TW200514828A - Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic part - Google Patents
Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic partInfo
- Publication number
- TW200514828A TW200514828A TW093140080A TW93140080A TW200514828A TW 200514828 A TW200514828 A TW 200514828A TW 093140080 A TW093140080 A TW 093140080A TW 93140080 A TW93140080 A TW 93140080A TW 200514828 A TW200514828 A TW 200514828A
- Authority
- TW
- Taiwan
- Prior art keywords
- based coating
- silica based
- coating film
- composition
- component
- Prior art date
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title abstract 12
- 239000011248 coating agent Substances 0.000 title abstract 7
- 238000000576 coating method Methods 0.000 title abstract 7
- 239000000377 silicon dioxide Substances 0.000 title abstract 6
- 238000000034 method Methods 0.000 title 1
- 238000002360 preparation method Methods 0.000 title 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 1
- 150000003863 ammonium salts Chemical class 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 239000003039 volatile agent Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/02—Polysilicates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Paints Or Removers (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Organic Insulating Materials (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002052025 | 2002-02-27 | ||
JP2002060622 | 2002-03-06 | ||
JP2002060615 | 2002-03-06 | ||
JP2002060620 | 2002-03-06 | ||
JP2002127012 | 2002-04-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200514828A true TW200514828A (en) | 2005-05-01 |
TWI297718B TWI297718B (zh) | 2008-06-11 |
Family
ID=27767938
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093140080A TW200514828A (en) | 2002-02-27 | 2003-02-27 | Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic part |
TW094127342A TW200600557A (en) | 2002-02-27 | 2003-02-27 | Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts |
TW92104285A TW200400237A (en) | 2002-02-27 | 2003-02-27 | Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094127342A TW200600557A (en) | 2002-02-27 | 2003-02-27 | Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts |
TW92104285A TW200400237A (en) | 2002-02-27 | 2003-02-27 | Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts |
Country Status (7)
Country | Link |
---|---|
US (1) | US7358300B2 (zh) |
JP (3) | JP4151579B2 (zh) |
KR (4) | KR100820992B1 (zh) |
CN (2) | CN100491486C (zh) |
AU (1) | AU2003211343A1 (zh) |
TW (3) | TW200514828A (zh) |
WO (1) | WO2003072668A1 (zh) |
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JP4744077B2 (ja) * | 2003-12-18 | 2011-08-10 | 京セラ株式会社 | シロキサンポリマ皮膜形成方法および光導波路の作製方法 |
JP2005181871A (ja) * | 2003-12-22 | 2005-07-07 | Kyocera Corp | 光導波路基板 |
US8901268B2 (en) | 2004-08-03 | 2014-12-02 | Ahila Krishnamoorthy | Compositions, layers and films for optoelectronic devices, methods of production and uses thereof |
US20060047034A1 (en) * | 2004-09-02 | 2006-03-02 | Haruaki Sakurai | Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film |
JP2006213908A (ja) * | 2004-12-21 | 2006-08-17 | Hitachi Chem Co Ltd | シリカ系被膜形成用組成物、シリカ系被膜の形成方法、シリカ系被膜、及び、電子部品 |
WO2006068181A1 (ja) * | 2004-12-21 | 2006-06-29 | Hitachi Chemical Company, Ltd. | 被膜、シリカ系被膜及びその形成方法、シリカ系被膜形成用組成物、並びに電子部品 |
US20060183055A1 (en) * | 2005-02-15 | 2006-08-17 | O'neill Mark L | Method for defining a feature on a substrate |
JP2007031697A (ja) * | 2005-06-10 | 2007-02-08 | Hitachi Chem Co Ltd | 被アルカリ処理被膜形成用組成物、被アルカリ処理被膜及びその製造方法、積層体、反射防止膜、並びに電子部品 |
JP2007031696A (ja) * | 2005-06-10 | 2007-02-08 | Hitachi Chem Co Ltd | 樹脂組成物、シリカ系被膜及びその製造方法、積層体、並びに、電子部品 |
JP2007241018A (ja) * | 2006-03-10 | 2007-09-20 | Epson Toyocom Corp | 全反射ミラー |
JP5127277B2 (ja) * | 2007-04-05 | 2013-01-23 | 新日鉄住金マテリアルズ株式会社 | 表面平坦性絶縁膜形成用塗布溶液、表面平坦性絶縁膜被覆基材、及び表面平坦性絶縁膜被覆基材の製造方法 |
WO2010065169A1 (en) * | 2008-12-05 | 2010-06-10 | E. I. Du Pont De Nemours And Company | Self-assembled silica condensates |
US8557877B2 (en) | 2009-06-10 | 2013-10-15 | Honeywell International Inc. | Anti-reflective coatings for optically transparent substrates |
US20110232677A1 (en) * | 2010-03-29 | 2011-09-29 | Tokyo Electron Limited | Method for cleaning low-k dielectrics |
JP2012049300A (ja) * | 2010-08-26 | 2012-03-08 | Nippon Zeon Co Ltd | 半導体素子基板 |
US8864898B2 (en) | 2011-05-31 | 2014-10-21 | Honeywell International Inc. | Coating formulations for optical elements |
US9273215B2 (en) * | 2012-10-30 | 2016-03-01 | Rohm And Haas Electronic Materials Llc | Adhesion promoter |
US9196849B2 (en) * | 2013-01-09 | 2015-11-24 | Research & Business Foundation Sungkyunkwan University | Polymer/inorganic multi-layer encapsulation film |
KR101506801B1 (ko) * | 2013-08-19 | 2015-03-30 | 성균관대학교산학협력단 | 고강도 저유전 플라즈마 중합체 박막 및 그 제조 방법 |
US9371430B2 (en) | 2013-08-19 | 2016-06-21 | Research & Business Foundation Sungkyunkwan University | Porous film with high hardness and a low dielectric constant and preparation method thereof |
US9153357B1 (en) * | 2014-03-27 | 2015-10-06 | Rohm And Haas Electronic Materials Llc | Adhesion promoter |
JP6451376B2 (ja) * | 2015-01-20 | 2019-01-16 | 三菱マテリアル株式会社 | 低屈折率膜形成用液組成物 |
JP6803842B2 (ja) | 2015-04-13 | 2020-12-23 | ハネウェル・インターナショナル・インコーポレーテッドHoneywell International Inc. | オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング |
US11747341B2 (en) | 2019-03-04 | 2023-09-05 | Waters Technologies Corporation | Methods of use for low-bind polypropylene plates and vials |
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US20040253462A1 (en) * | 1999-09-16 | 2004-12-16 | Hitachi Chemical Co., Ltd. | Composition, methods for forming low-permittivity film using the composition, low-permittivity film, and electronic part having the low-permittivity film |
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TW524883B (en) * | 2000-05-22 | 2003-03-21 | Jsr Corp | Composition for film formation, process for producing composition for film formation, method of film formation, and silica-based film |
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JP4697363B2 (ja) * | 2000-08-21 | 2011-06-08 | Jsr株式会社 | 膜形成用組成物および絶縁膜形成用材料 |
JP2002129103A (ja) | 2000-10-23 | 2002-05-09 | Jsr Corp | 膜形成用組成物および絶縁膜形成用材料 |
US6947651B2 (en) * | 2001-05-10 | 2005-09-20 | Georgia Tech Research Corporation | Optical waveguides formed from nano air-gap inter-layer dielectric materials and methods of fabrication thereof |
JP2003131001A (ja) * | 2001-05-25 | 2003-05-08 | Shipley Co Llc | 多孔性光学物質 |
JP2003041191A (ja) * | 2001-07-30 | 2003-02-13 | Jsr Corp | 膜形成用組成物、膜の形成方法およびシリカ系膜 |
JP2003064307A (ja) * | 2001-08-28 | 2003-03-05 | Hitachi Chem Co Ltd | シリカ系被膜、シリカ系被膜形成用組成物、シリカ系被膜の製造方法及び電子部品 |
JP4972834B2 (ja) * | 2001-08-28 | 2012-07-11 | 日立化成工業株式会社 | シロキサン樹脂 |
EP1446356A4 (en) * | 2001-11-21 | 2005-04-06 | Univ Massachusetts | MESOPOROUS MATERIALS AND METHOD |
JP3702842B2 (ja) | 2001-12-04 | 2005-10-05 | 日立化成工業株式会社 | シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品 |
US7381442B2 (en) * | 2002-04-10 | 2008-06-03 | Honeywell International Inc. | Porogens for porous silica dielectric for integral circuit applications |
US20050173803A1 (en) | 2002-09-20 | 2005-08-11 | Victor Lu | Interlayer adhesion promoter for low k materials |
-
2003
- 2003-02-26 KR KR1020057015194A patent/KR100820992B1/ko not_active IP Right Cessation
- 2003-02-26 CN CNB038048167A patent/CN100491486C/zh not_active Expired - Fee Related
- 2003-02-26 WO PCT/JP2003/002157 patent/WO2003072668A1/ja active Application Filing
- 2003-02-26 KR KR1020047019649A patent/KR100819226B1/ko not_active IP Right Cessation
- 2003-02-26 KR KR10-2004-7013253A patent/KR20040094732A/ko active Search and Examination
- 2003-02-26 JP JP2003571361A patent/JP4151579B2/ja not_active Expired - Fee Related
- 2003-02-26 AU AU2003211343A patent/AU2003211343A1/en not_active Abandoned
- 2003-02-26 KR KR1020077005209A patent/KR100795251B1/ko not_active IP Right Cessation
- 2003-02-26 CN CNB2004100970894A patent/CN1320073C/zh not_active Expired - Fee Related
- 2003-02-27 TW TW093140080A patent/TW200514828A/zh not_active IP Right Cessation
- 2003-02-27 TW TW094127342A patent/TW200600557A/zh not_active IP Right Cessation
- 2003-02-27 TW TW92104285A patent/TW200400237A/zh not_active IP Right Cessation
-
2004
- 2004-08-26 US US10/926,321 patent/US7358300B2/en not_active Expired - Fee Related
-
2008
- 2008-02-18 JP JP2008036562A patent/JP4169088B2/ja not_active Expired - Fee Related
- 2008-06-16 JP JP2008157012A patent/JP2008297550A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN1639283A (zh) | 2005-07-13 |
JP2008297550A (ja) | 2008-12-11 |
TWI297718B (zh) | 2008-06-11 |
TW200600557A (en) | 2006-01-01 |
KR20070038574A (ko) | 2007-04-10 |
CN1320073C (zh) | 2007-06-06 |
US20050119394A1 (en) | 2005-06-02 |
KR100819226B1 (ko) | 2008-04-02 |
KR20050095788A (ko) | 2005-09-30 |
JPWO2003072668A1 (ja) | 2005-06-23 |
KR100820992B1 (ko) | 2008-04-10 |
JP2008195945A (ja) | 2008-08-28 |
AU2003211343A1 (en) | 2003-09-09 |
JP4169088B2 (ja) | 2008-10-22 |
CN100491486C (zh) | 2009-05-27 |
US7358300B2 (en) | 2008-04-15 |
JP4151579B2 (ja) | 2008-09-17 |
CN1637097A (zh) | 2005-07-13 |
TW200400237A (en) | 2004-01-01 |
TWI304434B (zh) | 2008-12-21 |
KR20050008780A (ko) | 2005-01-21 |
TWI297717B (zh) | 2008-06-11 |
KR20040094732A (ko) | 2004-11-10 |
KR100795251B1 (ko) | 2008-01-15 |
WO2003072668A1 (en) | 2003-09-04 |
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