JP2013221144A - 回路接続材料、及びこれを用いた実装体の製造方法 - Google Patents

回路接続材料、及びこれを用いた実装体の製造方法 Download PDF

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Publication number
JP2013221144A
JP2013221144A JP2012095522A JP2012095522A JP2013221144A JP 2013221144 A JP2013221144 A JP 2013221144A JP 2012095522 A JP2012095522 A JP 2012095522A JP 2012095522 A JP2012095522 A JP 2012095522A JP 2013221144 A JP2013221144 A JP 2013221144A
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Japan
Prior art keywords
resin
adhesive layer
polyvinyl acetal
polymerization initiator
cationic polymerization
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JP2012095522A
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English (en)
Japanese (ja)
Inventor
Yoshihito Tanaka
芳人 田中
Ryota Aizaki
亮太 相崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
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Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2012095522A priority Critical patent/JP2013221144A/ja
Priority to KR1020147031952A priority patent/KR102036570B1/ko
Priority to CN201380020499.6A priority patent/CN104508062B/zh
Priority to PCT/JP2013/059950 priority patent/WO2013157378A1/ja
Publication of JP2013221144A publication Critical patent/JP2013221144A/ja
Pending legal-status Critical Current

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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83201—Compression bonding
    • H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83862—Heat curing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83905—Combinations of bonding methods provided for in at least two different groups from H01L2224/838 - H01L2224/83904
    • H01L2224/83907—Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9211—Parallel connecting processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2012095522A 2012-04-19 2012-04-19 回路接続材料、及びこれを用いた実装体の製造方法 Pending JP2013221144A (ja)

Priority Applications (4)

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JP2012095522A JP2013221144A (ja) 2012-04-19 2012-04-19 回路接続材料、及びこれを用いた実装体の製造方法
KR1020147031952A KR102036570B1 (ko) 2012-04-19 2013-04-01 회로 접속 재료 및 이것을 사용한 실장체의 제조 방법
CN201380020499.6A CN104508062B (zh) 2012-04-19 2013-04-01 电路连接材料及使用其的安装体的制备方法
PCT/JP2013/059950 WO2013157378A1 (ja) 2012-04-19 2013-04-01 回路接続材料、及びこれを用いた実装体の製造方法

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JP2015147832A (ja) * 2014-02-05 2015-08-20 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法、並びに、接続方法及び接合体
WO2018092452A1 (ja) * 2016-11-18 2018-05-24 住友電気工業株式会社 接着剤組成物及びプリント配線板
JP2018104653A (ja) * 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤

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* Cited by examiner, † Cited by third party
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JP6307308B2 (ja) * 2014-03-06 2018-04-04 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
KR102457858B1 (ko) * 2015-06-23 2022-10-21 주식회사 쿠라레 접착제, 접착체, 및 접착체의 제조 방법

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JP2004221312A (ja) * 2003-01-15 2004-08-05 Hitachi Chem Co Ltd 回路接続用接着フィルムの接続方法及び回路接続用接着フィルム
JP2007153933A (ja) * 2005-11-30 2007-06-21 Matsushita Electric Works Ltd 接着方法及び接着剤
JP2007331180A (ja) * 2006-06-14 2007-12-27 General Technology Kk 昇華転写受像シート、昇華転写シート及び昇華転写記録セット
WO2009028241A1 (ja) * 2007-08-24 2009-03-05 Sony Chemical & Information Device Corporation 異方性導電フィルム及びそれを用いた接続構造体の製造方法
JP2012021141A (ja) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法

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JP2004221312A (ja) * 2003-01-15 2004-08-05 Hitachi Chem Co Ltd 回路接続用接着フィルムの接続方法及び回路接続用接着フィルム
JP2007153933A (ja) * 2005-11-30 2007-06-21 Matsushita Electric Works Ltd 接着方法及び接着剤
JP2007331180A (ja) * 2006-06-14 2007-12-27 General Technology Kk 昇華転写受像シート、昇華転写シート及び昇華転写記録セット
WO2009028241A1 (ja) * 2007-08-24 2009-03-05 Sony Chemical & Information Device Corporation 異方性導電フィルム及びそれを用いた接続構造体の製造方法
JP2012021141A (ja) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015147832A (ja) * 2014-02-05 2015-08-20 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法、並びに、接続方法及び接合体
WO2018092452A1 (ja) * 2016-11-18 2018-05-24 住友電気工業株式会社 接着剤組成物及びプリント配線板
JPWO2018092452A1 (ja) * 2016-11-18 2019-10-17 住友電気工業株式会社 接着剤組成物及びプリント配線板
JP2018104653A (ja) * 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤

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CN104508062B (zh) 2017-02-22

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