JP2003331953A - Substrate interconnection device, and probe card using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a substrate interconnection device with high reliability on the connection between electrodes, and to obtain a probe card using the same. <P>SOLUTION: The probe card A comprises an upper substrate 100 on the surface of which, an upper electrodes 110 are formed and through holes 120 are formed to the lower side thereof, a lower substrate 200 located on the back side of the upper base plate 100 on the surface of which, a lower electrodes 210 are formed, connection pieces 300 interposed between the upper substrate 100 and the lower substrate 200 and connected to the upper substrate 100 and the lower substrate 200, and probes 400 mounted to the back surface of the lower side base plate 200 and electrically connected to the lower electrodes 210. Base end parts 310 of the connection pieces 300 are inserted into the through holes 120 and soldered to the upper electrodes 110, and top end parts 320 are soldered to the lower electrodes 210. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board-to-board connecting device for electrically connecting boards provided with electrodes and a probe card using the same.

[0002]

2. Description of the Related Art Conventionally, an inter-substrate connecting device B as shown in FIG. 4 has been used to electrically connect an upper electrode 11 of an upper substrate 10 and a lower electrode 21 of a lower substrate 20. There is.
This board-to-board connecting device B includes an upper electrode 11 and a lower electrode 21.
Connector 110, 11 which is an elastic body for electrically connecting
0, between the upper substrate 10 and the lower substrate 20,
The connector 110 is provided with a substrate 200 coaxially fixed to the front and back surfaces.

[0003]

However, in the inter-substrate connecting device B, the connectors 110, 110 urge and contact the upper electrode 11 and the lower electrode 21, and the upper electrode 11 of the upper substrate 10 and the lower substrate 20 are connected. The lower electrode 21 is electrically connected. Therefore, there is a problem that the reliability of the connection between the electrodes is low.

The present invention was made in view of the above circumstances, and an object of the present invention is to obtain a board-to-board connecting device having a highly reliable connection between electrodes and a probe card using the same. It is in.

[0005]

SUMMARY OF THE INVENTION An inter-substrate connecting device of the present invention comprises an upper substrate having an upper electrode formed on the front surface thereof and a through hole formed below the upper electrode, and a rear surface of the upper substrate. And a connector for connecting the upper electrode and the lower electrode with the lower substrate having a lower electrode formed on its surface and the upper substrate and the lower substrate interposed therebetween. The connector has a base end inserted into a through hole of the upper substrate and soldered to the upper electrode, and a tip end soldered to the lower electrode.

More preferably, the base end of the connector is
It is desirable that it is formed straight.

More preferably, the tip of the connector is
It is desirable that a curved portion be provided.

A probe card of the present invention comprises the above-mentioned inter-substrate connecting device, a probe is attached to the back surface of the lower substrate, and the probe is electrically connected to the lower electrode. .

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1 is a schematic side view of a probe card according to an embodiment of the present invention, FIG. 2 is a schematic side view of a connector, and FIG. 3 is a schematic side view of a probe according to another embodiment of the present invention. is there.

The probe card A listed here has an upper electrode 110 formed on the surface thereof.
Upper substrate 100 having through holes 120 formed on the lower side of 0
And a lower substrate 200 provided on the back surface side of the upper substrate 100 and having a lower electrode 210 formed on the front surface,
A connector 300 that is interposed between the upper substrate 100 and the lower substrate 200 to connect the upper electrode 100 and the lower electrode 200.
And a probe 400 attached to the back surface of the lower substrate 200 and electrically connected to the lower electrode 200. Hereinafter, each part will be described in detail.

The upper substrate 100 has a through hole 120 (shown in FIG. 4).
Base end portion 3 of the connector 300 described later, which is inserted from
Soldered to 10.

The lower substrate 200 is provided with lower electrodes 210 (four shown) formed on the surface and through holes 220 (four shown) formed below the lower electrode 210. . The lower electrode 210 has a connector 300 whose surface side will be described later.
While being soldered to the tip end portion 320 of the above, the back surface side is soldered to a base end portion 410 of the probe 400 described later, which is inserted from the through hole 220. It is also possible to bring the base end portion 410 of the probe 400 into contact with the lower electrode 210 so as to be electrically connected thereto and mechanically fixed in that state.

The connector 300 (four shown in the figure) has a base end portion 310 formed straight and a curved portion 3 as shown in FIG.
21 is a molded article integrally formed with the tip 320 having 21. In the connector 300, the base end portion 310 has the upper substrate 10
0 is inserted into the through hole 120 and soldered to the upper electrode 110, while the tip portion 320 is soldered to the lower electrode 110, so that the upper electrode 110 and the lower electrode 210
And are electrically connected. This is a characteristic part of the present invention.

At this time, the bending portion 321 of the tip portion 320.
However, since it is elastically deformed, the upper substrate 10
The soldering is not peeled off due to the positional displacement between 0 and the lower substrate 200, the thermal displacement at high temperature, or the like, and the connection between the upper electrode 110 and the lower electrode 210 is not broken.

Since the base end portion 310 of the connector 300 is formed straight, it can be easily inserted and removed before being fixed with solder.

The probe 400 (four shown) is integrally formed with a base end portion 410 which is inserted into the through hole 220 of the lower substrate 200 and a front end portion 420 which contacts an electrode of a semiconductor integrated circuit (not shown). This is a straight formed product, and a general product is used.

The method of assembling the probe card A will be described below.

First, the connector 300 is inserted into the through hole 120 of the upper substrate 100. After that, the base end portion 310 of the connector 300 and the upper electrode 110 of the upper substrate 100 are connected by soldering.

Next, solder is placed on the lower electrode 210 of the lower substrate 200. Then, the upper substrate 100 is connected to the lower substrate 20.
It is lowered toward 0 and the tip portion 3 of the connector 300 is attached to the solder.
Contact 20.

Then, the solder is heated and melted under pressure while the tip portion 320 is in contact with the solder.
After sufficient heating, the heating is stopped and the tip 320 is maintained in that position. Then, when the solder hardens, the connection between the lower electrode 210 and the tip portion 320 of the connector 300 is completed.

The probe 400 now has a proximal end 410.
Is inserted through the through hole 220 of the lower substrate 200, and the tip 3
As in the case of 20, the lower electrode 210 and the tip end 320 of the connector 300 are soldered and then the base end 410 is mechanically fixed in contact with the lower electrode 210. .

In the case of such a probe card A,
Since the connector 300 is soldered to the upper electrode 110 and the lower electrode 210, the upper electrode 110 and the lower electrode 21
The connection with 0 can be made reliable. Moreover, the distal end portion 320 of the connector 300 has the curved portion 32.
1 has an upper electrode 110 and a lower electrode 210.
There is no possibility that the upper electrode 110 and the lower electrode 210 will be disconnected from each other due to the positional displacement between the upper electrode 110 and the lower electrode 210 due to the thermal displacement at high temperature, etc. The connection between can be made reliable. The design can be changed as follows.

The lower substrate 200 has a through hole 22 here.
Although 0 is provided, it is also possible to change the design so as to provide a conductive wire on the surface of each layer using a laminated substrate as shown in FIG. At this time, in the probe 400, the base end portion 410 is electrically connected to the conductive wire extending from the back surface side of the lower substrate 200, and is fixed by solder or mechanically.

Although the base end portion 310 of the connector 300 is assumed to be formed straight in this case, the design can be changed to provide a curved portion or a bent portion as shown in FIG. When such a connector 300 is used, the curved portion or the bent portion is formed on the upper substrate 10 before soldering.
Since it abuts and is fixed in the through hole 120 of 0, the position does not shift during soldering, and the solder connection becomes very easy. At this time, the curved portion or the bent portion is bent slightly larger than the diameter of the through hole 120.

Although the tip portion 320 of the connector 300 is provided with the curved portion 321 here, it may have an elastically deformable shape. For example, a bent portion may be provided. Alternatively, it is also possible to change the design of the tip 320 without the curved portion 321.

Although the probe 400 is assumed to be linear here, it is not limited to this and various probes can be used.

Although the probe card A has been described here, the present invention is not limited to this. For example, electrodes between personal computer boards are connected, and electrodes between IC boards such as IC sockets are electrically connected. It can be used as a board-to-board connecting device.

[0028]

The inter-substrate connecting device of the present invention is provided on the upper substrate having the upper electrode formed on the front surface and the through hole formed on the lower side of the upper electrode, and on the rear surface side of the upper substrate. And a lower substrate having a lower electrode formed on the surface thereof, and a connector interposed between the upper substrate and the lower substrate to connect the upper electrode and the lower electrode. In the connector, the base end portion is inserted into the through hole of the upper substrate and soldered to the upper electrode, while the tip end portion is soldered to the lower electrode.

Therefore, in such an inter-substrate connecting device, since the connectors are soldered to the upper electrode and the lower electrode, the connection between the electrodes can be made highly reliable.

Further, since the base end portion of the connector is formed straight, it is easy to insert and remove it from the upper substrate.

Further, since the tip of the connector has a curved portion, the soldering is peeled off due to the positional displacement between the upper electrode and the lower electrode, thermal displacement at high temperature, etc. The connection with the lower electrode is not broken, and in this respect also, the connection between the upper electrode and the lower electrode can be made highly reliable.

Since the probe card of the present invention uses the inter-substrate connecting device, it is possible to obtain the same effect as the inter-substrate connecting device. Therefore, the effect becomes remarkable in the probe card in which a large number of connectors need to be attached.

[Brief description of drawings]

FIG. 1 is a schematic side view of a probe card according to an embodiment of the present invention.

FIG. 2 is a schematic side view of a connector.

FIG. 3 is a schematic side view of a probe according to another embodiment of the present invention.

FIG. 4 is a schematic side view of a board-to-board connecting device in a conventional example.

[Explanation of symbols]

A probe card 100 upper substrate 110 upper electrode 200 lower substrate 210 Lower electrode 300 connector 400 probe

Claims (4)

[Claims] 1. An upper substrate having an upper electrode formed on a surface thereof and having a through hole formed below the upper electrode, and a lower electrode provided on the back surface of the upper substrate and having a lower electrode on the surface thereof. It has a lower substrate formed, and a connector for interposing the upper electrode and the lower electrode interposed between the upper substrate and the lower substrate, wherein the connector is a base. An inter-board connection device, wherein an end portion is inserted into a through hole of the upper substrate and soldered to the upper electrode, and a tip portion is soldered to the lower electrode. 2. The inter-substrate connecting device according to claim 1, wherein the base end portion of the connector is formed straight. 3. The inter-substrate connecting device according to claim 1 or 2, wherein a curved portion is provided at a tip portion of the connector. 4. The inter-substrate connecting device according to claim 1, 2 or 3, wherein a probe is attached to the back surface of the lower substrate, and the probe electrically connects to the lower electrode. A probe card that is connected.