bolting, clamping, and gluing.

  The contact member 28 includes an interlock component 42 and a transition 44 coupled to the interlock component 42. In the illustrated embodiment, the interlock component 42 is larger in size than the transition portion 44 in at least one direction. The through opening 26 in the housing 24 has at least one interlock component 46 that is dimensioned to accommodate the interlock component 42 on the contact member 28. In the illustrated embodiment, the interlock component 42 is a ball-shaped structure, and the interlock component 46 is a socket. As used herein, “interlocked” and “interlocked” means that one part is captured by another part and at least one part of the part is at least relative to the other part. It means a mechanical connection, such as a hook fit, snap fit, non-bonding interference fit, dovetail joint, etc. that can move with one degree of freedom. The “interlock component” means a structure for interlocking.

  The housing 24 is large enough to accommodate the transition 44, but has an opening 48 that is smaller than the interlock component 42 in at least one direction so that the contact component 28 does not fall out of the housing 24. The interlock component 42 can thus be secured to the interlock portion 46 by a transition 44 that extends through the opening 48.

  FIG. 3 is a composite view illustrating the contact component 28 before and after being installed in the housing 24. The portions 50, 52 and / or the interlock component 42 on either side of the opening 48 are sufficiently flexible that the interlock component 42 is snapped into the corresponding interlock component 46. As used herein, “snap fit” means an interlock due to substantial elastic deformation of the contact member and / or the housing.

  FIG. 4 illustrates the operation of the contact member 28 within the housing 24. The housing 24 has an upper surface 60 and a bottom surface 62. Top surface 60 is adapted to be biased toward first circuit member 34 and bottom surface 62 is adapted to be biased toward second circuit member 40 (see, eg, FIG. 2). The first interface 30 of the contact member 28 is biased by the elastic member 64 so that it protrudes above the upper surface 60 (position A) when the first circuit member 34 is not secured to the housing 24. When the first circuit member 34 is biased toward the housing 24, the first interface 30 is displaced toward the upper surface 62 (position B). If both the first and second circuit members 34, 40 are biased toward the housing 24, the position of the second interface 36 is biased against the second circuit member 40.

  In the embodiment shown in FIG. 4, the bias of the first interface 30 is at least partially provided by the elastic member 64 positioned below the first interface 30. The elastic member 64 may be any shape suitable for providing the necessary bias force and includes a sphere, a cylinder, and a cuboid. Glued to the housing 24 and / or the contact member 28, press fit in a recess provided on either the housing or the contact member, or in a gap provided between the housing and the contact member It can be fixed in a variety of ways, including simply being caught. When the first circuit member 34 is biased toward the housing 24, the elastic member 64 is compressed and the moment arm created by the elastic member 64 by the force at the tip 66 and at the first interface 30. arm) results in a force that biases (biases) the second interface 36 toward the second circuit member 40 secured to the bottom surface 62 of the housing 24.

  Note that the designations “top” and “bottom” in this description are purely for the convenience of distinguishing the different parts of the contact system from the environment in which they are used. These and other orientation indications are not intended to limit the scope of the invention as it is necessary to orient the housing in one direction.

  The contact system 22 can also have components that provide stress relief to the contact member. For example, in one embodiment best represented in FIG. 4, the second interface 36 has an arcuate bottom surface for rotating the contact member 28 when the first contact member is depressed by the first circuit member 34. Have. Contact member 28 and housing 24 may be sufficiently compliant to provide stress relief.

  Contact member 28 is preferably composed of copper or a similar metal compound such as phosphor bronze or beryllium copper. The contact member is preferably plated with a corrosion resistant metal material such as nickel, gold, silver, palladium, or a multilayer thereof. In some embodiments, the contact member is coated except at the interface. The coating material is typically a silicone based on a Shore A durometer of about 20-40. Suitable coating materials include Sylgard® available from Dow Corning Silicone, Midland, Michigan and Master Sil713® available from Master Bond Silicone, Hackensack, NJ.

  FIG. 5 illustrates the lateral movement or movement of the contact member 28 within the housing 24. The amount of movement d is preferably smaller than the difference between the width of the interlock component 42 and the width of the opening 48 so that the contact member 28 does not fall off the interlock component 46.

  FIG. 6 illustrates the present interconnect assembly 20 in operation. The interconnect assembly 20 is preferably compressed between the first and second circuit members 34, 40. The optical alignment member 70 forms the device site 71 by aligning the terminal 32 on the first circuit device 34 with the first interface 30 of the contact member 28 (see FIG. 2). The alignment member 70 can optionally have a second elastic member 72 that applies an additional biasing force to the contact members 28A and 28D. The interconnect assembly 20 of FIG. 6 can be selectively designed to receive multiple circuit members 34, such as the replaceable chip modules disclosed in US Pat. All these documents are incorporated by reference.

  In the illustrated embodiment, the first circuit member 34 is an LGA device and the second circuit member 40 is a PCB. The housing 24 is selectively fixed to the PCB 40, where the second interface 36 of each contact member 28 is placed over the conductive pad 38 on the PCB 40. Since the LGA device 34 is pushed against the contact system 22, the first interface 30 is pushed down against the first elastomer 64. The arcuate second interface 36 of the contact member 28 rolls over and slides over each conductive pad 38 on the PCB 40 and is biased against the conductive pad 38 for reliability. Ensuring electrical contact is possible. The interlock component 42 tends to move upward but is constrained by a downward force from either the housing 24 cover or the second elastomer 72.

  In the embodiment of FIGS. 7 and 8, the contact member 80 is elongated and the housing 82 has a slot 84 that accommodates each contact member 80 to prevent their lateral rotation or displacement. The slot or slot 84 can be made by a variety of methods including mechanical or laser drilling, etching, molding, and the like.

  FIG. 9 illustrates an interconnect assembly 100 having a two-part housing 102 in accordance with the present invention. The housing 102 has an upper part 104 and a bottom part 106. The interlock portion 108 preferably extends across the interface 110 between the top and bottom portions 104, 106. By moving the top 104 in the direction 112 relative to the bottom 106, the interlock 108 captures the interlock component 114 on the contact member 116. The interlock component 114 preferably retains the contact member 116 within the housing 102, but provides movement of the contact member 116 through the range of motion required to couple with the first and second circuit members 118, 120. Restrict or not limit. The elastic member 122 biases the contact member 116 against the circuit members 118 and 120.

  FIG. 10 illustrates an alternative interconnect assembly 130 having a two-part housing 132 in accordance with the present invention. The top portion 134 and the bottom portion 136 form an interlock portion 138 that captures the interlock component 140 on the contact member 142. The second elastic member 144 is selectively installed adjacent to the interlock portion 138. The elastic members 144 and 146 bias the contact member 142 against the circuit members 148 and 150.

  FIG. 11 is a cross-sectional side view of an alternative interconnect assembly 200 in accordance with the present invention. In the embodiment of FIG. 11, the housing 202 includes a contact bonding layer 204, an alignment layer 206, and a stabilization layer 208. In one embodiment, the layers 204, 206, 208 are laminated using various techniques such as thermal or ultrasonic bonding, adhesives, and the like. The contact bonding layer 204 has a pair of through openings 210 separated by a central member 212. The contact alignment layer 206 also has a pair of through openings 214 generally aligned with the through openings 210. The through opening 214 is separated by the central member 216. The stabilization layer 208 in the embodiment of FIG. 11 has a single through opening 218 generally aligned with the through opening 214.

  The contact system 220 of the present invention has a number of contact members 222 coupled to the housing 202 with a snap-fit connection. In the embodiment of FIG. 11, the contact member 222 has a generally U-shaped configuration with a pair of beams 224A, 224B (collectively referred to as “224”) fastened at the central portion 226. The beam 224 has a pair of opposed protrusions 228A, 228B (collectively referred to as “228”) installed near the central portion 226 that form an expanded opening 227. The groove 230 between the protrusions 228 is smaller than the expansion opening 227, but preferably smaller than the width of the central member 212.

  To assemble the present interconnect assembly 200, the distal ends 232A, 232B (collectively referred to as “232”) of the beam 224 are inserted through the through opening 210. When the protrusions 228A, 228B reach the central member 212, the contact member 222 and / or the central member 212 are substantially elastically stretched and deformed to create a snap-fit connection. Once assembled, the protrusion 228 holds the contact member 222 to the central member 212. Protrusions 228 are preferably disposed against or adjacent to central member 216 on contact alignment layer 206, thereby minimizing rotation of contact member 222 relative to housing 202. The central member 216 also holds a groove between the first interface portions 234. In one embodiment, a sealing material is placed in the opening 210 between the contact member 216 and the contact bonding layer 204 to prevent debris or solder from migrating into the housing 202.

  The dimensions and shape of the expansion opening 227 and the central member 212 can be adjusted so that the contact member 222 can move somewhat relative to the housing 202. Movement of the contact member 222 along the major axis 250 and rotation about the central member 212 is of particular interest in obtaining a stable and reliable electrical coupling with the circuit members 240, 242.

  The contact member 222 has a first interface portion 234 near the distal end 232 and a second interface portion 236 near the center portion 226. The first and second interface portions 234, 236 may be electrically coupled to the first and second circuit members 240, 242 using soldering, compressive force, or a combination thereof. The configuration of the first interface 234 of the contact member 222 is particularly well suited for engaging the solder balls 244 on the first circuit member 240. The contact member 222 includes, for example, a flexible circuit, a ribbon connector, a cable, a printed circuit board, a ball grid array (BGA), a land grid array (LGA), a plastic lead chip carrier (PLCC), a pin grid array (PGA), and a miniaturized integrated circuit. Circuit (SOIC), dual in-line package (DIP), quad flat package (QFP), leadless chip carrier (LCC), chip scale package (CSP) or packaged or unpackaged integrated circuit It may be configured to be electrically coupled to a wide variety of circuit members 240 including.

  As the first circuit member 240 is brought into a compressive relationship with the housing 202, the distal end 232 of the contact member 222 is displaced in a direction 246 toward the sidewall 248 of the stabilization layer 208. The side wall 248 limits the displacement (displacement) of the distal end 232.

  FIG. 12 is a cross-sectional side view of an alternative interconnect assembly 300 in accordance with the present invention. A number of contact members 302A, 302B, 302C, 302D, 302E (collectively referred to as “302”) are generally referred to as through openings 326 in housing 304 as described in connection with FIG. Placed inside. In the embodiment of FIG. 12, a circuit layer 306 and an optical reinforcement layer 308 are disposed between the contact coupling layer 310 and the contact alignment layer 312. The circuit layer 306 may be a power plane, a ground plane, or any other circuit structure. In the illustrated embodiment, the through opening 326 is non-moldable and is typically formed by forming the housing 304 from multiple laminated layers.

  Contact member 302 is coupled to contact coupling layer 310 as described in connection with FIG. The first interface 318 of the contact member 302 is preferably configured to form a snap fit engagement with the solder ball 320 on the first circuit member 322. In some embodiments, the snap-fit connection between the solder ball 320 and the first interface 318 may be sufficient to hold the first circuit member 322 to the interconnect assembly 300.

  The embodiment of FIG. 12 has an extraction layer 314 attached to the top surface 316 of the contact alignment layer 312. The extraction layer 314 is preferably removably attached to the surface 316, such as by a low tack adhesive. In a preferred embodiment, the extraction layer 314 is composed of a flexible sheet material that can peel the top surface 316 of the contact alignment layer 312. As shown in FIG. 13, when the extraction layer 314 is peeled off in the direction 324, the first circuit member 322 is safely removed from the first interface 318 of the contact member 302.

  FIG. 14 illustrates an alternative interconnect assembly 400 according to the present invention. The contact member 402 is generally configured as shown in FIG. Opposing protrusions 404 A, 404 B apply pressure 406 on the central member 408. In the embodiment shown in FIG. 14, however, the central member 408 does not constrain the movement of the contact member 402 along the axis 410. Rather, the contact member 402 can slide along the axis 410 to achieve an ideal position for coupling the first circuit member 412 to the second circuit member 414.

  In the illustrated embodiment, the first circuit member 412 is an LGA device having multiple terminals 416. The intermediate contact set (set) 418 provides an interface between the terminal 416 and the first interface 420 of the contact member 402. The intermediate contact set 418 has a carrier 422 with a number of conductive members 424. In the illustrated embodiment, the lower portion of the conductive member 424 simulates a BGA device adapted to couple with the first interface 420. The top of the conductive member 424 is adapted to couple with the contact pad 416 on the first circuit member 412.

  The carrier 422 may be flexible or rigid. In a preferred embodiment, the carrier 422 is a flexible circuit member with circuit paths that carry outputs, signals, and / or provides a ground plane for the first and second circuit members 412, 414. In other embodiments, the carrier 422 is a flexible circuit member that is electrically coupled to a logic analyzer or other external device.

  FIG. 15 is a cross-sectional view of an alternative interconnect assembly 500 in accordance with the present invention. The contact member 502 has an expanded second interface 504 and includes a narrow engagement region 506 disposed between the second interface 504 and the beam 508. In the illustrated embodiment, the first circuit member 510 is a BGA device comprising solder balls 512 that are compression coupled to the beams 508.

  The length of the engagement region 506 relative to the thickness of the contact bonding layer 514 allows the contact member 502 to float within the housing 520 along the axis 516. The sidewall 522 of the stabilization layer 524 and the sidewall 526 of the contact alignment layer 528 limit the lateral displacement of the beam 508.

  16A-16C illustrate one technique for configuring the connection 500 of FIG. As shown in FIG. 16A, the contact bonding layer 514 has a series of through openings 530 surrounded by a number of adjacent slits 532. The second interface portion 504 of the contact member 502 is inserted into the through opening 530. The contact bonding layer 514 is elastically deformed to some extent by the slit 532 in order to pass the second interface part 504 through the through opening 530. Elastic deformation of the contact bonding layer 514 creates a snap-fit connection with the contact member 502. Depending on the configuration of the slit 532, the contact member 502 may have several rotational degrees of freedom 513 (see FIG. 15) around the engagement region 506. Accordingly, the connector 500 can be devised by a contact member 502 having one or two degrees of freedom.

  FIG. 16B illustrates attachment of the contact alignment layer 528. Contact alignment layer 528 is typically a separate and separate structure coupled to contact bonding layer 514.

  FIG. 16C illustrates the attachment of the stabilization layer 524. In the illustrated embodiment, stabilization layer 524 has a number of through openings 536 adapted to receive solder balls 512 on BGA device 510. The through-opening 536 may optionally have a pair of opposed grooves 538 in which the beam 508 of the contact member 502 can flex. The groove 538 also limits the rotation of the contact member 502 in the direction 540 within the housing 520.

  17A-17D illustrate various aspects of an alternative interconnect assembly 800 according to the present invention. The contact member 804 is slidably coupled with the central member 812 on the contact bonding layer 806. In one embodiment, the contact member 804 forms a friction stop with the central member 812. In other embodiments, dielectric layers 816, 818 are disposed above and below the central member 812 to capture or hold the contact member 804 on the interconnect assembly 800. Contact member 804 is selectively crimped to contact bonding layer 806. Alternatively, contact member 804 is attached to central member 812 using a variety of techniques such as thermal or ultrasonic bonding, adhesives, mechanical attachment, and the like.

  The upper and lower dielectric layers 816, 818 prevent the contact member 804 from shorting and falling during compression. Additional circuit surface 820 and dielectric cover layer 822 may optionally be added to the interconnect assembly 800. In one embodiment, the contact bonding layer 806 includes a flexible circuit member. In the embodiment of FIGS. 17A-17D, the flexible circuit member is singulated prior to attachment to the contact bonding layer 806.

  As shown in FIG. 17B, the contact bonding layer 806 has multiple pairs of adjacent slots 808, 810. A central portion 812 of the contact bonding layer 806 between the slots 808 and 810 acts as a bar spring. Contact member 804 is inserted through slot 808 and disposed on central portion 812. Alternatively, the compliant member 804 can be coupled to the contact bonding layer 806 through one slot 814.

  As best depicted in FIGS. 17C and 17D, the central portion 812 twists and / or deforms such that the contact member 804 compensates for non-planarity within the first and second circuit members 824, 826 (see FIG. FIG. 17A). The distal ends 828 and 830 of the contact member 804 also bend when compressed by the first and second circuit members 824 and 826. The amount of displacement and resistance to displacement can be achieved by changing the size and shape of the central portion 812 on the carrier 806, the size and shape of the distal ends 828, 830 (see FIG. 17A) of the contact member 804, and / or compliant. It can be controlled by constructing the carrier 806 from a more rigid or less rigid material that will resist the displacement of the member 804.

  FIG. 18 illustrates an interconnect assembly 840 that is a variation of the interconnect assembly 800 of FIGS. Interconnect assembly 840 includes a number of separate contact members 842 that are bonded to a contact bonding layer 844 as described above. A distal end 846 is disposed to electrically couple with a terminal 848 on the first circuit member 850. A solder ball 852 replaces the distal end 830 in FIG. 17A. Solder balls 852 are disposed to electrically couple with terminals 854 on second circuit member 856.

  In one embodiment, dielectric layer 856 and / or dielectric layer 858 preferably form a seal between contact member 842 and contact coupling layer 844. The dielectric layers 856, 858 are optionally a sealing material that flows around the contact member 842 to shield any grooves. The seal material is preferably a flowable polymer material that forms a non-brittle seal. A solder mask material may optionally be used as the sealing material. In one embodiment, the distal end 860 and / or 846 is planarized to remove any accumulated sealing material 856, 858. The seal material prevents the solder from wicking past the contact bonding layer 844. In one embodiment, the sealing material 856, 858 helps retain the contact member 842 that is bonded to the contact bonding layer 844.

  FIG. 19 is a top view of an interconnect assembly 900 according to the present invention. Any contact member configuration disclosed herein may be used with interconnect assembly 900. The housing 902 has a row of holes 904 through which the distal end of the contact member is coupled with the circuit member. Additional circuit surfaces are transferred, preferably from the side of the interconnect assembly 900, preferably by flexible circuit members 906, 908.

  20 is a cross-sectional side view of an alternative interconnect assembly 1000 according to the present invention. The housing 1002 has a contact bonding layer 1004 and a stabilization layer 1006. The contact bonding layer 1004 has a through opening 1008 adapted to couple with the contact member 1010.

  Contact member 1010 is adapted to electrically couple with a solder ball 1014 (eg, see FIG. 11) as seen on a BGA device, or with a conductive member 1016 on an intermediate contact set 1018 (eg, see FIG. 14). Three beams 1012a, 1012b, 1012c (referred to as “1012” as a set). The leftmost contact member 1010 is oriented 90 ° relative to the contact member to better illustrate the configuration of the beam 1012.

  The mesial end 1020 of the contact member 1010 has a narrow region 1022 that forms a snap-fit connection with the opening 1008 in the contact bonding layer 1004. The contact member 1010 moves along the axis 1024 to provide an optimal position for coupling with the solder ball 1014 or the intermediate contact set 1018 on the first circuit member (not shown) and the second circuit member 1028. I can do it. Beam 1012 bends in direction 1028 but is limited by sidewall 1032 to form an optimal electrical interface with solder ball 1014 or conductive member 1016.

  A seal layer 1030, such as a solder mask film or a fluid seal material, is selectively applied to the exposed surface of the contact bonding layer 1004. Seal layer 1030 preferably shields opening 1008 around contact member 1010.

  FIG. 21 is a cross-sectional side view of an alternative interconnect assembly 1050 in accordance with the present invention. The housing 1052 includes a contact bonding layer 1054, an alignment layer 1056, and a stabilization layer 1058. The contact bonding layer 1054 has a through opening 1060 that forms a snap-fit connection with a narrow region 1062 on the contact member 1064.

  Contact member 1064 includes two beams 1066a, 1066b (collectively “1066”) adapted to electrically couple to a BGA device or to a conductive member on an intermediate contact set (see, eg, FIG. 14). To be referred to). The leftmost contact member 1064 is oriented 90 ° with respect to the other contact members to better illustrate the configuration of the beam 1066.

  Contact member 1064 can move along axis 1068 so as to be in an optimal position relative to circuit members 1070, 1072. Beam 1066 bends in direction 1074 but is limited by side wall 1076 to form an optimal electrical interface with solder ball 1078.

  FIG. 22 is a cross-sectional side view of an alternative interconnect assembly 1100 substantially as shown in FIG. 21 except that the contact member 1064 is interlocked with the housing 1102. A seal layer 1104 is optionally attached to the surface 1106 of the housing 1102. Seal layer 1104 can assist in retaining contact member 1064 within housing 1102 and / or prevent solder from wicking along contact member 1064. In one embodiment, the seal layer 1104 is a solder mask film that is attached to the housing 1102 before the contact member 1064 is inserted.

  FIG. 23 is a diagram of an alternative connector member 1150 according to the present invention. A snap-fit component 1152 interlocks with the housing 1154. The distal end 1156 bends in the direction 1158 while being limited by the sidewall 1160 on the spacer 1164. The alignment component 1162 engages the housing 1154 to maintain a contact member 1150 oriented relative to a circuit member (not shown).

  FIG. 24 illustrates an alternative connector member 1170 that is interlocked with the contact bonding layer 1172. FIG. 25 illustrates a connector member 1174 that is interlocked with the contact bonding layer 1176. FIG. 26 illustrates a connector member 1178 that is interlocked with the contact bonding layer 1180. FIG. 27 illustrates a connector member 1182 interlocked with the contact bonding layer 1184. The connector member of FIGS. 23-27 may be used in the various embodiments disclosed herein.

  FIG. 28 illustrates an alternative interconnect assembly 1200 that is a variation of the interconnect assembly of FIGS. 17A and 18. The interconnect assembly 1200 has a contact bonding layer 1202, which includes a number of separate contact members 1204, 1206 bonded thereto. The curved portion 1208 and the solder ball 1210 help hold the contact member 1204 to the contact bonding layer 1202. The curved portion 1208 bends the distal end 1212 when coupled to the first circuit member 1214.

  The contact member 1204 has first and second curved portions 1216 and 1218. The curved portion 1218 secures the contact member 1206 in place, reduces the over height of the interconnect assembly 1200, and increases the through-hole pull-out strength or the reliability of the solder joint. Thus, an angle from 0 ° to about 90 ° can be formed. By forming the curved portion 1218 at an angle of less than 90 °, the mesial end 1220 can be bent when it is compression coupled to the second circuit member 1222.

  The bends 1208, 1216, 1218 can be used alone or in combination with a snap fit that is bonded to the contact bonding layer 1206. In one embodiment, a sealing material 1224 is applied to one or both sides of the contact bonding layer 1202 to prevent solder, such as solder balls 1210, from wicking along the contact members 1204, 1206.

  FIG. 29 illustrates an interconnect assembly 1300 according to the present invention. In the embodiment of FIG. 29, the housing 1302 includes a seal layer 1304, an optical leveling layer (planarization layer) 1306, a contact bonding layer 1308, a spacer or reinforcement layer 1310, and an alignment or protection layer 1312. In the illustrated embodiment, one or more layers 1302, 1304, 1306, 1308, 1310, and 1312 are laminated by using various techniques such as thermal or ultrasonic bonding, adhesives, and the like.

  Seal layer 1304 is optionally a solder mask film or solder mask solution that is at least partially cured prior to insertion of contact member 1316. Alternatively, the seal layer may be a flowable / curable polymer material.

  Contact bonding layer 1308 has at least one opening 1314 adapted to receive contact member 1316. Contact member 1316 typically forms a press fit, snap fit, or integrated bond with contact bond layer 1308. Alternatively, contact member 1316 is coupled to housing 1302 by using one or more compressive forces, solder, wedge bonding, conductive adhesive, ultrasonic or thermal bonding, or wire bonding. Contact member 1316 preferably forms a seal bond with seal layer 1304 to prevent wicking of solder 1324 along contact member 1316 during bonding with second circuit member 1330.

  In the illustrated embodiment, the alignment layer 1312 and the seal layer 1304 extend across the reinforcing layer 1310 to form a non-moldable recess 1318. The recess 1318 provides a region where the contact member 1316 extends without limiting the deflection of the beams 1326A, 1326B. Beams 1326A, 1326B of contact member 1316 deflect outward toward surface 1328 during compression. The alignment layer 1312 places the distal end 1320 of the contact member 1316 at a desired position in order to electrically couple the first circuit member 1322.

  To assemble the interconnect assembly 1300, the distal end 1320 of the contact member 1316 is inserted through the opening 1314 until engagement with the contact bonding layer 1308 is achieved. The contact member 1316 is electrically coupled to the first and second circuit members 1322 and 1330 by using solder, compressive force, or a combination thereof. The structure of the distal end 1320 is particularly well suited for engagement with an LGA device such as the first circuit member 1322. The contact member 1316 is, for example, a flexible circuit, ribbon connector, cable, printed circuit board, ball grid array (BGA), land grid array (LGA), plastic lead chip carrier (PLCC), pin grid array (PGA), miniaturized integration. Circuit (SOIC), dual in-line package (DIP), quad flat package (QFP), leadless chip carrier (LCC), chip scale package (CSP) or packaged or unpackaged integrated circuit It can be configured to electrically couple with a wide variety of circuit members 1322, 1330, including.

  FIG. 30 is an interconnect assembly 1348 that is a variation of FIG. In the embodiment of FIG. 30, the alignment layer 1312 is replaced with a stripper plate 1350. The stripper plate 1350 is biased away from the reinforcing layer 1310 by something like a spring 1311 so that the distal end 1320 of the contact member 1316 is generally protected prior to use. The distal end 1320 is preferably flush with the surface 1354 of the stripper plate 1350 or below it. The dimension of the groove 1352 depends on the dimension of the contact member 1316. When compressive force is applied between the first and second circuit members 1322 and 1330, the stripper plate 1350 is displaced toward the reinforcing layer 1310 so as to expose the distal end 1320 of the contact member 1316. Alternatively, the stripper plate 1350 is displaced toward the reinforcing layer 1310 to expose the distal end 1320. The stripper plate 1350 may be offset before, during, or after the second circuit member 1330 is positioned for engagement with the contact member 1316.

  FIG. 31 illustrates an interconnect assembly 1368 that is a variation of FIG. In the embodiment of FIG. 31, the contact member 1370 has a pair of beams 1372, 1374 that form rings 1376, 1378, 1380. Ring 1376 forms a press-fit bond with contact bond layer 1308. Rings 1378 and 1380 extend within recess 1318 as described above. The beams 1372, 1374 may or may not contact each other where they overlap to form the rings 1376, 1378, 1380. Accordingly, the contact member has a ring when the conductive material forms a closed shape when viewed from at least one surface.

  FIG. 32 illustrates an interconnect assembly 1400 according to the present invention. In the embodiment of FIG. 32, the housing 1402 includes a seal layer 1404, a contact bonding layer 1406, and a stripper plate 1408 as described in connection with FIG. The contact member 1410 has a pair of beams 1412, 1414 that form rings 1416, 1418, 1420. Ring 1420 forms a press-fit bond with contact bond layer 1406. Seal layer 1404 minimizes or eliminates migration of solder 1426 into recess 1422. Rings 1418 and 1420 expand within recess 1422 as stripper plate 1408 travels toward contact bonding layer 1406.

  FIG. 33 illustrates a modified interconnect assembly 1428 of FIG. Contact bonding layer 1430 has a groove 1432 formed to receive contact member 1434. Contact member 1434 preferably includes a tab 1436 formed with groove 1432 to create a seal. A seal layer can optionally be used to reduce the risk of solder 1438 wicking along contact member 1434.

  FIG. 34 illustrates an interconnect assembly 1450 with a portion of the contact member 1452 extending beyond the surface 1454 of the housing 1456. In the illustrated embodiment, the contact member 1452 forms a ring 1458 that extends below the surface 1454 of the contact bonding layer 1460. Solder 1462 flows into ring 1458 during reflow to form a stronger seam. Seal material 1464 is optionally placed at the interface between contact member 1452 and contact bonding layer 1460 to prevent solder wicking. The embodiment of FIG. 34 may be arbitrarily separated as illustrated in FIGS. 30, 32 and 33.

  FIG. 35 illustrates an interconnect assembly 1480 where the beams 1482, 1484 of the contact member 1486 are warped outward. The elasticity of the beams 1482, 1484 holds the contact member 1486 in a non-moldable recess 1488. In one embodiment, contact member 1486 forms a snap-fit connection with recess 1488.

  FIG. 36 illustrates an interconnect assembly 1500 having a second contact member 1502 that forms a snap-fit interface with the distal ends 1504, 1506 of the contact member 1508. Second contact member 1502 and contact member 1508 operate together during operation. When the first circuit member 1510 is pressed against the interconnect assembly 1500, the second contact member 1502 induces warpage in the beams 1512, 1514 of the contact member 1508.

  FIGS. 37A-37C illustrate a dual wheel contact member 1600 having inverted overlapping tips 1602, 1604. FIG. Overlapping tips 1602, 1604 are more resistant to handling-derived damage than a single tip configuration. Since the tips 1602, 1604 overlap, the beams 1606, 1608 warp outward in direction 1610 under compression, but the tips 1602, 1604 remain within the limited proximal. In the preferred embodiment, the tips 1602, 1604 remain engaged during compression. In an alternative embodiment, the wheel is completed by a circuit member electrically coupled to the tip as illustrated in FIG.

  In the illustrated embodiment, beams 1606, 1608 are integrally formed with bottom 1612 from a continuous sheet material. Beams 1606, 1608 are bent relative to bottom 1612 generally in direction 1614. Solder balls 1616 are preferably attached to the bottom 1612 opposite the beams 1606, 1608. The solder ball 1616 can be attached to the bottom 1612 by using various techniques such as reflow of the solder ball 1616, conductive adhesive, compression bonding, mechanical interconnection, and the like. Contact member 1600 may be comprised of a variety of conductive materials such as, for example, a 0.002 inch thick BeCu A390 sheet.

  The beams 1606, 1608 are preferably bent to create two or more rings 1607, 1609. Beams 1606 and 1608 overlap at position 1611 to form a ring 1609. The beams 1606 and 1608 may or may not contact each other at the position 1611. Contact member 1600 has rings 1607, 1609 because the conductive material forms two closed shapes as seen from the face in FIG. 37A. Rings 1607 and 1609 are visible in FIG. 37A but not in 37B.

  The tip portions 1602 and 1604 also overlap arbitrarily. In one embodiment, the tips 1602, 1604 do not contact each other until they engage another circuit member. In yet another embodiment, additional circuit members complete the annulus 1609 by electrically coupling with the tips 1602, 1604. FIG. 29 illustrates a contact member 1316 that can represent both of these embodiments depending on the degree of compression applied by the circuit members 1322, 1330.

  38A-38C illustrate an alternative dual wheel contact member 1620 with partially modified overlapping tips 1622, 1624. FIG. 39A-39C illustrate another double wheel contact member 1630 with inverted overlapping tips 1632, 1634. Contact members 1600, 1620, 1630 are particularly well suited for LGA devices and can be used in the various interconnect assemblies disclosed herein.

  40A-40C illustrate a dual wheel contact member 1650 with inverted overlapping tips 1652, 1654 that is particularly well suited for BGA devices. Again, under compression, beams 1656, 1658 warp outward in direction 1660, while tips 1652, 1654 remain in a limited proximal position. 41A-41C illustrate an alternative dual wheel contact member 1670 with partially modified overlapping tips 1672, 1674. FIG.

  FIG. 42 illustrates an alternative double wheel contact member 1700 with an alternative solder member attachment mechanism 1702 in accordance with the present invention. In the illustrated embodiment, the double wheel contact member 1700 is constructed such that beams 1704, 1706 and bottom 1708 are composed of different portions of a continuous sheet of material formed as shown. A blank having the desired shape is cut from the sheet material and bent so that the beams 1704, 1706 extend generally in direction 1710. Tabs 1716, 1718 are also preferably integrally formed with bottom 1708 and are bent to extend generally in direction 1720. Tabs 1716, 1718, beams 1704, 1706, and bottom 1708 are preferably composed of different portions of continuous sheet material bent as shown.

  The tip portions 1712 and 1714 are arbitrarily overlapped. In the illustrated embodiment, the tabs 1716, 1718 are arranged in a face-to-face configuration to capture or compressively engage the solder member 1726 (see FIGS. 43A-43C).

  In some embodiments, directions 1710, 1720 may form an acute angle, but in the illustrated embodiment, directions 1710 and 1720 are generally reversed. Tabs 1716, 1718 have one or more engaging components 1722, 1724 that are adapted to mechanically engage solder member 1726. In the illustrated embodiment, tabs 1716, 1718 engage solder member 1726 on two sides.

  In the illustrated embodiment, the solder member 1726 is a solder ball as that term is used and understood in the electronic field. Solder balls are generally spherical, but not exactly, and are not consistent with the mathematical sphere definition.

  As described herein, the engaging component of the present invention enables the solder member to be mechanically attached to the contact without reflowing the solder member. The mechanical engagement is preferably mechanism only, whereby the solder member is attached to the contact. Alternatively, the engagement component can facilitate the bonding of the mixed solder to the tab.

  As best shown in FIGS. 43A-43C, the engagement pieces 1722, 1724 comprise cutouts 1723 with slots 1725, 1727, respectively, on the distal ends of the tabs 1716, 1718. Slots 1725 and 1727 facilitate insertion of solder member 1726 in direction 1729 (see FIG. 43B).

  Cutout 1723 may be replaced by various shaped cutouts such as oval, triangular, rectangular, hexagonal, etc. By changing the size and shape of the cutout 1723 and / or the size and shape of the solder member 1726, the solder member 1726 can still move within the tabs 1716, 1718 while moving relative to the contact member 1700. . Free-floating solder member 1726 increases the ability of contact member 1700 to conform to non-planar circuit member 1772 (see FIG. 44).

  The solder member 1726 has a generally spherical shape with a diameter 1728 that is slightly larger than the gap 1730 between the tabs 1716, 1718. In one embodiment, tabs 1716, 1718 are elastically deformed to accept solder member 1726. In the illustrated embodiment, a portion of the solder member 1726 is placed within the opposing engagement components 1722, 1724 within the snap-fit connection. In an alternative embodiment, the solder member 1726 and / or tabs 1716, 1718 may be mechanically engaged, for example, by crimping the tabs 1716, 1718 to more securely secure the solder member 1726 to the contact member 1700. Plastically deformed during or after.

  In other embodiments, the solder member 1726 is plastically deformed, such as by coining before engaging the tabs 1716, 1718 (see, eg, FIGS. 49 and 50). Solder member 1726 may include one or more supplemental components that mechanically engage with solder member attachment mechanism 1702. For example, a series of protrusions can be formed in the surface of the solder member 1726. By trimming the number, size, and gap of the protrusions, it is possible to increase the probability that the protrusions will engage the engaging parts on the tab.

  A solder mask 1732 is optionally placed on one or both sides of the bottom 1708. Solder mask 1732 can optionally be attached before or after solder member 1726 is mechanically engaged with tabs 1716, 1718.

  FIG. 44A illustrates an interconnect assembly 1750 in combination with the dual wheel contact member 1700 of FIGS. The housing 1752 preferably has multiple layers 1754, 1756, 1758, 1760 (insulators and / or conductors) that are sufficiently intimate (overmolded) to hold the layers together. One or more of the layers 1754, 1756, 1758, 1760 may be circuit members. Each layer 1754, 1756, 1758, 1760 is placed in a suitable stack of sheets (individual or multiple connector patterns per sheet) or in an open reel or roll feed process.

  Layers 1754, 1756, 1758, 1760 are aligned and are preferably fed into a molding operation that tightly attaches frame or retaining ring 1762 to housing 1752. The retaining ring 1762 is a frame that extends along the outer periphery of two or more sides of the interconnect assembly 1750, and preferably extends along all four sides. Each layer 1754, 1756, 1758, 1760 of the housing creates a hole 1761 and a housing 1752 that cannot be molded (adhered) when the molding material flows around or through it or is integrated with an overmold part. Parts, for example, part 1763.

  The distal ends 1712, 1714 of the double wheel contact member 1700 are preferably inserted into the housing 1752 in the direction 1764. The bottom 1708 of the double wheel contact member 1700 is preferably press fitted into the housing 1702 and sealed to the housing by a solder mask 1732 (liquid or film) to minimize solder wicking during solder reflow. (See FIG. 43B). Solder member 1726 is then press fit into engagement components 1722, 1724 with tabs 1716, 1718. In the illustrated embodiment, the engagement components 1722, 1724 preferably hold the solder member 1726 mechanically without having to melt the solder member 1726 onto the contact member 1700.

  In one embodiment, the mechanical engagement of the solder member 1726 to the engagement components 1722, 1724 is optionally free-floating to provide some flat relief that results in the solder member 1726 not falling. Engaging the solder member 1726 with the double wheel contact member 1700 may optionally include post-insertion processing, such as coining to change the shape of the solder member 1726 to improve engagement. For example, tabs 1716, 1718 can be crimped to increase retention reliability.

  During solder reflow, the solder member 1726 melts and flows around the tabs 1716, 1718, and the pads 1770 are welded onto the printed circuit board 1772 to electrically and mechanically connect between the interconnect assembly 1750 and the printed circuit board 1772. Create a bond.

  The resulting joint is much stronger than a typical BGA solder joint with room to shift the load. Tabs 1716, 1718 provide inlets and outlets for the cleaning fluid to be used to prevent solder member 1726 from being crushed by interconnect assembly 1750 during reflow, and to clean under interconnect assembly 1750 and printed circuit board 1772. Also provided is a structure in a standoff (isolation insulator) for providing a circuit.

  FIG. 44B illustrates an alternative interconnect assembly 1780 in combination with the dual wheel contact member 1670 of FIGS. The housing 1752 includes layers 1754, 1756, 1758, 1760 (insulators and / or conductors), one or more of which may be circuit members. Each layer 1754, 1756, 1758, 1760 of the housing has a hole 1761 and a housing 1752 integrated with an unmoldable or overmolded part such as, for example, part 1763, when molding (adhering) material flows around or through it. With other parts to create.

  The distal ends 1672, 1674 of the double wheel contact member 1670 are preferably inserted into the housing 1752 in the direction 1764. The bottom 1804 of the contact member 1670 is masked during overmolding of the layer 1802, thereby exposing the bottom 1804. The overmolded plastic layer 1802 secures the contact member 1670 to the housing 1752 and may optionally form a groove 1806 in which the solder material 1726 is disposed. Any of the contact members disclosed herein can be used with the method and apparatus of FIG. 44B. In solder reflow, solder member 1726 is welded to pad 1770 on printed circuit board 1772 to create an electrical and mechanical connection between interconnect assembly 1780 and printed circuit board 1772.

  FIG. 44C illustrates the interconnect assembly 1750 of FIG. 44A without the solder member 1726. Rather, solder paste 1890 is deposited or printed on the printed circuit board 1772. Engagement component 1722 on tabs 1716, 1718 and / or contact member 1700 is placed in intimate contact with solder paste 1890. As the solder paste 1890 melts, it collects on the tabs 1716, 1718 and / or the engagement piece 1722. Tabs 1716, 1718 also define a minimum groove between interconnect assembly 1750 and printed circuit board 1772. When the solder paste 1890 is solidified, a connection is created between the contact member 1700 and the circuit board 1772. Any of the contact members disclosed herein can be used with the embodiment of FIG. 44C. In particular, the horizontal engagement piece 1974 on the mounting member 1970 of FIGS. 53A and 53B is particularly well suited for use in the embodiment of FIG. 44C.

  FIG. 45A illustrates an alternative solder member attachment mechanism 1800 according to the present invention. Tabs 1802 and 1804 are each provided with engagement components 1806 and 1808 adapted to engage with solder member 1726. In the illustrated embodiment, tabs 1802, 1804 are oriented on one side of bottom 1810, while beams 1812, 1814 (see FIGS. 45B and 45C) are oriented on the opposite side of bottom 1810.

  In the embodiment of FIG. 45B, the engagement components 1806, 1808 are elongated grooves that extend the width 1816 of the tabs 1802, 1804. The solder member 1818 is selectively cylindrical. In the embodiment of FIG. 45C, the solder member 1726 is spherical. Alternatively, the engaging parts 1806, 1808 may be hemispherical grooves (dents).

  In the embodiment of FIGS. 45B and 45C, solder members 1726, 1818 are inserted along axis 1807 generally perpendicular to bottom 1810 (see FIG. 45A) or along axis 1809 generally parallel to bottom 1810 (see FIG. 45C). can do.

  FIG. 46 illustrates an alternative solder member attachment mechanism 1820 according to the present invention. Tabs 1822, 1824 are each provided with engagement components 1826, 1828 adapted to engage with solder member 1726. In the illustrated embodiment, the distal ends 1832, 1834 of the tabs 1822, 1824 are bent toward the bottom 1830 to form a barbed structure. The inclined surfaces 1836, 1838 facilitate the insertion of the solder member 1726, while the distal ends 1832, 1834 hold the solder member 1726 within the solder member mounting mechanism 1820. An optional groove 1840 between the optional solder mask 1842 and the solder member 1726 allows the solder member 1726 to move within the attachment mechanism 1820 while still being retained therein.

  47A and 47B illustrate an alternative solder member attachment mechanism 1850 according to the present invention. Tabs 1852 and 1854 are each provided with engagement components 1856 and 1858 adapted to engage with solder member 1726.

  As best shown in FIG. 47B, the engagement piece 1856 of the tab 1852 is bent toward the tab 1854. The engaging piece 1858 of the tab 1854 is bent toward the tab 1852. Tabs 1852, 1854 and engaging components 1856, 1858 extend along a portion of the four sides of solder member 1726. The groove 1855 is preferably serviced between the engagement components 1856, 1858. As best illustrated in FIG. 47C, the engagement components 1856, 1858 and / or tabs 1852, 1854 are optionally crimped to mechanically engage the solder member 1726. Groove 1855 facilitates crimping of tabs 1852, 1854.

  FIG. 47D illustrates the use of a hexagonal solder member 1860 with the solder member attachment mechanism 1850 of FIG. 47A in accordance with the present invention. For any of the solder members disclosed herein, various non-spherical shapes can be used, such as pyramid shapes, donut shapes, cubes, and the like. Engagement components 1856, 1858 and / or tabs 1852, 1854 are also optionally crimped, as illustrated in FIG. 47C.

  FIG. 47E illustrates alternative engagement components 1862, 1864 for the solder member attachment mechanism 1850 of FIG. 47A in accordance with the present invention. Tab 1852 has a single engagement piece 1862 and tab 1854 has a single engagement piece 1864.

  FIG. 48 illustrates an alternative solder member attachment mechanism 1870 according to the present invention. Tabs 8172, 1874 have one or more engaging parts 1876, 1878 in the form of protrusions 1880, 1882 that mechanically engage with solder member 1726. In one embodiment, the protrusions 1880, 1882 deform plastically and enter the mass of solder member 1726. Tabs 1872, 1874 are crimped by a person to cause protrusions 1880, 1882 to enter the mass of solder member 1726. In another embodiment, the friction between the protrusions 1880, 1882 holds the solder member 1726 in place.

  FIG. 49 illustrates an alternative solder member attachment mechanism 1900 according to the present invention. Solder member 1902 has a series of indentations 1904 and ledges 1906. In the illustrated embodiment, one or more ledges engage one or more engaging components 1908, 1910 on tabs 1912, 1914. Any engagement component disclosed herein is suitable for use with the solder member 1902.

  The indents 1904 and ledges 1904 on the solder member 1902 may be regular or irregular, may be symmetric or asymmetric, have the same size and shape, or Different dimensions and shapes may be used. In one embodiment, the solder member 1902 is randomly shaped. The solder member 1902 can be formed by coining, molding, or various molding processes.

  FIG. 50 illustrates an alternative solder member attachment mechanism 1920 according to the present invention. Hexagonal solder member 1922 is engaged with rectangular engagement parts 1924, 1926 on tabs 1928, 1930. Engagement parts 1924, 1926 have a greater height 1932 than is necessary to allow solder member 1922 to float freely along axis 1934.

