CN104508062A - 电路连接材料及使用其的安装体的制备方法 - Google Patents

电路连接材料及使用其的安装体的制备方法 Download PDF

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Publication number
CN104508062A
CN104508062A CN201380020499.6A CN201380020499A CN104508062A CN 104508062 A CN104508062 A CN 104508062A CN 201380020499 A CN201380020499 A CN 201380020499A CN 104508062 A CN104508062 A CN 104508062A
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bond layer
circuit connection
resin
connection material
cationic polymerization
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CN201380020499.6A
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CN104508062B (zh
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田中芳人
相崎亮太
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Dexerials Corp
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Dexerials Corp
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Abstract

提供一种具有优异的低温固化性的电路连接材料和使用该电路连接材料的安装体的制备方法。制成第1粘接剂层与第2粘接剂层层叠的2层结构，所述第1粘接剂层含有聚乙烯醇缩醛树脂、阳离子聚合性树脂、阳离子聚合引发剂和导电性粒子，所述第2粘接剂层含有阳离子聚合性树脂和阳离子聚合引发剂。由此，在低温下进行压接的情况下也可得到导电性粒子的高捕捉效率，可改善低温固化性。

Description

电路连接材料及使用其的安装体的制备方法
技术领域
本发明涉及一种分散有导电性粒子的电路连接材料及使用该电路连接材料的安装体的制备方法。
本申请以在日本国于2012年4月19日申请的日本专利申请号特愿2012-95522为基础主张优先权，通过参照该申请而引用在本申请中。
背景技术
分散有导电性粒子的各向异性导电膜(ACF：Anisotropic Conductive Film)等电路连接材料主要可分为对于环氧树脂的阳离子固化型、阴离子固化型，对于丙烯酸树脂的自由基固化型等。其中，特别是在COG (Chip on Glass：覆晶玻璃)领域，从低温固化性、粘接力的观点出发，使用阳离子固化型的电路连接材料(例如参照专利文献1。)。
现有技术文献
专利文献
专利文献1：日本特开2011-181525号公报。
发明内容
发明所要解决的课题
阳离子固化型的电路连接材料尝试了通过选择固化性高的引发剂、固化性高的环氧树脂来实现低温固化性的提高，但若考虑临时粘贴性与膜性的平衡，则对掺混有限制。
本发明鉴于这样的现有实际情况而提出，提供一种具有优异的低温固化性的电路连接材料和使用该电路连接材料的安装体的制备方法。
解决课题的手段
本发明人进行了深入研究，结果发现：通过制成具有导电性粒子的ACF层和由绝缘性树脂形成的NCF (Non Conductive Film：非导电性膜)层层叠的2层结构，且至少在ACF层中掺混聚乙烯醇缩醛树脂，可改善低温固化性。
即，本发明所涉及的电路连接材料的特征在于：具有第1粘接剂层和第2粘接剂层，所述第1粘接剂层含有聚乙烯醇缩醛树脂、阳离子聚合性树脂、阳离子聚合引发剂和导电性粒子，所述第2粘接剂层含有阳离子聚合性树脂和阳离子聚合引发剂。
另外，本发明所涉及的安装体的制备方法的特征在于：具有临时粘贴工序和按压工序，所述临时粘贴工序将具有第1粘接剂层和第2粘接剂层的电路连接材料的第1粘接剂层一侧临时粘贴于第1电子部件的电极上，所述第1粘接剂层含有聚乙烯醇缩醛树脂、阳离子聚合性树脂、阳离子聚合引发剂和导电性粒子，所述第2粘接剂层含有阳离子聚合性树脂和阳离子聚合引发剂；所述按压工序将第2电子部件配置于上述电路连接材料上，用压接头从该第2电子部件的上面进行按压。
另外，本发明所涉及的安装体的特征在于：通过具有第1粘接剂层和第2粘接剂层的电路连接材料将第1电子部件的电极与第2电子部件的电极电连接而成，所述第1粘接剂层含有聚乙烯醇缩醛树脂、阳离子聚合性树脂、阳离子聚合引发剂和导电性粒子，所述第2粘接剂层含有阳离子聚合性树脂和阳离子聚合引发剂。
根据本发明，即使在低温下进行压接的情况下也可得到导电性粒子的高捕捉效率，可改善低温固化性。
具体实施方式
以下，对于本发明的实施方式，在参照附图的同时按照下列顺序详细地说明：
1. 电路连接材料及其制备方法
2. 安装体及其制备方法
3. 实施例。
<1. 电路连接材料及其制备方法>
本实施方式的电路连接材料通过含有导电性粒子的第1粘接剂层与第2粘接剂层层叠的2层结构而具有优异的粒子捕捉性。
第1粘接剂层含有聚乙烯醇缩醛树脂、阳离子聚合性树脂、阳离子聚合引发剂和导电性粒子。
聚乙烯醇缩醛树脂可如下列化学式(1)所示，通过聚乙烯醇(PVA：polyvinyl alcohol)与醛的缩醛化反应而合成。
[化1]
另外，作为聚乙烯醇缩醛树脂之一的聚乙烯醇缩丁醛树脂可通过聚乙烯醇与丁醛的丁缩醛化反应而合成，但由于不完全地丁缩醛化，所以如下列化学式(2)所示地残留乙酰基和羟基。
[化2]
 
这样以聚乙烯醇缩丁醛树脂为代表的聚乙烯醇缩醛树脂可通过聚合度或缩醛基(丁缩醛基)、乙酰基、羟基等结构的比例来操纵热学·机械学性质、熔融粘度。
本实施方式的聚乙烯醇缩醛树脂由于具有羟基，所以可使阳离子聚合活化，提高低温固化性。具体的聚乙烯醇缩醛树脂的羟基率优选为20mol%以上且40mol%以下，更优选为30mol%以上且40mol%以下。由于聚乙烯醇缩醛树脂的羟基率在上述范围内，所以可提高低温固化性。
另外，聚乙烯醇缩醛树脂的常温下的粘度优选为50mPa·s以上且200mPa·s以下。由于聚乙烯醇缩醛树脂的常温下的粘度在上述范围内，所以可防止在常温下向SUS的附着，提高膜性，与此同时可抑制临时粘贴温度的上升，提高临时粘贴性。需说明的是，聚乙烯醇缩醛树脂的粘度为：将乙醇/甲苯=1/1的5%溶液或10%溶液作为溶剂，在20℃的测定温度下使用旋转粘度计(BM型)进行测定而得的粘度。
另外，聚乙烯醇缩醛树脂的玻璃化转变温度(Tg)优选为50℃以上且100℃以下，更优选为80℃以上且100℃以下。由于聚乙烯醇缩醛树脂的玻璃化转变温度(Tg)在上述范围内，所以可抑制压接时的流动性，提高导电性粒子的捕捉性。
另外，相对于总计100质量份的第1粘接剂层的树脂成分，聚乙烯醇缩醛树脂的含量优选为5~30质量份。由于聚乙烯醇缩醛树脂的含量在上述范围内，所以可得到优异的低温固化性、临时粘贴性和膜性。
作为阳离子聚合性树脂，可使用：环氧乙烷、环氧丙烷、环氧丁烷、氧化苯乙烯、苯基缩水甘油醚、丁基缩水甘油醚等单官能环氧化合物；双酚A型环氧树脂、双酚F型环氧树脂、线型酚醛树脂(phenol novolac)型环氧树脂、脂环式环氧树脂、三缩水甘油基异氰酸酯、乙内酰脲型环氧树脂等含杂环环氧树脂；氢化双酚A型环氧树脂、丙二醇二缩水甘油醚、季戊四醇-多缩水甘油醚等脂族类环氧树脂；通过芳族、脂族或脂环式的羧酸与表氯醇的反应而得到的环氧树脂；含有螺环的环氧树脂；作为邻-烯丙基-线型酚醛树脂化合物与表氯醇的反应产物的缩水甘油醚型环氧树脂；作为在双酚A的各个羟基的邻位具有烯丙基的二烯丙基双酚化合物与表氯醇的反应产物的缩水甘油醚型环氧树脂；席夫(Schiff)类化合物、二苯乙烯化合物和偶氮苯化合物的二缩水甘油醚型环氧树脂；(1,1,1,3,3,3-六氟-2-羟基异丙基)环己烷与表氯醇的反应产物等含氟脂环式、芳环式环氧树脂等。其中，特别优选将双酚A型环氧树脂、苯氧基树脂等阳离子聚合性树脂单独或混合使用。
阳离子聚合引发剂中，阳离子物类将环氧树脂末端的环氧基开环，从而使环氧树脂彼此自交联。作为这样的阳离子聚合引发剂，可列举出芳族锍盐、芳族重氮鎓(diazonium)盐、碘鎓盐、磷鎓盐、硒鎓盐等鎓盐。特别是芳族锍盐因低温下的反应性优异、适用期长而适合作为阳离子聚合引发剂。
导电性粒子例如可使用镍、金、铜等金属粒子，对树脂粒子实施镀金等而得的导电性粒子，在对树脂粒子实施镀金而得的粒子的最外层实施绝缘被覆而得的导电性粒子等。另外，从导电可靠性的观点出发，导电性粒子的平均粒径优选设为1~20μm。
另外，作为其它的添加组合物，优选添加硅烷偶联剂。作为硅烷偶联剂，可使用环氧类、氨基类、巯基·硫醚类、酰脲类等。由此，可提高有机材料与无机材料的界面处的粘接性。另外，也可添加无机填充剂。作为无机填充剂，可使用二氧化硅、滑石粉、氧化钛、碳酸钙、氧化镁等，无机填充剂的种类无特殊限定。通过无机填充剂的含量，可控制流动性，提高粒子捕捉率。另外，为了缓和接合体的应力，还可适宜使用橡胶成分等。
另外，第2粘接剂层含有阳离子聚合性树脂和阳离子聚合引发剂。由于阳离子聚合性树脂和阳离子聚合引发剂与第1环氧树脂同样，所以省略说明。另外，作为其它的添加组合物，与第1环氧树脂同样，优选添加硅烷偶联剂。另外，也可添加无机填充剂、橡胶成分等。
另外，与第1粘接剂层同样，在第2粘接剂层中也可含有聚乙烯醇缩醛树脂。在该情况下，只要使聚乙烯醇缩醛树脂的含量比第1粘接剂层的聚乙烯醇缩醛树脂的含量少即可。
包含这样的构成的电路连接材料，由于具有第1粘接剂层和第2粘接剂层的2层结构，在第1粘接剂层中含有聚乙烯醇缩醛树脂，所以即使在低温下进行压接的情况下也可得到导电性粒子的高捕捉效率，可得到优异的低温固化性。
接着，对将上述电路连接材料形成膜状而得的各向异性导电膜的制备方法进行说明。本实施方式的电路连接材料的制备方法为将第1粘接剂层与第2粘接剂层贴合的方法，具有制备第1粘接剂层的工序、制备第2粘接剂层的工序和将第1粘接剂层与第2粘接剂层粘贴的工序。
在制备第1粘接剂层的工序中，将含有阳离子聚合性树脂和阳离子聚合引发剂的粘接剂组合物溶解于溶剂中，添加导电性粒子。作为溶剂，可使用甲苯、醋酸乙酯等或它们的混合溶剂。在将第1粘接剂层的树脂组合物调整后，使用刮棒涂布机、涂布装置等涂布于剥离基材上。
剥离基材例如包含在PET (Poly Ethylene Terephthalate：聚对苯二甲酸乙二醇酯)、OPP (Oriented Polypropylene：定向聚丙烯)、PMP (Poly-4-methylpentene-1：聚-4-甲基戊烯-1)、PTFE (Polytetrafluoroethylene：聚四氟乙烯)等基材上涂布有硅酮等剥离剂的层叠结构。
接着，将涂布于剥离基材上的树脂组合物通过热烘箱、加热干燥装置等干燥。由此，可得到厚度为5~50μm左右的第1粘接剂层。
另外，制备第2粘接剂层的工序与第1粘接剂层同样，将含有阳离子聚合性树脂和阳离子聚合引发剂的粘接剂组合物溶解于溶剂中。然后，在将第2粘接剂层的树脂组合物调整后，将其涂布于剥离基材上，使溶剂挥发，由此可得到第2粘接剂层。
在下一步的将第1粘接剂层与第2粘接剂层粘贴的工序中，将第1粘接剂层与第2粘接剂层粘贴而层叠，制备2层结构的各向异性导电膜。
需说明的是，在上述实施方式中，设为将第1粘接剂层与第2粘接剂层粘贴而制备，但并不限定于此，也可在形成一个粘接剂层后，涂布另一个粘接剂层的树脂组合物，并进行干燥而制备。
<2. 安装体的制备方法>
接着，对使用上述电路连接材料的安装体的制备方法进行说明。本实施方式的安装体的制备方法具有临时粘接工序和按压工序，所述临时粘贴工序将上述电路连接材料的第1粘接剂层一侧临时粘贴于第1电子部件的电极上，所述按压工序将第2电子部件配置于电路连接材料上，用压接头从第2电子部件的上面进行按压。由此，可得到将第1电子部件的电极与第2电子部件的电极电连接而成的安装体。
作为第1电子部件，可列举出在玻璃基板上涂覆有IZO (Indium Zinc Oxide：氧化铟锌)膜的IZO涂覆玻璃、在玻璃基板上涂覆有SiNx (氮化硅)膜的SiNx涂覆玻璃等。另外，作为第2电子部件，可列举出COF (Chip On Film：覆晶薄膜)、IC (Integrated Circuit：集成电路)等。
在本实施方式中，通过使用第1粘接剂层和第2粘接剂层层叠而成的2层结构的电路连接材料，所述第1粘接剂层含有聚乙烯醇缩醛树脂、阳离子聚合性树脂、阳离子聚合引发剂和导电性粒子，所述第2粘接剂层含有阳离子聚合性树脂和阳离子聚合引发剂，从而即使在低温下进行固化的情况下也可得到导电性粒子的高捕捉效率，可得到优异的连接可靠性。
实施例
<3. 实施例>
以下，对本发明的实施例进行说明。在本实施例中，制备含有聚乙烯醇缩醛树脂的ACF层与NCF层层叠的2层结构的各向异性导电膜，使用该各向异性导电膜制备安装体，进行反应性、低温固化性、临时粘贴性和膜性的评价。需说明的是，本发明并不限定于这些实施例。
反应性、低温固化性、临时粘贴性和膜性的评价如下进行。
[反应性的评价]
使用差示扫描量热计DSC200 (Seiko Electronics Industrial Co., Ltd. (セイコー電子工業))，测定将10mg的样品以10℃/min从30℃升温至250℃时的放热峰。
[低温固化性]
对于在150℃的温度条件或160℃的温度条件下压接而成的安装体，使用数字万用表(数字万用表7555，横河电机社制)通过4端子法测定流过1mA的电流时各管脚的导通电阻，求得最大值和最小值。
[临时粘贴性的评价]
在评价用玻璃基板(IZO (氧化铟锌) 250nm涂覆玻璃)上，将切割成宽度为1.5mm的各向异性导电膜通过工具宽度为1.5mm的临时压接机在2MPa-1sec的条件下临时压接，求得可转接的温度的下限值。
[膜性的评价]
在常温下将各向异性导电性膜粘贴于不锈钢板(SUS304)上，调查剥离时树脂向不锈钢板的附着的有无。需说明的是，不锈钢为卷绕各向异性导电膜的带的辊的材料。
[实施例1]
(各向异性导电膜的制备)
在由15质量份的苯氧基树脂(商品名：YP-70，东都化成社制)、15质量份的环氧树脂(商品名：YD-019，东都化成社制)、35质量份的环氧树脂(商品名：EP828，JER公司制)、15质量份的特殊聚乙烯醇缩醛树脂(商品名：BX-1，积水化学工业社制，羟基：33±3mol%，粘度：80~130mPa·s (20℃)，玻璃化转变温度(Tg)：90℃)、2质量份的硅烷偶联剂(商品名：A187，Momentive Performance Materials Japan LLC (モメンティブ·パフォーマンス·マテリアルズ·ジャパン合同会社)制)、10质量份的阳离子聚合引发剂(商品名：SI-60L，三新化学社制)构成的组合物中，分散30质量份的导电性粒子(商品名：AUL704，积水化学工业社制)。将其使用刮棒涂布机涂布于PET膜上，用烘箱干燥，制备厚度为8μm的ACF层。
使用刮棒涂布机将由30质量份的苯氧基树脂(商品名：YP-70，东都化成社制)、20质量份的环氧树脂(商品名：YD-019，东都化成社制)、35质量份的环氧树脂(商品名：EP828，JER公司制)、2质量份的硅烷偶联剂(商品名：A187，Momentive Performance Materials Japan LLC (モメンティブ·パフォーマンス·マテリアルズ·ジャパン合同会社)制)、10质量份的阳离子聚合引发剂(商品名：SI-60L，三新化学社制)构成的组合物涂布于PET膜上，用烘箱干燥，制备厚度为16μm的NCF层。
使用辊式层压机在45℃的辊温度下将前述ACF层与NCF层层压，制备ACF层和NCF层的2层结构的各向异性导电膜。
(安装体的制备)
使用各向异性导电膜将评价用IC芯片(凸块尺寸：30×85μm，间距：50μm，金凸块高度h=15μm)与评价用玻璃基板(ITO图案，玻璃厚度t=0.7mm)接合。
首先，将切割成宽度为1.5mm的各向异性导电膜的ACF层一侧临时粘贴于评价用玻璃基板上。接着，从各向异性导电膜的NCF层一侧搭载评价用IC芯片，进行临时固定。然后，用宽度为1.5mm的加热工具，使用厚度为100μm的由聚四氟乙烯形成的片材作为缓冲材料， 在150℃或160℃、3MPa、5秒钟(工具速度为10mm/sec，台温度为40℃)的条件下进行压接，制备安装体。
(评价结果)
在表1中示出实施例1的评价结果。各向异性导电膜的DSC峰温度为102℃，可知具有优异的反应性。在160℃的条件下压接的安装体的导通电阻值的最大值为1.2Ω，最小值为0.3Ω。另外，在150℃的条件下压接的安装体的导通电阻值的最大值为1.1Ω，最小值为0.2Ω，可知低温固化性提高。另外，临时压接时的可转接的温度的下限值为50℃，可知具有优异的临时粘贴性。另外，在常温下无各向异性导电性膜向不锈钢的附着，可知具有优异的膜性。
[实施例2]
代替特殊聚乙烯醇缩醛树脂，使用聚乙烯醇缩丁醛树脂(商品名：BM-1，积水化学工业社制，羟基：约34mol%，粘度：60~100mPa·s (20℃)，玻璃化转变温度(Tg)：67℃)制备ACF层，除此之外，与实施例1同样地进行各向异性导电膜的制备，制备安装体。
(评价结果)
在表1中示出实施例2的评价结果。各向异性导电膜的DSC峰温度为102℃，可知具有优异的反应性。在160℃的条件下压接的安装体的导通电阻值的最大值为1.3Ω，最小值为0.3Ω。另外，在150℃的条件下压接的安装体的导通电阻值的最大值为1.2Ω，最小值为0.2Ω，可知低温固化性提高。另外，临时压接时的可转接的温度的下限值为50℃，可知具有优异的临时粘贴性。另外，在常温下无各向异性导电性膜向不锈钢的附着，可知具有优异的膜性。
[实施例3]
将特殊聚乙烯醇缩醛树脂设为7.5质量份，将聚乙烯醇缩丁醛树脂(商品名：BM-1，积水化学工业社制，羟基：约34mol%，粘度：60~100mPa·s (20℃)，玻璃化转变温度(Tg)：67℃)设为7.5质量份而制备ACF层，除此之外，与实施例1同样地进行各向异性导电膜的制备，制备安装体。
(评价结果)
在表1中示出实施例3的评价结果。各向异性导电膜的DSC峰温度为102℃，可知具有优异的反应性。在160℃的条件下压接的安装体的导通电阻值的最大值为1.2Ω，最小值为0.3Ω。另外，在150℃的条件下压接的安装体的导通电阻值的最大值为1.1Ω，最小值为0.2Ω，可知低温固化性提高。另外，临时压接时的可转接的温度的下限值为50℃，可知具有优异的临时粘贴性。另外，在常温下无各向异性导电性膜向不锈钢的附着，可知具有优异的膜性。
[比较例1]
在由30质量份的苯氧基树脂(商品名：YP-70，东都化成社制)、20质量份的环氧树脂(商品名：YD-019，东都化成社制)、35质量份的环氧树脂(商品名：EP828，JER公司制)、2质量份的硅烷偶联剂(商品名：A187，Momentive Performance Materials Japan LLC (モメンティブ·パフォーマンス·マテリアルズ·ジャパン合同会社)制)、10质量份的阳离子聚合引发剂(商品名：SI-60L，三新化学社制)构成的组合物中，分散30质量份的导电性粒子(商品名：AUL704，积水化学工业社制)而制备ACF层，除此之外，与实施例1同样地进行各向异性导电膜的制备，制备安装体。
(评价结果)
在表1中示出比较例1的评价结果。各向异性导电膜的DSC峰温度为106℃，可知反应性比实施例差。在160℃的条件下压接的安装体的导通电阻值的最大值为1.3Ω，最小值为0.3Ω。另外，在150℃的条件下压接的安装体的导通电阻值的最大值为5.3Ω，最小值为1.8Ω，在150℃的条件下导通不充分。另外，临时压接时的可转接的温度的下限值为50℃，可知具有优异的临时粘贴性。另外，在常温下无各向异性导电性膜向不锈钢的附着，可知具有优异的膜性。
[比较例2]
在由30质量份的苯氧基树脂(商品名：YP-70，东都化成社制)、20质量份的环氧树脂(商品名：YD-019，东都化成社制)、45质量份的环氧树脂(商品名：EP828，JER公司制)、2质量份的硅烷偶联剂(商品名：A187，Momentive Performance Materials Japan LLC (モメンティブ·パフォーマンス·マテリアルズ·ジャパン合同会社)制)、15质量份的阳离子聚合引发剂(商品名：SI-60L，三新化学社制)构成的组合物中，分散30质量份的导电性粒子(商品名：AUL704，积水化学工业社制)而制备ACF层，除此之外，与实施例1同样地进行各向异性导电膜的制备，制备安装体。
(评价结果)
在表1中示出比较例2的评价结果。各向异性导电膜的DSC峰温度为102℃，可知具有优异的反应性。在160℃的条件下压接的安装体的导通电阻值的最大值为1.2Ω，最小值为0.3Ω。另外，在150℃的条件下压接的安装体的导通电阻值的最大值为1.3Ω，最小值为0.3Ω。另外，临时压接时的可转接的温度的下限值为50℃，可知具有优异的临时粘贴性。另外，由于在常温下有各向异性导电性膜向不锈钢的附着，所以可知膜性比实施例差。
[比较例3]
在由45质量份的苯氧基树脂(商品名：YP-70，东都化成社制)、10质量份的环氧树脂(商品名：YD-019，东都化成社制)、35质量份的环氧树脂(商品名：EP828，JER公司制)、2质量份的硅烷偶联剂(商品名：A187，Momentive Performance Materials Japan LLC (モメンティブ·パフォーマンス·マテリアルズ·ジャパン合同会社)制)、15质量份的阳离子聚合引发剂(商品名：SI-60L，三新化学社制)构成的组合物中，分散30质量份的导电性粒子(商品名：AUL704，积水化学工业社制)而制备ACF层，除此之外，与实施例1同样地进行各向异性导电膜的制备，制备安装体。
(评价结果)
在表1中示出比较例3的评价结果。各向异性导电膜的DSC峰温度为102℃，可知具有优异的反应性。在160℃的条件下压接的安装体的导通电阻值的最大值为1.2Ω，最小值为0.3Ω。另外，在150℃的条件下压接的安装体的导通电阻值的最大值为1.3Ω，最小值为0.3Ω。另外，临时压接时的可转接的温度的下限值为60℃，可知临时粘贴性比实施例差。另外，在常温下无各向异性导电性膜向不锈钢的附着，可知具有优异的膜性。
[表1]
。
如表1所示，可知在ACF层与NCF层层叠的2层结构的各向异性导电膜中，通过在ACF层中掺混特殊聚乙烯醇缩醛树脂、聚乙烯醇缩丁醛树脂，可提高低温固化性。另外，可知临时粘贴性和膜性也优异。

Claims (6)

1. 一种电路连接材料，所述电路连接材料具有第1粘接剂层和第2粘接剂层，
所述第1粘接剂层含有聚乙烯醇缩醛树脂、阳离子聚合性树脂、阳离子聚合引发剂和导电性粒子，
所述第2粘接剂层含有阳离子聚合性树脂和阳离子聚合引发剂。
2. 权利要求1的电路连接材料，其中，所述聚乙烯醇缩醛树脂在常温下的粘度为50mPa·s以上且200mPa·s以下。
3. 权利要求1或2的电路连接材料，其中，所述聚乙烯醇缩醛树脂的玻璃化转变温度(Tg)为50℃以上且100℃以下。
4. 权利要求1的电路连接材料，其中，所述聚乙烯醇缩醛树脂的羟基率为20mol%以上且40mol%以下。
5. 一种安装体的制备方法，所述制备方法具有临时粘贴工序和按压工序，
所述临时粘贴工序将具有第1粘接剂层和第2粘接剂层的电路连接材料的第1粘接剂层一侧临时粘贴于第1电子部件的电极上，所述第1粘接剂层含有聚乙烯醇缩醛树脂、阳离子聚合性树脂、阳离子聚合引发剂和导电性粒子，所述第2粘接剂层含有阳离子聚合性树脂和阳离子聚合引发剂，
所述按压工序将第2电子部件配置于所述电路连接材料上，用压接头从所述第2电子部件的上面进行按压。
6. 一种安装体，所述安装体通过具有第1粘接剂层和第2粘接剂层的电路连接材料将第1电子部件的电极与第2电子部件的电极电连接而成，所述第1粘接剂层含有聚乙烯醇缩醛树脂、阳离子聚合性树脂、阳离子聚合引发剂和导电性粒子，所述第2粘接剂层含有阳离子聚合性树脂和阳离子聚合引发剂。
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