DE60308000D1 - Kationisch polymerisierbare klebstoffzusammensetzung und elektrisch anisotrop leitende klebstoffzusammensetzung - Google Patents

Kationisch polymerisierbare klebstoffzusammensetzung und elektrisch anisotrop leitende klebstoffzusammensetzung

Info

Publication number
DE60308000D1
DE60308000D1 DE60308000T DE60308000T DE60308000D1 DE 60308000 D1 DE60308000 D1 DE 60308000D1 DE 60308000 T DE60308000 T DE 60308000T DE 60308000 T DE60308000 T DE 60308000T DE 60308000 D1 DE60308000 D1 DE 60308000D1
Authority
DE
Germany
Prior art keywords
adhesive composition
cationic polymerizable
anisotrop
electrically
leading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60308000T
Other languages
English (en)
Other versions
DE60308000T2 (de
Inventor
Hiroaki Yamaguchi
Ryota Akiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of DE60308000D1 publication Critical patent/DE60308000D1/de
Publication of DE60308000T2 publication Critical patent/DE60308000T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
DE60308000T 2002-04-01 2003-02-19 Kationisch polymerisierbare klebstoffzusammensetzung und elektrisch anisotrop leitende klebstoffzusammensetzung Expired - Lifetime DE60308000T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002099071A JP4201519B2 (ja) 2002-04-01 2002-04-01 カチオン重合性接着剤組成物及び異方導電性接着剤組成物
JP2002099071 2002-04-01
PCT/US2003/004944 WO2003085062A1 (en) 2002-04-01 2003-02-19 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition

Publications (2)

Publication Number Publication Date
DE60308000D1 true DE60308000D1 (de) 2006-10-12
DE60308000T2 DE60308000T2 (de) 2007-03-01

Family

ID=28786222

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60308000T Expired - Lifetime DE60308000T2 (de) 2002-04-01 2003-02-19 Kationisch polymerisierbare klebstoffzusammensetzung und elektrisch anisotrop leitende klebstoffzusammensetzung

Country Status (11)

Country Link
EP (1) EP1490450B1 (de)
JP (1) JP4201519B2 (de)
KR (1) KR20040111454A (de)
CN (1) CN1312246C (de)
AT (1) ATE338102T1 (de)
AU (1) AU2003215305A1 (de)
DE (1) DE60308000T2 (de)
HK (1) HK1073473A1 (de)
MY (1) MY133275A (de)
TW (1) TWI322172B (de)
WO (1) WO2003085062A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4293187B2 (ja) 2003-06-25 2009-07-08 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP3977302B2 (ja) 2003-08-13 2007-09-19 キヤノン株式会社 露光装置及びその使用方法並びにデバイス製造方法
US20070213429A1 (en) * 2006-03-10 2007-09-13 Chih-Min Cheng Anisotropic conductive adhesive
DE102009013710A1 (de) * 2009-03-20 2010-09-23 Merck Patent Gmbh Polymere aus Mischungen mit Vinylether-Monomeren
CN102471660B (zh) * 2009-08-21 2014-04-09 Dic株式会社 阳离子聚合性粘接剂和使用其得到的偏振板
JP5643623B2 (ja) * 2010-12-02 2014-12-17 デクセリアルズ株式会社 異方性導電材料及びその製造方法
KR101671187B1 (ko) * 2010-12-31 2016-11-01 동우 화인켐 주식회사 점착제 조성물, 이를 포함하는 편광판 및 액정표시장치
JP2011102404A (ja) * 2011-02-17 2011-05-26 Sony Chemical & Information Device Corp 異方性導電フィルム
CN102690611B (zh) 2011-12-27 2015-06-24 3M中国有限公司 胶带组合物以及由其制备的胶带
JP6002518B2 (ja) * 2012-09-21 2016-10-05 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
CN103333463A (zh) * 2013-06-26 2013-10-02 苏州天脉导热科技有限公司 一种导热母粒的制备方法
KR101712703B1 (ko) * 2014-07-18 2017-03-06 삼성에스디아이 주식회사 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치
JP2016060761A (ja) * 2014-09-16 2016-04-25 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体の製造方法
JP2018104653A (ja) * 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤
DE102017001696A1 (de) * 2017-02-22 2018-08-23 Lohmann Gmbh & Co. Kg UV-aktivierbares strukturelles Haftklebeband
TWI672351B (zh) 2018-08-21 2019-09-21 財團法人工業技術研究院 感光膠組合物、感光導電膠組合物及包含感光導電膠組合物之電子裝置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3998983A (en) * 1975-06-27 1976-12-21 Westinghouse Electric Corporation Resin rich epoxide-mica flexible high voltage insulation
JPS6490269A (en) * 1987-09-30 1989-04-06 Fujikura Ltd Anisotropically conductive adhesive coating
JPH05262816A (ja) * 1992-03-18 1993-10-12 Nippon Oil & Fats Co Ltd 熱潜在性有機金属触媒
JPH05287696A (ja) * 1992-04-09 1993-11-02 Nippon Kayaku Co Ltd 紙用活性エネルギー線硬化性樹脂組成物及びその硬化物
US5403869A (en) * 1992-08-17 1995-04-04 Hitachi Chemical Company, Ltd. Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator
US5362421A (en) * 1993-06-16 1994-11-08 Minnesota Mining And Manufacturing Company Electrically conductive adhesive compositions
US5453450A (en) * 1993-06-16 1995-09-26 Minnesota Mining And Manufacturing Company Stabilized curable adhesives
JPH08295830A (ja) * 1995-04-27 1996-11-12 Sekisui Chem Co Ltd 導電性塗料組成物及びそれを用いた物品
WO1999009101A1 (en) * 1997-08-19 1999-02-25 Minnesota Mining And Manufacturing Company Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods
JP3775773B2 (ja) * 1998-06-17 2006-05-17 株式会社東芝 硬化触媒、樹脂組成物、樹脂封止型半導体装置、およびコーティング材
JP2001048921A (ja) * 1999-08-04 2001-02-20 Daicel Chem Ind Ltd エポキシ化ジエン系ブロック共重合体の粉末状水和反応物およびその製法

Also Published As

Publication number Publication date
KR20040111454A (ko) 2004-12-31
EP1490450B1 (de) 2006-08-30
EP1490450A1 (de) 2004-12-29
JP4201519B2 (ja) 2008-12-24
JP2003292921A (ja) 2003-10-15
ATE338102T1 (de) 2006-09-15
MY133275A (en) 2007-10-31
CN1646657A (zh) 2005-07-27
DE60308000T2 (de) 2007-03-01
HK1073473A1 (en) 2005-10-07
TWI322172B (en) 2010-03-21
CN1312246C (zh) 2007-04-25
WO2003085062A1 (en) 2003-10-16
AU2003215305A1 (en) 2003-10-20
TW200304935A (en) 2003-10-16

Similar Documents

Publication Publication Date Title
HK1073473A1 (en) Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
ATE500283T1 (de) Telecheles azlacton-polymer
NO20071727L (no) Amfifile blokk-kopolymerherdete epoksyharpikser og elektriske laminater fremstilt derfra.
DE60034152D1 (de) Thermohärtbare mischungen von polyphenylenethern und vinylpolymeren
WO2002057201A3 (en) Polymerizable higher diamondoid derivatives
EA200200261A1 (ru) Рецептор baff (bcma), иммунорегуляторный агент
DK1412445T3 (da) Polysilazanmodificerede polyaminhærdere til epoxyharpikser
WO2003006570A3 (en) Novel mesogens and methods for their synthesis and use
ATE503774T1 (de) Photohärtbare michaeladditionspolymere
ATE300589T1 (de) Polymerisationsinitiator-systeme und haftzusammensetzungen, die vinylaromatische verbindungen enthalten
FR2789991B1 (fr) Alcoxyamines issues de nitroxyde beta-phosphores, leur utilisation en polymerisation radicalaire
DE60306957D1 (de) Azlacton -initiatoren für atomtransferradikalpolymerisation
ATE353940T1 (de) Aufschäumende überzugszusammensetzungen
BR0207335A (pt) Sistema polimerizável
JP2003292921A5 (de)
BR9713854A (pt) Macromolécula e processo de preparar a mesma
DE60015754D1 (de) Gefertigte verbundene struktur
PL362552A1 (en) Aqueous dispersion and the use thereof in the production of coating agents, adhesives and sealing agents that can cured by heat or by actinic radiation
GB2393730B (en) Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
DE60238606D1 (de) 4-imin-n-alkoxy- oder oxy-polyalkyl-piperidin-verboren
ATE169643T1 (de) Aktivatorformulierung und zusammensetzung diese verwendend
ATE397022T1 (de) Ringgeöffnete azlactoninitiatoren für atomtransfer-radikalpolymerisation
MXPA03011833A (es) Alcoxiaminas multifuncionales basadas en polialquilpiperidinas, polialquipiperacinonas y polialquilmorfolinonas y su uso como reguladores/iniciadores de la polimerizacion.
DE69726160D1 (de) Neue polymerisierbare acylimidazolidinonmonomere
ATE370171T1 (de) Kaschierklebstoff

Legal Events

Date Code Title Description
8364 No opposition during term of opposition