TWI322172B - Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition - Google Patents

Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition Download PDF

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Publication number
TWI322172B
TWI322172B TW092104928A TW92104928A TWI322172B TW I322172 B TWI322172 B TW I322172B TW 092104928 A TW092104928 A TW 092104928A TW 92104928 A TW92104928 A TW 92104928A TW I322172 B TWI322172 B TW I322172B
Authority
TW
Taiwan
Prior art keywords
adhesive composition
solvent
cationic polymerization
cationic
polymerization catalyst
Prior art date
Application number
TW092104928A
Other languages
English (en)
Chinese (zh)
Other versions
TW200304935A (en
Inventor
Yamaguchi Hiroaki
Akiyama Ryota
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200304935A publication Critical patent/TW200304935A/zh
Application granted granted Critical
Publication of TWI322172B publication Critical patent/TWI322172B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW092104928A 2002-04-01 2003-03-07 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition TWI322172B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002099071A JP4201519B2 (ja) 2002-04-01 2002-04-01 カチオン重合性接着剤組成物及び異方導電性接着剤組成物

Publications (2)

Publication Number Publication Date
TW200304935A TW200304935A (en) 2003-10-16
TWI322172B true TWI322172B (en) 2010-03-21

Family

ID=28786222

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092104928A TWI322172B (en) 2002-04-01 2003-03-07 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition

Country Status (10)

Country Link
EP (1) EP1490450B1 (https=)
JP (1) JP4201519B2 (https=)
KR (1) KR20040111454A (https=)
CN (1) CN1312246C (https=)
AT (1) ATE338102T1 (https=)
AU (1) AU2003215305A1 (https=)
DE (1) DE60308000T2 (https=)
MY (1) MY133275A (https=)
TW (1) TWI322172B (https=)
WO (1) WO2003085062A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11016385B2 (en) 2018-08-21 2021-05-25 Industrial Technology Research Institute Photosensitive adhesive composition, photosensitive conductive adhesive composition, and electronic device containing photosensitive conductive adhesive composition

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WO2005002002A1 (ja) 2003-06-25 2005-01-06 Hitachi Chemical Co., Ltd. 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP3977302B2 (ja) 2003-08-13 2007-09-19 キヤノン株式会社 露光装置及びその使用方法並びにデバイス製造方法
US20070213429A1 (en) * 2006-03-10 2007-09-13 Chih-Min Cheng Anisotropic conductive adhesive
DE102009013710A1 (de) * 2009-03-20 2010-09-23 Merck Patent Gmbh Polymere aus Mischungen mit Vinylether-Monomeren
EP2468835B1 (en) * 2009-08-21 2019-01-02 DIC Corporation Cationically polymerizable adhesive and polarizing plate obtained using same
JP5643623B2 (ja) * 2010-12-02 2014-12-17 デクセリアルズ株式会社 異方性導電材料及びその製造方法
KR101671187B1 (ko) * 2010-12-31 2016-11-01 동우 화인켐 주식회사 점착제 조성물, 이를 포함하는 편광판 및 액정표시장치
JP2011102404A (ja) * 2011-02-17 2011-05-26 Sony Chemical & Information Device Corp 異方性導電フィルム
CN102690611B (zh) * 2011-12-27 2015-06-24 3M中国有限公司 胶带组合物以及由其制备的胶带
JP6002518B2 (ja) * 2012-09-21 2016-10-05 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
CN103333463A (zh) * 2013-06-26 2013-10-02 苏州天脉导热科技有限公司 一种导热母粒的制备方法
KR101712703B1 (ko) * 2014-07-18 2017-03-06 삼성에스디아이 주식회사 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치
JP2016060761A (ja) * 2014-09-16 2016-04-25 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体の製造方法
JP2018104653A (ja) * 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤
DE102017001696A1 (de) * 2017-02-22 2018-08-23 Lohmann Gmbh & Co. Kg UV-aktivierbares strukturelles Haftklebeband
KR102878827B1 (ko) 2020-09-28 2025-11-03 삼성디스플레이 주식회사 타일드 표시 장치
KR20260023513A (ko) * 2023-06-16 2026-02-20 가부시끼가이샤 쓰리본드 도전성 수지 접착제 및 그 경화물
KR20250041206A (ko) 2023-09-18 2025-03-25 엘지디스플레이 주식회사 이방성 도전필름 및 이를 포함하는 표시장치
JP2025079120A (ja) * 2023-11-09 2025-05-21 株式会社レゾナック 回路接続構造体の製造方法、回路接続用接着剤フィルム、及び回路接続構造体

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JPS6490269A (en) * 1987-09-30 1989-04-06 Fujikura Ltd Anisotropically conductive adhesive coating
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JPH08295830A (ja) * 1995-04-27 1996-11-12 Sekisui Chem Co Ltd 導電性塗料組成物及びそれを用いた物品
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11016385B2 (en) 2018-08-21 2021-05-25 Industrial Technology Research Institute Photosensitive adhesive composition, photosensitive conductive adhesive composition, and electronic device containing photosensitive conductive adhesive composition

Also Published As

Publication number Publication date
JP2003292921A (ja) 2003-10-15
DE60308000T2 (de) 2007-03-01
DE60308000D1 (de) 2006-10-12
EP1490450A1 (en) 2004-12-29
KR20040111454A (ko) 2004-12-31
CN1646657A (zh) 2005-07-27
ATE338102T1 (de) 2006-09-15
EP1490450B1 (en) 2006-08-30
CN1312246C (zh) 2007-04-25
TW200304935A (en) 2003-10-16
HK1073473A1 (en) 2005-10-07
WO2003085062A1 (en) 2003-10-16
MY133275A (en) 2007-10-31
JP4201519B2 (ja) 2008-12-24
AU2003215305A1 (en) 2003-10-20

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