TWI332686B - - Google Patents

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Publication number
TWI332686B
TWI332686B TW096120004A TW96120004A TWI332686B TW I332686 B TWI332686 B TW I332686B TW 096120004 A TW096120004 A TW 096120004A TW 96120004 A TW96120004 A TW 96120004A TW I332686 B TWI332686 B TW I332686B
Authority
TW
Taiwan
Prior art keywords
substrate
processing
processing apparatus
processing chamber
processing liquid
Prior art date
Application number
TW096120004A
Other languages
English (en)
Chinese (zh)
Other versions
TW200814183A (en
Inventor
Akira Harada
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200814183A publication Critical patent/TW200814183A/zh
Application granted granted Critical
Publication of TWI332686B publication Critical patent/TWI332686B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW096120004A 2006-06-22 2007-06-04 Substrate processing apparatus TW200814183A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006172570A JP4763527B2 (ja) 2006-06-22 2006-06-22 基板処理装置

Publications (2)

Publication Number Publication Date
TW200814183A TW200814183A (en) 2008-03-16
TWI332686B true TWI332686B (ko) 2010-11-01

Family

ID=38991946

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096120004A TW200814183A (en) 2006-06-22 2007-06-04 Substrate processing apparatus

Country Status (4)

Country Link
JP (1) JP4763527B2 (ko)
KR (1) KR100863665B1 (ko)
CN (1) CN100565792C (ko)
TW (1) TW200814183A (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5415981B2 (ja) * 2010-02-09 2014-02-12 三菱電機ビルテクノサービス株式会社 フィルタ洗浄装置及びフィルタ洗浄方法
CN103631100A (zh) * 2012-08-29 2014-03-12 无锡华润上华半导体有限公司 晶圆显影装置及方法
CN105044943B (zh) * 2015-08-25 2018-02-23 深圳市华星光电技术有限公司 蚀刻装置
CN105304535B (zh) * 2015-11-21 2018-09-18 武汉华星光电技术有限公司 显示面板制造系统
JP6789026B2 (ja) * 2016-07-28 2020-11-25 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
CN114229474B (zh) * 2016-08-08 2023-05-05 株式会社尼康 基板处理装置
CN107552461A (zh) * 2017-10-16 2018-01-09 浙江德立自动化装备股份有限公司 一种抽油烟机工件喷粉前的纯水清洗装置
JP7060415B2 (ja) * 2018-03-12 2022-04-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7148289B2 (ja) * 2018-06-20 2022-10-05 芝浦メカトロニクス株式会社 基板検出装置及び基板処理装置
JP6857682B2 (ja) * 2019-03-29 2021-04-14 芝浦メカトロニクス株式会社 基板処理装置
JP2023154863A (ja) * 2022-04-08 2023-10-20 株式会社荏原製作所 基板洗浄装置、基板処理装置、基板洗浄方法およびプログラム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH087431B2 (ja) * 1988-12-28 1996-01-29 富士写真フイルム株式会社 自動現像装置
TW309503B (ko) * 1995-06-27 1997-07-01 Tokyo Electron Co Ltd
JPH1144877A (ja) * 1997-07-24 1999-02-16 Nec Kagoshima Ltd 基板洗浄装置
JP4213905B2 (ja) * 2002-04-12 2009-01-28 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP4201324B2 (ja) * 2003-02-06 2008-12-24 澁谷工業株式会社 洗浄装置
JP4372536B2 (ja) * 2003-12-26 2009-11-25 大日本スクリーン製造株式会社 基板洗浄装置および基板処理システム

Also Published As

Publication number Publication date
CN100565792C (zh) 2009-12-02
KR100863665B1 (ko) 2008-10-15
JP4763527B2 (ja) 2011-08-31
JP2008004747A (ja) 2008-01-10
TW200814183A (en) 2008-03-16
KR20070121598A (ko) 2007-12-27
CN101093789A (zh) 2007-12-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees