TWI329918B - Semiconductor multi-package module having wire bond interconnection between stacked packages - Google Patents

Semiconductor multi-package module having wire bond interconnection between stacked packages Download PDF

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Publication number
TWI329918B
TWI329918B TW092125625A TW92125625A TWI329918B TW I329918 B TWI329918 B TW I329918B TW 092125625 A TW092125625 A TW 092125625A TW 92125625 A TW92125625 A TW 92125625A TW I329918 B TWI329918 B TW I329918B
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TW
Taiwan
Prior art keywords
package
die
substrate
module
stacked
Prior art date
Application number
TW092125625A
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English (en)
Chinese (zh)
Other versions
TW200419765A (en
Inventor
Karnezos Marcos
Original Assignee
Chippac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/632,552 external-priority patent/US20040061213A1/en
Priority claimed from US10/632,551 external-priority patent/US6838761B2/en
Priority claimed from US10/632,553 external-priority patent/US7053476B2/en
Priority claimed from US10/632,549 external-priority patent/US7064426B2/en
Priority claimed from US10/632,568 external-priority patent/US7205647B2/en
Priority claimed from US10/632,550 external-priority patent/US6972481B2/en
Application filed by Chippac Inc filed Critical Chippac Inc
Publication of TW200419765A publication Critical patent/TW200419765A/zh
Application granted granted Critical
Publication of TWI329918B publication Critical patent/TWI329918B/zh

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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
    • H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW092125625A 2002-09-17 2003-09-17 Semiconductor multi-package module having wire bond interconnection between stacked packages TWI329918B (en)

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US41159002P 2002-09-17 2002-09-17
US10/632,552 US20040061213A1 (en) 2002-09-17 2003-08-02 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages
US10/632,551 US6838761B2 (en) 2002-09-17 2003-08-02 Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield
US10/632,553 US7053476B2 (en) 2002-09-17 2003-08-02 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages
US10/632,549 US7064426B2 (en) 2002-09-17 2003-08-02 Semiconductor multi-package module having wire bond interconnect between stacked packages
US10/632,568 US7205647B2 (en) 2002-09-17 2003-08-02 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages
US10/632,550 US6972481B2 (en) 2002-09-17 2003-08-02 Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages

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TW200419765A TW200419765A (en) 2004-10-01
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TW100113640A TWI469301B (zh) 2002-09-17 2003-09-17 堆疊封裝間具有線接點互連之半導體多重封裝模組
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TW098139252A TWI378548B (en) 2002-09-17 2003-09-17 Semiconductor multi-package module having wire bond interconnection between stacked packages

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WO2004027823A3 (en) 2004-05-21
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EP1547141A4 (en) 2010-02-24
AU2003272405A1 (en) 2004-04-08
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EP1547141A2 (en) 2005-06-29
TW200419765A (en) 2004-10-01
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AU2003272405A8 (en) 2004-04-08
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TWI378548B (en) 2012-12-01
TW201131731A (en) 2011-09-16
JP5856103B2 (ja) 2016-02-09
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JP5602685B2 (ja) 2014-10-08
TWI469301B (zh) 2015-01-11

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