  FIG. 51 shows a solder member mounting mechanism 1820 as shown in FIG. A cube-shaped solder member 1950 is held by the distal ends 1832 and 1834 of the engaging parts 1826 and 1828.

  FIG. 52 illustrates a solder member attachment mechanism 1850 as illustrated in FIG. 47A. A solder member 1950 having a cubic shape is held by the engaging components 1856 and 1858. Tabs 1852, 1854, and / or engagement components 1856, 1858 may optionally be crimped as described above.

  53A and 53B illustrate an alternative solder member attachment member 1970 that is configured with a single tab 1972. The tab 1972 has an engagement piece 1974 with an opening 1976 that is generally parallel to the bottom 1978. In the illustrated embodiment, the bottom 1978 is slightly curved to help center the solder member 1726 within the opening 1976. The solder member 1726 is mechanically held between the engagement component 1974 and the bottom portion 1978.

  A portion 1726 </ b> A of the solder member 1726 penetrates the surface 1980 on the engaging component 1874 upward. In one embodiment, the solder member 1726 is disposed in the groove 1982 on the bottom 1978. Tab 1972 is then crimped to hold solder member 1726. In other embodiments, the solder member 1726 is inserted between the engagement piece 1974 and the bottom 1978.

  54A and 54B illustrate an interconnect assembly 2000 in combination with a contact member 2002. FIG. The contact member 2002 is formed from a continuous piece of material according to the present invention. In the illustrated embodiment, contact member 2002 is configured such that beams 2004, 2006 and bottom 2008 are composed of different portions of the formed continuous sheet material. A blank with the desired shape is cut from the sheet material and a slit 2010 is formed between the beams 2004, 2006. The slit 2010 does not extend through the tip 2012, so that the tip 2012 and the beams 2004, 2006 are the same continuous piece of sheet material. The beams 2004, 2006 are bent in opposite directions 2014, 2016 to form a central opening or ring 2018. In some embodiments, the directions 2014, 2016 may be formed at acute angles, but in the illustrated embodiment, the directions 2014, 2016 are generally opposite.

  Tab 2020 is mechanically coupled to solder mask 2034. In the illustrated embodiment, the tab 2020 has one or more engagement components 2022, 2024 that are adapted to mechanically engage the solder member 2026. Alternatively, a solder member attachment mechanism as illustrated in FIGS. 42-53 may be substituted for the tab 2020.

  In one embodiment, the housing 2028 of the interconnect assembly 2000 has a pair of walls 2030, 2032 that are selectively arranged to limit the beams 2004, 2006 from deflecting in directions 2014, 2016, respectively. . The housing 2028 may have any additional layers described herein.

  55A and 55B illustrate an interconnect assembly 2050 in combination with a contact member 2052. Contact member 2052 is formed from a continuous piece of material in accordance with the present invention. In the illustrated embodiment, the contact member 2052 is configured to consist of different portions of continuous sheet material formed with beams 2054, 2056 and a bottom 2058. Slit 2060 does not extend through tip 2062. Beams 2054, 2056 are bent to form rings 2064, 2066, 2068. FIG. 55C illustrates the contact member 2052 in a substantially uncompressed stage.

  56A and 56B also illustrate interconnect assembly 2100 in combination with contact member 2102. The contact member 2102 is formed from a continuous piece of material as described above. The slit 2104 does not extend through the tip 2106. Beams 2108, 2110 are bent inward toward ring 2112. The solder member mounting mechanism as illustrated in FIGS. 42 to 53 may be substituted for the tab 2114.

  57A-57C illustrate an alternative contact member interconnect assembly 2150 in combination with a dual wheel contact member 2152 according to the present invention. Beams 2158 and 2160 also overlap at position 2162. In the illustrated embodiment, beams 2158, 2160 do not contact each other at location 2162 (see FIG. 57C). The tips 2154, 2156 of the beams 2158, 2160 overlap and are mechanically coupled to limit separation in directions 2168, 2170. The distal ends 2154 and 2156 of the distal ends 2162 and 2164 respectively extend out of the housing 2166 and extend upward. The distal ends 2162, 2164 are particularly well suited for coupling with LGA devices.

  FIG. 58 illustrates a flexible circuit 3020 with a number of openings 3022 in contact with the wire 3024 according to the present invention. The flexible circuit 3020 is preferably a multilayer structure including upper and lower layers 3021 of a dielectric material such as Kapton (registered trademark) (see FIG. 59). In one embodiment, the inner periphery 3026 of the opening is plated with a conductive material to facilitate electrical coupling with the wire 3024.

The opening 3022 may be formed by a mechanical technique such as punching or cutting, a chemical technique such as photolithography, an overcurrent to break bonds, an electrical technique such as a laser, or various other techniques. Can be formed. In one embodiment, a laser system such as excimer, CO ₂ , YAG creates the opening 3022.

  FIG. 59 is a cross-sectional side view of an interconnect or socket assembly 3040 that includes an integrated circuit 3043 in accordance with the present invention. Contact member 3042 is held within housing 3044 by a variety of techniques such as friction fit, mechanical interlocks, and the like. The mesial end 3046 of the contact member 3042 is provided with a solder material 3048 that electrically couples a circuit member 3050 such as a printed circuit board.

  The mesial end 3046 of the contact member 3042 is, for example, a flexible circuit, ribbon connector, cable, printed circuit board, ball grid array (BGA), land grid array (LGA), plastic lead chip carrier (PLCC), pin grid array (PGA). ), Miniaturized integrated circuit (SOIC), dual in-line package (DIP), quad flat package (QFP), leadless chip carrier (LCC), chip scale package (CSP) or packaged or packaged Preferably adapted to engage a connector member selected from the group consisting of non-integrated circuits. The circuit member 3050 may be one of a printed circuit board, a flexible circuit, a bare die device, an integrated circuit device, an organic or inorganic substrate, or a rigid circuit.

  In accordance with an embodiment of the present invention, an opening 3022 in the circuit member 3020 of FIG. 1 is disposed across the mesial end 2046 of the contact member 3042, whereby the wire 3024 is electrically coupled to the contact member 3042. To do. Circuit member 3020 is optionally attached to surface 3052 of housing 3044.

  In the illustrated embodiment, the solder material 3048 facilitates electrical coupling between the electrical wire 3024 and the contact member 3042. In other embodiments, the electrical interconnect (interconnect) is initially made by compression of the conductive surface 3026 around the opening 3022 around the mesial end 3046 of the contact member 3042, followed by the solder material 3048. Reinforced when reflowed on circuit member 3050. The wires 3024 essentially redistribute the fine pitch of the socket assembly 3040 to facilitate electrical analysis at the distal end 3054 by a logic analyzer or other device.

  FIG. 60 illustrates an alternative socket assembly 3060 where friction provides a mechanical and electrical coupling between the wire 3024 on the circuit member 3020 and the mesial end 3062 of the contact member 3064. Solder is not necessary. In the illustrated embodiment, compression also provides mechanical and electrical coupling between the contact member 3064 and the circuit members 3065, 3066.

  FIG. 61 illustrates an alternative embodiment of a socket assembly 3060 where the mesial end 3062 of the contact member 3064 does not pass through the circuit member 3070. Instead, a conductive member 3072 is disposed in the opening 3074 in the circuit member 3070. Conductive member 3072 facilitates compression placed on the interface between mesial end 3062 of contact member 3064 and circuit member 3066. In the illustrated embodiment, the circuit member 3065 is also engaged with the contact member 3064 by compression. The conductive member 3072 is one of solder, conductive plug, conductive rivet, conductive adhesive, heat stake, spot welding, and ultrasonic welding, compression connection, or electroplating. Also good. In one embodiment, conductive member 3072 was made from a material such as Cu or BeCu.

  The conductive member 3072 allows a fine pitch and controls the gap between the socket assembly 3060 and the circuit member 3066. The conductive member 3072 can be engaged with the circuit member 3070 by friction, solder, or the like. In some embodiments, conductive member 3072 can be selectively interconnected with line 3076 of circuit member 3070. For example, if the flexible circuit member 3090 has multiple layers of conductive wires 3076 (see, eg, FIG. 63C), the conductive members 3072 will selectively engage various layers of the conductive wires 3076. Can be configured. In other embodiments, the side 3078 may be coated with a dielectric material to prevent electrical coupling of the circuit member 3070 with the wire 3076 while still electrically coupling the contact member 3064 with the circuit member 3066. .

  FIG. 62 illustrates a multilayer flexible circuit member 3090 according to one embodiment of the present invention. The circuit member 3090 is preferably manufactured by selectively adding or removing material using traditional circuit manufacturing processes. In the illustrated embodiment, a portion of the dielectric top layer 3092 has been removed and a conductive material 3094 has been added. A conductive material 3094 is disposed to electrically couple with the mesial end 3096 of the contact member 3098. Additional conductive material 3100 is added along the bottom surface of circuit member 3090 to bond with contact pads 3102 of circuit member 3104. Conductive materials 3094 and 3100 are electrically coupled to conductive wire 3091.

  In the embodiment of FIG. 62, other components 3106 and 3108 are mounted on a circuit member 3090, such as individual passive devices such as capacitors, flip chips, packaged IC devices, and the like. In the illustrated embodiment, the circuit member 3110 electrically couples with a contact member 3098 disposed within the socket assembly 3114 to allow for a multi-layer socket assembly.

  62A-63C illustrate an alternative multilayer flexible circuit member 3120 adapted for redistributing electrical signals from a fine pitch device. FIG. 63A shows a flexible circuit member having a number of exposed contact pads 3122 having a pitch 3124 and arranged corresponding to electrical contacts on a socket assembly (see, eg, FIG. 59) or an integrated circuit. 3 is a top view of 3120. FIG.

  FIG. 63B is a bottom view of a flexible circuit member 3120 with contacts 3126 arranged with a larger pitch 3128. In the illustrated embodiment, the flexible circuit member 3120 redistributes the pitch 3124 of the fine pitch BGA device from 0.4 or 0.5 mm to a larger pitch 3128 of 0.8 mm, thereby engaging the contact 3126. Less cost is required to create a PCB.

  63C is a cross-sectional view of the flexible circuit member 3120 of FIGS. 63A and 63B. The contact pads 3122 are arranged in a row at a first pitch corresponding to the row of contacts 3134 of the socket assembly 3132. Contact pad 3122 is routed through electrical wire 3130 to contact 3126 on the opposite surface of flexible circuit member 3120. The contact pads 3126 are arranged in a row at a second pitch that is larger than the first pitch and that corresponds to the row of contact pads 3136 on the printed circuit board 3138. In the illustrated embodiment, the flexible circuit member 3120 is a multi-layer structure with each approximately 0.001 inch thick layer so that the contact pads 3122 can be rerouted without traversing the electrical wires 3130.

  The individual embodiments disclosed above are illustrative only so that the present invention may be modified and implemented in an equivalent manner apparent to those of ordinary skill in the art having the benefit of this teaching. For example, the contact member and housing disclosed herein can be combined in various ways. Also, any solder member attachment mechanism disclosed herein can be combined with any connector member beam configuration. Furthermore, there is no intention to limit the details of the construction or design shown herein other than as described in the claims. It is therefore evident that the individual embodiments disclosed above may be altered or modified and all such variations are considered within the scope and spirit of the invention.

  This application claims priority from US Provisional Application No. 60 / 909,550, filed Apr. 2, 2007, incorporated herein by reference.

Claims (20)

Socket assembly,
A first circuit member electrically coupled to the contact member along the first side of the socket assembly;
A second circuit member electrically coupled to the contact member along the second side of the socket assembly; and
An electrical assembly comprising a flexible circuit member interposed between a socket assembly and a second circuit member,
The flexible circuit member comprises a number of wires electrically coupled to contact members on the socket assembly,
The flexible circuit member comprises an electrical assembly comprising at least one distal portion extending an electrical wire beyond the socket assembly.   The electrical assembly of claim 1, wherein the contact member on the socket assembly extends through a hole in the flexible circuit member.   The electrical assembly of claim 1, wherein the electrical assembly is configured with solder that electrically couples the contact member on the socket assembly with both wires on the first circuit member and the second circuit member.   The electrical assembly of claim 1, wherein the hole in the flexible circuit member is in compression engagement with a contact member on the socket assembly.   A conductive member disposed in a hole in the flexible circuit member and electrically coupled to the electric wire, wherein the conductive member electrically couples the contact member on the socket assembly to the second circuit member. The electrical assembly according to claim 1, comprising an electrically conductive member.   The electrical assembly of claim 1, wherein the flexible circuit member is compressed and held between the socket assembly and the second circuit member.   The electrical assembly of claim 1 configured with an additional circuit member electrically coupled to the flexible circuit member.   The electrical assembly of claim 1, wherein the flexible circuit member is configured with a sealing layer that substantially prevents solder from wicking into the socket assembly along the contact member.   The electrical assembly of claim 1, wherein the flexible circuit member comprises at least one dielectric layer covering at least a portion of the electrical wire.   The electrical assembly of claim 1, wherein the contact members in the socket assembly have a first pitch and the electrical wires on the distal portion have a second pitch that is greater than the first pitch. Flexible circuit members
A first surface configured with a row of first contact pads electrically coupled to an electrical wire, the first contact pad having a first pitch corresponding to the pitch of the contact members on the socket assembly. A first surface; and
A second surface comprising a row of second contact pads electrically coupled to the electrical wires, wherein the second contact pads have a second pitch corresponding to the pitch of the second circuit member. The electrical assembly of claim 1, comprising: a second surface.   The electrical assembly of claim 11, wherein the second pitch is greater than the first pitch.   The electrical assembly of claim 11, wherein the second circuit member comprises a printed circuit board.   The electrical assembly of claim 1, wherein the electrical assembly is configured with an external device electrically coupled to a wire on a distal portion of the flexible circuit member.   The electrical assembly of claim 14, wherein the external device is one or more logic analyzers or printed circuit boards. A first circuit member comprising a row of electrical contacts electrically coupled to a contact member in a socket assembly, wherein the row of contact members has a first pitch;
A first surface having a row of first contact pads corresponding to and electrically coupled to the row of contact members on the socket assembly, and selectively connected to the row of first contact pads by an electrical wire A flexible circuit member comprising a second surface having a second row of contact pads coupled to the row, wherein the second row of contact pads has a second pitch greater than the first pitch. Flexible circuit members, and
A second circuit member having a row of electrical contacts corresponding to and electrically coupled to the second row of contact pads on the flexible circuit member. Assembly.   The electrical assembly of claim 16, wherein the flexible circuit member is compressed and held between the socket assembly and the second circuit member.   The electrical assembly of claim 16, wherein the electrical assembly is configured with an additional circuit member electrically coupled to the flexible circuit member.   The electrical assembly of claim 16, wherein the flexible circuit member comprises a seal layer that prevents solder from wicking into the socket assembly along the contact member.   The electrical assembly of claim 16, wherein the electrical wires are distributed across multiple layers in the flexible circuit member.

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