TWI304434B - - Google Patents

Download PDF

Info

Publication number
TWI304434B
TWI304434B TW94127342A TW94127342A TWI304434B TW I304434 B TWI304434 B TW I304434B TW 94127342 A TW94127342 A TW 94127342A TW 94127342 A TW94127342 A TW 94127342A TW I304434 B TWI304434 B TW I304434B
Authority
TW
Taiwan
Prior art keywords
film
atom
cerium oxide
composition
component
Prior art date
Application number
TW94127342A
Other languages
English (en)
Chinese (zh)
Other versions
TW200600557A (en
Inventor
Haruaki Sakurai
Kouichi Abe
Kazuhiro Enomoto
Shigeru Nobe
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200600557A publication Critical patent/TW200600557A/zh
Application granted granted Critical
Publication of TWI304434B publication Critical patent/TWI304434B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/02—Polysilicates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Organic Insulating Materials (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Silicon Compounds (AREA)
TW094127342A 2002-02-27 2003-02-27 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts TW200600557A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002052025 2002-02-27
JP2002060615 2002-03-06
JP2002060622 2002-03-06
JP2002060620 2002-03-06
JP2002127012 2002-04-26

Publications (2)

Publication Number Publication Date
TW200600557A TW200600557A (en) 2006-01-01
TWI304434B true TWI304434B (https=) 2008-12-21

Family

ID=27767938

Family Applications (3)

Application Number Title Priority Date Filing Date
TW093140080A TW200514828A (en) 2002-02-27 2003-02-27 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic part
TW92104285A TW200400237A (en) 2002-02-27 2003-02-27 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
TW094127342A TW200600557A (en) 2002-02-27 2003-02-27 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW093140080A TW200514828A (en) 2002-02-27 2003-02-27 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic part
TW92104285A TW200400237A (en) 2002-02-27 2003-02-27 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts

Country Status (7)

Country Link
US (1) US7358300B2 (https=)
JP (3) JP4151579B2 (https=)
KR (4) KR100820992B1 (https=)
CN (2) CN1320073C (https=)
AU (1) AU2003211343A1 (https=)
TW (3) TW200514828A (https=)
WO (1) WO2003072668A1 (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4744077B2 (ja) * 2003-12-18 2011-08-10 京セラ株式会社 シロキサンポリマ皮膜形成方法および光導波路の作製方法
JP2005181871A (ja) * 2003-12-22 2005-07-07 Kyocera Corp 光導波路基板
US8901268B2 (en) 2004-08-03 2014-12-02 Ahila Krishnamoorthy Compositions, layers and films for optoelectronic devices, methods of production and uses thereof
US20060047034A1 (en) * 2004-09-02 2006-03-02 Haruaki Sakurai Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film
JP2006213908A (ja) * 2004-12-21 2006-08-17 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜の形成方法、シリカ系被膜、及び、電子部品
US20080260956A1 (en) * 2004-12-21 2008-10-23 Haruaki Sakurai Film, Silica Film and Method of Forming the Same, Composition for Forming Silica Film, and Electronic Part
US20060183055A1 (en) * 2005-02-15 2006-08-17 O'neill Mark L Method for defining a feature on a substrate
JP2007031696A (ja) * 2005-06-10 2007-02-08 Hitachi Chem Co Ltd 樹脂組成物、シリカ系被膜及びその製造方法、積層体、並びに、電子部品
JP2007031697A (ja) * 2005-06-10 2007-02-08 Hitachi Chem Co Ltd 被アルカリ処理被膜形成用組成物、被アルカリ処理被膜及びその製造方法、積層体、反射防止膜、並びに電子部品
JP2007241018A (ja) * 2006-03-10 2007-09-20 Epson Toyocom Corp 全反射ミラー
JP5127277B2 (ja) * 2007-04-05 2013-01-23 新日鉄住金マテリアルズ株式会社 表面平坦性絶縁膜形成用塗布溶液、表面平坦性絶縁膜被覆基材、及び表面平坦性絶縁膜被覆基材の製造方法
JP5351279B2 (ja) * 2008-12-05 2013-11-27 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 自己組織化シリカ縮合物
US8557877B2 (en) 2009-06-10 2013-10-15 Honeywell International Inc. Anti-reflective coatings for optically transparent substrates
US9017933B2 (en) * 2010-03-29 2015-04-28 Tokyo Electron Limited Method for integrating low-k dielectrics
JP2012049300A (ja) * 2010-08-26 2012-03-08 Nippon Zeon Co Ltd 半導体素子基板
US8864898B2 (en) 2011-05-31 2014-10-21 Honeywell International Inc. Coating formulations for optical elements
US9273215B2 (en) * 2012-10-30 2016-03-01 Rohm And Haas Electronic Materials Llc Adhesion promoter
US9196849B2 (en) * 2013-01-09 2015-11-24 Research & Business Foundation Sungkyunkwan University Polymer/inorganic multi-layer encapsulation film
US9371430B2 (en) 2013-08-19 2016-06-21 Research & Business Foundation Sungkyunkwan University Porous film with high hardness and a low dielectric constant and preparation method thereof
KR101506801B1 (ko) * 2013-08-19 2015-03-30 성균관대학교산학협력단 고강도 저유전 플라즈마 중합체 박막 및 그 제조 방법
US9153357B1 (en) * 2014-03-27 2015-10-06 Rohm And Haas Electronic Materials Llc Adhesion promoter
JP6451376B2 (ja) * 2015-01-20 2019-01-16 三菱マテリアル株式会社 低屈折率膜形成用液組成物
JP6803842B2 (ja) 2015-04-13 2020-12-23 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング
US11747341B2 (en) 2019-03-04 2023-09-05 Waters Technologies Corporation Methods of use for low-bind polypropylene plates and vials
US11635717B2 (en) * 2021-02-12 2023-04-25 Canon Kabushiki Kaisha Electrophotographic member and method for manufacturing the same, thermal fixing apparatus, and electrophotographic image forming apparatus

