TW200614404A - Semiconductor device and manufacturing method thereof - Google Patents
Semiconductor device and manufacturing method thereofInfo
- Publication number
- TW200614404A TW200614404A TW094131762A TW94131762A TW200614404A TW 200614404 A TW200614404 A TW 200614404A TW 094131762 A TW094131762 A TW 094131762A TW 94131762 A TW94131762 A TW 94131762A TW 200614404 A TW200614404 A TW 200614404A
- Authority
- TW
- Taiwan
- Prior art keywords
- ion
- semiconductor substrate
- semiconductor device
- sealing material
- manufacturing
- Prior art date
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004270646 | 2004-09-17 | ||
JP2005100737A JP4003780B2 (ja) | 2004-09-17 | 2005-03-31 | 半導体装置及びその製造方法 |
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TW200614404A true TW200614404A (en) | 2006-05-01 |
TWI296139B TWI296139B (zh) | 2008-04-21 |
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TW094131762A TW200614404A (en) | 2004-09-17 | 2005-09-15 | Semiconductor device and manufacturing method thereof |
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US (2) | US7417330B2 (zh) |
JP (1) | JP4003780B2 (zh) |
KR (1) | KR100727519B1 (zh) |
TW (1) | TW200614404A (zh) |
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US8587124B2 (en) | 2007-09-21 | 2013-11-19 | Teramikros, Inc. | Semiconductor device having low dielectric insulating film and manufacturing method of the same |
US9177848B2 (en) | 2007-05-04 | 2015-11-03 | Stats Chippac, Ltd. | Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer |
US9524938B2 (en) | 2007-05-04 | 2016-12-20 | STATS ChipPAC Pte. Ltd. | Package-in-package using through-hole via die on saw streets |
US9847253B2 (en) | 2007-05-04 | 2017-12-19 | STATS ChipPAC Pte. Ltd. | Package-on-package using through-hole via die on saw streets |
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- 2005-09-14 US US11/226,769 patent/US7417330B2/en not_active Expired - Fee Related
- 2005-09-15 TW TW094131762A patent/TW200614404A/zh unknown
- 2005-09-16 KR KR1020050086569A patent/KR100727519B1/ko not_active IP Right Cessation
-
2008
- 2008-07-17 US US12/218,685 patent/US7867826B2/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7816790B2 (en) | 2006-05-19 | 2010-10-19 | Casio Computer Co., Ltd. | Semiconductor device having low dielectric insulating film and manufacturing method of the same |
US9177848B2 (en) | 2007-05-04 | 2015-11-03 | Stats Chippac, Ltd. | Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer |
US9524938B2 (en) | 2007-05-04 | 2016-12-20 | STATS ChipPAC Pte. Ltd. | Package-in-package using through-hole via die on saw streets |
US9847253B2 (en) | 2007-05-04 | 2017-12-19 | STATS ChipPAC Pte. Ltd. | Package-on-package using through-hole via die on saw streets |
US8587124B2 (en) | 2007-09-21 | 2013-11-19 | Teramikros, Inc. | Semiconductor device having low dielectric insulating film and manufacturing method of the same |
US8871627B2 (en) | 2007-09-21 | 2014-10-28 | Tera Probe, Inc. | Semiconductor device having low dielectric insulating film and manufacturing method of the same |
US9070638B2 (en) | 2007-09-21 | 2015-06-30 | Tera Probe, Inc. | Semiconductor device having low dielectric insulating film and manufacturing method of the same |
US9640478B2 (en) | 2007-09-21 | 2017-05-02 | Aoi Electronics Co., Ltd. | Semiconductor device having low dielectric insulating film and manufacturing method of the same |
US8154133B2 (en) | 2008-03-31 | 2012-04-10 | Casio Computer Co., Ltd. | Semiconductor device having low dielectric constant film and manufacturing method thereof |
Also Published As
Publication number | Publication date |
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US20080286903A1 (en) | 2008-11-20 |
US7417330B2 (en) | 2008-08-26 |
TWI296139B (zh) | 2008-04-21 |
US7867826B2 (en) | 2011-01-11 |
KR20060051364A (ko) | 2006-05-19 |
US20060060984A1 (en) | 2006-03-23 |
JP4003780B2 (ja) | 2007-11-07 |
KR100727519B1 (ko) | 2007-06-14 |
JP2006114867A (ja) | 2006-04-27 |
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