TWI332686B - - Google Patents
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- TWI332686B TWI332686B TW096120004A TW96120004A TWI332686B TW I332686 B TWI332686 B TW I332686B TW 096120004 A TW096120004 A TW 096120004A TW 96120004 A TW96120004 A TW 96120004A TW I332686 B TWI332686 B TW I332686B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Manufacturing Optical Record Carriers (AREA)
Description
九、發明說明： 【發明所屬之技術領域】 本發明關於一種向半導體晶圓、光罩用玻璃基板、液晶 顯示面板用玻璃基板、光盤用基板等基板上供給餘刻液或 凊洗液等各種處理液’從而對基板實施特定處理之基板處 理裝置。 【先前技術】 作為如上所述之基板處理裝置，自先前以來，眾所周知 有以如下方式構成之基板處理裝置，即，具有複數個處理 室、例如剝離處理室、清洗處理室以及乾燥處理室，而 且’藉由滚靖式輸送機之驅動搬送形成有薄膜之矩形玻璃 基板之同時，對該基板依次實施剝離處理、清洗處理以及 乾燥處理（例如專利文獻丨）。於該裝置之剝離處理室内之上 游端以及下游端，配置有檢測有無基板之感測器，藉由該 感測器檢測到基板之後，若於預先設定之定時器時間内基 板沒有通過，亦即，即使超過定時器時間，亦繼續處於由 該感測器檢測到基板之狀態時，執行特定之處理，例如視 I* 為發生了搬送不良而發出警告以使裝置停止等。 [專利文獻]日本專利特開2001-57355號公報 【發明内容】 [發明所欲解決之問題] 於如上所述之先前裝置中’即使於感測器檢測到基板之 後立即使基板停止，亦會發生響應延遲現象，即，經過了 定時器時間而仍不執行異常處理。因此，當因搬送故障而 121458.doc 1332686 使一張基板横跨停止Μ裁器（卸载器）與處理室之間之情 料’於執行異常處理之前，會向其局部(基板之前端部 幻供給處理液，從而成為基板處理不良之原因，亦會不 必要地消耗處理液。又， 併、至基板上之處理液流過基板 表面：向裝載器(卸載器)一側漏出，藉此會導致設備故 障。當-張基板橫跨複數個處理室而停止時，由於處理液 會漏到相鄰&置之處理室中’因此也會發生同樣之問題。 本發月係雲於上述情況開發而成者，且係、為了避免如上 所述之響應延遲所導致之不良而提出纟，其第—目的在於 避免基板之處理不良之同時防止處理液之不必要消耗， 又’、第一目的在於防止處理液經過基板而向處理室外漏 出。 [解決問題之技術手段] 為了解決上述課題，本發明提供一種基板處理裝置，其 包括處理至，該處理室包括將基板以水平或傾斜之姿勢搬 送之搬送機構及處理液供給機構’且對由上述搬送機構搬 送之基板供給處理液，藉此對該基板實施特定之處理，上 述基板處理裝置包括：檢測機構，其配設於上述處理室之 基板搬入用以及搬出用之開口部之至少一側開口部附近， 並對基板之搬送狀態進行檢測；判定機構，其基於上述檢 測機構之檢測結果，判定上述基板是否停滯；以及控制機 構’其於判定上述基板停滯時，控制上述處理液供給機構 以停止上述處理液之供給。 根據該裝置，藉由檢測機構檢測出於處理室之開口部位 I21458.doc 1332686 置之基板之搬送狀態’且藉由判定機構基於該搬送狀態來 判定基板於該開口部之位置是否停滯。而且，當發生了停 滯時，藉由控制機構之控制使顯影液之供給停止。於該結 構中’因基於基板之搬送狀態之檢測來判定基板是否停 滯，故若基板於開口部之位置處於停滯之狀態，則可即時 • 土也檢測到該狀態。而且’基於該即時之檢測結果停止處理 • 液之供給，藉此可抑制局部（基板之前端部分）地對基板進 行處理，另外亦可防止處理液之不必要之消耗。 • 較好的是，本裝置進而包括流出阻止機構，該流出阻止 機構阻止於上述開口部之位置停滯之基板上之處理液向處 理室外流出’#由上述判定機構判定上述基板停滞時，上 述控制機構使上述流出阻止機構作動，以阻止上述處理液 向上述處理室外流出。 根據該裝置，當基板於處理室之上述開口部之位置停滞 時，流出阻止裝置進一步作動，藉此防止供給至基板上之 ^ 處理液向處理室外流出。 另-方面’本發明之其他基板處理裝置包括處理室，該 處理至包括將基板以水平或傾斜之姿勢搬送之搬送機構及 處理液供給機構，且對由上述搬送機構搬送之基板供給處 理液’藉此對該基板實施特定之處理，上述基板處理裝置 &括：檢測機構，其配設於上述處理室之基板搬入用以及 搬出用之開口部之至少一側開口部附近，並對基板之搬送 狀態進订檢測，判定機構，其基於上述檢測機構之檢測結 果，判定上述基板是否停滞；流出阻止機構’其阻止於上 121458.doc 1332686 述開口部之位置停滯之基板上之處理液向處理室外流出； 以及控制機構，其於上述判定機構判定基板停滞時，使上 述流出阻止機構作動。。 根據該裝置，藉由檢測機構檢測出基板於處理室之開口 部之位置之搬送狀態，藉由判定機構基於該搬送狀態來判 • 定基板於該開口部之位置是否停滞。而且，於發生了停滯 ♦ 時，藉由控制機構之控制來驅動流出阻止裝置。該結構 中，因基於基板之搬送狀態之檢測來判定基板是否停滯， # &若基板於開口部之位置處於停滞之狀態，則可即時地檢 測到》亥狀態。而且，基於該即時之檢測來驅動流出阻止裝 藉此可丨夬速地阻止供給至基板上之處理液向處理室外 之流出。 該裝置中，較好的是，當藉由上述判定機構判定基板停 滯時，上述控制機構進一步控制上述處理液供給機構，以 使處理液之供給停止。 鲁 據k裝置，可防止基板上之處理液增加而促使向處理 出 又’可抑制藉由繼續供給處理液而局部（基板 之刚端部分）地對基板進行處理之情況，另外可防止處理 液之不必要之消耗。 再者，作為用於上述裝置之流出阻止裝置之具體結構， =可採用如下者：於作動狀態下藉由向上述基板之表面 氣體’而於該基板上形成氣流，該氣流之方向係自處 理至之外側朝向内側之方向。 據該裝置，藉由形成於基板表面上之氣流之壓力（氣 121458.doc 1332686 體壓力）將基板上之處理液推回至處理室一側，從而可阻 止其逆流。藉此，可有效地防止處理液向處理室外之流 出。 又，上述流出阻止裝置具有可自基板下側將上述基板向 上提升之提升機構’上述提升機構於上述作動狀態下，使 基板自處理室之外側向内側以前端下降之方式提升上述基 板。[Technical Field] The present invention relates to a method of supplying a residual liquid or a rinsing liquid to a substrate such as a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display panel, or a substrate for an optical disk. A substrate processing apparatus that processes a liquid to perform a specific treatment on the substrate. [Prior Art] As the substrate processing apparatus as described above, a substrate processing apparatus configured to have a plurality of processing chambers, for example, a peeling processing chamber, a cleaning processing chamber, and a drying processing chamber, is known. The rectangular glass substrate on which the thin film is formed is conveyed by the driving of the rolling conveyor, and the substrate is sequentially subjected to a peeling treatment, a cleaning treatment, and a drying treatment (for example, Patent Document). A sensor for detecting the presence or absence of a substrate is disposed at an upstream end and a downstream end of the stripping chamber of the device. After the substrate is detected by the sensor, if the substrate does not pass within a preset timer period, When the state of the substrate is detected by the sensor continues even if the timer time is exceeded, a specific process is executed, for example, I* is issued a warning to cause a conveyance failure to stop the device. [Patent Document] Japanese Patent Laid-Open Publication No. 2001-57355 [Draft of the Invention] [Problems to be Solved by the Invention] In the prior device as described above, 'even if the substrate is stopped immediately after the sensor detects the substrate, A response delay occurs, that is, the exception processing is not performed after the timer time elapses. Therefore, when the transfer failure occurs, 121458.doc 1332686 causes a substrate to straddle between the stop ejector (unloader) and the processing chamber. Before performing the exception processing, it will be partially localized (the front end of the substrate is illusory) When the processing liquid is supplied, the processing of the substrate is poor, and the processing liquid is unnecessarily consumed. Further, the processing liquid onto the substrate flows over the surface of the substrate: it leaks toward the loader (unloader) side. This causes equipment failure. When the --substrate stops across a plurality of processing chambers, the same problem occurs because the processing liquid leaks into the adjacent & processing chamber. The same problem occurs in this month. Developed, and in order to avoid the defects caused by the response delay as described above, the first purpose is to avoid the processing failure of the substrate while preventing unnecessary consumption of the processing liquid, and the first purpose The present invention provides a substrate processing apparatus including processing to, in order to solve the above problems, by preventing the processing liquid from leaking out of the processing chamber through the substrate. The processing chamber includes a transport mechanism that transports the substrate in a horizontal or inclined posture, and a processing liquid supply mechanism ', and supplies the processing liquid to the substrate transported by the transport mechanism, thereby performing specific processing on the substrate, and the substrate processing apparatus includes: The detecting means is disposed in the vicinity of at least one opening of the opening for the substrate loading and unloading in the processing chamber, and detects the conveyance state of the substrate; and the determining means determines based on the detection result of the detecting means Whether the substrate is stagnant or not; and a control mechanism that controls the processing liquid supply mechanism to stop the supply of the processing liquid when determining that the substrate is stagnant. According to the apparatus, the opening portion of the processing chamber is detected by the detecting mechanism I21458.doc 1332686 The conveyance state of the substrate is determined by the determination means determining whether or not the position of the substrate at the opening is stagnant based on the conveyance state. Further, when the stagnation occurs, the supply of the developer is stopped by the control of the control means. In this structure, it is judged by the detection of the substrate-based transport state. Whether the substrate is stagnant or not, if the position of the substrate in the opening portion is stagnant, the state can be detected immediately; and 'the processing is stopped based on the immediate detection result, and the liquid can be supplied, thereby suppressing the local ( The substrate is processed at the front end portion of the substrate to prevent unnecessary consumption of the treatment liquid. • Preferably, the device further includes an outflow prevention mechanism that prevents the position of the opening portion from stagnating. When the processing liquid on the substrate flows out to the processing chamber'# when the determining means determines that the substrate is stagnant, the control means activates the outflow prevention means to prevent the processing liquid from flowing out of the processing chamber. According to the apparatus, when the substrate is processed When the position of the opening portion of the chamber is stagnant, the outflow prevention device is further actuated, thereby preventing the treatment liquid supplied onto the substrate from flowing out to the processing chamber. In another aspect, the other substrate processing apparatus of the present invention includes a processing chamber that supplies a processing unit that supplies the substrate to the substrate conveyed by the transport mechanism and a processing liquid supply mechanism that transports the substrate in a horizontal or inclined posture. By performing a specific process on the substrate, the substrate processing apparatus includes: a detection mechanism disposed in the vicinity of at least one opening of the substrate for loading and unloading of the processing chamber, and for the substrate In the transport state order detection, the judging means determines whether the substrate is stagnant based on the detection result of the detecting means; and the outflow preventing means "blocks the processing liquid on the substrate where the position of the opening portion is stagnant to the upper 121458.doc 1332686 The outdoor flow out; and a control mechanism that causes the outflow prevention mechanism to act when the determination unit determines that the substrate is stagnant. . According to this apparatus, the detecting means detects the conveyance state of the substrate at the position of the opening of the processing chamber, and the determining means determines whether or not the position of the substrate at the opening is stagnated based on the conveyance state. Moreover, when the stagnation ♦ occurs, the outflow prevention device is driven by the control of the control mechanism. In this configuration, it is determined whether or not the substrate is stagnated based on the detection of the transport state of the substrate. # & If the position of the substrate in the opening is stagnant, the "Hai" state can be detected immediately. Further, the outflow preventing device is driven based on the instantaneous detection, whereby the flow of the processing liquid supplied onto the substrate to the outside of the processing chamber can be promptly prevented. In the apparatus, preferably, when the determination means determines that the substrate is stagnant, the control means further controls the processing liquid supply means to stop the supply of the processing liquid. According to the k device, the processing liquid on the substrate can be prevented from being increased, and the processing can be suppressed to prevent the substrate from being processed locally (the rigid end portion of the substrate) by continuing to supply the processing liquid, and the treatment liquid can be prevented. Unnecessarily consumed. Furthermore, as a specific structure of the outflow prevention device for the above device, the following may be employed: in the active state, a gas flow is formed on the substrate by the surface gas to the substrate, and the direction of the gas flow is self-processed. To the outside of the direction toward the inside. According to the apparatus, the treatment liquid on the substrate is pushed back to the side of the processing chamber by the pressure of the gas stream formed on the surface of the substrate (gas 121458.doc 1332686 body pressure), thereby preventing the backflow. Thereby, the discharge of the treatment liquid to the outside of the treatment chamber can be effectively prevented. Further, the outflow prevention device has a lifting mechanism that can lift the substrate upward from the lower side of the substrate. The lifting mechanism raises the substrate so that the substrate descends from the outer side to the inner side of the processing chamber in the above-described operating state.
根據该裝置，藉由使基板處於自室外側向室内側傾斜之 姿勢而使基板上之處理液向處理室一側流下，從而阻止其 逆流。藉此可有效地防止處理液向處理室外流出。 進而，流出阻止機構具有可於退避位置與抵接位置之間 位移的圍堰構件，上述退避位置係遠離上述基板之上表面 之位置，上述抵接位置係上述圍堰構件與上述基板之表面 抵接而阻止處理液流動之位置，於上述作動狀態下，上述 圍堰構件配置於上述抵接位置。According to this device, the processing liquid on the substrate flows down toward the processing chamber side by the posture in which the substrate is inclined from the outdoor side to the indoor side, thereby preventing the backflow. Thereby, it is possible to effectively prevent the treatment liquid from flowing out to the outside of the treatment chamber. Further, the outflow prevention mechanism has a dam member that is displaceable between the retracted position and the abutting position, wherein the retracted position is away from a surface of the upper surface of the substrate, and the abutting position is a surface of the dam member that is offset from the surface of the substrate The position of the processing liquid is prevented from flowing, and in the above-described operating state, the dam member is disposed at the abutting position.
根據該裝置，藉由圍堰構件抵接於基板 之流動，從而防止處理液向處理室外流出 再者，較好的是，上述檢測機構檢測出基板之移動速 作為基板之上述搬送狀態，於上述檢職構所檢測出之 :速度為特定之速度以下時’上述判定機構判定基板According to the device, the flow of the substrate is prevented from flowing out of the processing chamber by the flow of the dam member, and it is preferable that the detecting means detects the moving speed of the substrate as the transfer state of the substrate. The inspection organization detects that the speed is below a certain speed.
㈣該裝置，即使於基板正被搬送時（移動中時），若: 特定速度以下，則判定A 蛤 判疋為基板停冰’從而停止處理液之/ 或執行流出阻止裝置之作動笑_ . 衣1 <忭勖等處理。亦即，即使基; 121458.doc 1332686 於處理室之開口部移動時，也會因搬送異常而存在其速度 極其慢之情況，此時與基板停止之情況相同，基板上之處 理液亦會通過開口部而向處理室外流出《針對這一點，如 上所述’只要係以特定速度以下搬送基板之情況就作為停 滯狀態而進行處理，則可更可靠地防止處理液之流出。 再者於上述裝置中，較好的是，上述檢測機構具有從 動輥，且輸出與該從動輥之旋轉速度對應之信號，上述從 動輥藉由與上述基板表面之間之伴隨著上述搬送機構所搬 送之基板之移動而產生的摩擦力而旋轉，上述判定機構基 於自上述檢測機構輸出之信號之狀態進行上述判定。 根據該結構，藉由基板與從動輥之間之物理接觸來檢測 基板之搬送狀態，因此可利用簡單之結構以高可靠性對搬 送狀態進行檢測。 [發明之效果] 根據本發明之基板處理裝置，基板停滯於處理室開口部 之位置時，可快速檢測出該狀態而停止處理液之供給，因 此可有效地避免由於繼續供給處理液而局部（基板之前端 部分）地進行基板處理，從而導致處理不良之情況，又， 可防止處理液之不必要之消耗。 根據本發明之其他基板處理裝置，當基板停滞於處 理室之開口部位置時’可快速檢測出該狀態而使阻止處理 液向處理室外流出之流出阻止裝置作自，因此可有效地防 止處理液將基板作為媒介而流出到處理室外。 【實施方式】 121458.doc -11 - 1332686 利用圖式對本發明之實施形態進行說明。 圖1係表示本發明之基板處理裝置之第1實施形態的圖。 該基板處理裝置以如下方式而構成，即，基板8由搬送機 構1向特定之搬送方向（自圖1之左側朝向右側之方向）？搬 送，且沿著該搬送機構1之基板搬送路徑，依次配設有裝 載器10、複數個處理部、即顯影處理部12與水洗處理部 14° 於該實施形態中，使用滾筒式輸送機作為搬送機構i。 該滾筒式輸送機係於搬送方向p上以特定之間距並排設置 複數個滾筒2而形成，該等複數個滾筒2於與基板3之搬送 方向P正交之方向上配置有支撐軸。而且，如圖2所示，橫 跨連接至驅動馬達（省略圖示）之驅動輪3和各個滾筒2之間 而架設有驅動皮帶4,藉此’利用上述驅動馬達之驅動力 使各滾筒2向相同方向同步旋轉，從而使載置於滾筒2上之 基板S以水平姿勢向搬送方向p搬送。再者，如該圖所示， 對裝載器10、處理部12、14分別獨立設置有滾筒式輸送 機且藉由下述控制器60分別單獨地進行驅動控制。 返回至圖1，於裝載器1〇上配備有省略圖示之基板之搬 入機構，藉由該搬入機構將於前一步驟中實施了曝光處理 之基板一片一片地移載至搬送機構丨之滾筒2上，從而依次 向顯影處理部12搬出。 顯影處理部12以及水洗處理部14分別具有處理室121、 141 ’該等處理室121、141用以對藉由搬送機構1所搬送之 土板s實施處理。於各處理室121、⑷之側壁分別形成有 121458.doc •12· 1332686 開口部15，且通過該開口部15進行基板8之搬入以及搬 出。 顯影處理部12係用以於處理室121内向基板8供給顯影液 (處理液）使基板S顯影者。於該處理室121之内部，於搬送 機構1之上方配設有用以供給顯影液之複數個液體噴嘴 • 30，因此可對搬送機構1所搬送之基板S從其上方供給顯影 顯影液之供排系統具有：貯藏槽32，其貯藏顯影液；泵 % ;供給配管％，其將由該泵36加壓輸送之顯影液導向上 j液體噴嘴30;回收配管35’其將使用後之顯影液自處理 至121回收至貯藏槽32中；以及未圖示之過濾器等，其介 設於該回收配管上，藉此，使顯影液循環之同時，將顯影 液供給至顯影處理部12。於供給配管34上介設有由電磁閥 等構成之變動閥38，該變動閥38用以進行顯影液之供給以 及停止，進而用於調節供給量，藉由下述控制器6〇對該變 φ 動閥38進行控制。再者，於該實施形態中，該顯影液之供 排系統相當於本發明之處理液供給機構。 於處理室121内配設有檢測機構7(相當於本發明之檢測 機構），該檢測機構7檢測通過開口部1 5所搬入之基板8之 搬送狀態，並藉由下述控制器60基於該檢測機構7之檢測 結果來判定基板s是否停滯（於該實施形態中為判定基板s 是否停止）。如圖1以及圖2所示，檢測機構7具有：從動輥 6，其配置於處理室121内之最上游側，亦即，配置於基板 S之搬送方向上之上游側（下面，簡稱為上游側，而且將其 121458.doc -13- 1332686 相反方向稱為下游侧）；旋轉編碼㈣，其與該從動棍6連 接。 從動輥6以與搬送機構丨之滾筒2並排之方式配置並且 由與該基板表面之間之伴隨著基板s之搬送所產生之摩擦 力的作用而旋轉，絲此之外之情況下靜止。另一方面: 編碼器40具有：狹縫板42，纟固定於從動輥“—端；感 測器44，其具有中間夾持該狹縫板42而配置之光之昭射部 44a以及受光部44b，$光部桃通過狹縫板42之狹缝42a接 收自照射部44a投射之光’ &而將相應於該受糾間之脈 衝信號輸出至下述控制⑽。亦即，於基板§在移動時， 從動輥6和狹縫板42-體旋轉而自編碼㈣定期地輸出脈 衝佗號因此根據有無輸出該脈衝信號，可檢測基板s是 否在移動。再者，於圖示之例子中，狹縫板42之狹縫42a 為一個，但亦可採用具有複數個狹缝42a之狹縫板42。 又，於從動輥6與配置於其旁邊下游側之滾筒2之間之部 分，配置有用以進一步檢測基板s有無之感測器46(稱為基 板檢測感測器46)。該基板檢測感測器46雖沒有詳細之圖 不’但該基板檢測感測器46係一種所謂垂擺型感測器，其 具有可搖動地被支撐之擺錘構件、及根據磁場之變化輸出 信號之霍爾元件（磁電轉換元件），該磁場隨著内置於該擺 鐘構件十之磁石之位移而變化’且該基板檢測感測器46隨 著與基板S之接觸而將上述信號輸出至下述控制器60中。 再者’如下所述，亦可使檢測機構7以及基板檢測感測 器46位於裝載器1〇之下游端之位置（參照圖13)。又，於沒(4) This device, even when the substrate is being transported (when moving), if it is below the specific speed, it is judged that A is judged to be the substrate to stop the ice, and the processing liquid is stopped or the flow-out prevention device is operated. Clothing 1 < 忭勖 and other treatments. That is, even if the base; 121458.doc 1332686 moves in the opening of the processing chamber, the speed is extremely slow due to the abnormality of the conveyance. At this time, the processing liquid on the substrate passes through the same as when the substrate is stopped. In the case where the substrate is conveyed at a specific speed or lower, the treatment is performed as a stagnant state, and the outflow of the treatment liquid can be more reliably prevented. Further, in the above apparatus, preferably, the detecting means has a driven roller, and outputs a signal corresponding to a rotational speed of the driven roller, wherein the driven roller is accompanied by the surface of the substrate The frictional force generated by the movement of the substrate conveyed by the transport mechanism rotates, and the determination means performs the above determination based on the state of the signal output from the detection means. According to this configuration, since the conveyance state of the substrate is detected by the physical contact between the substrate and the driven roller, the conveyance state can be detected with high reliability with a simple configuration. [Effects of the Invention] According to the substrate processing apparatus of the present invention, when the substrate is stopped at the position of the opening of the processing chamber, the state can be quickly detected and the supply of the processing liquid can be stopped, so that it is possible to effectively avoid partial supply due to the continued supply of the processing liquid ( Substrate processing is performed on the front end portion of the substrate, resulting in poor handling, and unnecessary consumption of the processing liquid can be prevented. According to another substrate processing apparatus of the present invention, when the substrate is stagnated at the opening position of the processing chamber, the state can be quickly detected and the outflow preventing means for preventing the processing liquid from flowing out to the processing chamber can be self-contained, thereby effectively preventing the processing liquid The substrate is used as a medium to flow out of the processing chamber. [Embodiment] 121458.doc -11 - 1332686 An embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a view showing a first embodiment of a substrate processing apparatus according to the present invention. The substrate processing apparatus is configured such that the substrate 8 is transported by the transport mechanism 1 in a specific transport direction (from the left side to the right side in Fig. 1). In the embodiment, the loader 10 and the plurality of processing units, that is, the development processing unit 12 and the water washing treatment unit 14 are sequentially disposed along the substrate transport path of the transport mechanism 1. In this embodiment, a drum conveyor is used. Transfer mechanism i. The drum conveyor is formed by arranging a plurality of rollers 2 at a predetermined interval in the transport direction p, and the plurality of rollers 2 are arranged with a support shaft in a direction orthogonal to the transport direction P of the substrate 3. Further, as shown in FIG. 2, a drive belt 4 is placed across a drive wheel 3 connected to a drive motor (not shown) and each of the rollers 2, whereby each of the rollers 2 is driven by the driving force of the drive motor. The rotation is synchronized in the same direction, so that the substrate S placed on the drum 2 is conveyed in the horizontal direction to the conveyance direction p. Further, as shown in the figure, the loader 10 and the processing units 12 and 14 are separately provided with a drum conveyor, and the drive controllers are separately controlled by the controller 60 described below. Returning to Fig. 1, a loading mechanism for a substrate (not shown) is provided on the loader 1A, and the substrate subjected to the exposure processing in the previous step is transferred to the roller of the transport mechanism one by one by the loading mechanism. In the second step, the developing unit 12 is sequentially carried out. The development processing unit 12 and the water washing processing unit 14 have processing chambers 121 and 141', and the processing chambers 121 and 141 are used to perform processing on the earth plate s transported by the transport mechanism 1. Openings 15 of 121458.doc • 12· 1332686 are formed in the side walls of the respective processing chambers 121 and (4), and the substrate 8 is carried in and out through the opening 15 . The development processing unit 12 is for supplying a developer (treatment liquid) to the substrate 8 in the processing chamber 121 to develop the substrate S. In the processing chamber 121, a plurality of liquid nozzles 30 for supplying a developing solution are disposed above the conveying mechanism 1, so that the substrate S conveyed by the conveying mechanism 1 can be supplied with the developing developer from above. The system has a storage tank 32, which stores a developing solution, a pump %, a supply pipe %, which guides the developing liquid pressurized by the pump 36 to the upper j liquid nozzle 30, and a recovery pipe 35' which self-processes the developing solution after use. The liquid is collected into the storage tank 32, and a filter or the like (not shown) is placed on the recovery pipe, whereby the developer is supplied to the development processing unit 12 while circulating the developer. A variation valve 38 composed of a solenoid valve or the like is disposed in the supply pipe 34. The variation valve 38 is used to supply and stop the developer, and is used to adjust the supply amount, which is controlled by the controller 6 described below. The φ moving valve 38 is controlled. Further, in this embodiment, the developer supply and discharge system corresponds to the treatment liquid supply mechanism of the present invention. A detection mechanism 7 (corresponding to the detection mechanism of the present invention) is disposed in the processing chamber 121, and the detection mechanism 7 detects the conveyance state of the substrate 8 carried in through the opening portion 15, and is based on the controller 60 described below. The detection result of the detecting means 7 determines whether or not the substrate s is stagnant (in this embodiment, it is determined whether or not the substrate s is stopped). As shown in FIG. 1 and FIG. 2, the detecting mechanism 7 has a driven roller 6 which is disposed on the most upstream side in the processing chamber 121, that is, is disposed on the upstream side in the transport direction of the substrate S (hereinafter, simply referred to as The upstream side, and its opposite direction of 121458.doc -13 - 1332686 is referred to as the downstream side; and the rotary code (four) is connected to the driven stick 6. The driven roller 6 is disposed in parallel with the roller 2 of the transport mechanism and is rotated by the frictional force generated by the transfer of the substrate s with the surface of the substrate, and is stopped outside the wire. On the other hand, the encoder 40 has a slit plate 42 which is fixed to the driven roller "-end; a sensor 44 having an incident portion 44a for arranging light sandwiching the slit plate 42 and receiving light. The portion 44b, the light portion peach receives the light projected from the illuminating portion 44a through the slit 42a of the slit plate 42, and outputs a pulse signal corresponding to the corrected portion to the following control (10). § When moving, the driven roller 6 and the slit plate 42 are rotated and self-encoded (four) periodically output pulse apostrophes, so that whether or not the substrate s is moved according to the presence or absence of the pulse signal can be detected. In the example, the slit 42a of the slit plate 42 is one, but a slit plate 42 having a plurality of slits 42a may be used. Further, between the driven roller 6 and the roller 2 disposed on the downstream side thereof In part, a sensor 46 (referred to as a substrate detecting sensor 46) for detecting the presence or absence of the substrate s is disposed. The substrate detecting sensor 46 is not detailed, but the substrate detecting sensor 46 is a type. a so-called pendulum type sensor having a pendulum member that is rockably supported, and a Hall element (magnetoelectric conversion element) that changes the output signal, the magnetic field changes with the displacement of the magnet built into the pendulum clock member' and the substrate detecting sensor 46 will follow the contact with the substrate S The signal is output to the controller 60 described below. Further, as described below, the detecting mechanism 7 and the substrate detecting sensor 46 may be positioned at the downstream end of the loader 1 (see Fig. 13). No
121458.doc 14· 1332686 有發生因處理液之附著而導致誤檢測等不良之情況下，亦 可採用反射式光感測器作為該基板檢測感測器46，從而藉 由接收由基板s反射之光而檢測出基板s，上述反射式光感 測器一體地具有光之照射部及受光部。 返回至圖1，於顯影處理部12之上游側，配備有流出阻 止裝置20(相當於本發明之逆流阻止機構之一）。該流出阻 止裝置20係如下裝置：於基板s因搬送故障而停止於開口 β 1 5分時，用以阻止顯影液經過基板s而流至裝載器丄〇 一側0 5亥流出阻止裝置20具有配置於處理室121上游側之開口 部15附近之氣體喷嘴21，且對搬送機構丨上之基板8，從其 上游側朝向下游側並向斜下方向供給高壓氣體，該高壓氣 體係自氣體供給源24通過供給配管22而供給◊氣體喷嘴2 j 具有狹縫狀之氣體喷出口，該氣體噴出口沿著與基板8之 搬送方向P正交之方向延伸，可於上述方向上無間隙地對 基板s喷出氣體。再者，於氣體之供給配管22上介設有由 電磁閥等構成之變動閥23，並通過下述控制器6〇來控制該 變動閥23。 人 另一方面，水洗處理部14用以於處理室141内向基板呂供 給純水而對其進行清洗。於該處理室141之内部，夾著搬 送機構1而於其上方側以及下方側配設有用以供給純水之 複數個液體噴嘴50,從而可對搬送機構丨所搬送之基板s， 從基板S之上下兩側供給純水。 純水之供排系統具有貯藏純水之貯藏槽52、泵56、亦即 121458.doc 1332686 供給配管54等’上述供給配管54將由該泵56加壓輸送之純 水導向上述液體喷嘴50。於供給配管54上介設有由電磁閥 等構成之變動閥5 8，該變動閥5 8用以進行純水之供給以及 停止’或者用以調節供給量’並藉由下述控制器6〇對該閥 58進行控制。再者’於水洗處理部14中不循環使用純水， 而且使用後之純水經由連接至處理室141之廢液管55而回 收至未圖示之廢液槽中。 圖1中’符號26以及48分別係配置於裝載器10以及顯影 處理室12(處理室1S1内）之下游端之送出感測器。該感測器 26 48由與上述基板檢測感測器46同樣之垂擺型感測器構 成，檢測出藉由搬送機構1之驅動所搬送之基板8並將檢測 信號輸出至控制器60。控制器6〇基於該等送出感測器26、 48對基板S之檢測結果，開始對各處理部丨2、丨4進行液體 之供給等。 於採用上述結構之基板處理裝置中，搭載有對一系列之 基板處理動作進行控制之控制器6〇。該控制器6〇由執行邏 輯運算之CPU (central processing unit，中央處理單元）、 儲存用以控制該CPU之各種程式等之R〇M (read 〇nly memory，唯讀記憶體）、於裝置動作中臨時儲存各種資料 之RAM (Random-access memory，隨機存取記憶體）等構 成’該控制器60全面控制搬送機構i、裝載器1〇、顯影處 理部12以及水洗處理部14等。尤其自裝載器1〇向顯影處理 部12搬入基板S時，基於上述檢測機構7之檢測結果，判定 於開口部15之位置是否停滯有基板3(於該實施形態中，判 121458.doc • 16 · 1332686 又疋否停止有基板s)，而且，於有基板s停止時，如下所 說明般控制顯影處理部12之顯影液之供給以及流出阻止褒 置之作動，從而可防止顯影液向裝載㈣—侧漏出等。、 即，於該實施形態中，該控制器6〇發揮本發明 以及控制機構之功能。 恢稱 圖3係表*控制器6〇之動作控制之—例的流程圖。 於上述基板處理裝置中’若基板s藉由裝載器ι〇搬入並 載置於滚筒2上，則控制器6〇首先使屬於裝載器ι〇之搬送 機構1作動，從而開始搬送基板s(步驟S2)。 "繼而，若同時送出感測器26檢測到基板S(於步驟S4中為 "是’貝控制器60使屬於上述顯影處理㈣之㈣機構夏 作動’並對上述供㈣統之閥38進行開啟操作，藉此於處 理至^丨内，從液體喷嘴3〇開始供給顯影液（步驟％)。 接考’控制器60判斷基板檢測感測器糾否檢測到基板 S(步驟S8)，並且，若此時判斷為，•是"，則進―步來自 上述編碼器40之輸出脈衝是否增加，㈣，判斷基板以 否在移動（步驟S10)。繼而’若此時判斷為”是"，則根據預 先儲存之程式（正常動作序列）’控制搬送機構i等來實施對 基板s之顯影處理（步驟S12)。 與此相對’若於步驟S10中判定為"否"，則控制器60根 據異常動作序列來控制搬送機構1。即，所謂基板檢測 感測器46檢測到基板S、且夹白结_庶& 1Λ 且采自編碼器4〇之輸出脈衝未增 加之狀態，係基板S於開口部15之位置停止之狀態，此 時’控制器60對上述閥38進行關閉操作而停止供給顯影 121458.doc -17- U32686 液，並對上述閥23進行開啟操作而使流出阻止裝置叫乍 ，’並且使未圖示之警報裝置作動。此時，亦使屬於裝載 器1〇以及顯影處理部12之搬送機構丨停止。 藉由以上述方式停止供給顯景^，防纟向停止中之基板 S上供給顯影液’從而可抑制局部（基板之前端部分）地對 ·， &板進行處理之情況發生’並可防止不必要之顯影液之消 ， 耗°並且進而’藉由流出阻止裝置20之作動而向基板8上 噴“壓氣體之結果為，如圖4所示，於基板S上形成自處 =室⑵之外側朝向内側之氣流，基板上之顯影液藉由該 軋流之壓力（氣體壓力）而被壓回至處理室121内，從而可防 止其逆流》藉此，可防止顯影液經過基板s而自處理室id 向裝載器1〇一側漏出。尤其藉由如上所述之方式停止供給 顯影液’可防止基板S上之處理液增加而促使向處理室⑵ 外流出。 再者，若於步驟S8中判斷為”否"，則此時亦判斷來自上 • 述編碼器40之輸出脈衝是否在增加（步驟si4)。繼而，若 於此時判斷為疋’則與上述同樣進入到步驟㈣，藉此 根據異常動作序列來控制搬送機構1等。即’所謂基板檢 測感測器4 6沒有檢測到基板s、且來自編碼器4 〇之輸出脈 衝在增加之狀態，係基板檢測感測器“發生故障之狀態， 此時’控制器60為了對基板檢測感測器⑽行維修，與上 述同樣地根據異常動作序列來控難送機構1。再者， 右於步驟S14中判斷為"否"，則基板s還處於未搬入至處理 室121内之狀態，此時返回至步驟s8。 121458.doc 1332686 如上所說明，於該基板處理裝置中，當自裝載器10通過 開口部15搬入顯影處理部12之基板s發生搬送故障，從而 基板s停止（停滯）於該開口部15之位置時，以如上所述之 方式停止供給顯影液，並進而使流出阻止裝置2〇作動，藉 此防止基板S上之顯影液向裝載器1〇一侧漏出，因此可有 效地防，例如基板S之處理不良、起因於所漏出之顯影液 之裝載器10之故障、以及顯影液不必要之消耗等。 而且，於該基板處理裝置中，除了基板檢測感測器46之 外，亦將可檢測基板S是否在移動之檢測機構7設置於開口 部15之附近，因此，於基板5停止時，可利用該檢測機構7 更即時地檢測出該狀態。而且，基於上述對基板停止之即 時之檢測而轉移到異常動作序列，其結果，可盡可能快地 停止顯影液之供給，又，可盡可能快地使流出阻止裝置 作動。因此可更可靠地防止基板s因搬送異常而停止於開 口部15之位置時之如上述般之故障，即基板8之處理不 良、起因於所漏出之顯影液之裝載器1〇之故障、以及顯影 液不必要之消耗等。 接著，說明本發明之基板處理裝置之第2實施形態。 圖5表示第2實施形態之基板處理裝置。該基板處理裝置 係於第1實施形態之基板處理裝置之基礎上增加了如下結 構之裝置。 即，於第2實施形態之基板處理裝置中，與顯影處理部 I2同樣’於水洗處理部Μ之處理室之上游側之開口部 1 5附近，亦設置有基板檢測感測器46，以及檢測機構7%該 121458.doc •19· 1332686 等基板檢測感測器46,以及檢測機構7ι之結構與顯影處理部 12之相應構件(基板檢測感測器46、檢測機構7)基本相同， 因此於對應構件之符號上.賦予「，」以加以區別，並省略詳 細圖示。 又’於該基板處理裝置中，將第i實施形態之流出阻止 裝置20作為第1流出阻止裝置2〇，與此區別而設置有第2流 出阻止裝置20·。 ’121458.doc 14· 1332686 In the case where a defect such as erroneous detection due to adhesion of the treatment liquid occurs, a reflection type photo sensor may be used as the substrate detection sensor 46 so as to be reflected by the substrate s. The substrate s is detected by light, and the reflective photosensor integrally includes a light irradiation unit and a light receiving unit. Returning to Fig. 1, on the upstream side of the development processing unit 12, an outflow prevention device 20 (corresponding to one of the backflow prevention mechanisms of the present invention) is provided. The outflow prevention device 20 is configured to prevent the developer from flowing through the substrate s to the loader side when the substrate s is stopped at the opening β 15 minutes due to the conveyance failure. The gas nozzle 21 disposed in the vicinity of the opening 15 on the upstream side of the processing chamber 121 is supplied with high-pressure gas from the upstream side toward the downstream side of the substrate 8 on the transport mechanism, and the high-pressure gas system is supplied from the gas. The source 24 is supplied to the helium gas nozzle 2 j through the supply pipe 22, and has a slit-shaped gas discharge port extending in a direction orthogonal to the transport direction P of the substrate 8, so that the gap can be made in the above direction without a gap. The substrate s ejects gas. Further, the gas supply pipe 22 is provided with a change valve 23 composed of a solenoid valve or the like, and the change valve 23 is controlled by a controller 6A described below. On the other hand, the water washing treatment unit 14 is for supplying pure water to the substrate in the processing chamber 141 to clean it. Inside the processing chamber 141, a plurality of liquid nozzles 50 for supplying pure water are disposed on the upper side and the lower side of the processing unit 141, and the substrate s that can be transported to the transport mechanism , is removed from the substrate S. Pure water is supplied from the upper and lower sides. The pure water supply and discharge system has a storage tank 52 for storing pure water, a pump 56, that is, 121458.doc 1332686, a supply pipe 54, and the like. The supply pipe 54 guides the pure water pressurized by the pump 56 to the liquid nozzle 50. A variation valve 5 8 composed of a solenoid valve or the like is interposed on the supply pipe 54 for the supply and stop of pure water or to adjust the supply amount and is controlled by the controller 6 described below. The valve 58 is controlled. Further, pure water is not recycled in the water washing treatment unit 14, and the purified water after use is returned to the waste liquid tank (not shown) via the waste liquid pipe 55 connected to the processing chamber 141. The symbols 26 and 48 in Fig. 1 are the delivery sensors disposed at the downstream end of the loader 10 and the development processing chamber 12 (in the processing chamber 1S1), respectively. The sensor 26 48 is constituted by a pendulum type sensor similar to the above-described substrate detecting sensor 46, and detects the substrate 8 transported by the driving mechanism 1 and outputs a detection signal to the controller 60. The controller 6 starts the supply of the liquid to each of the processing units 丨2 and 丨4 based on the detection results of the substrate S by the delivery sensors 26 and 48. In the substrate processing apparatus having the above configuration, a controller 6 for controlling a series of substrate processing operations is mounted. The controller 6 is implemented by a CPU (central processing unit) that performs logical operations, R〇M (read 〇nly memory) that stores various programs for controlling the CPU, and the like. A RAM (Random-access memory) or the like for temporarily storing various kinds of data constitutes 'the controller 60 comprehensively controls the transport mechanism i, the loader 1〇, the development processing unit 12, the water washing processing unit 14, and the like. In particular, when the substrate S is loaded from the loader 1 to the development processing unit 12, it is determined whether or not the substrate 3 is stagnated at the position of the opening 15 based on the detection result of the detection unit 7 (in the embodiment, 121458.doc • 16) In addition, when the substrate s is stopped, the supply of the developing solution of the development processing unit 12 and the operation of the outflow prevention device are controlled as described below, thereby preventing the developer from being loaded (4). - side leakage and so on. That is, in this embodiment, the controller 6 functions as the present invention and the control means. Recalling Figure 3 is a flow chart of an example of the action control of the controller * controller. In the above substrate processing apparatus, if the substrate s is carried by the loader and placed on the drum 2, the controller 6 first operates the transport mechanism 1 belonging to the loader to start transporting the substrate s (step S2). " Then, if the sensor 26 is simultaneously sent out, the substrate S is detected (in step S4, " is the 'before the controller 60, so that the (four) mechanism belonging to the above-mentioned development processing (4) is actuated 'to the above-mentioned (four) system of the valve 38 The opening operation is performed, whereby the supply of the developer is started from the liquid nozzle 3〇 in the process (step %). The controller 60 determines that the substrate detecting sensor corrects the substrate S (step S8), Further, if it is judged at this time, if it is ", the output pulse from the encoder 40 is incremented, and (4), it is judged whether or not the substrate is moving (step S10). Then, if it is judged as " ", the development processing of the substrate s is performed based on the pre-stored program (normal operation sequence) 'control of the transport mechanism i, etc. (step S12). In contrast, if it is determined in step S10 as "no", Then, the controller 60 controls the transport mechanism 1 according to the abnormal operation sequence. That is, the substrate detecting sensor 46 detects the substrate S, and the white junction _ 庶 & 1 且 and the output pulse from the encoder 4 未 is not increased. State, the substrate S is in the opening portion 15 When the position is stopped, the controller 60 closes the valve 38 and stops supplying the developing 121458.doc -17- U32686 liquid, and opens the valve 23 to cause the outflow prevention device to scream, 'and The alarm device (not shown) is activated. At this time, the transport mechanism 属于 belonging to the loader 1〇 and the development processing unit 12 is also stopped. By stopping the supply of the scene in the above manner, the tamper is supplied to the stopped substrate S. The developing solution' can thereby suppress the local (the front end portion of the substrate) from being processed, and can prevent the unnecessary developer from being consumed, and further, by the action of the outflow preventing device 20. As a result of the "pressure gas" being sprayed onto the substrate 8, as shown in FIG. 4, a gas flow from the outer side of the chamber (2) toward the inner side is formed on the substrate S, and the developer on the substrate is pressurized by the pressure (gas) The pressure is pressed back into the processing chamber 121 so that it can be prevented from flowing back. Thereby, the developer can be prevented from leaking from the processing chamber id to the side of the loader 1 through the substrate s, especially by the manner described above. stop The supply of the developing solution 'can prevent the processing liquid on the substrate S from increasing to cause the outside of the processing chamber (2) to flow out. Further, if it is determined as "NO" in the step S8, it is judged from the above-mentioned encoder 40 at this time. Whether or not the output pulse is increasing (step si4). Then, if it is determined to be "疋" at this time, the process proceeds to step (4) in the same manner as described above, whereby the conveying mechanism 1 or the like is controlled according to the abnormal operation sequence. That is, the so-called substrate detection sensing The controller 46 does not detect the substrate s, and the output pulse from the encoder 4 is in an increased state, and the substrate detecting sensor "state of failure, at this time" controller 60 in order to detect the sensor (10) for the substrate In the maintenance, the difficult-to-feed mechanism 1 is controlled based on the abnormal operation sequence in the same manner as described above. Further, if it is determined in the step S14 that it is "No", the substrate s is still not loaded into the processing chamber 121, and the process returns to the step s8. As described above, in the substrate processing apparatus, when the substrate s loaded into the development processing unit 12 from the loader 10 through the opening 15 causes a conveyance failure, the substrate s is stopped (stagnation) at the position of the opening portion 15. When the supply of the developer is stopped as described above, and the outflow prevention device 2 is further activated, the developer on the substrate S is prevented from leaking to the side of the loader 1 so that it can be effectively prevented, for example, the substrate S. The processing is poor, the failure of the loader 10 due to the leaked developer, and unnecessary consumption of the developer, and the like. Further, in the substrate processing apparatus, in addition to the substrate detecting sensor 46, the detecting means 7 for detecting whether or not the substrate S is moving is disposed in the vicinity of the opening portion 15, and therefore, when the substrate 5 is stopped, it can be utilized. The detecting mechanism 7 detects this state more immediately. Further, based on the above-described detection of the stop of the substrate, the process shifts to the abnormal operation sequence. As a result, the supply of the developer can be stopped as quickly as possible, and the outflow prevention device can be actuated as quickly as possible. Therefore, it is possible to more reliably prevent the above-described failure when the substrate s is stopped at the position of the opening portion 15 due to the conveyance abnormality, that is, the processing failure of the substrate 8, the failure of the loader 1 due to the leaked developer, and The developer is not consumed or the like. Next, a second embodiment of the substrate processing apparatus of the present invention will be described. Fig. 5 shows a substrate processing apparatus according to a second embodiment. This substrate processing apparatus is an apparatus having the following structure in addition to the substrate processing apparatus of the first embodiment. In the substrate processing apparatus of the second embodiment, similarly to the development processing unit I2, the substrate detecting sensor 46 is provided in the vicinity of the opening portion 15 on the upstream side of the processing chamber of the water washing processing unit, and the detection is performed. The mechanism 7% of the 121458.doc •19· 1332686 substrate detecting sensor 46, and the detecting mechanism 7 ι have the same structure as the corresponding components of the developing processing unit 12 (the substrate detecting sensor 46 and the detecting mechanism 7), and thus "," is given to the symbol of the corresponding member to distinguish it, and the detailed illustration is omitted. Further, in the substrate processing apparatus, the outflow prevention device 20 of the i-th embodiment is used as the first outflow prevention device 2, and the second outflow prevention device 20· is provided in distinction. ’
第2流出阻止裝置20·具有配置於水洗處理部“之處理室 141之上游侧之開口部15附近的氣體噴嘴以，，對搬送機構1 上之基板S自下游側向上游側並向斜下方向供給高壓氣 體，該高壓氣體係通過自上述供給配管分支之供給配管25 而供給。The second outflow prevention device 20 includes a gas nozzle disposed in the vicinity of the opening 15 on the upstream side of the processing chamber 141 of the water washing processing unit, and the substrate S on the conveying mechanism 1 is inclined downward from the downstream side to the upstream side. The high-pressure gas is supplied in the direction, and the high-pressure gas system is supplied through the supply pipe 25 branched from the supply pipe.
與上述噴嘴21同樣，氣體喷嘴21，具有狹縫狀之氣體喷 出口，該氣體噴出口沿著與基板S之搬送方向p正交之方向 延伸，從而可於上述方向上無間隙地對基板s喷出氣體。 再者，於供給配管25·上介設有由電磁閥等構成之變動閥 23'，且藉由控制器60來控制該閥23,。 於該第2實施形態之基板處理裝置中，當基板8自顯影處 理部12搬入至水洗處理部14中時，控制器6〇基於來自檢測 機構7'(編碼器40’）以及基板檢測感測器46，之信號輸出，按 照圖3所示之流程來驅動控制流出阻止裝置2〇,等，從而可 防止顯影液向水洗處理部14 一側漏出等。 即，如上述圖所示，若基於來自檢測機構7，（編碼器40,) 以及基板檢測感測器46,之輸出信號而檢測到基板s停止於 121458.doc -20-Similarly to the nozzle 21, the gas nozzle 21 has a slit-shaped gas discharge port extending in a direction orthogonal to the conveying direction p of the substrate S, so that the substrate s can be applied without a gap in the above direction. Spray gas. Further, a change valve 23' composed of a solenoid valve or the like is interposed in the supply pipe 25, and the valve 23 is controlled by the controller 60. In the substrate processing apparatus according to the second embodiment, when the substrate 8 is carried into the water washing processing unit 14 from the development processing unit 12, the controller 6 detects the sensing based on the detection mechanism 7' (encoder 40') and the substrate. The signal output of the unit 46 is controlled to control the outflow prevention device 2, etc. according to the flow shown in Fig. 3, thereby preventing the developer from leaking to the side of the water washing treatment unit 14 or the like. That is, as shown in the above figure, based on the output signals from the detecting means 7, the encoder (40) and the substrate detecting sensor 46, it is detected that the substrate s is stopped at 121458.doc -20-
1332686 開口。M5之位置之狀態（於步驟sl〇中為"否"），則控制器 對上述閥58進行關閉操作而停止^域理部咐純水之 供給’並對上述閥23,進行開啟操作而使第2流出阻止裝置 〇作動it匕時’藉由對上述閥38進行關閉操作而使顯影處 理部12之顯影液之供給亦停止。 藉由如上所述之方式停止顯影液以及純水之供給，可抑 制例如局部（基板之後端部分）地對基板進行處理之情況，1332686 opening. The state of the position of M5 (in the step s1, "No"), the controller closes the valve 58 and stops the supply of the domain 咐 pure water' and opens the valve 23 described above. When the second outflow prevention device is activated, the supply of the developer in the development processing unit 12 is also stopped by the closing operation of the valve 38. By stopping the supply of the developer and the pure water as described above, it is possible to suppress the processing of the substrate, for example, locally (the rear end portion of the substrate),
又’可防止顯影液以及純水不必要之消耗。又，自第2流 出阻止裝置20,之氣體喷嘴21,向基板S上喷出高壓氣體，藉 此使基板上之顯影液返回至處理室内，從而可阻止其 逆流，藉此可防止顯影液經過基板8而向水洗處理部14一 侧漏出。 若採用上述般之第2實施形態之基板處理裝置，則除了 可防止基板s停止於顯影處理部12之上游側之開口部15之 位置時顯影液向裝載器10一側之漏出等以外，亦可有效地 防止基板S停止於顯影處理部12下游側之開口部Η之位置 時顯影液向水洗處理部14一側漏出等。 再者，上述般第2實施形態之基板處理裝置，亦可用於 對大型基板S之處理。即，如圖6所示，於對較之顯影處理 部12之處理室121更大型之基板8進行處理時，如上述圖所 示，可設想到基板S橫跨裝載器10及水洗處理部M而存在 之狀態下停止之情況。此時，若採用該基板處理裝置，則 顯影液之供給停止，且藉由第！以及第2流出阻止裝置Μ、 20’之作動 向處理 處理室121之上游側以及下游側分別 12l458.doc 21 - 室内部對基板s喑φ古 > 赁出呵壓氣體’因此可有效地防止顯影液 經過基板S而向梦苷·„ , η 裝戰益1 0 —側、或向水洗處理部i 4 一側漏 出。 然而，以上所«·. ^ W說明之基板處理裝置僅係一種對本發明之 板處理裝置之較佳實施形態之示例，於不脫離本發明之 要曰之範圍内，可對其具體之結構進行適當之變形。例 如，亦可採用如下之結構。 (1) "IL出阻止裝置2〇亦可採用如圖7、圖8所示之結構。 <a>圖7所示之流出阻止裝置2〇 °玄机出阻止裝置20具有細長之逆流防止棒70(相當於本 發明之圍堰構件）及致動器72等，該逆流防止棒70於上下 方向具有厚度且沿著滾筒2之轴向延伸，該致動器72使該 逆机防止棒70於搬送機構丨之上方的退避位置（圖7(勾所示 之位置）與抵接於由滾筒2所支撐之基板表面的抵接位置（圖 7(b))之間位移。而且，通常將逆流防止棒7〇設置於退避位 置上，並於基板S發生了搬送異常（基板s之停止）時，將逆 流防止棒70設置於抵接位置，藉此利用該逆流防止棒7〇來 堵住顯影液於基板S上之流動。亦即，可利用該逆流防止 棒70防止顯影液向裝載器10—側漏出。 再者’於該流出阻止裝置2〇中，逆流防止棒7〇之材質較 好的是採用樹脂或橡膠等密封性能較高之材料。又，逆流 防止棒70除了採用於滾筒2之長度方向為直線狀之形狀之 外，亦可以採用俯視時呈弓形彎曲之形狀、或向顯影處理 部12 —側開啟之俯視時呈"口 ”字形之形狀。又，如上述圖 121458.doc -22- 1332686 所示，剖面形狀除了圓形之外’亦可採用矩形。 <1)>圖8所示之流出阻止裝置2〇 該流出阻止裝置20一體地組裝於裝載器ι〇之搬送機構丄 中，並具有提升機構74，該提升機構74藉由氣缸等致動器 76之作動，將搬送機構丨之一部分滾筒2提升到上方。而 且，通常將滾筒2設置於基準位置，，可進行基板搬送 之位置（圖8(a)所示之狀態），並於基板8發生了搬送異常 (基板s之停止）時，使升降機74作動以提升滾筒2(圖8(b)所 示之狀態），藉此以自處理室121之外侧向内側前端下降之 方式使基板s傾斜。亦即，藉由如上所述之方式使基板8傾 斜，使基板s上之顯影液沿著其表面向處理室121 一側流 下’從而防止其逆流’其結果，可防止顯影液向裝載器10 一側漏出。再者，如圖9所示，此時，亦可設置藉由分別 獨立之致動器76a〜76c分別驅動之複數個提升機構 74a〜74C，從而以滾筒2之高度自顯影處理部12一側向上游 側逐漸變高之方式構成流出阻止裝置2〇。若採用該結構， 則由於可使基板s平滑地傾斜，因此不會發生基板s損傷等 不良現象’而且可有效地防止顯影液流出。 再者，此處僅說明了配置於顯影處理部12上游側之流出 阻止裝置20之例，而於第2實施形態之基板處理裝置中所 採用之第2流出阻止裝置2〇1亦可採用相同之結構。 (2)作為檢測基板s之搬送狀態之機構，除了採用如實 施形態般之檢測機構7、7’以外，亦可以採用圖1〇以及圖u 所示之感測器。 121458.doc -23- 1332686 <a>圖10所示之感測器80 如上述圖所示，該感測器80具有發光二極體等光源部 80a、接收自該光源部80a投光並被基板s反射之光（圖像）之 攝像元件80b，該等光源部80a及攝像元件8〇b成為一體。 亦可將上述感測器8 0固定於開口部1 5之上壁面等上，連声 讀取藉由搬送機構1之作動而搬送之基板表面的圖像，並 將該圖像#號輸出至控制器60，繼而基於該圖像之變化檢 測出基板S之搬送狀態、即基板S是否在移動。再者，作為 一種類似之結構（更間單之結構），亦可採用如下結構， 即’藉由受光元件接收自光源部投光且被基板S反射之 光，並基於有無該受光信號之變化來檢測基板S之搬送狀 態。 <b>圖11所示之感測器82 如上述圖所示’該感測器82具備光源部82a和受光部 82b ’該等光源部82a和受光部82b中間隔著搬送機構i搬送 基板s之搬送路徑而彼此對向，而且，由受光部82b接收自 光源部82a投光並透過基板s之光。而且，於基板s上沿著 搬送方向以特定間距標註有遮光用標記Μ。亦可將此種感 測器82固定於開口部15 ’且伴隨著基板8之搬送，將受光 部82b之受光信號輸出至控制器6〇，藉此基於與基板s之遮 光用標記Μ對應之位準之輸出信號（脈衝信號）之變化來檢 測出基板S是否在移動。 (3)於實施形態中，當基板s停滯時，檢測基板s停止之 狀態’並基於該檢測結果執行了使流出阻止裝置2〇、2〇,作 12l458.doc -24- 1332686 動等異常動作序列，然@，例如，亦可檢測基板s之移動 速度而作為基板s之搬送狀態，並基於該檢測速度而轉移 到異常動作序列。具體而言’亦可預先設定基板s之基準 速度（閾值），並於檢測速度為該基準速度以下時，視為基 板S停滯而執行異常動作序列。亦即，即使基板3在移動， 但於其速度極其慢之情況下’與基板S停止時同樣，基板s 上之顯影液也會經由該基板s而向裝載器10一側流動。針 對04 —點，只要對以如上所述之方式基板於基準速度以下 搬送基板之情況進行與基板3之停止狀態相同之處理，則 即使於基板S以基準速度以下之極低速度移動之狀況下， 亦可使流出阻止裝置2G、2G，作動，從而具有能更可靠地防 止顯影液自顯影處理部12漏出之優點。 再者，於此情況下，只要基於來自編碼器4〇(移動狀態 檢測機構7、7·)之輸出脈衝之脈衝數或脈衝寬度，求出基 板s之移動速度即可。例如’編碼請採用具有狹縫板 之編碼器，該狹縫板42於外周方向上以等間距排列有複數 個狹縫42a ’而且’持續監視單位時間所對應之脈衝數之 變動，並基於下式來計算基板s之移動速度即可。 基板速度=(L/S)x(Dp/Tl) 其中’ L :從動輥之周長 S :狹縫42a之數目Further, it prevents the developer and pure water from being consumed unnecessarily. Further, the gas nozzle 21 from the second outflow prevention device 20 ejects high-pressure gas onto the substrate S, thereby returning the developer on the substrate to the processing chamber, thereby preventing the backflow, thereby preventing the developer from passing through. The substrate 8 leaks to the side of the water washing treatment unit 14 . According to the substrate processing apparatus of the second embodiment, the substrate s can be prevented from leaking to the loader 10 side when the substrate s is stopped at the position of the opening 15 on the upstream side of the development processing unit 12, and the like. When the substrate S is stopped at the position of the opening portion 下游 on the downstream side of the development processing unit 12, the developer can be prevented from leaking to the side of the water washing treatment unit 14 or the like. Further, the substrate processing apparatus according to the second embodiment described above can be used for processing the large substrate S. That is, as shown in FIG. 6, when the substrate 8 larger than the processing chamber 121 of the development processing unit 12 is processed, as shown in the above figure, it is conceivable that the substrate S straddles the loader 10 and the water washing processing portion M. And the situation of stopping in the state of existence. At this time, if the substrate processing apparatus is used, the supply of the developer is stopped, and by the first! And the upstream side and the downstream side of the second outflow prevention device Μ, 20', respectively, 12l458.doc 21 - the interior portion of the substrate s 喑 古 ancient > the gas is released, thus effectively preventing The developer passes through the substrate S and leaks to the side of the game, or to the side of the water-washing unit i 4 . However, the substrate processing apparatus described above is only a pair of An example of a preferred embodiment of the present invention can be suitably modified in its specific structure without departing from the scope of the invention. For example, the following structure can also be employed. (1) " The IL out-stop device 2 can also be configured as shown in Figs. 7 and 8. <a> The outflow prevention device 2 shown in Fig. 7 has an elongated backflow prevention rod 70 (equivalent to In the dam member according to the present invention, the actuator 72, and the like, the backflow prevention rod 70 has a thickness in the up and down direction and extends in the axial direction of the drum 2, and the actuator 72 causes the reverse prevention rod 70 to be in the conveying mechanism. The retracted position above (Figure 7 (the position shown in the tick) Displacement between the abutting position (Fig. 7 (b)) abutting on the surface of the substrate supported by the drum 2. Further, the backflow preventing rod 7 is usually placed at the retracted position, and the substrate S is abnormally transported. (When the substrate s is stopped), the backflow prevention rod 70 is placed at the contact position, whereby the backflow prevention rod 7 is used to block the flow of the developer on the substrate S. That is, the backflow prevention rod 70 can be utilized. The developer is prevented from leaking to the side of the loader 10. Further, in the outflow prevention device 2, the material of the backflow prevention rod 7 is preferably made of a material having a high sealing property such as resin or rubber. The rod 70 may have a shape that is linear in the longitudinal direction of the drum 2, and may have a shape that is bow-shaped when viewed in a plan view or a shape that is opened in a plan view toward the side of the development processing unit 12. Further, as shown in the above-mentioned Fig. 121458.doc -22- 1332686, the cross-sectional shape may be rectangular in addition to the circular shape. <1)> The outflow prevention device 2 shown in Fig. 8 is integrated with the outflow prevention device 20 Assembled in the loader ι〇之Shang feeding means and having a lifting mechanism 74, the lift mechanism 74 such as a cylinder by actuating the actuator 76 of the transfer mechanism part of the drum 2 Shu lifted above. Further, generally, the drum 2 is placed at the reference position, and the position at which the substrate is transported (the state shown in FIG. 8(a)) can be performed, and when the substrate 8 is transported abnormally (stopping of the substrate s), the lift 74 is actuated. The substrate s is tilted so as to descend from the outer side of the processing chamber 121 toward the inner front end by the lift roller 2 (the state shown in FIG. 8(b)). That is, by tilting the substrate 8 as described above, the developer on the substrate s flows down along the surface thereof toward the processing chamber 121 side to prevent it from flowing backward. As a result, the developer can be prevented from being applied to the loader 10. One side leaked out. Further, as shown in FIG. 9, at this time, a plurality of lifting mechanisms 74a to 74C driven by the respective independent actuators 76a to 76c may be provided, so that the height of the drum 2 is self-developed by the processing unit 12 side. The way of gradually increasing to the upstream side constitutes the outflow prevention device 2〇. According to this configuration, since the substrate s can be smoothly inclined, a problem such as damage of the substrate s does not occur, and the developer can be effectively prevented from flowing out. Here, only the example of the outflow prevention device 20 disposed on the upstream side of the development processing unit 12 will be described, and the second outflow prevention device 2〇1 used in the substrate processing apparatus according to the second embodiment may be the same. The structure. (2) As the mechanism for detecting the conveyance state of the substrate s, in addition to the detection mechanisms 7 and 7' as in the embodiment, the sensors shown in Figs. 1A and 9b may be employed. 121458.doc -23- 1332686 <a> The sensor 80 shown in Fig. 10 is as shown in the above figure, and the sensor 80 has a light source unit 80a such as a light emitting diode, and receives light from the light source unit 80a. The imaging element 80b of the light (image) reflected by the substrate s is integrated with the light source unit 80a and the imaging element 8〇b. The sensor 80 may be fixed to the upper surface of the opening 15 or the like, and the image of the surface of the substrate conveyed by the operation of the transport mechanism 1 may be continuously read, and the image # is output to The controller 60 then detects the conveyance state of the substrate S, that is, whether or not the substrate S is moving based on the change in the image. Furthermore, as a similar structure (a more monolithic structure), it is also possible to adopt a structure in which light received by the light source unit and reflected by the substrate S is received by the light receiving element, and based on the presence or absence of the change of the light receiving signal. The conveyance state of the substrate S is detected. <b> The sensor 82 shown in Fig. 11 is as shown in the above figure. The sensor 82 includes a light source unit 82a and a light receiving unit 82b. The light source unit 82a and the light receiving unit 82b carry the substrate with the transport mechanism i interposed therebetween. The transport path of the s is opposed to each other, and the light receiving unit 82b receives light that is emitted from the light source unit 82a and transmitted through the substrate s. Further, a light-shielding mark Μ is marked on the substrate s at a specific pitch along the transport direction. The sensor 82 may be fixed to the opening 15' and the light-receiving signal of the light-receiving portion 82b may be output to the controller 6A in accordance with the conveyance of the substrate 8, thereby corresponding to the light-shielding mark 基板 of the substrate s. A change in the level of the output signal (pulse signal) detects whether the substrate S is moving. (3) In the embodiment, when the substrate s is stagnant, the state in which the substrate s is stopped is detected', and based on the detection result, the outflow prevention device 2〇, 2〇 is performed, and the abnormal operation such as 12l458.doc -24 - 1332686 is performed. The sequence, for example, can also detect the moving speed of the substrate s as the transport state of the substrate s, and shift to the abnormal operation sequence based on the detection speed. Specifically, the reference speed (threshold value) of the substrate s may be set in advance, and when the detection speed is equal to or lower than the reference speed, the substrate S is regarded as being stagnated and the abnormal operation sequence is executed. That is, even when the substrate 3 is moving, when the speed is extremely slow, the developing solution on the substrate s flows to the loader 10 side via the substrate s as in the case where the substrate S is stopped. In the case where the substrate is transported at a reference speed or lower as described above, the same processing as in the stop state of the substrate 3 is performed, and even when the substrate S is moved at an extremely low speed equal to or lower than the reference speed, Further, the outflow prevention devices 2G and 2G can be operated to have an advantage of more reliably preventing the developer from leaking from the development processing unit 12. In this case, the moving speed of the substrate s may be obtained based on the number of pulses or the pulse width of the output pulses from the encoder 4 (the moving state detecting means 7, 7·). For example, 'the encoder is an encoder having a slit plate. The slit plate 42 has a plurality of slits 42a' arranged at equal intervals in the outer circumferential direction and continuously monitors the fluctuation of the number of pulses corresponding to the unit time, and based on The formula can be used to calculate the moving speed of the substrate s. Substrate speed = (L / S) x (Dp / Tl) where ' L : the circumference of the driven roller S : the number of slits 42a
Dp/Tl :脈衝速度（Dp :脈衝數；Tl :單位時間） 又：當採用如圖1〇所示之感測器8〇作為檢測基板s之搬 送狀態之裝置時，只要基於單位時間所對應的圖像之位移 121458.doc •25- 1332686 量，出基板s之移動速度即可。x，於採用圖"所 測益82時，與上述編碼器4〇之情況同樣，只 、 衝之脈衝數等求出基板s之移動速度即可。土 ’ 出脈Dp/Tl: pulse speed (Dp: number of pulses; Tl: unit time): When the sensor 8 as shown in FIG. 1A is used as the device for detecting the transport state of the substrate s, it is required to correspond to the unit time. The displacement of the image is 121458.doc • 25- 1332686, and the moving speed of the substrate s can be. x is the same as the case of the encoder 4〇 described above, and the moving speed of the substrate s can be obtained only by the number of pulses or the like. Earth ‘ vein
