WO2009072632A1 - 硬化性組成物、光学素子コーティング用組成物、およびｌｅｄ封止用材料ならびにその製造方法 - Google Patents

硬化性組成物、光学素子コーティング用組成物、およびｌｅｄ封止用材料ならびにその製造方法 Download PDF

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Publication number
WO2009072632A1
WO2009072632A1 PCT/JP2008/072204 JP2008072204W WO2009072632A1 WO 2009072632 A1 WO2009072632 A1 WO 2009072632A1 JP 2008072204 W JP2008072204 W JP 2008072204W WO 2009072632 A1 WO2009072632 A1 WO 2009072632A1
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Prior art keywords
epoxy group
composition
producing
sealing material
curable composition
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PCT/JP2008/072204
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English (en)
French (fr)
Inventor
Tarou Kanamori
Kimihiko Yoshii
Keisuke Yajima
Kouji Kashishita
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Jsr Corporation
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Priority to JP2009544758A priority Critical patent/JPWO2009072632A1/ja
Publication of WO2009072632A1 publication Critical patent/WO2009072632A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Abstract

　本発明は、耐紫外線性、透明性に優れ、高い硬度を有する硬化物を得ることができる硬化性組成物、光学素子コーティング用組成物、およびＬＥＤ封止用材料、ならびにこのような組成物の製造方法を提供することを目的としている。本発明の硬化性組成物は、エポキシ基を含有する有機基を末端に有し、該エポキシ基含有有機基が結合したケイ素に１個または２個の水酸基が結合しており、エポキシ当量が１５０ｇ／ｅｑ．以上、２０００ｇ／ｅｑ．未満であるエポキシ基末端ポリジメチルシロキサンと硬化剤とを含有することを特徴とする。
PCT/JP2008/072204 2007-12-07 2008-12-05 硬化性組成物、光学素子コーティング用組成物、およびｌｅｄ封止用材料ならびにその製造方法 WO2009072632A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009544758A JPWO2009072632A1 (ja) 2007-12-07 2008-12-05 硬化性組成物、光学素子コーティング用組成物、およびｌｅｄ封止用材料ならびにその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-316880 2007-12-07
JP2007316880 2007-12-07

Publications (1)

Publication Number Publication Date
WO2009072632A1 true WO2009072632A1 (ja) 2009-06-11

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JP (1) JPWO2009072632A1 (ja)
TW (1) TW200925173A (ja)
WO (1) WO2009072632A1 (ja)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009235376A (ja) * 2008-03-06 2009-10-15 Nitto Denko Corp 変性ポリアルミノシロキサン
WO2010026714A1 (ja) * 2008-09-03 2010-03-11 日本化薬株式会社 シロキサン化合物、硬化性樹脂組成物、その硬化物及び光半導体素子
JP2011021078A (ja) * 2009-07-14 2011-02-03 Jsr Corp オルガノポリシロキサンならびにこれを含む硬化性組成物およびその製造方法
WO2011108516A1 (ja) * 2010-03-02 2011-09-09 日本化薬株式会社 オルガノポリシロキサンの製造方法、該製造方法により得られるオルガノポリシロキサン、該オルガノポリシロキサンを含有する組成物
CN102850992A (zh) * 2012-09-16 2013-01-02 江苏江永新材料科技有限公司 一种单组份脱醇型灌封胶
JP2013057000A (ja) * 2011-09-08 2013-03-28 Mitsubishi Chemicals Corp 熱硬化性樹脂組成物、半導体デバイス用部材、及びそれを用いた半導体発光デバイス
EP2587560A1 (en) * 2011-10-26 2013-05-01 Forschungsverbund Berlin e.V. Light emitting diode
JP2014173019A (ja) * 2013-03-11 2014-09-22 Panasonic Corp 金属塗装用コーティング剤組成物
JP2014173020A (ja) * 2013-03-11 2014-09-22 Panasonic Corp 金属塗装用コーティング剤組成物
JP2014177616A (ja) * 2013-02-15 2014-09-25 Arakawa Chem Ind Co Ltd コーティング組成物
JP2014237861A (ja) * 2014-09-26 2014-12-18 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物
WO2014208619A1 (ja) * 2013-06-26 2014-12-31 日本化薬株式会社 エポキシ基含有ポリオルガノシロキサンおよびそれを含有する硬化性樹脂組成物
TWI609927B (zh) * 2012-01-06 2018-01-01 羅門哈斯電子材料韓國公司 含有機聚矽氧烷之可固化樹脂組成物
CN110023371A (zh) * 2016-11-29 2019-07-16 西门子股份公司 灌注料、绝缘材料及其用途

