KR20040111454A - 양이온 중합성 접착제 조성물 및 이방 도전성 접착제조성물 - Google Patents

양이온 중합성 접착제 조성물 및 이방 도전성 접착제조성물 Download PDF

Info

Publication number
KR20040111454A
KR20040111454A KR10-2004-7015480A KR20047015480A KR20040111454A KR 20040111454 A KR20040111454 A KR 20040111454A KR 20047015480 A KR20047015480 A KR 20047015480A KR 20040111454 A KR20040111454 A KR 20040111454A
Authority
KR
South Korea
Prior art keywords
adhesive composition
cationic polymerization
polymerization catalyst
cationic
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR10-2004-7015480A
Other languages
English (en)
Korean (ko)
Inventor
히로아끼 야마구찌
료따 아끼야마
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20040111454A publication Critical patent/KR20040111454A/ko
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
KR10-2004-7015480A 2002-04-01 2003-02-19 양이온 중합성 접착제 조성물 및 이방 도전성 접착제조성물 Ceased KR20040111454A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002099071A JP4201519B2 (ja) 2002-04-01 2002-04-01 カチオン重合性接着剤組成物及び異方導電性接着剤組成物
JPJP-P-2002-00099071 2002-04-01
PCT/US2003/004944 WO2003085062A1 (en) 2002-04-01 2003-02-19 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition

Publications (1)

Publication Number Publication Date
KR20040111454A true KR20040111454A (ko) 2004-12-31

Family

ID=28786222

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-7015480A Ceased KR20040111454A (ko) 2002-04-01 2003-02-19 양이온 중합성 접착제 조성물 및 이방 도전성 접착제조성물

Country Status (10)

Country Link
EP (1) EP1490450B1 (https=)
JP (1) JP4201519B2 (https=)
KR (1) KR20040111454A (https=)
CN (1) CN1312246C (https=)
AT (1) ATE338102T1 (https=)
AU (1) AU2003215305A1 (https=)
DE (1) DE60308000T2 (https=)
MY (1) MY133275A (https=)
TW (1) TWI322172B (https=)
WO (1) WO2003085062A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120078119A (ko) * 2010-12-31 2012-07-10 동우 화인켐 주식회사 점착제 조성물, 이를 포함하는 편광판 및 액정표시장치
US12288772B2 (en) 2020-09-28 2025-04-29 Samsung Display Co., Ltd. Tiled display device

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005002002A1 (ja) 2003-06-25 2005-01-06 Hitachi Chemical Co., Ltd. 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP3977302B2 (ja) 2003-08-13 2007-09-19 キヤノン株式会社 露光装置及びその使用方法並びにデバイス製造方法
US20070213429A1 (en) * 2006-03-10 2007-09-13 Chih-Min Cheng Anisotropic conductive adhesive
DE102009013710A1 (de) * 2009-03-20 2010-09-23 Merck Patent Gmbh Polymere aus Mischungen mit Vinylether-Monomeren
EP2468835B1 (en) * 2009-08-21 2019-01-02 DIC Corporation Cationically polymerizable adhesive and polarizing plate obtained using same
JP5643623B2 (ja) * 2010-12-02 2014-12-17 デクセリアルズ株式会社 異方性導電材料及びその製造方法
JP2011102404A (ja) * 2011-02-17 2011-05-26 Sony Chemical & Information Device Corp 異方性導電フィルム
CN102690611B (zh) * 2011-12-27 2015-06-24 3M中国有限公司 胶带组合物以及由其制备的胶带
JP6002518B2 (ja) * 2012-09-21 2016-10-05 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
CN103333463A (zh) * 2013-06-26 2013-10-02 苏州天脉导热科技有限公司 一种导热母粒的制备方法
KR101712703B1 (ko) * 2014-07-18 2017-03-06 삼성에스디아이 주식회사 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치
JP2016060761A (ja) * 2014-09-16 2016-04-25 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体の製造方法
JP2018104653A (ja) * 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤
DE102017001696A1 (de) * 2017-02-22 2018-08-23 Lohmann Gmbh & Co. Kg UV-aktivierbares strukturelles Haftklebeband
TWI672351B (zh) 2018-08-21 2019-09-21 財團法人工業技術研究院 感光膠組合物、感光導電膠組合物及包含感光導電膠組合物之電子裝置
KR20260023513A (ko) * 2023-06-16 2026-02-20 가부시끼가이샤 쓰리본드 도전성 수지 접착제 및 그 경화물
KR20250041206A (ko) 2023-09-18 2025-03-25 엘지디스플레이 주식회사 이방성 도전필름 및 이를 포함하는 표시장치
JP2025079120A (ja) * 2023-11-09 2025-05-21 株式会社レゾナック 回路接続構造体の製造方法、回路接続用接着剤フィルム、及び回路接続構造体

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3998983A (en) * 1975-06-27 1976-12-21 Westinghouse Electric Corporation Resin rich epoxide-mica flexible high voltage insulation
JPS6490269A (en) * 1987-09-30 1989-04-06 Fujikura Ltd Anisotropically conductive adhesive coating
JPH05262816A (ja) * 1992-03-18 1993-10-12 Nippon Oil & Fats Co Ltd 熱潜在性有機金属触媒
JPH05287696A (ja) * 1992-04-09 1993-11-02 Nippon Kayaku Co Ltd 紙用活性エネルギー線硬化性樹脂組成物及びその硬化物
US5403869A (en) * 1992-08-17 1995-04-04 Hitachi Chemical Company, Ltd. Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator
US5362421A (en) * 1993-06-16 1994-11-08 Minnesota Mining And Manufacturing Company Electrically conductive adhesive compositions
US5453450A (en) * 1993-06-16 1995-09-26 Minnesota Mining And Manufacturing Company Stabilized curable adhesives
JPH08295830A (ja) * 1995-04-27 1996-11-12 Sekisui Chem Co Ltd 導電性塗料組成物及びそれを用いた物品
KR100563806B1 (ko) * 1997-08-19 2006-03-28 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 전도성 에폭시 수지 조성물, 비등방 전도성 접착 필름 및전기 접속 방법
JP3775773B2 (ja) * 1998-06-17 2006-05-17 株式会社東芝 硬化触媒、樹脂組成物、樹脂封止型半導体装置、およびコーティング材
JP2001048921A (ja) * 1999-08-04 2001-02-20 Daicel Chem Ind Ltd エポキシ化ジエン系ブロック共重合体の粉末状水和反応物およびその製法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120078119A (ko) * 2010-12-31 2012-07-10 동우 화인켐 주식회사 점착제 조성물, 이를 포함하는 편광판 및 액정표시장치
US12288772B2 (en) 2020-09-28 2025-04-29 Samsung Display Co., Ltd. Tiled display device

Also Published As

Publication number Publication date
JP2003292921A (ja) 2003-10-15
DE60308000T2 (de) 2007-03-01
DE60308000D1 (de) 2006-10-12
EP1490450A1 (en) 2004-12-29
CN1646657A (zh) 2005-07-27
ATE338102T1 (de) 2006-09-15
EP1490450B1 (en) 2006-08-30
CN1312246C (zh) 2007-04-25
TW200304935A (en) 2003-10-16
HK1073473A1 (en) 2005-10-07
WO2003085062A1 (en) 2003-10-16
MY133275A (en) 2007-10-31
JP4201519B2 (ja) 2008-12-24
TWI322172B (en) 2010-03-21
AU2003215305A1 (en) 2003-10-20

Similar Documents

Publication Publication Date Title
KR20040111454A (ko) 양이온 중합성 접착제 조성물 및 이방 도전성 접착제조성물
US6699351B2 (en) Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it
JP2021185256A (ja) 接着剤組成物及びフィルム状接着剤組成物
CN1289621C (zh) 可阳离子聚合的粘合剂组合物和各向异性导电粘合剂组合物
JP5561199B2 (ja) 接着剤組成物、回路接続材料、接続体及びその製造方法、並びに半導体装置
CN101970525A (zh) 固化性组合物、各向异性导电材料及连接结构体
EP1401984B1 (en) Ultraviolet activatable adhesive film
CN104541333A (zh) 导电材料、连接结构体及连接结构体的制造方法
JP2011111557A (ja) 接着剤組成物、回路接続材料、接続体及び回路部材の接続方法、並びに半導体装置
EP1272586B1 (en) Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it
JP6672837B2 (ja) 異方導電性接着剤組成物、フィルム状接着剤、接続構造体及び半導体装置
JP2004155957A (ja) 異方導電性接着剤及びフィルム
CN103773265B (zh) 各向异性导电性粘接剂组合物
US20050256230A1 (en) Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
US20040266913A1 (en) Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
HK1073473B (en) Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
CN117659667A (zh) 热固化型树脂组合物、各向异性导电膜及连接结构体
JP6265242B2 (ja) 異方導電性接着剤組成物

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20040930

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20080214

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20091204

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20100518

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20091204

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I