TWI363412B - - Google Patents

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Publication number
TWI363412B
TWI363412B TW096138590A TW96138590A TWI363412B TW I363412 B TWI363412 B TW I363412B TW 096138590 A TW096138590 A TW 096138590A TW 96138590 A TW96138590 A TW 96138590A TW I363412 B TWI363412 B TW I363412B
Authority
TW
Taiwan
Prior art keywords
semiconductor element
semiconductor device
semiconductor
layer
substrate
Prior art date
Application number
TW096138590A
Other languages
English (en)
Chinese (zh)
Other versions
TW200832659A (en
Inventor
Hosono Masayuki
Shibata Akiji
Inaba Kimio
Original Assignee
Hitachi Cable
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable filed Critical Hitachi Cable
Publication of TW200832659A publication Critical patent/TW200832659A/zh
Application granted granted Critical
Publication of TWI363412B publication Critical patent/TWI363412B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/291—Configurations of stacked chips characterised by containers, encapsulations, or other housings for the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips

Landscapes

  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW096138590A 2006-11-17 2007-10-16 Semiconductor device, stacked semiconductor device and interposer substrate TW200832659A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006311850A JP5028968B2 (ja) 2006-11-17 2006-11-17 半導体装置、積層型半導体装置およびインターポーザ基板

Publications (2)

Publication Number Publication Date
TW200832659A TW200832659A (en) 2008-08-01
TWI363412B true TWI363412B (https=) 2012-05-01

Family

ID=39416112

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096138590A TW200832659A (en) 2006-11-17 2007-10-16 Semiconductor device, stacked semiconductor device and interposer substrate

Country Status (5)

Country Link
US (2) US20080116559A1 (https=)
JP (1) JP5028968B2 (https=)
KR (1) KR100892203B1 (https=)
CN (3) CN101604678B (https=)
TW (1) TW200832659A (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5671681B2 (ja) * 2009-03-05 2015-02-18 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 積層型半導体装置
US8363418B2 (en) * 2011-04-18 2013-01-29 Morgan/Weiss Technologies Inc. Above motherboard interposer with peripheral circuits
US11309250B2 (en) * 2018-01-17 2022-04-19 Shindengen Electric Manufacturing Co., Ltd. Electronic module
KR102743244B1 (ko) * 2019-02-12 2024-12-18 삼성전자주식회사 인쇄 회로 기판 및 이를 포함하는 반도체 패키지
JP7135999B2 (ja) * 2019-05-13 2022-09-13 株式会社オートネットワーク技術研究所 配線基板
JP7156230B2 (ja) * 2019-10-02 2022-10-19 株式会社デンソー 半導体モジュール
IT202000001819A1 (it) * 2020-01-30 2021-07-30 St Microelectronics Srl Circuito integrato e dispositivo elettronico comprendente una pluralita' di circuiti integrati accoppiati elettricamente tramite un segnale di sincronizzazione
CN112588222B (zh) * 2020-11-25 2022-02-18 浙江大学 声表面波调控孔隙率与排布的多孔聚合物制备装置与方法
CN121040214A (zh) * 2023-05-09 2025-11-28 索尼集团公司 中继部件以及电子设备

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6111306A (en) * 1993-12-06 2000-08-29 Fujitsu Limited Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
JPH07201912A (ja) * 1993-12-28 1995-08-04 Hitachi Cable Ltd フィルムキャリア方式半導体装置及びフィルムキャリア
JPH0831868A (ja) * 1994-07-21 1996-02-02 Hitachi Cable Ltd Ｂｇａ型半導体装置
US5747874A (en) * 1994-09-20 1998-05-05 Fujitsu Limited Semiconductor device, base member for semiconductor device and semiconductor device unit
JP2755252B2 (ja) * 1996-05-30 1998-05-20 日本電気株式会社 半導体装置用パッケージ及び半導体装置
JP3195236B2 (ja) * 1996-05-30 2001-08-06 株式会社日立製作所 接着フィルムを有する配線テープ，半導体装置及び製造方法
US6617193B1 (en) * 1997-04-30 2003-09-09 Hitachi Chemical Company, Ltd. Semiconductor device, semiconductor device substrate, and methods of fabricating the same
JP2924854B2 (ja) * 1997-05-20 1999-07-26 日本電気株式会社 半導体装置、その製造方法
JP3639088B2 (ja) * 1997-06-06 2005-04-13 株式会社ルネサステクノロジ 半導体装置及び配線テープ
US6300679B1 (en) * 1998-06-01 2001-10-09 Semiconductor Components Industries, Llc Flexible substrate for packaging a semiconductor component
JP2000077563A (ja) * 1998-08-31 2000-03-14 Sharp Corp 半導体装置およびその製造方法
JP2000260792A (ja) * 1999-03-10 2000-09-22 Toshiba Corp 半導体装置
JP3180800B2 (ja) 1999-04-08 2001-06-25 カシオ計算機株式会社 半導体装置及びその製造方法
JP3722209B2 (ja) * 2000-09-05 2005-11-30 セイコーエプソン株式会社 半導体装置
JP2002289741A (ja) * 2001-03-23 2002-10-04 Nec Kyushu Ltd 半導体装置
JP4103342B2 (ja) * 2001-05-22 2008-06-18 日立電線株式会社 半導体装置の製造方法
JP3705235B2 (ja) * 2002-04-16 2005-10-12 日立電線株式会社 半導体装置の製造方法
JP4225036B2 (ja) 2002-11-20 2009-02-18 日本電気株式会社 半導体パッケージ及び積層型半導体パッケージ
JP3900093B2 (ja) * 2003-03-11 2007-04-04 日立電線株式会社 モールド金型及びそれを用いた半導体装置の製造方法
TW200514484A (en) * 2003-10-08 2005-04-16 Chung-Cheng Wang Substrate for electrical device and methods of fabricating the same
JP4291209B2 (ja) * 2004-05-20 2009-07-08 エルピーダメモリ株式会社 半導体装置の製造方法
US7154175B2 (en) * 2004-06-21 2006-12-26 Intel Corporation Ground plane for integrated circuit package
KR100715316B1 (ko) * 2006-02-13 2007-05-08 삼성전자주식회사 유연성 회로 기판을 이용하는 반도체 칩 패키지 실장 구조

Also Published As

Publication number Publication date
JP5028968B2 (ja) 2012-09-19
CN101604678B (zh) 2012-02-22
TW200832659A (en) 2008-08-01
CN101604681B (zh) 2012-03-14
US20080116559A1 (en) 2008-05-22
US20100171210A1 (en) 2010-07-08
JP2008130678A (ja) 2008-06-05
KR100892203B1 (ko) 2009-04-07
CN101183670A (zh) 2008-05-21
CN101183670B (zh) 2011-06-22
CN101604678A (zh) 2009-12-16
CN101604681A (zh) 2009-12-16
KR20080045079A (ko) 2008-05-22

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Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees