CN108602970A - 各向异性导电膜 - Google Patents

各向异性导电膜 Download PDF

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Publication number
CN108602970A
CN108602970A CN201780010511.3A CN201780010511A CN108602970A CN 108602970 A CN108602970 A CN 108602970A CN 201780010511 A CN201780010511 A CN 201780010511A CN 108602970 A CN108602970 A CN 108602970A
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China
Prior art keywords
anisotropic conductive
conductive film
ingredient
alicyclic epoxide
low polarity
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Pending
Application number
CN201780010511.3A
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English (en)
Inventor
林慎
林慎一
德久宪司
山口惠津子
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Dexerials Corp
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Dexerials Corp
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Publication date
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Priority claimed from PCT/JP2017/004887 external-priority patent/WO2017145801A1/ja
Publication of CN108602970A publication Critical patent/CN108602970A/zh
Pending legal-status Critical Current

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Abstract

本发明提供一种使用脂环族环氧化合物的阳离子聚合性的各向异性导电膜，其在确保与以往相同的固化温度及连接可靠性的同时，具有比以往更优异的保存期限性。所述各向异性导电膜包含：含有成膜用成分及阳离子聚合性成分的粘合剂组合物、阳离子聚合引发剂、和导电粒子。该各向异性导电膜使用季铵盐系热产酸剂作为阳离子聚合引发剂，含有脂环族环氧化合物及低极性氧杂环丁烷化合物作为阳离子聚合性成分。

Description

各向异性导电膜
技术领域
本发明涉及各向异性导电膜。
背景技术
以往，在将IC芯片等电子部件安装于布线基板上时，广泛使用在含有聚合性化合物的绝缘性粘合剂组合物中分散有导电粒子的各向异性导电膜。对于这样的各向异性导电膜，为了实现低温快速固化性，有人提出使用阳离子聚合反应性比通用的缩水甘油醚系化合物高的脂环族环氧化合物作为聚合性化合物，同时使用通过热产生质子的锍盐系热产酸剂作为不抑制基于氧的聚合、显示暗反应性的聚合引发剂(专利文献1~3)。这样的含有脂环族环氧化合物及锍盐系热产酸剂的以往的各向异性导电膜显示出较低温(例如100℃左右)的固化温度。
现有技术文献
专利文献
专利文献1：特开平9-176112号公报
专利文献2：特开2008-308596号公报
专利文献3：国际公开2012/018123号。
发明内容
发明所要解决的课题
然而，关于如上所述的各向异性导电膜，由于商业交易的国际化等，存在从制造到实际实用为止的时间变长的问题、以及存在有可能在未配备空调的仓库中存储的问题，有从暂贴(仮貼り)性或压痕等观点出发的保存稳定性(保存期限性)降低、或从粘合特性等观点出发的连接可靠性降低之虞。
本发明的课题在于，对于使用脂环族环氧化合物的阳离子聚合性的各向异性导电膜，在确保与以前相同的固化温度及连接可靠性的同时，还可以实现比以往更优异的保存期限性。
用于解决课题的手段
本发明人发现，除了脂环族环氧化合物之外，以特定比例并用低极性氧杂环丁烷化合物作为阳离子聚合性化合物，且使用季铵盐系热产酸剂代替锍盐系热产酸剂作为阳离子聚合引发剂，由此在确保与以往相同的固化温度及连接可靠性的同时，还可以实现比以往更优异的保存期限性，从而完成了本发明。
即，本发明提供各向异性导电膜，其包含：含有成膜用成分及阳离子聚合性成分的粘合剂组合物、阳离子聚合引发剂、和导电粒子，
其中，阳离子聚合引发剂为季铵盐系热产酸剂，阳离子聚合性成分含有脂环族环氧化合物及低极性氧杂环丁烷化合物。
另外，本发明提供连接结构体，其是利用上述的各向异性导电膜对第1电子部件与第2电子部件进行各向异性导电连接而成的。
发明效果
本发明的各向异性导电膜包含含有成膜用成分及阳离子聚合性成分的粘合剂组合物、阳离子聚合引发剂、和导电粒子，使用季铵盐系热产酸剂作为阳离子聚合引发剂，含有脂环族环氧化合物及低极性氧杂环丁烷化合物作为阳离子聚合性成分。因此，在确保与以往相同的固化温度及连接可靠性的同时，还可以实现比以往更优异的保存期限性。
具体实施方式
以下对本发明的一例进行详细说明。
<各向异性导电膜>
本发明的各向异性导电膜包含：含有成膜用成分及阳离子聚合性成分的粘合剂组合物、阳离子聚合引发剂、和导电粒子。
(粘合剂组合物)
本发明中，含有并保持导电粒子的粘合剂组合物含有成膜用成分及阳离子聚合性成分。
(成膜用成分)
成膜用成分是为了使各向异性导电膜进行膜化而使用的成分，是具有成膜能力的成分。作为这样的成膜用成分，可举出：苯氧基树脂、环氧树脂、不饱和聚酯树脂、饱和聚酯树脂、聚氨酯树脂、丁二烯树脂、聚酰亚胺树脂、聚酰胺树脂、聚烯烃树脂等，可以将它们的2种以上并用。这些之中，从成膜性、加工性、连接可靠性的观点出发，可以优选使用苯氧基树脂。
粘合剂组合物中的成膜用成分的掺混比例优选为10~70质量%，更优选为20~50质量%。如果在该范围内，则可以发挥充分的成膜能力。
(阳离子聚合性成分)
阳离子聚合性成分是使各向异性导电膜固化的成分，含有脂环族环氧化合物及低极性氧杂环丁烷化合物。粘合剂组合物中的阳离子聚合性成分的掺混量优选为10~80质量%，更优选为20~60质量%。如果在该范围内，则可以提供具有更高的固化速度的粘合剂组合物。
(脂环族环氧化合物)
使用脂环族环氧化合物的理由在于，利用其比通用的缩水甘油醚型环氧化合物高的反应性，对各向异性导电膜赋予良好的低温快速固化性。作为这样的脂环族环氧化合物，优选可举出在分子内具有2个以上的环氧基的脂环族环氧化合物。它们可以为液状，也可以为固体状。具体而言，可举出：六氢双酚A二缩水甘油醚、3,4-环氧环己烯基甲基-3′,4′-环氧环己烯甲酸盐(酯)、双环己基二环氧化物(ジエポキシビシクロヘキシル)等。其中，从可以确保固化物的透光性、快速固化性也优异的观点出发，可以优选使用六氢双酚A二缩水甘油醚，特别是双环己基二环氧化物。
(低极性氧杂环丁烷化合物)
本发明中将低极性氧杂环丁烷化合物与脂环族环氧化合物并用。低极性氧杂环丁烷化合物是偶极矩为3.0d以下的氧杂环丁烷化合物，表面张力比较低，可以对各向异性导电膜的膜赋予良好的流平性，结果可提升各向异性导电膜的保存期限性。另一方面，低极性氧杂环丁烷化合物具有使来源于脂环族环氧化合物的各向异性导电膜的利用差示扫描量热计(DSC)所测定的反应开始温度及反应结束温度上升的作用。作为这样的低极性氧杂环丁烷化合物，可举出：3-乙基-3-(2-乙基己氧基甲基)氧杂环丁烷、3-乙基-3-羟基甲基氧杂环丁烷、二[1-乙基(3-氧杂环丁烷基)]甲醚、4,4′-双[(3-乙基-3-氧杂环丁烷基)甲氧基甲基]联苯等。其中，从表面张力低、润湿性优异的方面出发，优选3-乙基-3-(2-乙基己氧基甲基)氧杂环丁烷，特别是4,4′-双[(3-乙基-3-氧杂环丁烷基)甲氧基甲基]联苯。
脂环族环氧化合物与低极性氧杂环丁烷化合物的掺混比例以质量标准计优选为25：75~60：40，更优选为45：55~60：40，特别优选为50：50~55：45。若低极性氧杂环丁烷化合物的掺混量比该范围増加，则有使反应开始温度及反应结束温度上升的倾向，相反若比该范围减少，则有保存期限降低的倾向。因此，通过调整脂环族环氧化合物与低极性氧杂环丁烷化合物的掺混比例，可控制各向异性导电膜的反应开始温度及反应结束温度，此外，通过调整反应时的升温速度等，还可控制反应时间。
粘合剂组合物可视需要含有：双酚A型环氧树脂、双酚F型环氧树脂、酚醛清漆型环氧树脂、它们的改性环氧树脂等其他环氧树脂、硅烷偶联剂、填充剂、软化剂、助催化剂、抗老化剂、着色剂(颜料、染料)、有机溶剂、离子捕获剂等。另外，可视需要含有(甲基)丙烯酸酯化合物及自由基聚合引发剂。在此，作为(甲基)丙烯酸酯化合物，可以使用以往公知的(甲基)丙烯酸酯单体。例如，可以使用单官能(甲基)丙烯酸酯系单体、二官能以上的多官能(甲基)丙烯酸酯系单体。在此，(甲基)丙烯酸酯包含丙烯酸酯及甲基丙烯酸酯。另外，作为自由基聚合引发剂，可以含有有机过氧化物、偶氮二丁腈(アゾビスブリトニトリル)等公知的自由基聚合引发剂。
(导电粒子)
为了实现各向异性导电连接，本发明的各向异性导电膜在粘合剂组合物中含有导电粒子。作为导电粒子，可以从以往公知的各向异性导电膜所用的导电粒子中适宜选择而使用。例如可举出：镍、钴、银、铜、金、钯等金属粒子，焊料等合金粒子，金属被覆树脂粒子等。也可以将2种以上并用。
作为导电粒子的平均粒径，为了可以与布线高度的偏差对应，以及抑制导通电阻的上升，并且抑制短路的发生，优选为2.5μm以上且30μm以下，更优选为3μm以上且9μm以下。导电粒子的粒径可以通过一般的粒度分布测定装置进行测定，另外，其平均粒径也可以使用粒度分布测定装置求得。
需说明的是，导电粒子为金属被覆树脂粒子的情形，关于树脂芯粒子的粒子硬度(20%K值；压缩弹性形变特性K20)，为了获得良好的连接可靠性，优选为100~1000kgf/mm2，更优选为200至500kgf/mm2。关于压缩弹性形变特性K20，例如可以使用微小压缩试验机(MCT-W201，(株)岛津制作所)在测定温度20℃下进行测定。
关于导电粒子在各向异性导电膜中的存在量，为了抑制导电粒子捕获效率的降低，且抑制短路的发生，优选每1平方mm为50个以上且100000个以下，更优选为200个以上且70000个以下。该存在量的测定可以通过用光学显微镜观察材料的薄膜来进行。需说明的是，在各向异性导电连接前，由于各向异性导电膜中的导电粒子存在于粘合剂组合物中，因此有用光学显微镜难以观察的情形。此种情形下，也可观察各向异性导电连接后的各向异性导电膜。该情形下，可以考虑连接前后的膜厚改变以推断出存在量。
需说明的是，导电粒子在各向异性导电膜中的存在量也可以质量标准表示。该情形，关于其存在量，将各向异性导电膜的总质量作为100质量份时，该100质量份中优选为1质量份以上且30质量份以下，更优选为3质量份以上且10质量份以下的量。
(阳离子聚合引发剂)
作为阳离子聚合引发剂，本发明的各向异性导电膜含有季铵盐系热产酸剂，而非锍盐系热产酸剂。这是为了提升保存期限性。作为这样的季铵盐系热产酸剂，可举出季铵阳离子与下述阴离子的盐等：六氟锑酸阴离子、六氟磷酸阴离子、三氟甲磺酸阴离子、全氟丁磺酸阴离子、二壬基萘磺酸阴离子、对甲苯磺酸阴离子、十二烷基苯磺酸阴离子或四(五氟苯基)硼酸根阴离子。另外，作为季铵阳离子，可举出NR1R2R3R4＋所表示的阳离子。在此，R1、R2、R3和R4为直链、分支或环状的碳数1~12的烷基或芳基，也可分别具有羟基、卤素、烷氧基、氨基、酯基等。
作为季铵盐系热产酸剂的具体例，可举出King Industries, Inc.制造的CXC-1612、CXC-1733、CXC-1738、TAG-2678、CXC-1614、TAG-2689、TAG-2690、TAG-2700、CXC-1802-60、CXC-1821等。这些可从楠本化成(株)获取。
本发明的各向异性导电膜的层厚优选为3~50μm，更优选为5~20μm。
(各向异性导电膜的制造)
本发明的各向异性导电膜可以如下制造：将导电粒子及阳离子聚合引发剂与上述的粘合剂组合物溶解于甲苯等有机溶剂中以制备涂料，利用公知的膜化方法对该涂料进行膜化。
需说明的是，本发明的各向异性导电膜可以为单层，但为了不降低各向异性导电连接时的粒子捕获性、减少导电粒子的使用量以使制造成本减少且节省底部填料的填充操作，也可以层压绝缘性树脂层。该情形，本发明的各向异性导电膜成为含导电粒子层/绝缘性树脂层的2层构成。这样的绝缘性树脂层基本上可由以下组合物形成：在各向异性导电膜所使用的粘合剂组合物中，不使其含有导电粒子而掺混有阳离子聚合引发剂的组合物。
关于本发明的各向异性导电膜，从与反应速度控制的观点出发，优选将利用差示扫描量热计测定的反应峰的反应开始温度调整为60~80℃，而且将反应结束温度调整为155~185℃。这些调整可以通过调整脂环族环氧化合物与低极性氧杂环丁烷化合物的掺混比例等来进行。
<连接结构体>
本发明的各向异性导电膜可以优选适用于对IC芯片、IC模块、FPC等第1电子部件与塑料基板、玻璃基板、刚性基板、陶瓷基板、FPC等第2电子部件进行各向异性导电连接时。利用这样的本发明的各向异性导电膜对第1电子部件与第2电子部件进行各向异性导电连接的连接结构体也是本发明的一部分。需说明的是，作为使用各向异性导电膜的电子部件的连接方法，可以利用公知的方法。
实施例
以下通过实施例对本发明进行具体的说明。
实施例1
(含导电粒子层的形成)
将苯氧基树脂(YP-50，新日铁住金化学(株))60质量份、作为脂环族环氧化合物的双环己基二环氧化物(CELLOXIDE 8000，(株)Daicel)10质量份、低极性氧杂环丁烷化合物(OXBP，宇部兴产(株))20质量份、热阳离子聚合引发剂(季铵盐系热产酸剂，商品名CXC-1612，楠本化成(株))2质量份和平均粒径3μm的导电性粒子(镀Ni/Au树脂粒子，AUL704，积水化学工业(株))50质量份添加到甲苯中，调制了固体成分达到50质量%的混合液。
将所得的混合液涂布于厚度50μm的聚对苯二甲酸乙二醇酯剥离膜(PET剥离膜)上，使干燥厚度达到6μm，在60℃的烘箱中干燥5分钟，由此形成了含导电粒子层。
(绝缘性树脂层的形成)
除了未使用导电粒子以外，将与形成含导电粒子层时所使用的原材料相同的原材料添加到甲苯中，调制了固体成分达到50质量%的混合液。
将所得的混合液涂布于厚度50μm的PET剥离膜上，使干燥厚度达到12μm，在60℃的烘箱中干燥5分钟，由此形成了绝缘性树脂层。
(各向异性导电膜的制作)
将绝缘性树脂层在60℃、5MPa下层压于含导电粒子层，由此获得了由厚度50μm的一对PET剥离膜夹持的各向异性导电膜。
实施例2~4
除了将含导电粒子层和绝缘性树脂层中的脂环族环氧化合物(CELLOXIDE 8000，(株)Daicel)与作为低极性氧杂环丁烷化合物的4,4′-双[(3-乙基-3-氧杂环丁烷基)甲氧基甲基]联苯(0XBP，宇部兴产(株))的掺混量(比率)变更为如表1所示以外，与实施例1同样地获得了各向异性导电膜。
比较例1~4
除了将含导电粒子层和绝缘性树脂层中的热阳离子聚合引发剂替换成如表1所示的锍盐系热产酸剂(SI-60L，三新化学工业(株))以外，与实施例1~4同样地制作了各向异性导电膜。
实施例5~13、比较例5
除了将含导电粒子层和绝缘性树脂层中的脂环族环氧化合物(CELLOXIDE 8000，(株)Daicel)与低极性氧杂环丁烷化合物(0XBP，宇部兴产(株))的掺混量(比率)变更为如表1所示以外，与实施例1同样地制作了各向异性导电膜。
<<评价>>
对于各实施例和比较例中所得的各向异性导电膜，如以下所说明的那样，试验或测定、评价了“保存期限特性”、“固化温度”、“粘合特性”和“反应时间”。
<保存期限特性>
将一对PET剥离膜所夹持的各向异性导电膜投入到设定为湿度40%、温度25℃或30℃的恒温恒湿室中，投入后每隔24小时进行取样，实施以下的暂贴评价和压合评价，根据这些评价结果综合性地评价了保存期限特性。将所得的结果示于表1中。
(暂贴评价)
剥离各向异性导电膜的含导电粒子层一侧的PET剥离膜，从含导电粒子层一侧将各向异性导电膜贴附于素玻璃上，制作了素玻璃与各向异性导电膜的层压体。将该层压体以该素玻璃一侧与设定为45℃的热板接触的方式载置，用手从各向异性导电膜一侧施加压力，然后冷却至室温。冷却后，从层压体上剥离绝缘性树脂层一侧的PET剥离膜，确认是否仅PET剥离膜从素玻璃上剥离，而各向异性导电膜未剥离。
(压合评价)
在测试用IC芯片与测试用基板之间，以使绝缘性树脂层配置于IC芯片一侧的方式夹持各向异性导电膜，进行加热加压(120℃、60MPa、5秒)，制作了评价用连接物。确认所制作的连接物的压痕状态，确认压痕是否在未变薄、未消失的情况下残存。
(保存期限特性评价)
将暂贴评价中各向异性导电膜从素玻璃上剥离的时间点作为保存期限。另外，在暂贴评价中各向异性导电膜未从素玻璃上剥离的情形，将压合评价中压痕变薄的(消失的)时间点作为保存期限。
<固化温度>
在测试用IC芯片与测试用基板之间，以使绝缘性树脂层配置于IC芯片一侧的方式夹持各向异性导电膜，进行加热加压(80℃、90℃、100℃、110℃或120℃，60MPa，5秒)，获得了评价用连接物。按照如下说明测定该连接物中各向异性导电膜的反应率，根据该测定结果确定了固化温度。将所得的结果示于表1中。
(反应率测定)
将评价用连接物的IC芯片用手捏着进行剥离，使已固化的各向异性导电膜暴露，对各向异性导电膜进行取样。将所得的样品溶解于乙腈中，使浓度达到0.1g/mL。另外，将固化前的各向异性导电膜以达到同样浓度的方式溶解于乙腈中，使用HPLC-MS(WaterS公司)，按照以下的条件确认了各单体的峰强度。通过固化后的峰强度的减少量求出各温度下的反应率，将反应率80%以上的温度作为固化温度。
溶剂：向水/乙腈混合溶液(90/10)60质量份中混合乙腈40质量份而得的混合溶剂
流量：0.4mL/分钟
柱：10cm，40℃C
注入量：5μL
分析波：210-410nm
<粘合特性>
在测试用IC芯片与测试用基板之间，以使绝缘性树脂层配置于IC芯片一侧的方式夹持各向异性导电膜，进行加热加压(120℃、60MPa、5秒)，获得了评价用连接物。对于该连接物，使用ETAC公司的型号EHS-411M，实施了压力锅测试(Pressure Cooker Test, PCT)。具体而言，对于所得的评价用连接物，将连接物投入至设定为121℃、2atm、饱和水蒸气气氛的条件的恒温恒湿槽中，每隔24小时进行以下的粘合评价。将所得的结果示于表1中。
(粘合评价)
进行投入于PCT试验的连接物的外观确认，目视观察了在各向异性导电膜与IC芯片或基板的层之间是否产生剥离。
等级 标准
〇： IC压合后，进行48小时的PCT也未观察到剥离的情形
△： IC压合后，进行24小时的PCT时未观察到剥离，但进行48小时的PCT试验时观察到剥离的情形
×： IC压合后，在进行PCT之前已经观察到剥离或在24小时的PCT观察到剥离的情形
<反应时间>
将由所得的各向异性导电膜切出的约5mg的样品收纳至铝PAN(TA Instruments Inc.)中，将其设置于DSC测定装置(Q2000，TA Instruments Inc.)中，从30℃到250℃，以10℃/分钟的升温速度进行了差示扫描量热计(DSC)测定。根据所得的DSC图表，将发热峰上升的时间点的温度作为反应开始温度读取，将发热峰改变为基线的时间点的温度作为反应结束温度读取。另外，依据下式算出了反应时间。将所得的结果示于表1中。
反应时间(分钟)=(反应结束温度(℃)−反应开始温度(℃))/10[℃/分钟]
[表1]
<<评价结果的考察>>
根据表1的结果(实施例1与比较例1的对比、实施例2与比较例2的对比、实施例3与比较例3的对比、实施例4与比较例4的对比)可知，若使用季铵盐系热产酸剂代替锍盐系热产酸剂，则即使变动脂环族环氧化合物与低极性氧杂环丁烷化合物之间的掺混比，也可不改变固化温度或作为连接可靠性的评价指标的粘合特性，而大幅提升保存期限。
另外，根据实施例1、5~7和比较例5的对比可知，伴随着低极性氧杂环丁烷化合物相对于脂环族环氧化合物的掺混比例的增加，保存期限有提升的倾向，但若脂环族环氧化合物的掺混量相对减少，则粘合特性有降低的倾向。相反，根据实施例8~13的对比可知，伴随着低极性氧杂环丁烷化合物相对于脂环族环氧化合物的掺混比例的减少，保存期限有降低的倾向。
需说明的是，根据实施例1、实施例5~13、比较例5中所进行的DSC测定结果的对比可知，若增加低极性氧杂环丁烷化合物的掺混量，则有使反应开始温度及反应结束温度上升的倾向。
产业上的可利用性
使用脂环族环氧化合物的阳离子聚合性的本发明的各向异性导电膜在确保与使用锍盐系热产酸剂的以往的各向异性导电膜同等的固化温度及连接可靠性的同时，还可以实现比以往更优异的保存期限性，因此可用于对IC芯片等电子部件的布线基板的各向异性导电连接。

Claims (9)

1.各向异性导电膜，包含：含有成膜用成分及阳离子聚合性成分的粘合剂组合物、阳离子聚合引发剂、和导电粒子，
其中，阳离子聚合引发剂为季铵盐系热产酸剂，阳离子聚合性成分含有脂环族环氧化合物及低极性氧杂环丁烷化合物。
2.权利要求1所述的各向异性导电膜，其中，脂环族环氧化合物与低极性氧杂环丁烷化合物的掺混比例以质量标准计为25：75~60：40。
3.权利要求1所述的各向异性导电膜，其中，脂环族环氧化合物与低极性氧杂环丁烷化合物的掺混比例以质量标准计为45：55~60：40。
4.权利要求1~3的任一项所述的各向异性导电膜，其中，季铵盐系热产酸剂是季铵阳离子与下述阴离子的盐：六氟锑酸阴离子、六氟磷酸阴离子、三氟甲磺酸阴离子、全氟丁磺酸阴离子、二壬基萘磺酸阴离子、对甲苯磺酸阴离子、十二烷基苯磺酸阴离子或四(五氟苯基)硼酸根阴离子。
5.权利要求4所述的各向异性导电膜，其中，季铵阳离子为NR1R2R3R4＋所表示的阳离子，R1、R2、R3和R4为直链、分支或环状的碳数1~12的烷基或芳基。
6.权利要求1~5的任一项所述的各向异性导电膜，其中，脂环族环氧化合物为六氢双酚A二缩水甘油醚或双环己基二环氧化物，低极性氧杂环丁烷化合物为3-乙基-3-(2-乙基己氧基甲基)氧杂环丁烷或4,4′-双[(3-乙基-3-氧杂环丁烷基)甲氧基甲基]联苯。
7.权利要求1~6的任一项所述的各向异性导电膜，其中，成膜用成分为苯氧基树脂。
8.权利要求1~7的任一项所述的各向异性导电膜，其中，利用差示扫描量热计测定的反应峰的反应开始温度为60~80℃，反应结束温度为155~185℃。
9.连接结构体，其是利用权利要求1~8的任一项所述的各向异性导电膜对第1电子部件与第2电子部件进行各向异性导电连接而成的。
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