KR100727519B1 - 반도체장치 및 그 제조방법 - Google Patents
반도체장치 및 그 제조방법 Download PDFInfo
- Publication number
- KR100727519B1 KR100727519B1 KR1020050086569A KR20050086569A KR100727519B1 KR 100727519 B1 KR100727519 B1 KR 100727519B1 KR 1020050086569 A KR1020050086569 A KR 1020050086569A KR 20050086569 A KR20050086569 A KR 20050086569A KR 100727519 B1 KR100727519 B1 KR 100727519B1
- Authority
- KR
- South Korea
- Prior art keywords
- sealing film
- ions
- semiconductor substrate
- film
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H10P72/74—
-
- H10W76/60—
-
- H10W72/0198—
-
- H10W74/019—
-
- H10W74/121—
-
- H10W74/129—
-
- H10P54/00—
-
- H10P72/7418—
-
- H10P72/7422—
-
- H10P72/7432—
-
- H10W70/656—
-
- H10W72/019—
-
- H10W72/07251—
-
- H10W72/20—
-
- H10W72/251—
-
- H10W72/9223—
-
- H10W72/923—
-
- H10W72/9413—
-
- H10W72/9415—
-
- H10W72/942—
-
- H10W72/952—
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2004-00270646 | 2004-09-17 | ||
| JP2004270646 | 2004-09-17 | ||
| JPJP-P-2005-00100737 | 2005-03-31 | ||
| JP2005100737A JP4003780B2 (ja) | 2004-09-17 | 2005-03-31 | 半導体装置及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060051364A KR20060051364A (ko) | 2006-05-19 |
| KR100727519B1 true KR100727519B1 (ko) | 2007-06-14 |
Family
ID=36073083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020050086569A Expired - Fee Related KR100727519B1 (ko) | 2004-09-17 | 2005-09-16 | 반도체장치 및 그 제조방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US7417330B2 (enExample) |
| JP (1) | JP4003780B2 (enExample) |
| KR (1) | KR100727519B1 (enExample) |
| TW (1) | TW200614404A (enExample) |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4193897B2 (ja) | 2006-05-19 | 2008-12-10 | カシオ計算機株式会社 | 半導体装置およびその製造方法 |
| JP4812525B2 (ja) * | 2006-06-12 | 2011-11-09 | パナソニック株式会社 | 半導体装置および半導体装置の実装体および半導体装置の製造方法 |
| JP5119756B2 (ja) * | 2006-06-30 | 2013-01-16 | 株式会社デンソー | 配線基板 |
| JP2008098529A (ja) * | 2006-10-13 | 2008-04-24 | Toshiba Corp | 半導体装置及びその製造方法 |
| US8749065B2 (en) * | 2007-01-25 | 2014-06-10 | Tera Probe, Inc. | Semiconductor device comprising electromigration prevention film and manufacturing method thereof |
| JP2008227398A (ja) * | 2007-03-15 | 2008-09-25 | Sanken Electric Co Ltd | 半導体装置の製法 |
| TWI341577B (en) * | 2007-03-27 | 2011-05-01 | Unimicron Technology Corp | Semiconductor chip embedding structure |
| US7829998B2 (en) | 2007-05-04 | 2010-11-09 | Stats Chippac, Ltd. | Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer |
| US7723159B2 (en) * | 2007-05-04 | 2010-05-25 | Stats Chippac, Ltd. | Package-on-package using through-hole via die on saw streets |
| US8445325B2 (en) | 2007-05-04 | 2013-05-21 | Stats Chippac, Ltd. | Package-in-package using through-hole via die on saw streets |
| US7838424B2 (en) * | 2007-07-03 | 2010-11-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching |
| JP2009049218A (ja) * | 2007-08-21 | 2009-03-05 | Nec Electronics Corp | 半導体装置及び半導体装置の製造方法 |
| US8587124B2 (en) * | 2007-09-21 | 2013-11-19 | Teramikros, Inc. | Semiconductor device having low dielectric insulating film and manufacturing method of the same |
| US20090079072A1 (en) * | 2007-09-21 | 2009-03-26 | Casio Computer Co., Ltd. | Semiconductor device having low dielectric insulating film and manufacturing method of the same |
| JP2009146988A (ja) * | 2007-12-12 | 2009-07-02 | Fujitsu Ltd | 配線基板の個片化方法およびパッケージ用基板 |
| JP4666028B2 (ja) * | 2008-03-31 | 2011-04-06 | カシオ計算機株式会社 | 半導体装置 |
| JP4538764B2 (ja) * | 2008-07-24 | 2010-09-08 | カシオ計算機株式会社 | 半導体装置およびその製造方法 |
| US9473681B2 (en) | 2011-06-10 | 2016-10-18 | Flir Systems, Inc. | Infrared camera system housing with metalized surface |
| US9235876B2 (en) | 2009-03-02 | 2016-01-12 | Flir Systems, Inc. | Row and column noise reduction in thermal images |
| US9948872B2 (en) | 2009-03-02 | 2018-04-17 | Flir Systems, Inc. | Monitor and control systems and methods for occupant safety and energy efficiency of structures |
| US9674458B2 (en) | 2009-06-03 | 2017-06-06 | Flir Systems, Inc. | Smart surveillance camera systems and methods |
| US9998697B2 (en) | 2009-03-02 | 2018-06-12 | Flir Systems, Inc. | Systems and methods for monitoring vehicle occupants |
| US9756264B2 (en) | 2009-03-02 | 2017-09-05 | Flir Systems, Inc. | Anomalous pixel detection |
| US9986175B2 (en) | 2009-03-02 | 2018-05-29 | Flir Systems, Inc. | Device attachment with infrared imaging sensor |
| US10757308B2 (en) | 2009-03-02 | 2020-08-25 | Flir Systems, Inc. | Techniques for device attachment with dual band imaging sensor |
| US10244190B2 (en) | 2009-03-02 | 2019-03-26 | Flir Systems, Inc. | Compact multi-spectrum imaging with fusion |
| US9451183B2 (en) | 2009-03-02 | 2016-09-20 | Flir Systems, Inc. | Time spaced infrared image enhancement |
| US9517679B2 (en) | 2009-03-02 | 2016-12-13 | Flir Systems, Inc. | Systems and methods for monitoring vehicle occupants |
| US9843742B2 (en) | 2009-03-02 | 2017-12-12 | Flir Systems, Inc. | Thermal image frame capture using de-aligned sensor array |
| USD765081S1 (en) | 2012-05-25 | 2016-08-30 | Flir Systems, Inc. | Mobile communications device attachment with camera |
| US9635285B2 (en) | 2009-03-02 | 2017-04-25 | Flir Systems, Inc. | Infrared imaging enhancement with fusion |
| US9208542B2 (en) | 2009-03-02 | 2015-12-08 | Flir Systems, Inc. | Pixel-wise noise reduction in thermal images |
| US9756262B2 (en) | 2009-06-03 | 2017-09-05 | Flir Systems, Inc. | Systems and methods for monitoring power systems |
| US9292909B2 (en) | 2009-06-03 | 2016-03-22 | Flir Systems, Inc. | Selective image correction for infrared imaging devices |
| US9716843B2 (en) | 2009-06-03 | 2017-07-25 | Flir Systems, Inc. | Measurement device for electrical installations and related methods |
| US10091439B2 (en) | 2009-06-03 | 2018-10-02 | Flir Systems, Inc. | Imager with array of multiple infrared imaging modules |
| US9843743B2 (en) | 2009-06-03 | 2017-12-12 | Flir Systems, Inc. | Infant monitoring systems and methods using thermal imaging |
| US9819880B2 (en) | 2009-06-03 | 2017-11-14 | Flir Systems, Inc. | Systems and methods of suppressing sky regions in images |
| US9918023B2 (en) | 2010-04-23 | 2018-03-13 | Flir Systems, Inc. | Segmented focal plane array architecture |
| US9207708B2 (en) | 2010-04-23 | 2015-12-08 | Flir Systems, Inc. | Abnormal clock rate detection in imaging sensor arrays |
| US9848134B2 (en) | 2010-04-23 | 2017-12-19 | Flir Systems, Inc. | Infrared imager with integrated metal layers |
| US9706138B2 (en) | 2010-04-23 | 2017-07-11 | Flir Systems, Inc. | Hybrid infrared sensor array having heterogeneous infrared sensors |
| JP2012009816A (ja) * | 2010-05-28 | 2012-01-12 | Casio Comput Co Ltd | 半導体装置およびその製造方法 |
| JP2012039005A (ja) * | 2010-08-10 | 2012-02-23 | Toshiba Corp | 半導体装置およびその製造方法 |
| US9509924B2 (en) | 2011-06-10 | 2016-11-29 | Flir Systems, Inc. | Wearable apparatus with integrated infrared imaging module |
| US10841508B2 (en) | 2011-06-10 | 2020-11-17 | Flir Systems, Inc. | Electrical cabinet infrared monitor systems and methods |
| US10079982B2 (en) | 2011-06-10 | 2018-09-18 | Flir Systems, Inc. | Determination of an absolute radiometric value using blocked infrared sensors |
| US9143703B2 (en) | 2011-06-10 | 2015-09-22 | Flir Systems, Inc. | Infrared camera calibration techniques |
| CN103875235B (zh) | 2011-06-10 | 2018-10-12 | 菲力尔系统公司 | 用于红外成像装置的非均匀性校正技术 |
| US10389953B2 (en) | 2011-06-10 | 2019-08-20 | Flir Systems, Inc. | Infrared imaging device having a shutter |
| CN109618084B (zh) | 2011-06-10 | 2021-03-05 | 菲力尔系统公司 | 红外成像系统和方法 |
| EP2719166B1 (en) | 2011-06-10 | 2018-03-28 | Flir Systems, Inc. | Line based image processing and flexible memory system |
| US10169666B2 (en) | 2011-06-10 | 2019-01-01 | Flir Systems, Inc. | Image-assisted remote control vehicle systems and methods |
| US10051210B2 (en) | 2011-06-10 | 2018-08-14 | Flir Systems, Inc. | Infrared detector array with selectable pixel binning systems and methods |
| US9900526B2 (en) | 2011-06-10 | 2018-02-20 | Flir Systems, Inc. | Techniques to compensate for calibration drifts in infrared imaging devices |
| US9058653B1 (en) | 2011-06-10 | 2015-06-16 | Flir Systems, Inc. | Alignment of visible light sources based on thermal images |
| US9706137B2 (en) | 2011-06-10 | 2017-07-11 | Flir Systems, Inc. | Electrical cabinet infrared monitor |
| US9235023B2 (en) | 2011-06-10 | 2016-01-12 | Flir Systems, Inc. | Variable lens sleeve spacer |
| US9961277B2 (en) | 2011-06-10 | 2018-05-01 | Flir Systems, Inc. | Infrared focal plane array heat spreaders |
| EP2873058B1 (en) | 2012-07-16 | 2016-12-21 | Flir Systems, Inc. | Methods and systems for suppressing noise in images |
| US9811884B2 (en) | 2012-07-16 | 2017-11-07 | Flir Systems, Inc. | Methods and systems for suppressing atmospheric turbulence in images |
| WO2014178426A1 (ja) * | 2013-05-02 | 2014-11-06 | 富士フイルム株式会社 | エッチング方法、これに用いるエッチング液およびエッチング液のキット、ならびに半導体基板製品の製造方法 |
| US9973692B2 (en) | 2013-10-03 | 2018-05-15 | Flir Systems, Inc. | Situational awareness by compressed display of panoramic views |
| US11297264B2 (en) | 2014-01-05 | 2022-04-05 | Teledyne Fur, Llc | Device attachment with dual band imaging sensor |
| US20180096909A1 (en) * | 2016-10-05 | 2018-04-05 | Nxp B.V. | Semiconductor device having two encapsulants |
| US10522440B2 (en) * | 2017-11-07 | 2019-12-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package structure and method of manufacturing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3388369B2 (ja) | 1994-01-31 | 2003-03-17 | 日本テキサス・インスツルメンツ株式会社 | 半導体パッケージ装置 |
| JP2003197802A (ja) | 2001-12-25 | 2003-07-11 | Kyocera Corp | 電子部品収納用容器 |
| KR20040074337A (ko) * | 2003-02-17 | 2004-08-25 | 삼성전자주식회사 | 실리콘 웨이퍼를 이용한 기판단위 진공실장방법 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57113235A (en) * | 1980-12-29 | 1982-07-14 | Nec Corp | Semiconductor device |
| JPH07100766B2 (ja) * | 1987-06-25 | 1995-11-01 | ソマール株式会社 | エポキシ樹脂粉体塗料組成物 |
| JP2643714B2 (ja) * | 1992-02-07 | 1997-08-20 | 信越化学工業株式会社 | 液状エポキシ樹脂組成物及び硬化物 |
| JPH08335653A (ja) * | 1995-04-07 | 1996-12-17 | Nitto Denko Corp | 半導体装置およびその製法並びに上記半導体装置の製造に用いる半導体装置用テープキャリア |
| JPH1095910A (ja) * | 1996-09-26 | 1998-04-14 | Fuji Electric Co Ltd | 半導体封止用不飽和ポリエステル樹脂組成物とその成形方法 |
| JP3671563B2 (ja) * | 1996-12-09 | 2005-07-13 | 株式会社デンソー | モールドicをケースに固定した構造の半導体装置 |
| JP3658160B2 (ja) * | 1997-11-17 | 2005-06-08 | キヤノン株式会社 | モールドレス半導体装置 |
| JP3291289B2 (ja) * | 2000-01-19 | 2002-06-10 | サンユレック株式会社 | 電子部品の製造方法 |
| US6744124B1 (en) | 1999-12-10 | 2004-06-01 | Siliconix Incorporated | Semiconductor die package including cup-shaped leadframe |
| JP3955712B2 (ja) | 2000-03-03 | 2007-08-08 | 株式会社ルネサステクノロジ | 半導体装置 |
| JP3455948B2 (ja) | 2000-05-19 | 2003-10-14 | カシオ計算機株式会社 | 半導体装置およびその製造方法 |
| US6391687B1 (en) | 2000-10-31 | 2002-05-21 | Fairchild Semiconductor Corporation | Column ball grid array package |
| JP2003060130A (ja) * | 2001-08-08 | 2003-02-28 | Seiko Epson Corp | 半導体装置及びその封止方法及びそれを用いた実装方法 |
| US6620651B2 (en) | 2001-10-23 | 2003-09-16 | National Starch And Chemical Investment Holding Corporation | Adhesive wafers for die attach application |
| JP2003174111A (ja) | 2001-12-06 | 2003-06-20 | Sanyo Electric Co Ltd | 半導体装置 |
| JP2003273279A (ja) * | 2002-03-18 | 2003-09-26 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| JP2003309228A (ja) * | 2002-04-18 | 2003-10-31 | Oki Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| JP4243075B2 (ja) * | 2002-06-13 | 2009-03-25 | パナソニック株式会社 | 半導体装置およびその製造方法 |
| US6770971B2 (en) * | 2002-06-14 | 2004-08-03 | Casio Computer Co., Ltd. | Semiconductor device and method of fabricating the same |
| JP2004221417A (ja) * | 2003-01-16 | 2004-08-05 | Casio Comput Co Ltd | 半導体装置およびその製造方法 |
| US6777263B1 (en) * | 2003-08-21 | 2004-08-17 | Agilent Technologies, Inc. | Film deposition to enhance sealing yield of microcap wafer-level package with vias |
| JP3915992B2 (ja) * | 2004-06-08 | 2007-05-16 | ローム株式会社 | 面実装型電子部品の製造方法 |
| JP4271625B2 (ja) * | 2004-06-30 | 2009-06-03 | 株式会社フジクラ | 半導体パッケージ及びその製造方法 |
-
2005
- 2005-03-31 JP JP2005100737A patent/JP4003780B2/ja not_active Expired - Fee Related
- 2005-09-14 US US11/226,769 patent/US7417330B2/en not_active Expired - Fee Related
- 2005-09-15 TW TW094131762A patent/TW200614404A/zh unknown
- 2005-09-16 KR KR1020050086569A patent/KR100727519B1/ko not_active Expired - Fee Related
-
2008
- 2008-07-17 US US12/218,685 patent/US7867826B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3388369B2 (ja) | 1994-01-31 | 2003-03-17 | 日本テキサス・インスツルメンツ株式会社 | 半導体パッケージ装置 |
| JP2003197802A (ja) | 2001-12-25 | 2003-07-11 | Kyocera Corp | 電子部品収納用容器 |
| KR20040074337A (ko) * | 2003-02-17 | 2004-08-25 | 삼성전자주식회사 | 실리콘 웨이퍼를 이용한 기판단위 진공실장방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006114867A (ja) | 2006-04-27 |
| US20080286903A1 (en) | 2008-11-20 |
| TW200614404A (en) | 2006-05-01 |
| JP4003780B2 (ja) | 2007-11-07 |
| TWI296139B (enExample) | 2008-04-21 |
| KR20060051364A (ko) | 2006-05-19 |
| US7417330B2 (en) | 2008-08-26 |
| US7867826B2 (en) | 2011-01-11 |
| US20060060984A1 (en) | 2006-03-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100727519B1 (ko) | 반도체장치 및 그 제조방법 | |
| US7312521B2 (en) | Semiconductor device with holding member | |
| JP5183708B2 (ja) | 半導体装置およびその製造方法 | |
| KR100222299B1 (ko) | 웨이퍼 레벨 칩 스케일 패키지 및 그의 제조 방법 | |
| EP1505643B1 (en) | Semiconductor device and manufacturing method thereof | |
| US6528881B1 (en) | Semiconductor device utilizing a side wall to prevent deterioration between electrode pad and barrier layer | |
| KR100589570B1 (ko) | 반도체 장치의 제조 방법 | |
| KR0178134B1 (ko) | 불연속 절연층 영역을 갖는 반도체 집적회로 소자 및 그 제조방법 | |
| US20060141750A1 (en) | Semiconductor integrated device and method for manufacturing same | |
| EP1478021B1 (en) | Semiconductor device and manufacturing method thereof | |
| JP4507175B2 (ja) | 半導体装置の製造方法 | |
| KR100659625B1 (ko) | 반도체 장치 및 그 제조 방법 | |
| JP2002231854A (ja) | 半導体装置およびその製造方法 | |
| US20150380372A1 (en) | Semiconductor device including a protective film | |
| JP4072141B2 (ja) | 半導体装置の製造方法 | |
| JP2006229113A (ja) | 半導体装置およびその製造方法 | |
| JP5004907B2 (ja) | 半導体装置の製造方法 | |
| CN100452367C (zh) | 具有密封膜的芯片尺寸的半导体装置及其制造方法 | |
| US7388297B2 (en) | Semiconductor device with reduced thickness of the semiconductor substrate | |
| JP4506168B2 (ja) | 半導体装置およびその実装構造 | |
| US7144760B2 (en) | Semiconductor device, method of manufacturing the same, circuit board, and electronic equipment | |
| US20070190908A1 (en) | Semiconductor device and method for manufacturing the semiconductor device | |
| JP2013065582A (ja) | 半導体ウエハ及び半導体装置並びに半導体装置の製造方法 | |
| CN100470781C (zh) | 半导体装置及其制造方法 | |
| JP4987683B2 (ja) | 半導体装置およびその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R14-asn-PN2301 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| FPAY | Annual fee payment |
Payment date: 20130524 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20140530 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20150430 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20160606 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20160606 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |