TWI296139B - - Google Patents

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Publication number
TWI296139B
TWI296139B TW094131762A TW94131762A TWI296139B TW I296139 B TWI296139 B TW I296139B TW 094131762 A TW094131762 A TW 094131762A TW 94131762 A TW94131762 A TW 94131762A TW I296139 B TWI296139 B TW I296139B
Authority
TW
Taiwan
Prior art keywords
film
ions
package
semiconductor substrate
semiconductor device
Prior art date
Application number
TW094131762A
Other languages
English (en)
Chinese (zh)
Other versions
TW200614404A (en
Inventor
Takeshi Wakabayashi
Ichiro Mihara
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Publication of TW200614404A publication Critical patent/TW200614404A/zh
Application granted granted Critical
Publication of TWI296139B publication Critical patent/TWI296139B/zh

Links

Classifications

    • H10P72/74—
    • H10W76/60—
    • H10W72/0198—
    • H10W74/019—
    • H10W74/121—
    • H10W74/129—
    • H10P54/00—
    • H10P72/7418—
    • H10P72/7422—
    • H10P72/7432—
    • H10W70/656—
    • H10W72/019—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/251—
    • H10W72/9223—
    • H10W72/923—
    • H10W72/9413—
    • H10W72/9415—
    • H10W72/942—
    • H10W72/952—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW094131762A 2004-09-17 2005-09-15 Semiconductor device and manufacturing method thereof TW200614404A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004270646 2004-09-17
JP2005100737A JP4003780B2 (ja) 2004-09-17 2005-03-31 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
TW200614404A TW200614404A (en) 2006-05-01
TWI296139B true TWI296139B (enExample) 2008-04-21

Family

ID=36073083

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131762A TW200614404A (en) 2004-09-17 2005-09-15 Semiconductor device and manufacturing method thereof

Country Status (4)

Country Link
US (2) US7417330B2 (enExample)
JP (1) JP4003780B2 (enExample)
KR (1) KR100727519B1 (enExample)
TW (1) TW200614404A (enExample)

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JP2012039005A (ja) * 2010-08-10 2012-02-23 Toshiba Corp 半導体装置およびその製造方法
US9509924B2 (en) 2011-06-10 2016-11-29 Flir Systems, Inc. Wearable apparatus with integrated infrared imaging module
US10841508B2 (en) 2011-06-10 2020-11-17 Flir Systems, Inc. Electrical cabinet infrared monitor systems and methods
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Also Published As

Publication number Publication date
JP2006114867A (ja) 2006-04-27
US20080286903A1 (en) 2008-11-20
TW200614404A (en) 2006-05-01
JP4003780B2 (ja) 2007-11-07
KR100727519B1 (ko) 2007-06-14
KR20060051364A (ko) 2006-05-19
US7417330B2 (en) 2008-08-26
US7867826B2 (en) 2011-01-11
US20060060984A1 (en) 2006-03-23

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