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2914427A1 (de) * 1979-04-10 1980-10-23 Bayer Ag Beschichtung fuer thermoplasten
US5820923A (en) 1992-11-02 1998-10-13 Dow Corning Corporation Curing silica precursors by exposure to nitrous oxide
EP0768352A4 (en) * 1994-06-30 1997-12-10 Hitachi Chemical Co Ltd MATERIAL FOR PRODUCING A SOLICA-COVERED INSULATING FILM, METHOD FOR PRODUCING THIS MATERIAL, SILICO INSULATING FILM, SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
JP3824334B2 (ja) 1995-08-07 2006-09-20 東京応化工業株式会社 シリカ系被膜形成用塗布液及び被膜形成方法
EP0798054B1 (en) 1996-02-28 2003-09-03 Nippon Shokubai Co., Ltd. Process for producing a coated film continuously
US5880187A (en) * 1996-04-24 1999-03-09 Toyota Jidosha Kabushiki Kaisha Top coating compositions
KR100317898B1 (ko) * 1996-06-24 2002-06-27 우츠미 오사무 투명피막형성용도포액,투명피막이도포된기재및그의용도
WO1998026019A1 (en) * 1996-12-13 1998-06-18 Matsushita Electric Works, Ltd. Silicone emulsion coating composition and processes for the preparation thereof
JP4321686B2 (ja) 1998-04-24 2009-08-26 旭化成株式会社 有機−無機複合体および多孔質ケイ素酸化物の製造方法
JPH11322992A (ja) 1998-05-18 1999-11-26 Jsr Corp 多孔質膜
JP2000049155A (ja) 1998-07-31 2000-02-18 Hitachi Chem Co Ltd 半導体装置
JP2000290590A (ja) 1999-04-12 2000-10-17 Jsr Corp 膜形成用組成物、膜の形成方法および低密度化膜
JP4096138B2 (ja) * 1999-04-12 2008-06-04 Ｊｓｒ株式会社 レジスト下層膜用組成物の製造方法
JP2000299316A (ja) * 1999-04-12 2000-10-24 Jsr Corp 膜形成用組成物、膜の形成方法および低密度化膜
JP2001002994A (ja) * 1999-06-24 2001-01-09 Jsr Corp 膜形成用組成物、膜の形成方法および低密度化膜
JP2001055554A (ja) * 1999-08-20 2001-02-27 Jsr Corp 膜形成用組成物および絶縁膜形成用材料
US6589889B2 (en) * 1999-09-09 2003-07-08 Alliedsignal Inc. Contact planarization using nanoporous silica materials
TWI260332B (en) 1999-09-16 2006-08-21 Hitachi Chemical Co Ltd Compositions, methods of forming low dielectric coefficient film using the composition, low dielectric coefficient films, and electronic components having the film
US20040253462A1 (en) 1999-09-16 2004-12-16 Hitachi Chemical Co., Ltd. Composition, methods for forming low-permittivity film using the composition, low-permittivity film, and electronic part having the low-permittivity film
JP2001098218A (ja) * 1999-09-28 2001-04-10 Hitachi Chem Co Ltd シリカ系被膜、シリカ系被膜の形成方法及びシリカ系被膜を有する電子部品
JP2001351911A (ja) 2000-04-03 2001-12-21 Ulvac Japan Ltd 多孔質ｓｏｇ膜の作製方法
US7265062B2 (en) 2000-04-04 2007-09-04 Applied Materials, Inc. Ionic additives for extreme low dielectric constant chemical formulations
US6576568B2 (en) 2000-04-04 2003-06-10 Applied Materials, Inc. Ionic additives for extreme low dielectric constant chemical formulations
JP4574054B2 (ja) 2000-04-28 2010-11-04 三井化学株式会社 撥水性多孔質シリカ、その製造方法および用途
EP1160848B1 (en) * 2000-05-22 2011-10-05 JSR Corporation Composition for silica-based film formation
JP2002020689A (ja) 2000-07-07 2002-01-23 Jsr Corp 膜形成用組成物の製造方法、膜形成用組成物、膜の形成方法およびシリカ系膜
JP4697363B2 (ja) * 2000-08-21 2011-06-08 Ｊｓｒ株式会社 膜形成用組成物および絶縁膜形成用材料
JP2002129103A (ja) 2000-10-23 2002-05-09 Jsr Corp 膜形成用組成物および絶縁膜形成用材料
US6947651B2 (en) * 2001-05-10 2005-09-20 Georgia Tech Research Corporation Optical waveguides formed from nano air-gap inter-layer dielectric materials and methods of fabrication thereof
JP2003131001A (ja) * 2001-05-25 2003-05-08 Shipley Co Llc 多孔性光学物質
JP2003041191A (ja) * 2001-07-30 2003-02-13 Jsr Corp 膜形成用組成物、膜の形成方法およびシリカ系膜
JP2003064307A (ja) * 2001-08-28 2003-03-05 Hitachi Chem Co Ltd シリカ系被膜、シリカ系被膜形成用組成物、シリカ系被膜の製造方法及び電子部品
JP4972834B2 (ja) * 2001-08-28 2012-07-11 日立化成工業株式会社 シロキサン樹脂
EP1446356A4 (en) * 2001-11-21 2005-04-06 Univ Massachusetts MESOPOROUS MATERIALS AND METHOD
JP3702842B2 (ja) 2001-12-04 2005-10-05 日立化成工業株式会社 シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品
AU2002309806A1 (en) * 2002-04-10 2003-10-27 Honeywell International, Inc. New porogens for porous silica dielectric for integral circuit applications
US20050173803A1 (en) 2002-09-20 2005-08-11 Victor Lu Interlayer adhesion promoter for low k materials

Also Published As

Publication number Publication date
KR20040094732A (ko) 2004-11-10
TW200600557A (en) 2006-01-01
TW200400237A (en) 2004-01-01
KR20050008780A (ko) 2005-01-21
US7358300B2 (en) 2008-04-15
KR100820992B1 (ko) 2008-04-10
TW200514828A (en) 2005-05-01
TWI297717B (https=) 2008-06-11
CN1320073C (zh) 2007-06-06
JP2008195945A (ja) 2008-08-28
AU2003211343A1 (en) 2003-09-09
KR100795251B1 (ko) 2008-01-15
CN1637097A (zh) 2005-07-13
JP2008297550A (ja) 2008-12-11
US20050119394A1 (en) 2005-06-02
JP4169088B2 (ja) 2008-10-22
JPWO2003072668A1 (ja) 2005-06-23
CN1639283A (zh) 2005-07-13
KR100819226B1 (ko) 2008-04-02
CN100491486C (zh) 2009-05-27
TWI297718B (https=) 2008-06-11
JP4151579B2 (ja) 2008-09-17
KR20070038574A (ko) 2007-04-10
KR20050095788A (ko) 2005-09-30
WO2003072668A1 (fr) 2003-09-04

Similar Documents

Publication Publication Date Title
TWI304434B (https=)
TWI261543B (en) Low dielectric materials and methods for making same
TW200415178A (en) Interlayer adhesion promoter for low k materials
TWI326891B (en) Material for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereof
JP3966026B2 (ja) シリカ系被膜形成用組成物、シリカ系被膜及びその製造方法、並びに電子部品
US7687590B2 (en) Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
US7682701B2 (en) Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
JP5143335B2 (ja) シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品
JP4110796B2 (ja) シリカ系被膜形成用組成物、シリカ系被膜の製造方法及び電子部品
JP2008050610A (ja) シリカ系被膜形成用組成物、シリカ系被膜及びその製造方法、並びに電子部品
JP5143334B2 (ja) シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品
JPH06181201A (ja) 半導体装置の絶縁膜およびその絶縁膜形成用塗布液
JP2005136429A (ja) シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品
JP2003119423A (ja) 半導体用シリカ系被膜形成用塗布液、半導体用シリカ系被膜及び該被膜を用いた半導体装置
JP2005105283A (ja) シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品
JP2005105281A (ja) シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品
JP2005105282A (ja) シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品
JP2009256437A (ja) 塗布型シリカ系被膜形成用組成物、シリカ系被膜の形成方法及びシリカ系被膜を有する電子部品
JP2005175396A (ja) ダマシン法を用いた配線の形成方法及び該配線形成に用いるシリカ系被膜形成用塗布液
JP2010093111A (ja) 塗布型無機シリカ系被膜形成用組成物、この組成物を用いた塗布型無機シリカ系被膜、及び、この被膜を有する電子部品
JP2003174026A (ja) 半導体用シリカ系被膜形成用塗布液、半導体用シリカ系被膜及び該被膜を用いた半導体装置
JP2005042123A (ja) シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品
JP2005139447A (ja) シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品
JP2007088298A (ja) 化学的機械的平坦化方法
JP2005097626A (ja) シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees