IT202000001819A1 - Circuito integrato e dispositivo elettronico comprendente una pluralita' di circuiti integrati accoppiati elettricamente tramite un segnale di sincronizzazione - Google Patents

Circuito integrato e dispositivo elettronico comprendente una pluralita' di circuiti integrati accoppiati elettricamente tramite un segnale di sincronizzazione

Info

Publication number
IT202000001819A1
IT202000001819A1 IT102020000001819A IT202000001819A IT202000001819A1 IT 202000001819 A1 IT202000001819 A1 IT 202000001819A1 IT 102020000001819 A IT102020000001819 A IT 102020000001819A IT 202000001819 A IT202000001819 A IT 202000001819A IT 202000001819 A1 IT202000001819 A1 IT 202000001819A1
Authority
IT
Italy
Prior art keywords
electronic device
synchronization signal
device including
electrically coupled
coupled via
Prior art date
Application number
IT102020000001819A
Other languages
English (en)
Inventor
Angelo Scuderi
Nicola Marinelli
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to IT102020000001819A priority Critical patent/IT202000001819A1/it
Priority to EP21153537.2A priority patent/EP3869541A3/en
Priority to US17/162,595 priority patent/US11742311B2/en
Priority to CN202110139579.XA priority patent/CN113206069A/zh
Priority to CN202120282004.9U priority patent/CN215600361U/zh
Publication of IT202000001819A1 publication Critical patent/IT202000001819A1/it
Priority to US18/334,280 priority patent/US20230335524A1/en

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    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
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    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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    • H01L2924/19033—Structure including wave guides being a coplanar line type
IT102020000001819A 2020-01-30 2020-01-30 Circuito integrato e dispositivo elettronico comprendente una pluralita' di circuiti integrati accoppiati elettricamente tramite un segnale di sincronizzazione IT202000001819A1 (it)

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EP21153537.2A EP3869541A3 (en) 2020-01-30 2021-01-26 Integrated circuit and electronic device comprising a plurality of integrated circuits electrically coupled through a synchronization signal
US17/162,595 US11742311B2 (en) 2020-01-30 2021-01-29 Integrated circuit and electronic device comprising a plurality of integrated circuits electrically coupled through a synchronization signal
CN202110139579.XA CN113206069A (zh) 2020-01-30 2021-02-01 集成电路和包括多个集成电路的电子设备
CN202120282004.9U CN215600361U (zh) 2020-01-30 2021-02-01 集成电路封装件和电子设备
US18/334,280 US20230335524A1 (en) 2020-01-30 2023-06-13 Integrated circuit and electronic device comprising a plurality of integrated circuits electrically coupled through a synchronization signal

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IT202000001822A1 (it) * 2020-01-30 2021-07-30 St Microelectronics Srl Circuito integrato e dispositivo elettronico comprendente una pluralita' di circuiti integrati accoppiati elettricamente tramite un segnale di sincronizzazione instradato attraverso il circuito integrato

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