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05287077A (ja) * 1992-04-14 1993-11-02 Toshiba Silicone Co Ltd エポキシ変性シリコーン樹脂組成物
JP2001040094A (ja) * 1999-07-30 2001-02-13 Shin Etsu Chem Co Ltd エポキシ基含有シリコーン樹脂
WO2005100445A1 (ja) * 2004-04-16 2005-10-27 Jsr Corporation 光半導体封止用組成物、光半導体封止材および光半導体封止用組成物の製造方法
WO2007046399A1 (ja) * 2005-10-18 2007-04-26 Asahi Kasei Kabushiki Kaisha 熱硬化性樹脂組成物及び光半導体封止材
JP2007106798A (ja) * 2005-10-11 2007-04-26 Jsr Corp 光半導体封止用組成物、光半導体封止材および光半導体封止用組成物の製造方法
JP2007169427A (ja) * 2005-12-21 2007-07-05 Jsr Corp 光半導体封止用組成物、その製造法および光半導体封止材
JP2007169406A (ja) * 2005-12-21 2007-07-05 Jsr Corp 光半導体封止用組成物、その製造法および光半導体封止材
JP2007191697A (ja) * 2005-12-19 2007-08-02 Shin Etsu Chem Co Ltd エポキシ・シリコーン混成樹脂組成物及び光半導体装置
JP2007332314A (ja) * 2006-06-16 2007-12-27 Jsr Corp 熱硬化性樹脂組成物および光半導体用接着剤
WO2008090971A1 (ja) * 2007-01-25 2008-07-31 Jsr Corporation エポキシ基末端ポリジメチルシロキサンおよびその製造方法、ならびに硬化性ポリシロキサン組成物

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05287077A (ja) * 1992-04-14 1993-11-02 Toshiba Silicone Co Ltd エポキシ変性シリコーン樹脂組成物
JP2001040094A (ja) * 1999-07-30 2001-02-13 Shin Etsu Chem Co Ltd エポキシ基含有シリコーン樹脂
WO2005100445A1 (ja) * 2004-04-16 2005-10-27 Jsr Corporation 光半導体封止用組成物、光半導体封止材および光半導体封止用組成物の製造方法
JP2007106798A (ja) * 2005-10-11 2007-04-26 Jsr Corp 光半導体封止用組成物、光半導体封止材および光半導体封止用組成物の製造方法
WO2007046399A1 (ja) * 2005-10-18 2007-04-26 Asahi Kasei Kabushiki Kaisha 熱硬化性樹脂組成物及び光半導体封止材
JP2007191697A (ja) * 2005-12-19 2007-08-02 Shin Etsu Chem Co Ltd エポキシ・シリコーン混成樹脂組成物及び光半導体装置
JP2007169427A (ja) * 2005-12-21 2007-07-05 Jsr Corp 光半導体封止用組成物、その製造法および光半導体封止材
JP2007169406A (ja) * 2005-12-21 2007-07-05 Jsr Corp 光半導体封止用組成物、その製造法および光半導体封止材
JP2007332314A (ja) * 2006-06-16 2007-12-27 Jsr Corp 熱硬化性樹脂組成物および光半導体用接着剤
WO2008090971A1 (ja) * 2007-01-25 2008-07-31 Jsr Corporation エポキシ基末端ポリジメチルシロキサンおよびその製造方法、ならびに硬化性ポリシロキサン組成物

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009235376A (ja) * 2008-03-06 2009-10-15 Nitto Denko Corp 変性ポリアルミノシロキサン
WO2010026714A1 (ja) * 2008-09-03 2010-03-11 日本化薬株式会社 シロキサン化合物、硬化性樹脂組成物、その硬化物及び光半導体素子
JP2011021078A (ja) * 2009-07-14 2011-02-03 Jsr Corp オルガノポリシロキサンならびにこれを含む硬化性組成物およびその製造方法
WO2011108516A1 (ja) * 2010-03-02 2011-09-09 日本化薬株式会社 オルガノポリシロキサンの製造方法、該製造方法により得られるオルガノポリシロキサン、該オルガノポリシロキサンを含有する組成物
JP5730852B2 (ja) * 2010-03-02 2015-06-10 日本化薬株式会社 オルガノポリシロキサンの製造方法、該製造方法により得られるオルガノポリシロキサン、該オルガノポリシロキサンを含有する組成物
JP2013057000A (ja) * 2011-09-08 2013-03-28 Mitsubishi Chemicals Corp 熱硬化性樹脂組成物、半導体デバイス用部材、及びそれを用いた半導体発光デバイス
EP2587560A1 (en) * 2011-10-26 2013-05-01 Forschungsverbund Berlin e.V. Light emitting diode
TWI609927B (zh) * 2012-01-06 2018-01-01 羅門哈斯電子材料韓國公司 含有機聚矽氧烷之可固化樹脂組成物
CN102850992A (zh) * 2012-09-16 2013-01-02 江苏江永新材料科技有限公司 一种单组份脱醇型灌封胶
JP2014177616A (ja) * 2013-02-15 2014-09-25 Arakawa Chem Ind Co Ltd コーティング組成物
JP2014173019A (ja) * 2013-03-11 2014-09-22 Panasonic Corp 金属塗装用コーティング剤組成物
JP2014173020A (ja) * 2013-03-11 2014-09-22 Panasonic Corp 金属塗装用コーティング剤組成物
WO2014208619A1 (ja) * 2013-06-26 2014-12-31 日本化薬株式会社 エポキシ基含有ポリオルガノシロキサンおよびそれを含有する硬化性樹脂組成物
JP2014237861A (ja) * 2014-09-26 2014-12-18 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物
CN110023371A (zh) * 2016-11-29 2019-07-16 西门子股份公司 灌注料、绝缘材料及其用途

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TW200925173A (en) 2009-06-16

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