⑷於實施形態中，執行了如下兩種措施，即 咖開口部15之位置停止(停滞)時之異常動作序列 止顯影液之措施、及使流出阻止裝置2〇作動之措施二 只執行其中之—亦可。亦即，於進行執行使顯影液停止: 措施時，亦可省略流出阻止裝置2〇其本身，與此相對於 ，置流出阻止裝置20時’亦可省略停止顯影液之控制。但 是’為了綜合防止基板S因搬送異常而停止於開口㈣之 位置時之故障，即基板S之處理不良、起因於所漏出之顯 影液之裝載器10之故障、進而顯影液不必要之消耗等較 好的是如實施形態般執行兩種措施。 (5) 於實施形態中，採用了僅於流出阻止裝置2〇處理室 121上游側之開口部15附近配置有氣體噴嘴21之結構，但 如圖12所示，亦可採用於處理室121之内側（開口部υ旁邊 下游之位置）配置有氣體噴嘴21之結構。若採用該結構， 則可更有效地防止顯影液之漏出。再者，雖省略了圖示， 但針對如圖6所示之流出阻止裝置2〇，之結構也相同。 (6) 於實施形態中，檢測機構7以及基板檢測感測器枓 配備於顯影處理部12之最上游側，具體而言係配置於處理 室121最上游之位置，但亦可將其配置於裝載器1〇最下游 側之位置。針對圖6所示之檢測機構7,以及基板檢測感測器 46’也同樣，亦可配備於顯影處理部u之最下游側（處理室 121458.doc •26· 1332686 121最下游之位置）。即，亦可如圖13所示之方式來配置檢 測機構7、7,以及基板檢測感測器46、46，。即使採用此種 結構，亦可良好地檢測基板S於開口部15之搬送狀態。 ⑺於實施形態中，作為基板處理裝置之構成例，說明 了具2裝載器1〇、顯影處理部12以及水洗處理部14之裝 Μ…：本發明亦可適用於具有除此之外之處理部等之基 ‘ 域理裝置。又，實施形態中之搬送機構!以水平姿勢搬 送基板S，但亦可傾斜之姿勢進行搬送。 ® 【圖式簡單說明】 圖1係表示本發明之基板處理裝置之第丨實施形態的圖。 圖2係表示檢測基板之搬送狀態之檢測機構、基板檢測 感測器以及搬送機構的圖。 圖3係表示控制器控制基板處理裝置之動作之一例的流 程圖。 圖4係表示流出阻止裝置之作動狀態的圖。 • 圓5係表示本發明之基板處理裝置之第2實施形態的圖。 圖6係用以說明處理大型基板時之優點的圖。 -圖7係表示流出阻止裝置之其他實施形態的圖（圖7⑷表 示流出阻止裝置之非作動狀態，圖7(b)表示流出阻止裝置 之作動狀態）。 圖8係表示流出阻止裝置之其他實施形態的圖（圖8(勾表 示流出阻止裝置之非作動狀態，圖8(b)表示流出阻止裝置 之作動狀態）。 圖9係表示圖8所示之流出阻止裝置之變形例的圖。 121458.doc -27- 1332686 圖10係表示用以檢測基板之搬送狀態之其他機構的圖。 圖11係表示用以檢測基板之搬送狀態之其他機構的圖。 圖12係表示流出阻止裝置之變形例的圖。 圖13係表示檢測基板之搬送狀態之檢測機構以及基板檢 測感測器之配置之變形例的圖（與圖6對應的圖）。 【主要元件符號說明】(4) In the embodiment, the following two measures are performed, that is, the measure of stopping the developer in the abnormal operation sequence when the position of the coffee opening portion 15 is stopped (stagnation), and the measure for causing the outflow prevention device 2 to actuate - Yes. In other words, when the developing solution is stopped, the flow-out preventing device 2 itself may be omitted, and the control for stopping the developing solution may be omitted when the flow-out preventing device 20 is placed. However, in order to comprehensively prevent the failure of the substrate S to stop at the position of the opening (4) due to the conveyance abnormality, that is, the processing failure of the substrate S, the failure of the loader 10 due to the leaked developer, and unnecessary consumption of the developer, etc. It is preferred to perform both measures as in the embodiment. (5) In the embodiment, the gas nozzle 21 is disposed only in the vicinity of the opening 15 of the upstream side of the processing chamber 121 in the outflow preventing device 2, but as shown in FIG. 12, it may be used in the processing chamber 121. The inside of the inside (the position of the downstream side of the opening part) is arrange|positioned by the gas nozzle 21. According to this configuration, leakage of the developer can be prevented more effectively. Further, although the illustration is omitted, the configuration of the outflow prevention device 2A shown in Fig. 6 is also the same. (6) In the embodiment, the detecting mechanism 7 and the substrate detecting sensor 枓 are disposed on the most upstream side of the development processing unit 12, specifically, at the most upstream position of the processing chamber 121, but may be disposed at The position of the most downstream side of the loader 1〇. Similarly to the detection mechanism 7 and the substrate detection sensor 46' shown in Fig. 6, it may be provided on the most downstream side of the development processing unit u (the most downstream position of the processing chamber 121458.doc • 26· 1332686 121). That is, the detecting mechanisms 7, 7 and the substrate detecting sensors 46, 46 can be arranged as shown in Fig. 13. Even with such a configuration, the conveyance state of the substrate S in the opening portion 15 can be satisfactorily detected. (7) In the embodiment, as a configuration example of the substrate processing apparatus, the mounting device 2, the development processing unit 12, and the water washing processing unit 14 are described. The present invention is also applicable to processing other than the above. Department of the Department of the 'domain device. Further, the transport mechanism in the embodiment: transports the substrate S in a horizontal posture, but may carry it in a tilted posture. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a third embodiment of a substrate processing apparatus according to the present invention. Fig. 2 is a view showing a detecting mechanism for detecting a conveyance state of a substrate, a substrate detecting sensor, and a conveying mechanism. Fig. 3 is a flow chart showing an example of the operation of the controller to control the substrate processing apparatus. Fig. 4 is a view showing an operation state of the outflow prevention device. • The circle 5 shows a second embodiment of the substrate processing apparatus of the present invention. Fig. 6 is a view for explaining the advantages of processing a large substrate. - Fig. 7 is a view showing another embodiment of the outflow prevention device (Fig. 7 (4) shows the inactive state of the outflow prevention device, and Fig. 7 (b) shows the operation state of the outflow prevention device). Fig. 8 is a view showing another embodiment of the outflow prevention device (Fig. 8 (the hook shows the inactive state of the outflow prevention device, and Fig. 8(b) shows the actuation state of the outflow prevention device). Fig. 9 shows the operation shown in Fig. 8. Fig. 10 is a view showing another mechanism for detecting the conveyance state of the substrate. Fig. 11 is a view showing another mechanism for detecting the conveyance state of the substrate. Fig. 12 is a view showing a modification of the outflow prevention device. Fig. 13 is a view showing a modification of the arrangement of the detection means for detecting the conveyance state of the substrate and the arrangement of the substrate detection sensor (corresponding to Fig. 6). Symbol Description】
1 搬送機構 6 從動輥 7 檢測機構 10 裝載機 12 影像處理部 15 開口部 121 、 141 處理室 14 水洗處理部 20 流出阻止裝置 21 空氣喷嘴 30、50 液體喷嘴 46 基板檢測感測器 60 控制器 S 基板 121458.doc -28 -1 conveying mechanism 6 driven roller 7 detecting mechanism 10 loader 12 image processing unit 15 opening portion 121, 141 processing chamber 14 water washing processing portion 20 outflow preventing device 21 air nozzle 30, 50 liquid nozzle 46 substrate detecting sensor 60 controller S substrate 121458.doc -28 -
Claims (1)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006172570A JP4763527B2 (en) | 2006-06-22 | 2006-06-22 | Substrate processing equipment |
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| TW200814183A TW200814183A (en) | 2008-03-16 |
| TWI332686B true TWI332686B (en) | 2010-11-01 |
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| JP (1) | JP4763527B2 (en) |
| KR (1) | KR100863665B1 (en) |
| CN (1) | CN100565792C (en) |
| TW (1) | TW200814183A (en) |
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| JP5415981B2 (en) * | 2010-02-09 | 2014-02-12 | 三菱電機ビルテクノサービス株式会社 | Filter cleaning device and filter cleaning method |
| CN103631100A (en) * | 2012-08-29 | 2014-03-12 | 无锡华润上华半导体有限公司 | Wafer development apparatus and method |
| CN105044943B (en) * | 2015-08-25 | 2018-02-23 | 深圳市华星光电技术有限公司 | Etaching device |
| CN105304535B (en) * | 2015-11-21 | 2018-09-18 | 武汉华星光电技术有限公司 | Display panel manufacture system |
| JP6789026B2 (en) * | 2016-07-28 | 2020-11-25 | 芝浦メカトロニクス株式会社 | Substrate processing equipment and substrate processing method |
| CN111470362B (en) * | 2016-08-08 | 2022-04-01 | 株式会社尼康 | Substrate processing apparatus |
| CN107552461A (en) * | 2017-10-16 | 2018-01-09 | 浙江德立自动化装备股份有限公司 | A kind of smoke exhaust ventilator workpiece dust before pure water cleaning device |
| JP7060415B2 (en) * | 2018-03-12 | 2022-04-26 | 株式会社Ｓｃｒｅｅｎホールディングス | Board processing equipment and board processing method |
| JP7148289B2 (en) * | 2018-06-20 | 2022-10-05 | 芝浦メカトロニクス株式会社 | Substrate detection device and substrate processing device |
| JP6857682B2 (en) * | 2019-03-29 | 2021-04-14 | 芝浦メカトロニクス株式会社 | Board processing equipment |
| JP2023154863A (en) * | 2022-04-08 | 2023-10-20 | 株式会社荏原製作所 | Substrate cleaning device, substrate processing device, substrate cleaning method, and program |
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| JPH087431B2 (en) * | 1988-12-28 | 1996-01-29 | 富士写真フイルム株式会社 | Automatic developing device |
| TW309503B (en) * | 1995-06-27 | 1997-07-01 | Tokyo Electron Co Ltd | |
| JPH1144877A (en) * | 1997-07-24 | 1999-02-16 | Nec Kagoshima Ltd | Substrate washing device |
| JP4213905B2 (en) * | 2002-04-12 | 2009-01-28 | 芝浦メカトロニクス株式会社 | Substrate processing apparatus and processing method |
| JP4201324B2 (en) * | 2003-02-06 | 2008-12-24 | 澁谷工業株式会社 | Cleaning device |
| JP4372536B2 (en) * | 2003-12-26 | 2009-11-25 | 大日本スクリーン製造株式会社 | Substrate cleaning apparatus and substrate processing system |
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| KR20070121598A (en) | 2007-12-27 |
| CN100565792C (en) | 2009-12-02 |
| JP2008004747A (en) | 2008-01-10 |
| KR100863665B1 (en) | 2008-10-15 |
| JP4763527B2 (en) | 2011-08-31 |
| CN101093789A (en) | 2007-12-26 |
| TW200814183A (en) | 2008-03-16 |
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