JP4800625B2 - 積み重ねられたパッケージ間のワイヤボンド相互接続を有する半導体マルチパッケージモジュール及びその形成方法 - Google Patents
積み重ねられたパッケージ間のワイヤボンド相互接続を有する半導体マルチパッケージモジュール及びその形成方法 Download PDFInfo
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- JP4800625B2 JP4800625B2 JP2004568930A JP2004568930A JP4800625B2 JP 4800625 B2 JP4800625 B2 JP 4800625B2 JP 2004568930 A JP2004568930 A JP 2004568930A JP 2004568930 A JP2004568930 A JP 2004568930A JP 4800625 B2 JP4800625 B2 JP 4800625B2
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- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
単に平面のヒートスプレッダをドロップインモールド処理したり、トップパッケージダイスの上側表面またはトップパッケージ上のスペーサの上側表面に接着剤を適用し、当該接着剤の上に平面のヒートスプレッダを取り付けたりすることにより挿入する。
400 ボトムパッケージ
401 縁部
412 トップパッケージ基板
413 接着剤
414 ダイス
415,427 はんだマスク
416 ワイヤボンド
417 モールディングコンパウンド
418 はんだボール
419 ボトムパッケージ上側表面
421,423 金属レイヤ
422 バイアス
424 ボトムパッケージz軸相互接続パッド
426 カプセル体の縁部
500 トップパッケージ
501 縁部
503,513 接着剤
507 モジュールカプセル体
512 トップパッケージ基板
514 ダイス
515,527 はんだマスク
516,518 ワイヤボンド
517 モールディングコンパウンド
519 トップパッケージ上側表面
521,523 金属レイヤ
522 バイアス
524 トップパッケージz軸相互接続パッド
525 上側表面
526 カプセル体の縁部
Claims (4)
- 第1基板と、第1ダイスと、該第1基板上に形成された第1金属レイヤと、前記第1ダイスと前記第1金属レイヤとを電気的に接続する第1ワイヤボンドとを有する第1パッケージ上に積み重ねられ、第2基板と、第2ダイスと、前記第2基板上に形成された第2金属レイヤと、前記第2ダイスと前記第2金属レイヤとを電気的に接続する第2ワイヤボンドとを有する第2パッケージを有し、前記積み重ねられた第1と第2パッケージの前記第1金属レイヤと前記第2金属レイヤは、第3ワイヤボンドにより電気的に相互接続され、前記第1と第2パッケージの少なくとも1つは、電気遮蔽材を有していることを特徴とするマルチパッケージモジュール。
- 第1基板と、第1ダイスと、該第1基板上に形成された第1金属レイヤと、前記第1ダイスと前記第1金属レイヤとを電気的に接続する第1ワイヤボンドとを有する第1パッケージ上に積み重ねられ、第2基板と、第2ダイスと、前記第2基板上に形成された第2金属レイヤと、前記第2ダイスと前記第2金属レイヤとを電気的に接続する第2ワイヤボンドとを有する第2パッケージを具備するマルチパッケージモジュールの形成方法であって、
電気遮蔽材を有する前記第1パッケージを供給し、
前記第2パッケージを供給し、
前記電気遮蔽材の略平面な上側表面に前記第2パッケージを積み重ね、そして、
前記第1および第2パッケージの前記第1金属レイヤと前記第2金属レイヤを第3ワイヤボンドにより電気的に相互接続することを特徴とするマルチパッケージモジュールの形成方法。 - 第1基板と、第1ダイスと、該第1基板上に形成された第1金属レイヤと、前記第1ダイスと前記第1金属レイヤとを電気的に接続する第1ワイヤボンドとを有する第1パッケージ上に積み重ねられ、第2基板と、第2ダイスと、前記第2基板上に形成された第2金属レイヤと、前記第2ダイスと前記第2金属レイヤとを電気的に接続する第2ワイヤボンドとを有する第2パッケージを有するマルチパッケージモジュールを具備する携帯機器であって、積み重ねられた前記第1と第2パッケージの前記第1金属レイヤと前記第2金属レイヤは、第3ワイヤボンドにより電気的に相互接続され、前記第1と第2パッケージの少なくとも1つは、電気遮蔽材を有することを特徴とする携帯機器。
- 第1基板と、第1ダイスと、該第1基板上に形成された第1金属レイヤと、前記第1ダイスと前記第1金属レイヤとを電気的に接続する第1ワイヤボンドとを有する第1パッケージ上に積み重ねられ、第2基板と、第2ダイスと、前記第2基板上に形成された第2金属レイヤと、前記第2ダイスと前記第2金属レイヤとを電気的に接続する第2ワイヤボンドとを有する第2パッケージを有するマルチパッケージモジュールを具備するコンピュータであって、積み重ねられた前記第1と第2パッケージの前記第1金属レイヤと前記第2金属レイヤは、第3ワイヤボンドにより電気的に相互接続され、前記第1と第2パッケージの少なくとも1つは、電気遮蔽材を有することを特徴とするコンピュータ。
Applications Claiming Priority (15)
Application Number | Priority Date | Filing Date | Title |
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US41159002P | 2002-09-17 | 2002-09-17 | |
US60/411,590 | 2002-09-17 | ||
US10/632,550 US6972481B2 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages |
US10/632,552 | 2003-08-02 | ||
US10/632,553 US7053476B2 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages |
US10/632,551 | 2003-08-02 | ||
US10/632,553 | 2003-08-02 | ||
US10/632,552 US20040061213A1 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages |
US10/632,568 | 2003-08-02 | ||
US10/632,549 | 2003-08-02 | ||
US10/632,551 US6838761B2 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield |
US10/632,568 US7205647B2 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages |
US10/632,550 | 2003-08-02 | ||
US10/632,549 US7064426B2 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module having wire bond interconnect between stacked packages |
PCT/US2003/028919 WO2004027823A2 (en) | 2002-09-17 | 2003-09-15 | Semiconductor multi-package module having wire bond interconnection between stacked packages |
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JP2011137096A Division JP5602685B2 (ja) | 2002-09-17 | 2011-06-21 | マルチパッケージモジュールおよびその形成方法 |
Publications (3)
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JP2005539403A JP2005539403A (ja) | 2005-12-22 |
JP2005539403A5 JP2005539403A5 (ja) | 2006-11-02 |
JP4800625B2 true JP4800625B2 (ja) | 2011-10-26 |
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JP2004568930A Expired - Fee Related JP4800625B2 (ja) | 2002-09-17 | 2003-09-15 | 積み重ねられたパッケージ間のワイヤボンド相互接続を有する半導体マルチパッケージモジュール及びその形成方法 |
JP2011137096A Expired - Fee Related JP5602685B2 (ja) | 2002-09-17 | 2011-06-21 | マルチパッケージモジュールおよびその形成方法 |
JP2013123601A Expired - Lifetime JP5856103B2 (ja) | 2002-09-17 | 2013-06-12 | 積み重ねられたパッケージ間のワイヤボンド相互接続を有する半導体マルチパッケージモジュール |
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JP2011137096A Expired - Fee Related JP5602685B2 (ja) | 2002-09-17 | 2011-06-21 | マルチパッケージモジュールおよびその形成方法 |
JP2013123601A Expired - Lifetime JP5856103B2 (ja) | 2002-09-17 | 2013-06-12 | 積み重ねられたパッケージ間のワイヤボンド相互接続を有する半導体マルチパッケージモジュール |
Country Status (6)
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EP (1) | EP1547141A4 (ja) |
JP (3) | JP4800625B2 (ja) |
KR (1) | KR101166575B1 (ja) |
AU (1) | AU2003272405A1 (ja) |
TW (3) | TWI378548B (ja) |
WO (1) | WO2004027823A2 (ja) |
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Also Published As
Publication number | Publication date |
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WO2004027823A2 (en) | 2004-04-01 |
WO2004027823A3 (en) | 2004-05-21 |
EP1547141A4 (en) | 2010-02-24 |
JP2013211589A (ja) | 2013-10-10 |
AU2003272405A8 (en) | 2004-04-08 |
JP2005539403A (ja) | 2005-12-22 |
AU2003272405A1 (en) | 2004-04-08 |
TW201131731A (en) | 2011-09-16 |
JP5856103B2 (ja) | 2016-02-09 |
EP1547141A2 (en) | 2005-06-29 |
KR20050044925A (ko) | 2005-05-13 |
TW200419765A (en) | 2004-10-01 |
JP5602685B2 (ja) | 2014-10-08 |
TWI469301B (zh) | 2015-01-11 |
KR101166575B1 (ko) | 2012-07-18 |
TW201017853A (en) | 2010-05-01 |
JP2011181971A (ja) | 2011-09-15 |
TWI329918B (en) | 2010-09-01 |
TWI378548B (en) | 2012-12-01 |
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