TWI335348B - - Google Patents

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Publication number
TWI335348B
TWI335348B TW093118657A TW93118657A TWI335348B TW I335348 B TWI335348 B TW I335348B TW 093118657 A TW093118657 A TW 093118657A TW 93118657 A TW93118657 A TW 93118657A TW I335348 B TWI335348 B TW I335348B
Authority
TW
Taiwan
Prior art keywords
rubber composition
composition
electrode circuit
component
electrode
Prior art date
Application number
TW093118657A
Other languages
English (en)
Chinese (zh)
Other versions
TW200513498A (en
Inventor
Tsutomu Kashiwagi
Toshio Shiobara
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200513498A publication Critical patent/TW200513498A/zh
Application granted granted Critical
Publication of TWI335348B publication Critical patent/TWI335348B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
    • B01J23/40—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals of the platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
TW093118657A 2003-10-14 2004-06-25 Silicon rubber composition for electrode circuit protection, electrode circuit protection material and electric, electronic parts TW200513498A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003354122A JP4645793B2 (ja) 2003-10-14 2003-10-14 電極回路保護用シリコーンゴム組成物、電極回路保護材及び電気・電子部品

Publications (2)

Publication Number Publication Date
TW200513498A TW200513498A (en) 2005-04-16
TWI335348B true TWI335348B (ja) 2011-01-01

Family

ID=34612202

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118657A TW200513498A (en) 2003-10-14 2004-06-25 Silicon rubber composition for electrode circuit protection, electrode circuit protection material and electric, electronic parts

Country Status (4)

Country Link
JP (1) JP4645793B2 (ja)
KR (1) KR101092092B1 (ja)
CN (1) CN100513485C (ja)
TW (1) TW200513498A (ja)

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JP2006206816A (ja) * 2005-01-31 2006-08-10 Ge Toshiba Silicones Co Ltd 室温硬化性ポリオルガノシロキサン組成物
JP2006330277A (ja) * 2005-05-25 2006-12-07 Fuji Xerox Co Ltd 静電潜像現像剤用キャリア及びその製造方法、静電潜像現像剤、画像形成装置
JP2007161999A (ja) * 2005-11-17 2007-06-28 Shin Etsu Chem Co Ltd 圧縮永久歪特性に優れた硬化物を与えるｃｉｐｇ用付加硬化型シリコーン組成物及び該組成物の硬化物の圧縮永久歪低減方法
JP5015476B2 (ja) * 2006-03-01 2012-08-29 東レ・ダウコーニング株式会社 電極・電気回路の保護剤組成物
US8754181B2 (en) * 2008-02-07 2014-06-17 Nippon Steel & Sumikin Chemical Co., Ltd. Silicone resin, process for producing the same, and curable resin composition comprising the same
JP5948240B2 (ja) * 2010-04-22 2016-07-06 日本化薬株式会社 銀変色防止剤、銀変色防止樹脂組成物、銀変色防止方法、及びこれを使用した発光ダイオード
JP5676785B2 (ja) * 2012-02-10 2015-02-25 三菱樹脂株式会社 カバーレイフィルム、発光素子搭載用基板、及び光源装置
DE102014200492A1 (de) * 2014-01-14 2015-07-16 Robert Bosch Gmbh Schaltungsträger mit einer Silikonpolymer-Beschichtung
US20160230044A1 (en) * 2015-02-10 2016-08-11 International Business Machines Corporation Modified Conformal Coatings With Decreased Sulfur Solubility
JP6637674B2 (ja) * 2015-04-30 2020-01-29 信越化学工業株式会社 プリント配線板、プリント配線板の製造方法、及び半導体装置
CN105489418B (zh) * 2015-12-31 2017-09-01 宝鸡市晨光真空电器有限责任公司 用于户外高压真空断路器的固封式极柱模块的固封工艺
CN116134104A (zh) * 2020-07-22 2023-05-16 信越化学工业株式会社 抗硫化涂布材料、抗硫化涂布材料的固化物及电子器件
JP2022034356A (ja) * 2020-08-18 2022-03-03 信越化学工業株式会社 ゼオライト含有シリコーンゴム組成物及びその製造方法

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JP3868272B2 (ja) * 2001-11-15 2007-01-17 電気化学工業株式会社 球状無機質粉末およびこれを充填した樹脂組成物
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Also Published As

Publication number Publication date
JP2005120155A (ja) 2005-05-12
JP4645793B2 (ja) 2011-03-09
CN100513485C (zh) 2009-07-15
TW200513498A (en) 2005-04-16
KR20050036749A (ko) 2005-04-20
KR101092092B1 (ko) 2011-12-12
CN1621448A (zh) 2005-06-01

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