KR100853624B1 - Method of bonding a connector - Google Patents

Abstract

The probe card for inspecting the semiconductor device and the flat panel display device includes a first substrate structure, a second substrate structure, and a plurality of connectors. The first substrate structure has a plurality of connection holes formed in the inner wall of the conductive film connected to the signal lines therein. The second substrate structure has a contact pad at the top and a plurality of probes in direct contact with the test object at the bottom. One end of the connecting member is fixed to the contact pad of the second substrate structure and the other end is inserted into each of the connection holes of the first substrate structure to be fixed to the conductive layer and bend flexibly. Therefore, it is possible to prevent the second substrate structure from being deformed by the vertical reaction force of the connecting body.

Description

Method of bonding a connector

1 is a cross-sectional view for explaining a probe card according to the prior art.

2 is a cross-sectional view for describing a probe card according to an exemplary embodiment of the present invention.

3 is an enlarged view illustrating an enlarged probe card of FIG. 2.

4A to 4E are cross-sectional views for describing a connector bonding method according to an embodiment of the present invention.

5A to 5E are cross-sectional views for describing a connector bonding method according to another embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100 probe card 110 first substrate structure

112: substrate 114: contact pad

116: probe 118: signal line

120: second substrate structure 122: connection hole

124: conductive film 130: connector

132: first end 134: second end

136: first solder 138; Secondary solder

140: fixing part 141: first reinforcing plate

142: second reinforcement plate 143: third reinforcement plate

144: leaf spring 145: first bolt

146: second bolt 147: third bolt

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector bonding method, and a connector bonding method for bonding a connector constituting a probe card for inspecting a semiconductor device and a flat panel display device to a substrate.

In general, a semiconductor device includes a Fab process for forming an electrical circuit including electrical elements on a silicon wafer used as a semiconductor substrate, and an EDS (electrical) for inspecting electrical characteristics of the semiconductor devices formed in the fab process. die sorting) and a package assembly process for encapsulating and individualizing the semiconductor devices with an epoxy resin.

Among the chips determined to be defective through the EDS process, a repairable chip is repaired and regenerated, and a chip that cannot be repaired is removed before performing the assembly process. Therefore, the EDS process is one of important processes to reduce the assembly cost in the packaging process and improve the yield of the semiconductor chip manufacturing process. An apparatus for performing the EDS process may include a probe card having a plurality of probes contacting a conductive pad formed on an inspection object such as a wafer to apply an electrical signal.

1 is a cross-sectional view for explaining a probe card according to the prior art.

Referring to FIG. 1, the probe card 1 may include a first substrate structure 10 having a connection hole 14 formed on an inner wall of a conductive layer 12 connected to a signal line therein, and a contact pad on an upper portion thereof. 22 and a second substrate structure 20 having a plurality of probes (not shown) in direct contact with an object to be inspected, and connecting the first substrate structure 10 and the second substrate structure 20 to each other. Sieve 30 is included.

The connector 30 is elastically deformable and is fixed to the elastic part 32 which is in point contact with the contact pad 22 and the elastic part 32 and is inserted into the connection hole 14. (34). The connecting member 30 has the elastic portion 32 in contact with the contact pad 22 in a vertical direction. The connector 30 is provided in plural and adjusts the flatness of the first substrate structure 10, the flatness of the second substrate structure 20, and the flatness of the probe and the test object. A height difference occurs between the connectors 30. A constant vertical force is applied to the connectors 30 so that the connectors 30 are in contact with the contact pad 22.

However, since a force in a direction perpendicular to the connectors 30 is applied, the connectors 30 press the second substrate structure 20 to bend the second substrate structure 20. As the technology develops, the size of the first substrate structure 10 and the second substrate structure 20 increases, and the number of the connectors 30 also increases. Accordingly, the force applied to the second substrate structure 20 is also increased to increase the degree of warpage of the second substrate structure 20. In addition, when the end portion of the elastic portion 32 is contaminated or impurities are present, the contact between the connectors 30 and the contact pad 22 is poor. In addition, since the elastic part 32 of the connectors 30 is lengthened for elastic deformation, the resistance of the connectors 30 is increased and electrical performance is deteriorated.

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Embodiments of the present invention provide a connector bonding method for coupling a connector to a substrate in the manufacture of the probe card.

The probe card according to the present invention includes a first substrate structure having a contact pad at an upper portion and a plurality of probes directly contacting a test object at a lower portion thereof, and provided on the first substrate structure and connected to an internal signal line. The second substrate structure having a plurality of connection holes formed in the inner wall and the one end is fixed to the contact pad of the first substrate structure and the other end is inserted into the respective connection holes of the second substrate structure is fixed to the conductive film And a plurality of connectors that are flexibly bent.

According to one embodiment of the invention, the one end and the other end may be fixed to the contact pad and the conductive film, respectively, by soldering.

According to another embodiment of the present invention, the connector may be a flexible cable or a flexible printed circuit board.

According to the present invention as described above, the connecting members are flexibly bent to prevent the first substrate structure from being deformed by the force in the vertical direction. In addition, one end and the other end of the connectors are fixed with solder, thereby preventing contact failure. In addition, since the elastic deformation of the connector is not required, the length of the connector can be reduced, thereby reducing the resistance of the connectors and improving electrical performance.

The connector bonding method according to the present invention fixes a plurality of connectors with a multilayer guide plate. Bonding members fixed to the guide plate are bonded to the upper surface of the first substrate structure having a plurality of probes on the lower surface. The connectors are bonded to connection holes formed in the second substrate structure.

According to an embodiment of the present invention, the process of bonding the connectors to the upper surface of the first substrate structure and the process of bonding the connectors to the connection holes of the second substrate structure may be performed at the same time.

According to another embodiment of the present invention, the process of bonding the connectors to the upper surface of the first substrate structure and the process of bonding the connectors to the connection holes of the second substrate structure may be performed sequentially.

According to another embodiment of the present invention, after the bonding of the connectors, the guide plate may be removed.

According to another embodiment of the present invention, the fixing process of the connecting member is provided with the guide plate having a plurality of through holes, and after inserting the connecting bodies into the through holes, respectively, one of the guide plates It is made by sliding it.

According to another embodiment of the present invention, the bonding of the connectors to the first substrate structure may be performed by applying a plurality of solders to an upper surface of the first substrate structure and fixing the solders to the guide plate. By contacting the connectors, heating the solders to reflow the solders, and then cooling the reflowed solders. The solders may be applied onto contact pads formed on the top surface of the first substrate structure, respectively.

According to another embodiment of the present invention, the process of bonding the connectors to the connection holes of the second substrate structure inserts the connectors fixed to the guide plate in the connection holes of the second substrate structure, respectively And applying a plurality of solders to the connection holes of the second substrate structure, heating the solders to reflow the solders, and cooling the reflowed solders.

According to another embodiment of the present invention, the connector bonding method may further include cutting the connectors extending from the bonding sites of the connection holes.

Another connector bonding method of the present invention secures a plurality of flexible connectors with multilayer guide plates. Connection holes fixed to the guide plate are inserted into the second substrate structure to contact the upper surface of the first substrate structure having the plurality of probes on the lower surface. The connectors fixed to the guide plate are bonded to the upper surface of the first substrate structure and the connection holes of the second substrate structure. The bonding of the connector is completed by removing the guide plate.

According to an embodiment of the present invention, the connecting plates may be bonded to the first substrate structure and the second substrate structure by using the guide plate. Thus, the connectors can be bonded exactly once at a predetermined position of the substrate structures.

Hereinafter, a probe card and a connector bonding method according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

2 is a cross-sectional view illustrating a probe card according to an exemplary embodiment of the present invention, and FIG. 3 is an enlarged view of an enlarged view of the probe card of FIG. 2.

2 and 3, the probe card 100 may include a first substrate structure 110, a second substrate structure 120, a connector 130, a fixing part 140, and a flatness adjusting member 150. Can be mentioned.

The first substrate structure 110 includes a substrate 112, a contact pad 114, a probe 116 and a signal line 118.

The substrate 112 has a substantially plate shape and has a smaller size than the second substrate structure 120.

The contact pads 114 are provided in plural on the upper surface of the substrate 112. The contact pad 114 is made of a conductive material.

The probe 116 protrudes from the bottom surface of the substrate 112 and is provided with a plurality. The probe 116 may be manufactured separately from the substrate 112 and attached to the substrate 112 or may be integrally formed with the substrate 112. Although the probe 116 is shown cantilevered in the above, the probe 116 may be vertical.

