TWI297717B - - Google Patents

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Publication number
TWI297717B
TWI297717B TW92104285A TW92104285A TWI297717B TW I297717 B TWI297717 B TW I297717B TW 92104285 A TW92104285 A TW 92104285A TW 92104285 A TW92104285 A TW 92104285A TW I297717 B TWI297717 B TW I297717B
Authority
TW
Taiwan
Prior art keywords
atom
film
cerium oxide
component
composition
Prior art date
Application number
TW92104285A
Other languages
English (en)
Chinese (zh)
Other versions
TW200400237A (en
Inventor
Haruaki Sakurai
Kouichi Abe
Kazuhiro Enomoto
Shigeru Nobe
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200400237A publication Critical patent/TW200400237A/zh
Application granted granted Critical
Publication of TWI297717B publication Critical patent/TWI297717B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/02—Polysilicates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Organic Insulating Materials (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Silicon Compounds (AREA)
TW92104285A 2002-02-27 2003-02-27 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts TW200400237A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002052025 2002-02-27
JP2002060615 2002-03-06
JP2002060622 2002-03-06
JP2002060620 2002-03-06
JP2002127012 2002-04-26

Publications (2)

Publication Number Publication Date
TW200400237A TW200400237A (en) 2004-01-01
TWI297717B true TWI297717B (https=) 2008-06-11

Family

ID=27767938

Family Applications (3)

Application Number Title Priority Date Filing Date
TW093140080A TW200514828A (en) 2002-02-27 2003-02-27 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic part
TW92104285A TW200400237A (en) 2002-02-27 2003-02-27 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
TW094127342A TW200600557A (en) 2002-02-27 2003-02-27 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW093140080A TW200514828A (en) 2002-02-27 2003-02-27 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic part

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW094127342A TW200600557A (en) 2002-02-27 2003-02-27 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts

Country Status (7)

Country Link
US (1) US7358300B2 (https=)
JP (3) JP4151579B2 (https=)
KR (4) KR100820992B1 (https=)
CN (2) CN1320073C (https=)
AU (1) AU2003211343A1 (https=)
TW (3) TW200514828A (https=)
WO (1) WO2003072668A1 (https=)

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US8901268B2 (en) 2004-08-03 2014-12-02 Ahila Krishnamoorthy Compositions, layers and films for optoelectronic devices, methods of production and uses thereof
US20060047034A1 (en) * 2004-09-02 2006-03-02 Haruaki Sakurai Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film
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US20080260956A1 (en) * 2004-12-21 2008-10-23 Haruaki Sakurai Film, Silica Film and Method of Forming the Same, Composition for Forming Silica Film, and Electronic Part
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US9273215B2 (en) * 2012-10-30 2016-03-01 Rohm And Haas Electronic Materials Llc Adhesion promoter
US9196849B2 (en) * 2013-01-09 2015-11-24 Research & Business Foundation Sungkyunkwan University Polymer/inorganic multi-layer encapsulation film
US9371430B2 (en) 2013-08-19 2016-06-21 Research & Business Foundation Sungkyunkwan University Porous film with high hardness and a low dielectric constant and preparation method thereof
KR101506801B1 (ko) * 2013-08-19 2015-03-30 성균관대학교산학협력단 고강도 저유전 플라즈마 중합체 박막 및 그 제조 방법
US9153357B1 (en) * 2014-03-27 2015-10-06 Rohm And Haas Electronic Materials Llc Adhesion promoter
JP6451376B2 (ja) * 2015-01-20 2019-01-16 三菱マテリアル株式会社 低屈折率膜形成用液組成物
JP6803842B2 (ja) 2015-04-13 2020-12-23 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング
US11747341B2 (en) 2019-03-04 2023-09-05 Waters Technologies Corporation Methods of use for low-bind polypropylene plates and vials
US11635717B2 (en) * 2021-02-12 2023-04-25 Canon Kabushiki Kaisha Electrophotographic member and method for manufacturing the same, thermal fixing apparatus, and electrophotographic image forming apparatus

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Also Published As

Publication number Publication date
KR20040094732A (ko) 2004-11-10
TW200600557A (en) 2006-01-01
TWI304434B (https=) 2008-12-21
TW200400237A (en) 2004-01-01
KR20050008780A (ko) 2005-01-21
US7358300B2 (en) 2008-04-15
KR100820992B1 (ko) 2008-04-10
TW200514828A (en) 2005-05-01
CN1320073C (zh) 2007-06-06
JP2008195945A (ja) 2008-08-28
AU2003211343A1 (en) 2003-09-09
KR100795251B1 (ko) 2008-01-15
CN1637097A (zh) 2005-07-13
JP2008297550A (ja) 2008-12-11
US20050119394A1 (en) 2005-06-02
JP4169088B2 (ja) 2008-10-22
JPWO2003072668A1 (ja) 2005-06-23
CN1639283A (zh) 2005-07-13
KR100819226B1 (ko) 2008-04-02
CN100491486C (zh) 2009-05-27
TWI297718B (https=) 2008-06-11
JP4151579B2 (ja) 2008-09-17
KR20070038574A (ko) 2007-04-10
KR20050095788A (ko) 2005-09-30
WO2003072668A1 (fr) 2003-09-04

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