JP4201519B2 - カチオン重合性接着剤組成物及び異方導電性接着剤組成物 - Google Patents

カチオン重合性接着剤組成物及び異方導電性接着剤組成物 Download PDF

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Publication number
JP4201519B2
JP4201519B2 JP2002099071A JP2002099071A JP4201519B2 JP 4201519 B2 JP4201519 B2 JP 4201519B2 JP 2002099071 A JP2002099071 A JP 2002099071A JP 2002099071 A JP2002099071 A JP 2002099071A JP 4201519 B2 JP4201519 B2 JP 4201519B2
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JP
Japan
Prior art keywords
adhesive composition
cationic polymerization
solvent
cationic
polymerization catalyst
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002099071A
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English (en)
Japanese (ja)
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JP2003292921A (ja
JP2003292921A5 (https=
Inventor
裕顕 山口
良太 秋山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2002099071A priority Critical patent/JP4201519B2/ja
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to DE60308000T priority patent/DE60308000T2/de
Priority to EP03711124A priority patent/EP1490450B1/en
Priority to AT03711124T priority patent/ATE338102T1/de
Priority to KR10-2004-7015480A priority patent/KR20040111454A/ko
Priority to AU2003215305A priority patent/AU2003215305A1/en
Priority to PCT/US2003/004944 priority patent/WO2003085062A1/en
Priority to HK05104574.1A priority patent/HK1073473B/en
Priority to US10/502,501 priority patent/US20050256230A1/en
Priority to CNB038079127A priority patent/CN1312246C/zh
Priority to TW092104928A priority patent/TWI322172B/zh
Priority to MYPI20030830A priority patent/MY133275A/en
Publication of JP2003292921A publication Critical patent/JP2003292921A/ja
Publication of JP2003292921A5 publication Critical patent/JP2003292921A5/ja
Application granted granted Critical
Publication of JP4201519B2 publication Critical patent/JP4201519B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2002099071A 2002-04-01 2002-04-01 カチオン重合性接着剤組成物及び異方導電性接着剤組成物 Expired - Fee Related JP4201519B2 (ja)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP2002099071A JP4201519B2 (ja) 2002-04-01 2002-04-01 カチオン重合性接着剤組成物及び異方導電性接着剤組成物
HK05104574.1A HK1073473B (en) 2002-04-01 2003-02-19 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
AT03711124T ATE338102T1 (de) 2002-04-01 2003-02-19 Kationisch polymerisierbare klebstoffzusammensetzung und elektrisch anisotrop leitende klebstoffzusammensetzung
KR10-2004-7015480A KR20040111454A (ko) 2002-04-01 2003-02-19 양이온 중합성 접착제 조성물 및 이방 도전성 접착제조성물
AU2003215305A AU2003215305A1 (en) 2002-04-01 2003-02-19 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
PCT/US2003/004944 WO2003085062A1 (en) 2002-04-01 2003-02-19 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
DE60308000T DE60308000T2 (de) 2002-04-01 2003-02-19 Kationisch polymerisierbare klebstoffzusammensetzung und elektrisch anisotrop leitende klebstoffzusammensetzung
US10/502,501 US20050256230A1 (en) 2002-04-01 2003-02-19 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
CNB038079127A CN1312246C (zh) 2002-04-01 2003-02-19 可阳离子聚合的粘合剂组合物和各向异性导电粘合剂组合物
EP03711124A EP1490450B1 (en) 2002-04-01 2003-02-19 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
TW092104928A TWI322172B (en) 2002-04-01 2003-03-07 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
MYPI20030830A MY133275A (en) 2002-04-01 2003-03-10 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002099071A JP4201519B2 (ja) 2002-04-01 2002-04-01 カチオン重合性接着剤組成物及び異方導電性接着剤組成物

Publications (3)

Publication Number Publication Date
JP2003292921A JP2003292921A (ja) 2003-10-15
JP2003292921A5 JP2003292921A5 (https=) 2005-09-15
JP4201519B2 true JP4201519B2 (ja) 2008-12-24

Family

ID=28786222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002099071A Expired - Fee Related JP4201519B2 (ja) 2002-04-01 2002-04-01 カチオン重合性接着剤組成物及び異方導電性接着剤組成物

Country Status (10)

Country Link
EP (1) EP1490450B1 (https=)
JP (1) JP4201519B2 (https=)
KR (1) KR20040111454A (https=)
CN (1) CN1312246C (https=)
AT (1) ATE338102T1 (https=)
AU (1) AU2003215305A1 (https=)
DE (1) DE60308000T2 (https=)
MY (1) MY133275A (https=)
TW (1) TWI322172B (https=)
WO (1) WO2003085062A1 (https=)

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WO2005002002A1 (ja) 2003-06-25 2005-01-06 Hitachi Chemical Co., Ltd. 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP3977302B2 (ja) 2003-08-13 2007-09-19 キヤノン株式会社 露光装置及びその使用方法並びにデバイス製造方法
US20070213429A1 (en) * 2006-03-10 2007-09-13 Chih-Min Cheng Anisotropic conductive adhesive
DE102009013710A1 (de) * 2009-03-20 2010-09-23 Merck Patent Gmbh Polymere aus Mischungen mit Vinylether-Monomeren
EP2468835B1 (en) * 2009-08-21 2019-01-02 DIC Corporation Cationically polymerizable adhesive and polarizing plate obtained using same
JP5643623B2 (ja) * 2010-12-02 2014-12-17 デクセリアルズ株式会社 異方性導電材料及びその製造方法
KR101671187B1 (ko) * 2010-12-31 2016-11-01 동우 화인켐 주식회사 점착제 조성물, 이를 포함하는 편광판 및 액정표시장치
JP2011102404A (ja) * 2011-02-17 2011-05-26 Sony Chemical & Information Device Corp 異方性導電フィルム
CN102690611B (zh) * 2011-12-27 2015-06-24 3M中国有限公司 胶带组合物以及由其制备的胶带
JP6002518B2 (ja) * 2012-09-21 2016-10-05 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
CN103333463A (zh) * 2013-06-26 2013-10-02 苏州天脉导热科技有限公司 一种导热母粒的制备方法
KR101712703B1 (ko) * 2014-07-18 2017-03-06 삼성에스디아이 주식회사 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치
JP2016060761A (ja) * 2014-09-16 2016-04-25 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体の製造方法
JP2018104653A (ja) * 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤
DE102017001696A1 (de) * 2017-02-22 2018-08-23 Lohmann Gmbh & Co. Kg UV-aktivierbares strukturelles Haftklebeband
TWI672351B (zh) 2018-08-21 2019-09-21 財團法人工業技術研究院 感光膠組合物、感光導電膠組合物及包含感光導電膠組合物之電子裝置
KR102878827B1 (ko) 2020-09-28 2025-11-03 삼성디스플레이 주식회사 타일드 표시 장치
KR20260023513A (ko) * 2023-06-16 2026-02-20 가부시끼가이샤 쓰리본드 도전성 수지 접착제 및 그 경화물
KR20250041206A (ko) 2023-09-18 2025-03-25 엘지디스플레이 주식회사 이방성 도전필름 및 이를 포함하는 표시장치
JP2025079120A (ja) * 2023-11-09 2025-05-21 株式会社レゾナック 回路接続構造体の製造方法、回路接続用接着剤フィルム、及び回路接続構造体

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JPH08295830A (ja) * 1995-04-27 1996-11-12 Sekisui Chem Co Ltd 導電性塗料組成物及びそれを用いた物品
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Also Published As

Publication number Publication date
JP2003292921A (ja) 2003-10-15
DE60308000T2 (de) 2007-03-01
DE60308000D1 (de) 2006-10-12
EP1490450A1 (en) 2004-12-29
KR20040111454A (ko) 2004-12-31
CN1646657A (zh) 2005-07-27
ATE338102T1 (de) 2006-09-15
EP1490450B1 (en) 2006-08-30
CN1312246C (zh) 2007-04-25
TW200304935A (en) 2003-10-16
HK1073473A1 (en) 2005-10-07
WO2003085062A1 (en) 2003-10-16
MY133275A (en) 2007-10-31
TWI322172B (en) 2010-03-21
AU2003215305A1 (en) 2003-10-20

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