KR200418776Y1 - Soldering apparatus for Electronic parts - Google Patents

Abstract

The present invention is to move the heating tip which is separated and coupled to the head of the mounting device up and down to mount a connector for coupling with electronic components or electronic components on the connection pad on the PCB or F-PCB, the heating tip is A pair of coupling members are formed to be coupled to the head and are separated by an anode at a predetermined interval, and are coupled to the lower end of the connecting member and the connecting member extending downward from the lower end of the coupling member. It has a horizontal cross section in shape, and is composed of a pressurizing and heating member which generates heat for soldering while simultaneously pressing lead wires formed on four sides of an electronic component or a connector for mounting.

Therefore, the present invention reduces soldering process time by simultaneously soldering and mounting lead wires formed on four sides of a connector for coupling with various small precision electronic components or electronic components to a connection pad on a PCB or an F-PCB. Errors due to bad connection can be eliminated.

PCB, F-PCB, Soldering, Heating Tips, Junction Pads, Electronic Components, Connectors.

Description

Apparatus for mounting electronic components having lead wires on four sides of a printed circuit board {Soldering apparatus for Electronic parts}

1 is a perspective view showing a heating tip according to the present invention.

Figure 2 is a view showing the front and side, the plane and the bottom of the heating tip according to the present invention.

3 is a perspective view showing the mounting of a connector for coupling with an electronic component or an electronic component using a mounting device equipped with a heating tip according to the present invention to a connection pad on a PCB or an F-PCB.

-Explanation of symbols for the main parts of the drawings

10: heating tip 11: coupling member

12 connection member 13 pressure and heating member

14 fastener 15 electronic components

16: lead wire 17: PCB

18: connection pad

The present invention relates to an apparatus for mounting electronic components having lead wires formed on four sides of a printed circuit board. In particular, the present invention is a printed circuit that can be mounted by soldering (soldering) while simultaneously pressing the lead wire formed on the four sides of the connector for coupling with various small precision electronic components or electronic components to the connection pad on the PCB or F-PCB The present invention relates to an apparatus for mounting an electronic component having lead wires formed on four sides of a substrate.

With the development of the semiconductor industry, many kinds of electronic devices using semiconductor chips are becoming smaller and lighter. For example, electronic devices such as mobile phones, PDAs, digital cameras, computers and their peripherals, video and audio devices, camcorders, printers, DVDs, TFT LCDs, satellite equipment, military equipment, medical equipment, etc. have.

Many of these electronic devices are embedded in a PCB (Printed Circuit Board) or F-PCB (Flexible Printed Circuit Board). The F-PCB is an electronic component developed as the electronic device becomes smaller and lighter, and thus it is used as a core component of all electronic devices because it has excellent workability, heat resistance, bending resistance, chemical resistance, and heat resistance.

Such F-PCB can be three-dimensional wiring alone, it is possible to reduce the size and weight of the electronic device. In addition, it has high durability even in repeated bending and enables high-density wiring of 0.2 m / m pitch. In addition, there is no wiring error, good assembly, and high reliability, which enables continuous production.

On the other hand, when mounting circuit components in the F-PCB, the F-PCB mounting apparatus is used. Currently, the mounting apparatus used for the F-PCB uses a single type tip, which is difficult to effectively respond to the F-PCB mounted in the recent electronic devices.

In detail, as described above, in order to perform a high function, an electronic input / output terminal is increased because a circuit component having a more advanced function must be used. Therefore, the current F-PCB mounting apparatus using a single type tip is difficult to cope with this effectively. For example, in order to mount the leads arranged on both sides of the connector, which is a circuit component, to the connection pads of the F-PCB, a single tip requires two soldering processes for mounting, thereby increasing the processing time. In addition, since the soldering process is divided into two times, precise soldering is difficult and an error occurs.

In particular, when soldering the lead wires of electronic components, that is, the electronic components formed on four sides of the input / output terminals using two single tips, the soldering process is longer and the lead wires formed on the four sides are correctly soldered to the F-PCB. There are many more cases of failure.

In the past, a jig that can be soldered to a PCB or an F-PCB while pressing the lead wires formed on two sides has appeared. This also requires two times of rough soldering to connect an electronic component or a connector to a PCB or an F-PCB. Since it can be mounted, the soldering process is lengthened and the error is increased.

The purpose of the present invention is to provide soldering process time by simultaneously soldering and mounting various small precision electronic components or lead wires formed on four sides of the connector for coupling with electronic components to the connection pads on the PCB or F-PCB. It is to reduce errors caused by bad connection.

According to the present invention, an apparatus for mounting an electronic component having lead wires on four sides of a printed circuit board includes a heating tip, which is separated from a head of a mounting apparatus, by moving up and down a PCB or an F-PCB. An apparatus for mounting an electronic component on a printed circuit board capable of mounting an electronic component or a connector for coupling with the electronic component on a connection pad on the upper side, wherein the heating tip has a fastening hole for coupling with the head. A pair of coupling members formed and separated by a positive electrode at a predetermined interval; A connection member extending downward from the lower end of the coupling member; And a pressurizing and heating member coupled to the lower end of the connection member and having a horizontal cross-section of a '□' shape to simultaneously generate pressure for soldering while simultaneously pressing lead wires formed on four sides of the electronic component or connector for mounting. It is characterized by.

In addition, in the present invention, it is preferable that the pressing and heating members have different horizontal cross-sectional shapes depending on the arrangement of the lead wires formed on the sides of the electronic component or the connector to be mounted on the PCB or the F-PCB.

In addition, in the present invention, the pressure and heating member is equipped with a temperature sensor, and adjusts the current supplied to the pressure and heating member so that the temperature value detected by the temperature sensor can maintain the temperature value set for soldering Preferably, the control means is further provided.

Hereinafter, the present invention will be described in detail.

1 is a perspective view showing a heating tip according to the present invention, Figure 2 is a view showing a front and side, a flat surface and a bottom of the heating tip according to the present invention, Figure 3 is a mounting device equipped with a heating tip according to the present invention Is a perspective view showing mounting of a connector for coupling with an electronic component or an electronic component to a connection pad on a PCB or an F-PCB.

The heating tip 10 separated and coupled to the head of the mounting apparatus according to the present invention, as shown in FIGS. 1 and 3, moves up and down together with the head to be mounted on a connection pad on a PCB or an F-PCB. It is for applying heat for soldering while pressing a lead wire formed on four sides of a connector for coupling with the electronic component.

The heating tip 10 has a coupling hole 14 for separating and coupling with the head is formed in a pair of coupling members 11 which are separated by an anode at a predetermined interval, and the coupling member 11 The lower end of the connecting member 12 extends downward, and the lower end of the connecting member 12 is combined with a pressing and heating member 13 having a horizontal cross section of a '□' shape. 13 simultaneously generates pressure for soldering while simultaneously pressing the lead wires 16 formed on the four sides of the electronic component or the connector for mounting.

Here, the pressing and heating member 13 has a horizontal cross-sectional shape depending on the arrangement of the lead wires 16 formed on the sides of the electronic component or connector to be mounted on the PCB or the F-PCB. That is, the user may exchange the heating tip 10 which is separated and coupled to the head of the mounting apparatus with a different shape or shape depending on the type of electronic component or connector to be mounted on the PCB or the F-PCB.

In addition, although the present invention is not shown in the drawings, a separate temperature sensor is mounted on the pressure and heating member 13, and set to be suitable for soldering and temperature values of the pressure and heating member 13 detected by the temperature sensor. By comparing the temperature value and having a control means for adjusting the current supplied to the pressing and heating member 13 according to the result, it is possible to maintain the heat generated from the pressing and heating member 13 at a temperature suitable for soldering have.

Hereinafter, a connector for coupling the electronic component 15 or the electronic component to the connection pad 18 on the PCB 17 or the F-PCB is mounted using the mounting apparatus of the present invention having the heating tip 10. The process is explained with reference to FIG.

First, the connection pads 18 on the PCB 17 or the F-PCB are part of a pattern electrically connected to the circuits on the PCB 17 or the F-PCB, in order for soldering with other electronic components together with the electrical connections. It consists of laminated copper, nickel and lead.

The connector for coupling with the electronic component 15 or the electronic component is placed on the PCB 17 or the F-PCB having the above structure so that the connection pad 18 and the lead wire 16 are electrically connected.

Then, the heating tip 10 is lowered together with the head of the mounting apparatus so that the pressing and heating member 13 of the heating tip 10 can simultaneously press the lead wires 16 formed on the four sides of the electronic component 15 or the connector. To help.

At this time, the lead of the connection pad 18 is melted by the heat generated by the pressurization and heating member 13 supplied with power from an unillustrated power supply, and the electronic component 15 or the lead wire 16 of the connector is buried therein. Then, as soon as the heating tip 10 is raised together with the head, the heat applied to the lead wires 16 and the connection pads 18 is blocked, and then hardened to maintain the connection state.

Therefore, the present invention reduces soldering process time by simultaneously soldering and mounting lead wires formed on four sides of connectors for coupling with various small precision electronic components or electronic components to connection pads on PCB or F-PCB. There is an effect that can eliminate the error caused by bad.

Claims (3)

Printed circuit that mounts a connector for coupling with electronic components on a connection pad on a PCB or F-PCB by moving a heating tip separated up and down to the head of the mounting apparatus. An apparatus for mounting an electronic component on a substrate, The heating tip may include a pair of coupling members in which a coupling ball for coupling with the head is formed and separated by an anode at a predetermined interval; A connection member extending downward from the lower end of the coupling member; And A pressurizing and heating member coupled to the lower end of the connection member and having a horizontal cross-section of a '□' shape to simultaneously generate pressure for soldering while simultaneously pressing lead wires formed on four sides of the electronic component or connector for mounting; An apparatus for mounting an electronic component having a lead wire formed on four sides of a printed circuit board, characterized in that consisting of. The method of claim 1, The pressurizing and heating members may be arranged on four sides of a printed circuit board according to a shape of a horizontal cross section depending on the arrangement of the lead wires formed on the side of the electronic component or the connector 4 to be mounted on the PCB or the F-PCB. An apparatus for mounting electronic components having lead wires. The method of claim 1, The pressure and heating member is equipped with a temperature sensor, and the control means for adjusting the current supplied to the pressing and heating member is further provided so that the temperature value detected by the temperature sensor can maintain the temperature value set for soldering An apparatus for mounting an electronic component having lead wires formed at four sides on a printed circuit board.

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