WO2008090971A1 - エポキシ基末端ポリジメチルシロキサンおよびその製造方法、ならびに硬化性ポリシロキサン組成物 - Google Patents
エポキシ基末端ポリジメチルシロキサンおよびその製造方法、ならびに硬化性ポリシロキサン組成物 Download PDFInfo
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- WO2008090971A1 WO2008090971A1 PCT/JP2008/051040 JP2008051040W WO2008090971A1 WO 2008090971 A1 WO2008090971 A1 WO 2008090971A1 JP 2008051040 W JP2008051040 W JP 2008051040W WO 2008090971 A1 WO2008090971 A1 WO 2008090971A1
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- WIPO (PCT)
- Prior art keywords
- polydimethylsiloxane
- polysiloxane composition
- producing
- same
- curable polysiloxane
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Silicon Polymers (AREA)
- Epoxy Resins (AREA)
Abstract
本発明は、エポキシ基を開環させるために用いられる酸発生剤を添加することなく、エポキシ基を開環重合させることができるエポキシ基含有ポリジメチルシロキサンを提供すること、およびこのポリジメチルシロキサンを含有する硬化性ポリシロキサン組成物を提供する。上記エポキシ基含有ポリジメチルシロキサンは、エポキシ基を含有する有機基を末端に有し、該エポキシ基含有有機基が結合したケイ素に1個または2個の水酸基が結合していることを特徴とする。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008555109A JPWO2008090971A1 (ja) | 2007-01-25 | 2008-01-25 | エポキシ基末端ポリジメチルシロキサンおよびその製造方法、ならびに硬化性ポリシロキサン組成物 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2007-015629 | 2007-01-25 | ||
JP2007015629 | 2007-01-25 | ||
JP2007175285 | 2007-07-03 | ||
JP2007-175285 | 2007-07-03 |
Publications (1)
Publication Number | Publication Date |
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WO2008090971A1 true WO2008090971A1 (ja) | 2008-07-31 |
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PCT/JP2008/051040 WO2008090971A1 (ja) | 2007-01-25 | 2008-01-25 | エポキシ基末端ポリジメチルシロキサンおよびその製造方法、ならびに硬化性ポリシロキサン組成物 |
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JP (1) | JPWO2008090971A1 (ja) |
WO (1) | WO2008090971A1 (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009072632A1 (ja) * | 2007-12-07 | 2009-06-11 | Jsr Corporation | 硬化性組成物、光学素子コーティング用組成物、およびled封止用材料ならびにその製造方法 |
WO2010026714A1 (ja) * | 2008-09-03 | 2010-03-11 | 日本化薬株式会社 | シロキサン化合物、硬化性樹脂組成物、その硬化物及び光半導体素子 |
JP2010059359A (ja) * | 2008-09-05 | 2010-03-18 | Jsr Corp | エポキシ基含有多官能ポリシロキサンおよびその製造方法、ならびに硬化性ポリシロキサン組成物 |
JP2011038019A (ja) * | 2009-08-13 | 2011-02-24 | Jsr Corp | 光半導体封止用組成物、硬化体、光半導体封止材および発光ダイオード封止材 |
JP2011042760A (ja) * | 2009-08-24 | 2011-03-03 | Nitto Denko Corp | 熱硬化性シリコーン樹脂用組成物 |
WO2011108516A1 (ja) * | 2010-03-02 | 2011-09-09 | 日本化薬株式会社 | オルガノポリシロキサンの製造方法、該製造方法により得られるオルガノポリシロキサン、該オルガノポリシロキサンを含有する組成物 |
JP2014177616A (ja) * | 2013-02-15 | 2014-09-25 | Arakawa Chem Ind Co Ltd | コーティング組成物 |
JP2014237861A (ja) * | 2014-09-26 | 2014-12-18 | 日本化薬株式会社 | エポキシ樹脂組成物、硬化性樹脂組成物 |
WO2014208619A1 (ja) * | 2013-06-26 | 2014-12-31 | 日本化薬株式会社 | エポキシ基含有ポリオルガノシロキサンおよびそれを含有する硬化性樹脂組成物 |
TWI609927B (zh) * | 2012-01-06 | 2018-01-01 | 羅門哈斯電子材料韓國公司 | 含有機聚矽氧烷之可固化樹脂組成物 |
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JPH05287077A (ja) * | 1992-04-14 | 1993-11-02 | Toshiba Silicone Co Ltd | エポキシ変性シリコーン樹脂組成物 |
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JP2007106798A (ja) * | 2005-10-11 | 2007-04-26 | Jsr Corp | 光半導体封止用組成物、光半導体封止材および光半導体封止用組成物の製造方法 |
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JP2007169427A (ja) * | 2005-12-21 | 2007-07-05 | Jsr Corp | 光半導体封止用組成物、その製造法および光半導体封止材 |
JP2007332314A (ja) * | 2006-06-16 | 2007-12-27 | Jsr Corp | 熱硬化性樹脂組成物および光半導体用接着剤 |
-
2008
- 2008-01-25 WO PCT/JP2008/051040 patent/WO2008090971A1/ja active Application Filing
- 2008-01-25 JP JP2008555109A patent/JPWO2008090971A1/ja active Pending
Patent Citations (11)
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JPH05287077A (ja) * | 1992-04-14 | 1993-11-02 | Toshiba Silicone Co Ltd | エポキシ変性シリコーン樹脂組成物 |
JPH07126391A (ja) * | 1993-09-07 | 1995-05-16 | Shin Etsu Chem Co Ltd | エポキシ基含有オルガノポリシロキサン |
JPH1192665A (ja) * | 1997-09-24 | 1999-04-06 | Dow Corning Toray Silicone Co Ltd | エポキシ基含有ジオルガノポリシロキサンの製造方法および繊維用処理剤 |
JP2001030725A (ja) * | 1999-07-16 | 2001-02-06 | Ohtsu Tire & Rubber Co Ltd :The | タイヤ滑り止め装置 |
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JP2007169427A (ja) * | 2005-12-21 | 2007-07-05 | Jsr Corp | 光半導体封止用組成物、その製造法および光半導体封止材 |
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Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2009072632A1 (ja) * | 2007-12-07 | 2011-04-28 | Jsr株式会社 | 硬化性組成物、光学素子コーティング用組成物、およびled封止用材料ならびにその製造方法 |
WO2009072632A1 (ja) * | 2007-12-07 | 2009-06-11 | Jsr Corporation | 硬化性組成物、光学素子コーティング用組成物、およびled封止用材料ならびにその製造方法 |
JP2014031522A (ja) * | 2008-09-03 | 2014-02-20 | Nippon Kayaku Co Ltd | シロキサン化合物及び硬化性樹脂組成物 |
WO2010026714A1 (ja) * | 2008-09-03 | 2010-03-11 | 日本化薬株式会社 | シロキサン化合物、硬化性樹脂組成物、その硬化物及び光半導体素子 |
CN102143986A (zh) * | 2008-09-03 | 2011-08-03 | 日本化药株式会社 | 硅氧烷化合物、固化性树脂组合物、其固化物及光半导体元件 |
JP5453276B2 (ja) * | 2008-09-03 | 2014-03-26 | 日本化薬株式会社 | シロキサン化合物の製造方法 |
JP2010059359A (ja) * | 2008-09-05 | 2010-03-18 | Jsr Corp | エポキシ基含有多官能ポリシロキサンおよびその製造方法、ならびに硬化性ポリシロキサン組成物 |
JP2011038019A (ja) * | 2009-08-13 | 2011-02-24 | Jsr Corp | 光半導体封止用組成物、硬化体、光半導体封止材および発光ダイオード封止材 |
JP2011042760A (ja) * | 2009-08-24 | 2011-03-03 | Nitto Denko Corp | 熱硬化性シリコーン樹脂用組成物 |
CN102782014A (zh) * | 2010-03-02 | 2012-11-14 | 日本化药株式会社 | 有机聚硅氧烷的制造方法、通过该制造方法得到的有机聚硅氧烷、含有该有机聚硅氧烷的组合物 |
WO2011108516A1 (ja) * | 2010-03-02 | 2011-09-09 | 日本化薬株式会社 | オルガノポリシロキサンの製造方法、該製造方法により得られるオルガノポリシロキサン、該オルガノポリシロキサンを含有する組成物 |
JP5730852B2 (ja) * | 2010-03-02 | 2015-06-10 | 日本化薬株式会社 | オルガノポリシロキサンの製造方法、該製造方法により得られるオルガノポリシロキサン、該オルガノポリシロキサンを含有する組成物 |
TWI609927B (zh) * | 2012-01-06 | 2018-01-01 | 羅門哈斯電子材料韓國公司 | 含有機聚矽氧烷之可固化樹脂組成物 |
JP2014177616A (ja) * | 2013-02-15 | 2014-09-25 | Arakawa Chem Ind Co Ltd | コーティング組成物 |
WO2014208619A1 (ja) * | 2013-06-26 | 2014-12-31 | 日本化薬株式会社 | エポキシ基含有ポリオルガノシロキサンおよびそれを含有する硬化性樹脂組成物 |
JP2014237861A (ja) * | 2014-09-26 | 2014-12-18 | 日本化薬株式会社 | エポキシ樹脂組成物、硬化性樹脂組成物 |
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