JP4763527B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

Info

Publication number
JP4763527B2
JP4763527B2 JP2006172570A JP2006172570A JP4763527B2 JP 4763527 B2 JP4763527 B2 JP 4763527B2 JP 2006172570 A JP2006172570 A JP 2006172570A JP 2006172570 A JP2006172570 A JP 2006172570A JP 4763527 B2 JP4763527 B2 JP 4763527B2
Authority
JP
Japan
Prior art keywords
substrate
processing
processing apparatus
unit
processing chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006172570A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008004747A (ja
Inventor
明 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2006172570A priority Critical patent/JP4763527B2/ja
Priority to TW096120004A priority patent/TW200814183A/zh
Priority to CNB2007101120655A priority patent/CN100565792C/zh
Priority to KR1020070061674A priority patent/KR100863665B1/ko
Publication of JP2008004747A publication Critical patent/JP2008004747A/ja
Application granted granted Critical
Publication of JP4763527B2 publication Critical patent/JP4763527B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2006172570A 2006-06-22 2006-06-22 基板処理装置 Expired - Fee Related JP4763527B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006172570A JP4763527B2 (ja) 2006-06-22 2006-06-22 基板処理装置
TW096120004A TW200814183A (en) 2006-06-22 2007-06-04 Substrate processing apparatus
CNB2007101120655A CN100565792C (zh) 2006-06-22 2007-06-22 基板处理装置
KR1020070061674A KR100863665B1 (ko) 2006-06-22 2007-06-22 기판 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006172570A JP4763527B2 (ja) 2006-06-22 2006-06-22 基板処理装置

Publications (2)

Publication Number Publication Date
JP2008004747A JP2008004747A (ja) 2008-01-10
JP4763527B2 true JP4763527B2 (ja) 2011-08-31

Family

ID=38991946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006172570A Expired - Fee Related JP4763527B2 (ja) 2006-06-22 2006-06-22 基板処理装置

Country Status (4)

Country Link
JP (1) JP4763527B2 (ko)
KR (1) KR100863665B1 (ko)
CN (1) CN100565792C (ko)
TW (1) TW200814183A (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5415981B2 (ja) * 2010-02-09 2014-02-12 三菱電機ビルテクノサービス株式会社 フィルタ洗浄装置及びフィルタ洗浄方法
CN103631100A (zh) * 2012-08-29 2014-03-12 无锡华润上华半导体有限公司 晶圆显影装置及方法
CN105044943B (zh) * 2015-08-25 2018-02-23 深圳市华星光电技术有限公司 蚀刻装置
CN105304535B (zh) * 2015-11-21 2018-09-18 武汉华星光电技术有限公司 显示面板制造系统
JP6789026B2 (ja) * 2016-07-28 2020-11-25 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
WO2018030357A1 (ja) * 2016-08-08 2018-02-15 株式会社ニコン 基板処理装置および基板処理方法
CN107552461A (zh) * 2017-10-16 2018-01-09 浙江德立自动化装备股份有限公司 一种抽油烟机工件喷粉前的纯水清洗装置
JP7060415B2 (ja) * 2018-03-12 2022-04-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7148289B2 (ja) * 2018-06-20 2022-10-05 芝浦メカトロニクス株式会社 基板検出装置及び基板処理装置
JP6857682B2 (ja) * 2019-03-29 2021-04-14 芝浦メカトロニクス株式会社 基板処理装置
JP2023154863A (ja) * 2022-04-08 2023-10-20 株式会社荏原製作所 基板洗浄装置、基板処理装置、基板洗浄方法およびプログラム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH087431B2 (ja) * 1988-12-28 1996-01-29 富士写真フイルム株式会社 自動現像装置
TW309503B (ko) * 1995-06-27 1997-07-01 Tokyo Electron Co Ltd
JPH1144877A (ja) * 1997-07-24 1999-02-16 Nec Kagoshima Ltd 基板洗浄装置
JP4213905B2 (ja) * 2002-04-12 2009-01-28 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP4201324B2 (ja) * 2003-02-06 2008-12-24 澁谷工業株式会社 洗浄装置
JP4372536B2 (ja) * 2003-12-26 2009-11-25 大日本スクリーン製造株式会社 基板洗浄装置および基板処理システム

Also Published As

Publication number Publication date
TW200814183A (en) 2008-03-16
CN100565792C (zh) 2009-12-02
KR100863665B1 (ko) 2008-10-15
CN101093789A (zh) 2007-12-26
TWI332686B (ko) 2010-11-01
KR20070121598A (ko) 2007-12-27
JP2008004747A (ja) 2008-01-10

Similar Documents

Publication Publication Date Title
JP4763527B2 (ja) 基板処理装置
JP2009158597A (ja) 基板処理装置
JP2009092656A (ja) 薬液漏れ感知装置および方法
JP3628895B2 (ja) 処理液供給装置
JP6553353B2 (ja) 基板処理方法及びその装置
JP4583235B2 (ja) 処理液吐出装置およびその動作検証方法ならびに同装置の駆動制御方法
JP6534578B2 (ja) 基板処理装置
JP5449116B2 (ja) 現像装置、これを備える現像塗布システム、および現像方法
JP3294023B2 (ja) 基板処理装置
US20040093938A1 (en) Liquid in pipeline and liquid level detection and warning system
JP6789026B2 (ja) 基板処理装置及び基板処理方法
KR100481178B1 (ko) 기판유무검사장치
CN111868882A (zh) 液处理装置和液处理方法
KR101040694B1 (ko) 처리액 공급 방법 및 장치
KR100702793B1 (ko) 포토 레지스트 공급장치 및 포토 레지스트 공급장치의검사방법
JP2000173963A (ja) 基板処理装置
CN111755366B (zh) 基板处理装置
JP2013051337A (ja) 基板処理装置及び処理液の流路切り替え方法
JP7451781B2 (ja) 基板処理装置
JP6534577B2 (ja) 基板処理装置
JP2007037753A (ja) 輸液装置及び輸液装置の制御方法
KR101412199B1 (ko) 누수감지 튜브펌프
KR20070031723A (ko) 약액 공급 장치
KR20020083296A (ko) 스핀코팅장치의 포토레지스트 용액 공급장치 및 방법
KR20220099091A (ko) 액 공급 장치, 액 공급 방법 및 컴퓨터 기억 매체

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20081225

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20101013

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101019

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101208

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110607

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110609

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140617

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees