CN100565792C - 基板处理装置 - Google Patents

基板处理装置 Download PDF

Info

Publication number
CN100565792C
CN100565792C CNB2007101120655A CN200710112065A CN100565792C CN 100565792 C CN100565792 C CN 100565792C CN B2007101120655 A CNB2007101120655 A CN B2007101120655A CN 200710112065 A CN200710112065 A CN 200710112065A CN 100565792 C CN100565792 C CN 100565792C
Authority
CN
China
Prior art keywords
substrate
process chamber
outflow
conveyance
treatment fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2007101120655A
Other languages
English (en)
Chinese (zh)
Other versions
CN101093789A (zh
Inventor
原田明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Skilling Group
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Publication of CN101093789A publication Critical patent/CN101093789A/zh
Application granted granted Critical
Publication of CN100565792C publication Critical patent/CN100565792C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
CNB2007101120655A 2006-06-22 2007-06-22 基板处理装置 Expired - Fee Related CN100565792C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006172570A JP4763527B2 (ja) 2006-06-22 2006-06-22 基板処理装置
JP2006172570 2006-06-22

Publications (2)

Publication Number Publication Date
CN101093789A CN101093789A (zh) 2007-12-26
CN100565792C true CN100565792C (zh) 2009-12-02

Family

ID=38991946

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2007101120655A Expired - Fee Related CN100565792C (zh) 2006-06-22 2007-06-22 基板处理装置

Country Status (4)

Country Link
JP (1) JP4763527B2 (ko)
KR (1) KR100863665B1 (ko)
CN (1) CN100565792C (ko)
TW (1) TW200814183A (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5415981B2 (ja) * 2010-02-09 2014-02-12 三菱電機ビルテクノサービス株式会社 フィルタ洗浄装置及びフィルタ洗浄方法
CN103631100A (zh) * 2012-08-29 2014-03-12 无锡华润上华半导体有限公司 晶圆显影装置及方法
CN105044943B (zh) * 2015-08-25 2018-02-23 深圳市华星光电技术有限公司 蚀刻装置
CN105304535B (zh) * 2015-11-21 2018-09-18 武汉华星光电技术有限公司 显示面板制造系统
JP6789026B2 (ja) * 2016-07-28 2020-11-25 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
WO2018030357A1 (ja) * 2016-08-08 2018-02-15 株式会社ニコン 基板処理装置および基板処理方法
CN107552461A (zh) * 2017-10-16 2018-01-09 浙江德立自动化装备股份有限公司 一种抽油烟机工件喷粉前的纯水清洗装置
JP7060415B2 (ja) * 2018-03-12 2022-04-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7148289B2 (ja) * 2018-06-20 2022-10-05 芝浦メカトロニクス株式会社 基板検出装置及び基板処理装置
JP6857682B2 (ja) * 2019-03-29 2021-04-14 芝浦メカトロニクス株式会社 基板処理装置
JP2023154863A (ja) * 2022-04-08 2023-10-20 株式会社荏原製作所 基板洗浄装置、基板処理装置、基板洗浄方法およびプログラム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH087431B2 (ja) * 1988-12-28 1996-01-29 富士写真フイルム株式会社 自動現像装置
TW309503B (ko) * 1995-06-27 1997-07-01 Tokyo Electron Co Ltd
JPH1144877A (ja) * 1997-07-24 1999-02-16 Nec Kagoshima Ltd 基板洗浄装置
JP4213905B2 (ja) * 2002-04-12 2009-01-28 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP4201324B2 (ja) * 2003-02-06 2008-12-24 澁谷工業株式会社 洗浄装置
JP4372536B2 (ja) * 2003-12-26 2009-11-25 大日本スクリーン製造株式会社 基板洗浄装置および基板処理システム

Also Published As

Publication number Publication date
TW200814183A (en) 2008-03-16
JP4763527B2 (ja) 2011-08-31
KR100863665B1 (ko) 2008-10-15
CN101093789A (zh) 2007-12-26
TWI332686B (ko) 2010-11-01
KR20070121598A (ko) 2007-12-27
JP2008004747A (ja) 2008-01-10

Similar Documents

Publication Publication Date Title
CN100565792C (zh) 基板处理装置
US6752599B2 (en) Apparatus for photoresist delivery
JP2010067978A (ja) フォトレジスト供給装置及び方法
JP2009158597A (ja) 基板処理装置
CN101026115A (zh) 基板裂纹检测装置以及基板处理装置
JP3628895B2 (ja) 処理液供給装置
JP4583235B2 (ja) 処理液吐出装置およびその動作検証方法ならびに同装置の駆動制御方法
JP6534578B2 (ja) 基板処理装置
JP5090460B2 (ja) 処理液供給機構および処理液供給方法
JP5379079B2 (ja) 搬送装置
JP2010217147A (ja) 生化学自動分析装置用流系内圧力制御システム
JP3294023B2 (ja) 基板処理装置
CN111755366B (zh) 基板处理装置
KR19990041379U (ko) 포토레지스트 공급장치
KR100648198B1 (ko) 밸브 시스템 및 이를 포함하는 반도체 기판 가공 장치
JP4884169B2 (ja) 処理システム
JP6534577B2 (ja) 基板処理装置
JP2006189259A (ja) 配管状態検出方法および装置
JP4418706B2 (ja) 液吸引吐出制御方法及びこれを用いた液吸引吐出装置
KR20070031723A (ko) 약액 공급 장치
KR101037182B1 (ko) 기판 제조장치의 약액 처리장치 및 그 방법
JPH10232156A (ja) 液量検出装置
KR20220099091A (ko) 액 공급 장치, 액 공급 방법 및 컴퓨터 기억 매체
KR20070007450A (ko) 케미컬 필터상태 검출장치
JP2006035185A (ja) 処理液供給方法及び処理液供給装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: SCREEN GROUP CO., LTD.

Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD.

Owner name: DAINIPPON SCREEN MFG. CO., LTD.

Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: Kyoto City, Kyoto, Japan

Patentee after: Skilling Group

Address before: Kyoto City, Kyoto, Japan

Patentee before: DAINIPPON SCREEN MFG Co.,Ltd.

Address after: Kyoto City, Kyoto, Japan

Patentee after: DAINIPPON SCREEN MFG Co.,Ltd.

Address before: Kyoto City, Kyoto, Japan

Patentee before: Dainippon Screen Mfg. Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091202

Termination date: 20160622

CF01 Termination of patent right due to non-payment of annual fee