The signal line 118 is formed in the substrate 112 and electrically connects the contact pad 114 and the probe 116 to each other. In detail, the signal line 118 includes a multi-layer wire and a via connecting the multi-layer wire.

Meanwhile, a capacitor (not shown) may be connected to the signal line 118. The capacitor may be provided to be exposed to the upper or lower surface of the substrate 112 or may be provided inside the substrate 112. The capacitor may suppress noise or distorted signals included in the electrical signal passing through the signal line 118 by grounding them to ground. In addition, the capacitor supplies insufficient power when the input object is insufficient in the inspection object.

The second substrate structure 120 is provided on the first substrate structure 110. The second substrate structure 120 has a signal line (not shown) therein, and a connection hole 122 connected to the signal line penetrates up and down. A conductive film 124 is formed on the inner wall of the connection hole 122. The conductive film 124 is made of a conductive material. Copper may be mentioned as an example of the said conductive material. The signal line is electrically connected to a separate test device (not shown).

The connector 130 electrically connects the first substrate structure 110 and the second substrate structure 120. Specifically, the connector 130 electrically connects the conductive film 124 of the connection hole 122 and the contact pad 114. The connector 130 includes a conductive material. Examples of the conductive material include metals.

One end 132 of the connector 130 is fixed to the contact pad 114 of the first substrate structure 110, and the other end 134 is connected to the connection hole 122 of the second substrate structure 120. Inserted and fixed. The connector 130 is easily bent by a force applied including a flexible material. Examples of the connector 130 may include a flexible cable or a flexible printed circuit board.

One end 134 of the connector 130 is bonded by the contact pad 114 and the first solder 136. The other end 136 of the connector 130 is bonded by the conductive layer 124 and the second solder 138. Thus, the connector 130 is fixed to the first substrate structure 110 and the second substrate structure 120.

The connector 130 is bendable and has a length greater than a distance between the first substrate structure 110 and the second substrate structure 120, and thus, the first substrate structure 110 and the second substrate. Even when the structures 120 are not parallel to each other or the first substrate structure 110 and the second substrate structure 120 are moved, the connecting member 130 has a force perpendicular to the first substrate structure 110. It can be easily deformed without adding. Therefore, it is possible to prevent the first substrate structure 110 from being deformed by the force in the vertical direction. In addition, since the connector 130 is fixed to the contact pad 114 and the conductive layer 124, contact failure may be prevented. In addition, since the elastic deformation of the connector 130 is not required, the length of the connector 130 may be relatively reduced, thereby reducing the resistance of the connector 130 and improving electrical performance.

4A to 4E are cross-sectional views for describing a connector bonding method of a probe card according to an exemplary embodiment.

Referring to FIG. 4A, a multilayer guide plate 500 having a plurality of through holes 510 is provided. Each guide plate 500 forms a plate having the through-hole 510 by coupling, and can be separated. For example, three guide plates 500 are preferably stacked in order to stably fix the connecting bodies of the probe card. As another example, two or four or more guide plates 500 may be stacked. The through holes 510 are substantially equal to the distance between the connecting bodies in the probe card. The through holes 510 of each guide plate 500 are arranged to communicate with each other at the same position.

A plurality of connectors 130 are inserted into the through holes 510 of the guide plates 500. The connectors 130 each have a line shape. For example, the connectors 130 may be flexible printed circuit boards having a flexible cable or line shape. The connecting members 130 extend sufficiently from the upper and lower surfaces of the guide plate 500.

Thereafter, one of the guide plates 500 slides. According to an embodiment of the present invention, as shown in FIG. 4A, the guide plate 500 in the center of the guide plates 500 may slide. According to another exemplary embodiment of the present invention, the uppermost or lowermost guide plate 500 of the guide plates 500 may slide. In this case, the remaining guide plates 500 are fixed. The sliding guide plate 500 contacts one side of the connector 130 to apply a force to the connector 130 in the sliding direction of the guide plate 500. The remaining guide plate 500 contacts the other side of the connecting body 130 opposite to the one side and exerts a force on the connecting body 130 in a direction opposite to the sliding direction of the guide plate 500. Thus, the guide plates 500 fix the connection body 130.

Referring to FIG. 4B, a plurality of first solders 136 are applied onto the plurality of contact pads 114 formed on the upper surface of the first substrate structure 110. The first solders 136 are applied in a paste state. The first substrate structure 110 has a plurality of probes 116 on the bottom surface. The spacing of the contact pads 114 is equal to the spacing of the through holes 510 of the guide plates 500. According to an embodiment of the present invention, the first solders 136 are applied using a mask pattern or an auto dispenser.

The contact pads 114 of the first substrate structure 110 and the connectors 130 fixed to the guide plates 500 are aligned to be aligned on the same line. In this state, the guide plates 500 are lowered to contact one end 132 of the connectors 130 and the first solders 136 on the contact pad 114. Next, the first solders 136 are heated and reflowed. Thereafter, the first solders 136 are cooled. For example, the first solders 136 may be naturally cooled. As another example, a cooling gas may be injected into the first solders 136 to cool the first solders 136. Accordingly, one end 132 of the connectors 130 is bonded to the contact pads 114 by the first solders 136.

Referring to FIG. 4C, the connection holes 122 of the second substrate structure 120 and the connectors 130 fixed to the guide plates 500 are aligned with each other. In this state, the second substrate structure 120 is lowered to insert the other ends 134 of the connectors 130 into the connection holes 122 of the second substrate structure 120. In this case, the other ends 134 of the connectors 130 are inserted to extend from the top surface of the second substrate structure 120.

Thereafter, a plurality of second solders 138 are applied to the connection holes 122, respectively. The second solders 138 may be applied to any portion of the top, center, or bottom of the connection holes 122. The second solders 138 are applied in a paste state. The second solders 138 are heated to reflow, and then cooled. Accordingly, the other ends 138 of the connectors 130 are bonded to the connection holes 122 by the second solders 138.

Referring to FIG. 4D, the sliding guide plate 500 of the guide plates 500 is returned to its original position. Thereafter, each of the guide plates 500 is separated and removed from the connectors 130.

Referring to FIG. 4E, portions of the connectors 130 extending upwardly beyond the second solders 138 are cut. Thus, bonding of the connectors 130 is completed.

In the exemplary embodiment of the present invention, although the connectors 130 are bonded to the first substrate structure 110 and then bonded to the second substrate structure 120, another embodiment of the present invention is illustrated. According to the present invention, the connectors 130 may be bonded to the second substrate structure 120 and then bonded to the first substrate structure 130. According to another embodiment of the present invention, the connectors 130 may be simultaneously bonded to the first substrate structure 110 and the second substrate structure 120.

5A to 5E are cross-sectional views illustrating a connector bonding method of a probe card according to an exemplary embodiment.

Referring to FIG. 5A, a plurality of connectors 130 are fixed by the multilayer guide plate 500. A description of the process of fixing the connectors 130 using the multilayer guide plate 500 is omitted since it is substantially the same as illustrated and described with reference to FIG. 4A.

Referring to FIG. 5B, connecting bodies 130 fixed to the guide plates 500, connection holes 122 of the second substrate structure 120, and contact pads of the first substrate structure 110 ( 114) on the same line. In this state, the guide plates 500 are lowered so that one end 132 of the connectors 130 contacts the contact pads 114 through the connection holes 122.

Referring to FIG. 5C, a first solder 136 is coated on contact pads 114 of the first substrate structure 110 to which one end 132 of the connectors 130 contacts. The one end 132 of the field 130 is bonded. A detailed description of the process of bonding one end 132 of the connectors 130 is substantially the same as that described with reference to FIG. 4B and thus will be omitted.

In addition, the second solder 138 is applied to the connection holes 122 of the second substrate structure 120 to bond the other ends 134 of the connectors 130 to the connection holes 122. . A detailed description of the process of bonding the other ends 134 of the connectors 130 is substantially the same as that described with reference to FIG. 4C and thus will be omitted.

According to the exemplary embodiment of the present invention, the bonding process of one end 132 of the connectors 130 and the bonding process of the other end 134 may be sequentially performed. That is, after performing the bonding process for one end 132 of the connectors 130, the bonding process for the other end 134 of the connectors 130, or the connectors 130 After performing the bonding process with respect to the other end 134, the bonding process with respect to one end 132 of the connectors 130 may be performed.

According to another embodiment of the present invention, the bonding process of one end 132 of the connecting body 130 and the bonding process of the other end 134 may be performed at the same time.

Referring to FIG. 5D, the sliding guide plate 500 of the guide plates 500 is returned to its original position. Thereafter, each of the guide plates 500 is removed or moved upwards to remove them from the connectors 130.

Referring to FIG. 5E, portions of the connectors 130 extending upward through the second solders 138 are cut. Thus, bonding of the connectors 130 is completed.

The connector contact method as described above may bond the plurality of connectors 130 to the first substrate structure 110 or to the second substrate structure 120 at the same time. In addition, the connector contact method accurately bonds the connectors 130 to the contact pads 114 of the first substrate structure 110 and the connection holes 122 of the second substrate structure 120. can do. Therefore, the connector bonding method can improve the productivity and reliability of the connector bonding process.

As described above, according to embodiments of the present invention, the connectors are flexibly bent. Therefore, the connectors do not exert a force in the vertical direction, thereby preventing the first substrate structure from being deformed by the force in the vertical direction. In addition, since the connector is fixed with solder to the contact pads of the first substrate structure and the connection holes of the second substrate structure, contact failure may be prevented. In addition, since the elastic deformation of the connector is not required, the length of the connector can be reduced, thereby reducing the resistance of the connectors and improving electrical performance. Therefore, the reliability of the probe card can be improved.

The connectors may be bonded to the contact pads of the first substrate structure and the connection holes of the second substrate structure at the same time and at the correct positions. Therefore, productivity and reliability of the connector bonding process can be improved.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

Claims (15)

delete delete delete Securing a plurality of connectors with a multilayer guide plate; Bonding the connectors fixed to the guide plate to an upper surface of the first substrate structure having a plurality of probes on a lower surface; Bonding the connectors to connection holes formed in a second substrate structure; And After bonding the linking elements, removing the guide plate . 5. The connector bonding according to claim 4, wherein the bonding of the connectors to the upper surface of the first substrate structure and the bonding of the connectors to the connection holes of the second substrate structure are performed simultaneously. Way. 5. The connector of claim 4, wherein the bonding of the connectors to the upper surface of the first substrate structure and the bonding of the connectors to the connection holes of the second substrate structure are sequentially performed. Bonding method. delete The method of claim 4, wherein the fixing of the connecting members comprises: Providing the guide plates having a plurality of through holes; Inserting the connecting bodies into the through holes, respectively; And Sliding one of the guide plates. The method of claim 4, wherein bonding the connectors to the first substrate structure comprises: Applying a plurality of solders to an upper surface of the first substrate structure; Contacting the solders and the connectors fixed to the guide plate; Heating the solders to reflow the solders; And Cooling the reflowed solders. 10. The method of claim 9, wherein the solders are each applied onto contact pads formed on the top surface of the first substrate structure. The method of claim 4, wherein the bonding of the connectors to the connection holes of the second substrate structure comprises: Inserting connectors fixed to the guide plate into connection holes of the second substrate structure, respectively; Applying a plurality of solders to the connection holes of the second substrate structure; Heating the solders to reflow the solders; And Cooling the reflowed solders. The connector bonding method of claim 4, further comprising cutting the connectors extending from the bonding sites of the connection holes. Securing a plurality of flexible connectors with a multilayer guide plate; Inserting connectors fixed to the guide plate into connection holes formed in the second substrate structure to contact the upper surface of the first substrate structure having the plurality of probes on the lower surface; Bonding the connectors fixed to the guide plate to the upper surface of the first substrate structure and the connection holes of the second substrate structure; And And after removing the guide plates, bonding the connectors. Bonding one end of each of the connectors to the top surface of the first substrate structure having a plurality of probes on the bottom surface; Inserting the one end-bonded connectors so that the other end protrudes through the connection holes formed in the second substrate structure; Bonding the connectors to conductive layers formed in the connection holes of the second substrate structure; And And cutting the other end portions of the connectors protruding from the connection holes. 15. The method of claim 14, further comprising: securing the connectors with a multilayer guide plate prior to bonding one end of each of the connectors to the top surface of the first substrate structure; And And removing the guide plate after bonding the connectors to the conductive film formed in the connection holes of the second substrate structure.

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